1EDI EiceDRIVERTM Compact Output with Clamp variant for IGBT Single Channel IGBT Gate Driver IC 1EDI10I12MF 1EDI20I12MF 1EDI30I12MF Data Sheet Rev. 2.0, 2014-11-10 Industrial Power Control Edition 2014-11-10 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2014 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Revision History Page or Item Subjects (major changes since previous revision) Rev. 2.0, 2014-11-10 all pages Final datasheet, parameter completion and editorial changes Rev. 1.02, 2014-10-14 all pages parameter completion Trademarks of Infineon Technologies AG AURIXTM, BlueMoonTM, C166TM, CanPAKTM, CIPOSTM, CIPURSETM, COMNEONTM, EconoPACKTM, CoolMOSTM, CoolSETTM, CORECONTROLTM, CROSSAVETM, DAVETM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPIMTM, EiceDRIVERTM, eupecTM, FCOSTM, HITFETTM, HybridPACKTM, IRFTM, ISOFACETM, IsoPACKTM, MIPAQTM, ModSTACKTM, my-dTM, NovalithICTM, OmniTuneTM, OptiMOSTM, ORIGATM, PRIMARIONTM, PrimePACKTM, PrimeSTACKTM, PRO-SILTM, PROFETTM, RASICTM, ReverSaveTM, SatRICTM, SIEGETTM, SINDRIONTM, SIPMOSTM, SMARTiTM, SmartLEWISTM, SOLID FLASHTM, TEMPFETTM, thinQ!TM, TRENCHSTOPTM, TriCoreTM, X-GOLDTM, X-PMUTM, XMMTM, XPOSYSTM. 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MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO., MICROWAVE OFFICETM (MWO) of Applied Wave Research Inc., OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Satellite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM, PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM, WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited. Last Trademarks Update 2010-10-26 Data Sheet 3 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 3.1 3.2 Pin Configuration and Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Pin Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 4.1 4.2 4.3 4.3.1 4.3.2 4.3.3 4.3.4 4.4 4.5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Undervoltage Lockout (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Shut-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Miller Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Non-Inverting and Inverting Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Driver Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 12 12 12 12 13 13 13 13 5 5.1 5.2 5.3 5.3.1 5.3.2 5.3.3 5.3.4 5.3.5 5.3.6 5.3.7 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gate Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Miller Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Shut Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 15 15 15 16 16 17 17 18 18 6 Timing Diagramms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8 8.1 8.2 Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Reference Layout for Thermal Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Printed Circuit Board Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Data Sheet 4 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Data Sheet Typical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Block Diagram 1EDI10I12MF, 1EDI20I12MF and 1EDI30I12MF. . . . . . . . . . . . . . . . . . . . . . . . . . . 9 PG-DSO-8-51 (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Application Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Propagation Delay, Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Typical Switching Behavior. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 UVLO Behavior. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PG-DSO-8-51 (Plastic (Green) Dual Small Outline Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Reference Layout for Thermal Data (Copper thickness 35 m) . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Table 7 Table 8 Table 9 Table 10 Data Sheet Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Logic Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gate Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Miller Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Active Shut Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 14 15 15 16 16 17 17 18 18 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact Single Channel IGBT Gate Driver IC 1 Output with Clamp variant for IGBT Overview Main Features * * * * Single channel isolated IGBT Driver For 600 V/1200 V IGBTs Up to 6 A typical peak current at rail-to-rail outputs Active Miller Clamp Product Highlights * * * Galvanically isolated Coreless Transformer Driver Wide input voltage operating range Suitable for operation at high ambient temperature ED- Typical Application * * * * * * Compact AC and Brushless DC Motor Drives High Voltage DC/DC-Converter and DC/AC-Inverter Induction Heating Resonant Application UPS-Systems Welding Solar Description The 1EDI10I12MF, 1EDI20I12MF and 1EDI30I12MF are galvanically isolated single channel IGBT driver in a PGDSO-8-51 package that provide minimum peak output currents up to 3 A and an integrated active Miller Clamp circuit with the same current rating to protect against parasitic turn on. The input logic pins operate on a wide input voltage range from 3 V to 15 V using CMOS threshold levels to support even 3.3 V microcontroller. Data transfer across the isolation barrier is realized by the Coreless Transformer Technology. Every driver family member comes with logic input and driver output under voltage lockout (UVLO) and active shutdown. Product Name Gate Drive Current (min) Package 1EDI10I12MF 1.0 A with 1.0 A Miller Clamp PG-DSO-8-51 1EDI20I12MF 2.0 A with 2.0 A Miller Clamp PG-DSO-8-51 1EDI30I12MF 3.0 A with 3.0 A Miller Clamp PG-DSO-8-51 Data Sheet 7 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Overview VCC1 VCC2,H OUT IN+ IN- EiceDRIVERTM 1EDIxxI12MF CLAMP GND1 GND2,H VCC1 VCC2,L Control OUT IN+ IN- EiceDRIVERTM 1EDIxxI12MF CLAMP GND2,L GND1 Figure 1 Data Sheet Typical Application 8 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Block Diagram 2 Block Diagram VCC1 1 UVLO UVLO 5 VCC2 6 OUT 7 CLAMP 8 GND2 & IN+ 2 input filter GND1 & active filter TX RX GND2 VCC1 IN- 3 VCC2 input filter 2V & GND1 4 Figure 2 Data Sheet Block Diagram 1EDI10I12MF, 1EDI20I12MF and 1EDI30I12MF 9 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Pin Configuration and Functionality 3 Pin Configuration and Functionality 3.1 Pin Configuration Table 1 Pin Configuration Pin No. Name Function 1 VCC1 Positive Logic Supply 2 IN+ Non-Inverted Driver Input (active high) 3 IN- Inverted Driver Input (active low) 4 GND1 Logic Ground 5 VCC2 Positive Power Supply Output Side 6 OUT Driver Output 7 CLAMP Active Miller Clamp 8 GND2 Power Ground 1 VCC1 GND2 8 2 IN+ CLAMP 7 3 IN- OUT 6 4 GND1 VCC2 5 Figure 3 PG-DSO-8-51 (top view) 3.2 Pin Functionality VCC1 Logic input supply voltage of 3.3 V up to 15 V wide operating range. IN+ Non Inverting Driver Input IN+ non-inverted control signal for driver output if IN- is set to low. (Output sourcing active at IN+ = high and IN- = low) Due to internal filtering a minimum pulse width is defined to ensure robustness against noise at IN+. An internal weak pull-down-resistor favors off-state. Data Sheet 10 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Pin Configuration and Functionality IN- Inverting Driver Input IN- inverted control signal for driver output if IN+ is set to high. (Output sourcing active at IN- = low and IN+ = high) Due to internal filtering a minimum pulse width is defined to ensure robustness against noise at IN-. An internal weak pull-up-resistor favors off-state. GND1 Ground connection of input circuit. VCC2 Positive power supply pin of output driving circuit. A proper blocking capacitor has to be placed close to this supply pin. OUT Driver Output Combined source and sink output pin to external IGBT. The output voltage will be switched between VCC2 and GND2 and is controlled by IN+ and IN-. In case of an UVLO event this output will be switched off and an active shut down keeps the output voltage at a low level. CLAMP Active Miller Clamp Connect gate of external IGBT directly to this pin. As soon as the gate voltage has dropped below 2 V referred to GND2 during turn off state the CLAMP function ties its output to GND2 to avoid parasitic turn on of the connected IGBT. GND2 Reference Ground Reference ground of the output driving circuit. Data Sheet 11 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Functional Description 4 Functional Description 4.1 Introduction The Output with Clamp variant for IGBT is a general purpose IGBT gate driver. Basic control and protection features support fast and easy design of highly reliable systems. The integrated galvanic isolation between control input logic and driving output stage grants additional safety. Its wide input voltage supply range support the direct connection of various signal sources like DSPs and microcontrollers. With the rail-to-rail output and the additional active miller clamp, dynamic turn on due to Miller capacitances are suppressed. 4.2 Supply The driver can operate over a wide supply voltage range. The typical positive supply voltage for the configuration in Figure 4 is 15V at VCC2. Erratical dynamic turn on of the IGBT can be prevented with the active Miller clamp function, in which the CLAMP output is directly connected to the IGBT gate. +5V VCC1 1 100n SGND IN +15V VCC2 10R OUT GND1 IN+ CLAMP IN- GND2 Figure 4 Application Example 4.3 Protection Features 4.3.1 Undervoltage Lockout (UVLO) To ensure correct switching of IGBTs the device is equipped with an undervoltage lockout for input and output independently. Operation starts only after both VCC levels have increased beyond the respective VUVLOH levels (see also Figure 7). If the power supply voltage VVCC1 of the input chip drops below VUVLOL1 a turn-off signal is sent to the output chip before power-down. The IGBT is switched off and the signals at IN+ and IN- are ignored until VVCC1 reaches the power-up voltage VUVLOH1 again. If the power supply voltage VVCC2 of the output chip goes down below VUVLOL2 the IGBT is switched off and signals from the input chip are ignored until VVCC2 reaches the power-up voltage VUVLOH2 again. 4.3.2 Active Shut-Down The active shut-down feature ensures a safe IGBT off-state if the output chip is not connected to the power supply, IGBT gate is clamped at OUT and CLAMP to GND2. Data Sheet 12 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Functional Description 4.3.3 Short Circuit Clamping During short circuit the IGBT's gate voltage tends to rise because of the feedback via the Miller capacitance. An additional protection circuit connected to OUT and CLAMP limits this voltage to a value slightly higher than the supply voltage. A maximum current of 500 mA may be fed back to the supply through one of these paths for 10 s. If higher currents are expected or tighter clamping is desired external Schottky diodes may be added. 4.3.4 Active Miller Clamp In a half bridge configuration the switched off IGBT tends to dynamically turn on during turn on phase of the opposite IGBT. A Miller clamp allows sinking the Miller current across a low impedance path in this high dV/dt situation. Therefore in many applications, the use of a negative supply voltage can be avoided. During turn-off, the gate voltage is monitored and the clamp output is activated when the gate voltage drops below typical 2 V (referred to GND2). The clamp is designed for a Miller current in the same range as the nominal output current. 4.4 Non-Inverting and Inverting Inputs There are two possible input modes to control the IGBT. At non-inverting mode IN+ controls the driver output while IN- is set to low. At inverting mode IN- controls the driver output while IN+ is set to high, please see Figure 6. A minimum input pulse width is defined to filter occasional glitches. 4.5 Driver Output The output driver section uses MOSFETs to provide a rail-to-rail output. This feature permits that tight control of gate voltage during on-state and short circuit can be maintained as long as the driver's supply is stable. Due to the low internal voltage drop, switching behaviour of the IGBT is predominantly governed by the gate resistor. Furthermore, it reduces the power to be dissipated by the driver. Data Sheet 13 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Electrical Parameters 5 Electrical Parameters 5.1 Absolute Maximum Ratings Note: Absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of the integrated circuit. Unless otherwise noted all parameters refer to GND1. Table 2 Absolute Maximum Ratings Parameter Symbol Values Min. Max. 20 Unit Note / Test Condition Power supply output side VVCC2 -0.3 V 1) Gate driver output VOUT VGND2-0.3 VVCC2+0.3 V - Pin CLAMP voltage VCLAMP -0.3 VVCC2 V 1) 1) +0.3 Maximum short circuit clamping time tCLP - 10 s ICLAMP/OUT = 500 mA Positive power supply input side VVCC1 -0.3 18.0 V - Logic input voltages (IN+,IN-) VLogicIN -0.3 18.0 V - Input to output isolation voltage (GND2) VISO -1200 1200 V Junction temperature TJ -40 150 C - Storage temperature TS -55 150 C - Power dissipation (Input side) PD, IN - 25 mW 2) @TA = 25C mW 2) @TA = 25C K/W 2) @TA = 85C @TA = 85C Power dissipation (Output side) Thermal resistance (Input side) PD, OUT RTHJA,IN - - 400 145 Thermal resistance (Output side) RTHJA,OUT - 165 K/W 2) ESD capability VESD,HBM - 2 kV Human Body Model3) 1) May be exceeded during short circuit clamping. 2) See Figure 9 for reference layouts for these thermal data. Thermal performance may change significantly with layout and heat dissipation of components in close proximity. 3) According to EIA/JESD22-A114-C (discharging a 100 pF capacitor through a 1.5 k series resistor). Data Sheet 14 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Electrical Parameters 5.2 Operating Parameters Note: Within the operating range the IC operates as described in the functional description. Unless otherwise noted all parameters refer to GND1. Table 3 Operating Parameters Parameter Symbol Values Min. Max. Unit Note / Test Condition Power supply output side VVCC2 13 18 V 1) Power supply input side VVCC1 3.1 17 V - Logic input voltages (IN+,IN-) VLogicIN -0.3 17 V - VCLAMP Pin CLAMP voltage VGND2-0.3 VVCC2 2) V - Switching frequency fsw - 1.0 MHz 3) 4) Ambient temperature TA -40 125 C - Thermal coefficient, junction-top th,jt - 4.8 K/W @TA = 85C kV/s 4) Common mode transient immunity 1) 2) 3) 4) |dVISO/dt| - 100 @ 1000 V With respect to GND2. May be exceeded during short circuit clamping. do not exceed max. power dissipation Parameter is not subject to production test - verified by design/characterization 5.3 Electrical Characteristics Note: The electrical characteristics include the spread of values in supply voltages, load and junction temperatures given below. Typical values represent the median values at TA = 25C. Unless otherwise noted all voltages are given with respect to their respective GND (GND1 for pins 1 to 3, GND2 for pins 5 to 7). 5.3.1 Voltage Supply Table 4 Voltage Supply Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition UVLO threshold input chip VUVLOH1 - 2.85 3.1 V - VUVLOL1 2.55 2.75 - V - UVLO hysteresis input chip (VUVLOH1 - VUVLOL1) VHYS1 90 100 - mV - UVLO threshold output chip (IGBT supply) VUVLOH2 - 11.9 12.7 V - VUVLOL2 10.5 11.0 - V - UVLO hysteresis output chip (VUVLOH1 - VUVLOL1) VHYS2 700 850 - mV - Data Sheet 15 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Electrical Parameters Table 4 Voltage Supply (cont'd) Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. IQ1 - 0.6 1.0 mA VVCC1 = 5 V IN+ = High, IN- = Low =>OUT = High Quiescent current output IQ2 chip - 1.2 2.0 mA VVCC2 = 15 V IN+ = High, IN- = Low =>OUT = High Unit Note / Test Condition Quiescent current input chip 5.3.2 Logic Input Note: Unless stated otherwise VCC1 = 5.0V Table 5 Logic Input Parameter Symbol Values Min. Typ. Max. IN+,IN- low input voltage VIN+L,VIN-L - - 30 % of VCC1 IN+,IN- high input voltage VIN+H,VIN-H 70 - - % of VCC1 IN+,IN- low input voltage VIN+L,VIN-L - - 1.5 V - IN+,IN- high input voltage VIN+H,VIN-H 3.5 - - V - IN- input current IIN- - 70 200 A VIN- = GND1 IN+ input current IIN+, - 70 200 A VIN+ = VCC1 Unit Note / Test Condition A 1) 5.3.3 Gate Driver Table 6 Gate Driver Parameter Symbol Values Min. High level output peak current (source) 1EDI10I12MF 1EDI20I12MF 1EDI30I12MF IOUT,H,PEAK 1.0 2.0 3.0 Typ. Max. - - - IOUT,L,PEAK Low level output peak current (sink) 2.3 1EDI10I12MF 1.0 4.1 1EDI20I12MF 2.0 6.2 1EDI30I12MF 3.0 1) voltage across the device V(VCC2 - OUT+) or V(OUT- - GND2) < VVCC2. Data Sheet IN+ = High, IN- = Low, VVCC2 = 15 V 2.2 4.4 5.9 16 - A 1) IN+ = Low, IN- = Low, VVCC2 = 15 V Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Electrical Parameters 5.3.4 Short Circuit Clamping Table 7 Short Circuit Clamping Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. - 0.9 1.3 V IN+ = High, IN- = Low, IOUT = 500 mA pulse test, tCLPmax = 10 s) Clamping voltage VCLPclamp1 (CLAMP) (VVCLAMP-VVCC2) - 1.3 - V IN+ = High, IN- = Low, ICLAMP = 500 mA (pulse test, tCLPmax = 10 s) VCLPclamp2 - 0.7 1.1 V IN+ = High, IN- = Low, ICLAMP = 20 mA Clamping voltage (OUT) (VOUT - VVCC2) Clamping voltage (CLAMP) VCLPout 5.3.5 Active Miller Clamp Table 8 Active Miller Clamp Parameter Symbol Values Min. Low level clamp current ICLAMP,PEAK 1EDI10I12MF 1.0 1EDI20I12MF 2.0 1EDI30I12MF 3.0 Clamp threshold voltage VCLAMP 1.6 Typ. Max. - - Unit Note / Test Condition A 1) IN+ = Low, IN- = Low, VCLAMP = 15 V pulsed tpulse = 2 s 2.0 2.4 V Related to GND2 1) The parameter is not subject to production test - verified by design/characterization Data Sheet 17 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Electrical Parameters 5.3.6 Dynamic Characteristics Dynamic characteristics are measured with VVCC1 = 5 V and VVCC2 = 15 V. Table 9 Dynamic Characteristics Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition CLOAD = 100 pF VIN+ = 50%, VOUT=50% @ 25C Input IN to output propagation delay ON TPDON 270 300 330 ns Input IN to output propagation delay OFF TPDOFF 270 300 330 ns Input IN to output propagation delay distortion (TPDOFF - TPDON) TPDISTO -30 5 40 ns Input pulse suppression IN+, IN- TMININ+, TMININ- 230 240 - ns - IN input to output propagation delay ON variation due to temp TPDONt - - 14 ns 1) IN input to output propagation delay OFF variation due to temp TPDOFFt - - 14 ns 1) IN input to output TPDISTOt propagation delay distortion variation due to temp (TPDOFF-TPDON) - - 8 ns 1) CLOAD = 100 pF VIN+ = 50%, VOUT=50% CLOAD = 100 pF VIN+ = 50%, VOUT=50% CLOAD = 100 pF VIN+ = 50%, VOUT=50% Rise time TRISE 5 9 19 ns CLOAD = 1 nF VL 20%, VH 80% Fall time TFALL 3 6 15 ns CLOAD = 1 nF VL 20%, VH 80% Unit Note / Test Condition V IOUT-/IOUT-,PEAK=0.1, VCC2 open 1) The parameter is not subject to production test - verified by design/characterization 5.3.7 Active Shut Down Table 10 Active Shut Down Parameter Active shut down voltage Symbol V 1) ACTSD Values Min. Typ. Max. - 1.8 2.0 1) With reference to GND2 Data Sheet 18 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Timing Diagramms 6 Timing Diagramms 50 % IN+ 80 % 50 % 20 % OUT TPDON Figure 5 TRISE TPDOFF TFALL Propagation Delay, Rise and Fall Time IN+ IN OUT Figure 6 Typical Switching Behavior IN+ VUVLOH 1 VUVLOL 1 VCC1 V UVLOH 2 V UVLOL 2 VCC2 OUT Figure 7 Data Sheet UVLO Behavior 19 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Package Outlines 7 Package Outlines Figure 8 PG-DSO-8-51 (Plastic (Green) Dual Small Outline Package) Data Sheet 20 Rev. 2.0, 2014-11-10 1EDI EiceDRIVERTM Compact 1EDIxxI12MF Application Notes 8 Application Notes 8.1 Reference Layout for Thermal Data The PCB layout shown in Figure 9 represents the reference layout used for the thermal characterisation. Pin 4 (GND1) and pin 8 (GND2) require each a ground plane of 100 mm for achieving maximum power dissipation. The Output with Clamp variant for IGBT is conceived to dissipate most of the heat generated through this pins. The thermal coefficient junction-top (th,jt) can be used to calculate the junction temperature at a given top case temperature and driver power dissipation: T j = th ,jt P D + T top Figure 9 Reference Layout for Thermal Data (Copper thickness 35 m) 8.2 Printed Circuit Board Guidelines The following factors should be taken into account for an optimum PCB layout. * * * Sufficient spacing should be kept between high voltage isolated side and low voltage side circuits. The same minimum distance between two adjacent high-side isolated parts of the PCB should be maintained to increase the effective isolation and to reduce parasitic coupling. In order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be kept as short as possible. Data Sheet 21 Rev. 2.0, 2014-11-10 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Infineon: 1EDI30I12MFXUMA1 1EDI10I12MFXUMA1 1EDI20I12MFXUMA1