Xtrinsic FXLN83xxQ 3-Axis Low-
Power Analog-Output Accelerometer
FXLN83xxQ is a family of 3-axis, low-power, low-g, analog-
output accelerometers that consist of an acceleration sensor
along with a CMOS signal conditioning and control ASIC in a
3x3x1mm QFN package. The analog outputs for the X, Y, and Z
axes are internally compensated for zero-g offset and sensitivity,
and then buffered to the output pads. The outputs have a fixed
zero-g offset of 0.75V, irrespective of the VDD supply voltage.
The bandwidth of the output signal for each axis may be
independently adjusted using external capacitors. The host can
place the FXLN83xxQ into a low-current shutdown mode to
conserve power.
Features
• Supply voltage (VDD) from 1.71 V to 3.6 V
• Accelerometer operating ranges selectable
• ±2 g or ±8 g (FXLN83x1Q)
• ±4 g or ±16 g (FXLN83x2Q)
• Low current consumption of 180 μA (typical)
• Output Bandwidth Options
• High bandwidth, 2.7 kHz (XY axes), 600 Hz (Z axis),
(FXLN837XQ)
• Low bandwidth, 1.1 kHz (XY axes), 600 Hz (Z axis),
(FXLN836XQ)
• 3 x 3 x 1 mm, 12-pin QFN package (0.65 mm lead pitch)
• Robust design with high shock survivability (10,000 g)
• Operating temperature from –40 °C to +105 °C
• MSL 1 compliant
Typical Applications
• Tamper detection
• White goods: tilt, vibration, and shake detection
• Motion sensing in robotics applications
• Inclinometer, vibrometer
• Activity monitoring in sports and medical devices
FXLN83xxQ
12-pin QFN
3 mm x 3 mm x 1 mm
Case 2300-01
Top View
2
3
56
8
11
1
47
9
10
12
VDD
ST
BYP
EN
YOUT
XOUT
GND
g-Select GND
NC NC
ZOUT
Pin Connections
Freescale Semiconductor, Inc. FXLN83xxQ
Data Sheet: Technical Data Rev 2.0, 7/2014
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products. © 2014 Freescale Semiconductor, Inc. All rights
reserved.
Ordering Information
Part Number Operating Range Bandwidth Temperature
Range
Package
Description
Shipping
FXLN8361QR1 ±2/8 gLow –40 °C to +105 °C QFN-12 Tape and reel (1 k)
FXLN8362QR1 ±4/16 gLow –40 °C to +105 °C QFN-12 Tape and reel (1 k)
FXLN8371QR1 ±2/8 gHigh –40 °C to +105 °C QFN-12 Tape and reel (1 k)
FXLN8372QR1 ±4/16 gHigh –40 °C to +105 °C QFN-12 Tape and reel (1 k)
Related Documentation
The FXLN83xxQ device features and operations are described in a variety of reference manuals, user guides,
and application notes. To find the most-current versions of these documents:
1. Go to the Freescale homepage at freescale.com.
2. In the Keyword search box at the top of the page, enter the device number FXLN83xxQ.
3. In the Refine Your Result pane on the left, click on the Documentation link.
2Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
Table of Contents
1 General Description......................................................................... 4
1.1 Block Diagram.........................................................................4
1.2 Pin Descriptions.......................................................................4
1.3 Typical Application Circuit..................................................... 6
1.4 Sensing Direction and Output Response................................. 6
2 Device Characteristics..................................................................... 8
2.1 Absolute Maximum Ratings.................................................... 8
2.2 Mechanical Specifications ...................................................... 9
2.3 Electrical Specifications ......................................................... 10
3 Printed Circuit Board Layout and Device Mounting.......................11
3.1 Printed Circuit Board Layout...................................................11
3.2 Overview of Soldering Considerations....................................12
3.3 Halogen Content...................................................................... 13
4 Package Information........................................................................ 13
4.1 Device Marking....................................................................... 13
4.2 Tape and Reel Information...................................................... 13
4.3 Package Description................................................................ 14
5 Revision History.............................................................................. 17
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
3
Freescale Semiconductor, Inc.
1 General Description
1.1 Block Diagram
G-cell
Gain
Z+
Z-
Digital Logic
and
Control
MUX
X+ Y+
X- Y-
C2V
XOUT
YOUT
ZOUT
g-Select
VDD
ST
EN
BYP
ClockSelf TestReferences
10 KΩ
10 KΩ
10 KΩ
MUX
D2SAAF
D2SAAF
D2SAAF
aX,aY,aZ
Figure 1. FXLN83xxQ block diagram
General Description
4Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
1.2 Pin Descriptions
2
3
56
8
11
1
47
9
10
12
VDD
ST
BYP
EN
YOUT
XOUT
GND
g-Select GND
NC NC
ZOUT
Figure 2. Pin locations
Table 1. Pin descriptions
Pin Name Description I/O
1 BYP Internal voltage regulator output capacitor connection Output
2 VDD Supply voltage Power
3 ST1Self-Test
• When ST pin is logic high, the accelerometer is put into self-test mode.
• When ST pin is logic low, the accelerometer is put into normal operating mode.
Input
4 EN Power enable pin
• When the EN pin is logic low, the accelerometer is shut down, minimizing current
consumption.
• When the EN pin is logic high, the accelerometer is fully functional.
Input
5 g-Select Full Scale Range selection:
For part numbers FXLN8361QR1 & FXLN8371QR1:
• When the g-select pin is logic low, the accelerometer is in ±8 g mode
• When the g-select pin is logic high, the accelerometer is in ±2 g mode
For part numbers FXLN8362QR1 & FXLN8372QR1:
• When the g-select pin is logic low, the accelerometer is in ±16 g mode
• When the g-select pin is logic high, the accelerometer is in ±4 g mode
Input
6 GND Ground Ground
7 GND Ground Ground
8 ZOUT Z-axis analog output Output
9 YOUT Y-axis analog output Output
10 XOUT X-axis analog output Output
11 NC No internal connection, may be left floating or connected to GND —
12 NC No internal connection, may be left floating or connected to GND —
EP DNC Center pads should not be soldered, refer to Printed Circuit Board Layout and Device Mounting —
General Description
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
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Freescale Semiconductor, Inc.
1. The Self-Test function verifies the correct functioning of the sensor and signal path without the need to apply a
mechanical stimulus. When Self-Test is activated, an electrostatic actuation force is applied to the sensor, simulating a
small acceleration.
1.3 Typical Application Circuit
SELF-TEST
ENABLE
RANGE SELECT
XOUT
YOUT
ZOUT
VDD
C6
C5
BYP
1
NC
11
GND
6
VDD
2
EN
4
XOUT 10
ZOUT 8
NC 12
YOUT 9
g-Select
5
ST
3
GND 7
C1
0.1μF
C3
0.1μF
C4
C2
4.7μF
Notes:
1
. Position the decoupling capacitors (C2, C3) as near as
possible to the VDD pin (common practice to filter out
undesired noise from the power supply).
2. C1 is required to stabilize the output of the internal
voltage regulator.
3. Connecting the EN pin to the VDD pin is not a supported
configuration and may prevent the part from starting up.
Do not set the EN pin high until VDD > 1.71 V.
FXLN83xxQ
Part Number Bandwidth C4 (pF) C5 (pF) C6 (pF)
FXLN8361Q Low 9100 9100 9100
FXLN8362Q Low 9100 9100 9100
FXLN8371Q High 8200 3300 3300
FXLN8372Q High 8200 3300 3300
Recommended Minimum Capacitance Specifications
Figure 3. Electrical Connections
General Description
6Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
1.4 Sensing Direction and Output Response
263
P3XX
ALYM
263
P3XX
ALYM
Top View
Pin 1
Earth Gravity
Xout @ 0 g
Yout @ 0 g
Zout @ –1 g
BACK
FRONT
Side View
Xout @ 0 g
Yout @ 0 g
Zout @ 1 g
Top View
Y
X
Z
Xout @ 0 g
Yout @ –1 g
Zout @ 0 g
Xout @ 1 g
Yout @ 0 g
Zout @ 0 g
Xout @ 0 g
Yout @ 1 g
Zout @ 0 g
Xout @ –1 g
Yout @ 0 g
Zout @ 0 g
–1 g 0 g +1 g
XYZ Output Voltage
ModePart Number
FXLN8361Q, FXLN8371Q ±2 g 0.521 0.750 0.979
±8 g 0.693 0.750 0.807
±4 g 0.636 0.750 0.865
±16 g 0.722 0.750 0.779
FXLN8362Q, FXLN8372Q
Figure 4. Sensitive Axes Orientation and Response to Gravity Stimulus
General Description
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
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Freescale Semiconductor, Inc.
2 Device Characteristics
2.1 Absolute Maximum Ratings
Absolute maximum ratings are the limits the device can be exposed to without
permanently damaging it. Absolute maximum ratings are stress ratings only; functional
operation at these ratings is not guaranteed. Exposure to absolute maximum ratings
conditions for extended periods may affect reliability.
This device contains circuitry to protect against damage due to high static voltage or
electrical fields. It is advised, however, that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
circuit.
Table 2. Absolute maximum ratings
Rating Symbol Value Unit
Supply voltage VDD –0.3 to +3.6 V
Drop-test height, component Ddrop 1.8 m
Operating temperature range TOP –40 to +105 °C
Storage temperature range TSTG –40 to +125 °C
Table 3. ESD and latch-up protection characteristics
Rating Symbol Value Unit
Human body model (HBM) VHBM ±2000 V
Machine model (MM) VMM ±200 V
Charge device model (CDM) VCDM ±500 V
Latch-up current at T = 85 °C ILU ±100 mA
Caution
This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.
Caution
This is an ESD sensitive device, improper handling can cause permanent damage to the part.
Device Characteristics
8Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
2.2 Mechanical Specifications
Table 4. Mechanical characteristics
Parameter Symbol Test Conditions Min Typ Max Unit
Full scale range (FXLN83X1)
FSR
±2 g mode — ±2 —
g
±8 g mode — ±8 —
Full scale range (FXLN83X2) ±4 g mode — ±4 —
±16 g mode — ±16 —
Nominal sensitivity SEN
±2 g range — 229.0 —
mV/g
±4g range — 114.5 —
±8 g range — 57.25 —
±16 g range — 28.62 —
Calibrated sensitivity SENCAL
±2 g
VBYP/(3.276*gRange) V/g
±4 g
±8 g
±16 g
Calibrated sensitivity error SENERR
±2 g range –5 — +5 %
±4 g range –6 — +6
Sensitivity change vs.
temperature1TCS — –0.07 — +0.07 %/°C
Cross-axis sensitivity1CAS — –4.2 — +4.2 %
Self-test output change1STOC — 35(XY)
300(Z) — — mg
Zero-g level offset VOFF
±2 g range 0.705 0.75 0.795
V
±4 g range
0.7125 0.75 0.7875±8 g range
±16 g range
Zero-g level change vs.
temperature1TCO ±2 g range –1.2 — +1.2 mg/°C
±4 g range –2.0 — +2.0
Zero-g level offset, post board
mount1OFFPBM 1 mm (overall thickness),
2-layer, FR4-based PCB –200 — +200 mg
Noise Density1, 2ND
FXLN8371QR1,
FXLN8372QR1 —200(XY)
280(Z) — µg/√Hz
FXLN8361QR1,
FXLN8362QR1 —130(XY)
200(Z) — µg/√Hz
Operating temperature range1TOP — –40 — +105 °C
Notes:
Test conditions (unless otherwise noted):
• VDD = 2.8 V, unless otherwise noted
• T = 25 °C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product)
Device Characteristics
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
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Freescale Semiconductor, Inc.
Table 4. Mechanical characteristics
• Analog acceleration output pin loading = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW
configuration)
• Analog acceleration output pin loading = 9.1 nF capacitors on X, Y and Z axes (LBW configuration)
• No analog acceleration output pin loading other than external BW setting capacitor
• No BYP pin loading other than bypass capacitor and 150 μA DC current draw through resistive divider.
1. Limits verified by characterization only.
2. High and Low Bandwidth modes are configured in non-volatile Memory (NVM) at the factory
2.3 Electrical Specifications
Table 5. Electrical characteristics
Parameter Symbol Test Conditions Min Typ Max Unit
Supply voltage1VDD — 1.71 2.8 3.6 V
Active supply current IDD — — 180 — µA
Shutdown supply current IDD–SD — — 30 — nA
Voltage supplied at BYP pin1VBYP IBYP ≤ 150 µA 1.45 1.5 1.55 V
Output impedance (XYZ
outputs)1RO— 8 10 12 kΩ
Bandwidth1, 2, 3BW
High BW device — 2700(XY)
600(Z) —
Hz
Low BW device — 1100(XY)
600(Z) —
BYP output capacitor value CBYP External capacitor 70 100 500 nF
Logic high input level on EN, g-
Select, ST pins1VIH — 0.75 * VDD — VDD V
Logic low input level on EN, g-
Select, ST pins1VIL — 0 — 0.3 * VDD V
Turn-on time1, 2, 4TON — 660 — µs
g-Select transition delay3Tg-Select — 340 — µs
Operating temperature range1TOP — –40 — +105 °C
Notes:
Test conditions (unless otherwise noted):
• VDD = 2.8 V
• Output load = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW configuration)
• Output load = 9.1 nF capacitors on X, Y and Z axes (LBW configuration)
• Output loading other than external capacitor: high impedance
• No electrical loading on BYP pin other than output capacitor and 150 μA (max)
• DC output current for ADC reference input
• T = 25°C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product)
1. Limits verified by characterization only.
2. Apply VDD first. Then, Turn-on time is defined by the delay between when the EN pin is set to high and the time at
which a pin's output value reaches 90% of its final value.
3. g-Select pin transition from high to low. Time for output value to reach 90% of final value.
Device Characteristics
10 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
4. BYP pin is not connected
3 Printed Circuit Board Layout and Device Mounting
Printed Circuit Board (PCB) layout and device mounting are critical to the overall
performance of the design. The footprint for the surface mount packages must be the
correct size as a base for a proper solder connection between the PCB and the
package. This, along with the recommended soldering materials and techniques, will
optimize assembly and minimize the stress on the package after board mounting.
Freescale application note AN1902, "Assembly Guidelines for QFN and DFN
Packages" discusses the QFN package used by the FXLN83xxQ.
3.1 Printed Circuit Board Layout
The following recommendations are a guide to an effective PCB layout. See Figure 5
for footprint dimensions.
• The PCB land should be designed with Non-Solder Mask Defined (NSMD) as
shown in Figure 5.
• No additional via pattern underneath package.
• No components or vias should be placed at a distance less than 2 mm from the
package land area. This may cause additional package stress if it is too close to
the package land area.
• Signal traces connected to pads should be as symmetric as possible. Put dummy
traces on the NC pads in order to have same length of exposed trace for all pads.
• No copper traces should be on the top layer of the PCB under the package. This
will cause planarity issues with board mount. Freescale QFN sensors are
compliant with Restrictions on Hazardous Substances (RoHS), having halide-free
molding compound (green) and lead-free terminations. These terminations are
compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-Cu) solder
paste soldering processes. Reflow profiles applicable to those processes can be
used successfully for soldering the devices.
Printed Circuit Board Layout and Device Mounting
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
11
Freescale Semiconductor, Inc.
PCB land pad
Solder stencil opening
12X 0.686
12X 0.330
Solder mask opening
Package
Package footprint
Package footprint
3
65
12X 0.35
0.25
3
12X 0.5
0.3
4
1
2024
7
10
Package footprint
Red = Package footprint
Green = Solder paste stencil
Blue = PCB pad
Black = Solder mask opening
12X 0.889
12X 0.533
12X 0.635
12X 0.305
8X 0.325
4X 0.650
8X 0.325
4X 0.650
8X 0.325
4X 0.650
8X 0.325
4X 0.650
12X 0.3105
12X 0.4121
Figure 5. Footprint
3.2 Overview of Soldering Considerations
The information provided here is based on experiments executed on QFN devices.
These experiments cannot represent exact conditions present at a customer site.
Therefore, information herein should be used for guidance purposes only. Process and
design optimizations are recommended to develop an application-specific solution.
With the proper PCB footprint and solder stencil designs, the package will self-align
during the solder reflow process.
•Stencil thickness should be 100 or 125 µm.
• The PCB should be rated for the multiple lead-free reflow condition with a
maximum 260 °C temperature.
Printed Circuit Board Layout and Device Mounting
12 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
• Use a standard pick-and-place process and equipment. Do not use a hand
soldering process.
• Do not use a screw-down or stacking to mount the PCB into an enclosure. These
methods could bend the PCB, which would put stress on the package.
3.3 Halogen Content
This package is designed to be Halogen Free, exceeding most industry and customer
standards. Halogen Free means that no homogeneous material within the assembly
package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or
bromine (Br) in excess of 900 ppm or 0.09% weight/weight.
4 Package Information
The FXLN83xxQ device uses a 12-lead QFN package, case number 2300-01.
4.1 Device Marking
Top View
263
P3XX
ALYW
Traceability date code
Assembly site
Lot code
Work week
Part number
P3XX
Freescale code
P = Prototype, 8 = Production
71, 72, 61, or 62
Figure 6. Device Marking Description
Package Information
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
13
Freescale Semiconductor, Inc.
4.2 Tape and Reel Information
Figure 7. Tape dimensions
Barcode label
side of reel
Pin 1
Direction
to unreel
Figure 8. Tape and reel orientation
Package Information
14 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
Freescale Semiconductor, Inc.
4.3 Package Description
Package Information
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
15
Freescale Semiconductor, Inc.
5 Revision History
Revision
number Revision date Description
1.0 11/2013 Initial release.
1.1 7/2014 Revised to match current Freescale standard
Figure 3, added note #3
2.0 7/2014 Changed document type from Advance Information to Technical Data
Revision History
Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0,
7/2014.
17
Freescale Semiconductor, Inc.
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Information in this document is provided solely to enable system and
software implementers to use Freescale products. There are no express
or implied copyright licenses granted hereunder to design or fabricate
any integrated circuits based on the information in this document.
Freescale reserves the right to make changes without further notice to
any products herein.
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the suitability of its products for any particular purpose, nor does
Freescale assume any liability arising out of the application or use of
any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages.
“Typical” parameters that may be provided in Freescale data sheets
and/or specifications can and do vary in different applications, and
actual performance may vary over time. All operating parameters,
including “typicals,” must be validated for each customer application by
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© 2014 Freescale Semiconductor, Inc.
Document Number FXLN83xxQ
Revision 2.0, 7/2014
