TLP104
TLP105
TLP108
TLP109
TLP109
(
IGM
)
TLP116A
TLP117
TLP118
TLP124
TLP126
TLP127
TLP130
TLP131
TLP137
TLP148G
TLP151
TLP151A
TLP155E
TLP160G
TLP160J
TLP161G
TLP161J
TLP163J
TLP165J
TLP166J
TLP168J
TLP170A
TLP170D
TLP170G
TLP170J
TLP172A
TLP172G
TLP173A
TLP174G
TLP174GA
TLP175A
TLP176A
TLP176D
TLP176G
TLP176GA
TLP179D
TLP180
TLP181
TLP184
TLP185
TLP190B
TLP191B
TLP192A
TLP192G
TLP197A
TLP197D
TLP197G
TLP197GA
TLP199D
TLP200D
TLP202A
TLP202G
TLP2066
TLP206A
TLP206G
TLP206GA
TLP2095
TLP2098
TLP209D
TLP2105
TLP2108
TLP2116
TLP2118E
TLP2160
TLP2166A
TLP2167
TLP2168
TLP2200
TLP220A
TLP220D
TLP220G
TLP220GA
TLP220J
TLP221A
SO6
MFSOP6
MFSOP6
SO6
SO6
SO6
MFSOP6
SO6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
SO6
SO6
SO6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
MFSOP6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
MFSOP6
2.54SOP4
2.54SOP4
SO6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
MFSOP6
MFSOP6
SO6
SO6
MFSOP6
MFSOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP6
2.54SOP8
2.54SOP8
2.54SOP8
MFSOP6
2.54SOP8
2.54SOP8
2.54SOP8
MFSOP6
MFSOP6
2.54SOP8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
DIP8
DIP4
DIP4
DIP4
DIP4
DIP4
DIP4
22
20
18
21
22
18
17
18
11
14
16
14
11
11
37
24
24
24
34
34
34
34
34
34
34
34
28
28
28
28
28
28
28
28
28
27
28
28
28
28
28
14,38
11,38
39
39
36
36
29
29
29
29
29
29
29
30
30
30
18
30
30
30
20
20
30
21
21
18
18
19
19
17
19
21
30
30
30
30
30
30
IC
IC
IC
IC
IC
IC
IC
IC
Transistor
Transistor
Darlington transistor
Transistor
Transistor
Transistor
Thyristor
IC
IC
IC
Triac
Triac
Triac
Triac
Triac
Triac
Triac
Triac
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET(Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
Transistor
Transistor
Transistor
Photovoltaic
Photovoltaic
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
IC
MOSFET (Photorelay)
IC
IC
IC
IC
IC
IC
IC
IC
IC
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
TLP222A
TLP222A-2
TLP222G
TLP222G-2
TLP224G
TLP224G-2
TLP224GA
TLP224GA-2
TLP225A
TLP227A
TLP227A-2
TLP227G
TLP227G-2
TLP227GA
TLP227GA-2
TLP2366
TLP2367
TLP2368
TLP2403
TLP2404
TLP2405
TLP2408
TLP2409
TLP2409
(
IGM
)
TLP2418
TLP2451
TLP2451A
TLP2466
TLP2467
TLP2468
TLP2530
TLP2531
TLP2601
TLP260J
TLP261J
TLP2630
TLP2631
TLP2766
TLP2767
TLP2768
TLP280
TLP280-4
TLP281
TLP281-4
TLP284
TLP284-4
TLP285
TLP285-4
TLP290-4
TLP291-4
TLP3022
(
S
)
TLP3023
(
S
)
TLP3042
(
S
)
TLP3043
(
S
)
TLP3052
(
S
)
TLP3062
(
S
)
TLP3063
(
S
)
TLP3064
(
S
)
TLP3082
(
S
)
TLP3100
TLP3110
TLP3111
TLP3113
TLP3114
TLP3115
TLP3116
TLP3118
TLP3119
TLP3120
TLP3121
TLP3122
TLP3123
TLP3125
TLP3130
TLP3131
TLP320
TLP320-2
TLP3203
TLP320-4
DIP4
DIP8
DIP4
DIP8
DIP4
DIP8
DIP4
DIP8
DIP4
DIP4
DIP8
DIP4
DIP8
DIP4
DIP8
SO6
SO6
SO6
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
SO8
DIP8
DIP8
DIP8
MFSOP6
MFSOP6
DIP8
DIP8
SDIP6
SDIP6
SDIP6
SOP4
SOP16
SOP4
SOP16
SOP4
SOP16
SOP4
SOP16
SO16
SO16
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
2.54SOP6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP6
2.54SOP4
2.54SOP6
2.54SOP4
2.54SOP4
2.54SOP4
2.54SOP8
2.54SOP4
2.54SOP4
DIP4
DIP8
SSOP4
DIP16
30
31
31
31
30
31
30
31
30
30
31
30
32
30
32
19
17
19
21
22
20
20
21
22
18
24
24
19
18
19
22
22
19
35
35
20
20
19
18
19
14,39
14
11,39
12
11,39
11
11,39
11
39
39
36,40
36,40
36,40
36,40
36,40
37,40
37,40
37,40
37,40
29
28
28
28
28
28
28
28
28
29
29
29
29
29
29
29
15
15
27
15
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
Triac
Triac
IC
IC
IC
IC
IC
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Triac
Triac
Triac
Triac
Triac
Triac
Triac
Triac
Triac
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
Transistor
MOSFET (Photorelay)
Transistor
Part Number Package Output Part Number Package OutputPage Page
1Product Index
3
27
27
27
27
27
27
27
27
27
27
27
27
27
27
27
15
12
27
12
27
24
24
24
24
24
24
31
31
31
31
31
35
35
35
16
16
16
37
37,40
37,40
38
38
38
38
33
33
33
33
32
32
32
32
33
32
32
33
33
33
32
33
12
21
19
16
16
16
35
35
35
12
12
37
37
21
21
19
21
19
20
25
20
21
23
35
36
36
36
16
16
16
38
38
31
31
31
31
31
31
31
15,39
15,39
15
12
12
12
15
15
15
16,39
16,39
16
12
13
13
13
13
13
15
13
13
21
25
25
25
25
25
25
25
18
22
20
18
20
21
13
13
13
14
37
22
22
22
22
23
36
36
14
14
31
31
31
23
23
23
23
23
Part Number
TLP3212
TLP3213
TLP3214
TLP3215
TLP3216
TLP3217
TLP3218
TLP3219
TLP3220
TLP3230
TLP3231
TLP3240
TLP3241
TLP3250
TLP3275
TLP330
TLP331
TLP3312
TLP332
TLP3375
TLP350
TLP350H
TLP351
TLP351A
TLP351H
TLP352
TLP3542
TLP3543
TLP3544
TLP3545
TLP3546
TLP360J
TLP361J
TLP363J
TLP371
TLP372
TLP373
TLP3762
(
S
)
TLP3782
(
S
)
TLP3783
(
S
)
TLP3902
TLP3904
TLP3914
TLP3924
TLP4006G
TLP4007G
TLP4026G
TLP4027G
TLP4172G
TLP4176G
TLP4192G
TLP4197G
TLP4202G
TLP4206G
TLP4222G
TLP4222G-2
TLP4227G
TLP4227G-2
TLP4592G
TLP4597G
TLP504A
TLP512
TLP513
TLP523
TLP523-2
TLP523-4
TLP525G
TLP525G-2
TLP525G-4
TLP531
TLP532
TLP548J
TLP549J
TLP550
TLP551
TLP552
TLP553
TLP554
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
SSOP4
DIP6
DIP6
USOP4
DIP6
USOP4
DIP8
DIP8
DIP8
DIP8
DIP8
DIP8
DIP6
DIP6
DIP6
DIP6
DIP6
DIP4
DIP4
DIP4
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
MFSOP6
SSOP4
SSOP4
SSOP4
DIP8
DIP8
2.54SOP8
2.54SOP8
2.54SOP4
2.54SOP4
2.54SOP6
2.54SOP6
2.54SOP8
2.54SOP8
DIP4
DIP8
DIP4
DIP8
DIP6
DIP6
DIP8
DIP6
DIP6
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP6
DIP6
DIP6
DIP8
DIP8
DIP8
DIP8
DIP8
DIP8
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
Transistor
MOSFET (Photorelay)
Transistor
MOSFET (Photorelay)
IC
IC
IC
IC
IC
IC
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Triac
Triac
Triac
Darlington transistor
Darlington transistor
Darlington transistor
Triac
Triac
Triac
Photovoltaic
Photovoltaic
Photovoltaic
Photovoltaic
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
Transistor
IC
IC
Darlington transistor
Darlington transistor
Darlington transistor
Triac
Triac
Triac
Transistor
Transistor
Thyristor
Thyristor
IC
IC
IC
IC
IC
Package Output Part NumberPage Page
TLP555
TLP557
TLP558
TLP559
TLP559
(
IGM
)
TLP560G
TLP560J
TLP561G
TLP561J
TLP570
TLP571
TLP572
TLP590B
TLP591B
TLP592A
TLP592G
TLP597A
TLP597G
TLP597GA
TLP598AA
TLP598GA
TLP620
TLP620-2
TLP620-4
TLP624
TLP624-2
TLP624-4
TLP626
TLP626-2
TLP626-4
TLP627
TLP627-2
TLP627-4
TLP628
TLP628-2
TLP628-4
TLP629
TLP629-2
TLP629-4
TLP630
TLP631
TLP632
TLP651
TLP700
TLP700H
TLP701
TLP701A
TLP701H
TLP705
TLP705A
TLP708
TLP714
TLP715
TLP716
TLP718
TLP719
TLP731
TLP732
TLP733
TLP734
TLP748J
TLP750
TLP751
TLP754
TLP759
TLP759
(
IGM
)
TLP762J
TLP763J
TLP781
TLP785
TLP797GA
TLP797J
TLP798GA
6N135
6N136
6N137
6N138
6N139
DIP8
DIP8
DIP8
DIP8
DIP8
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP4
DIP8
DIP16
DIP6
DIP6
DIP6
DIP8
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
SDIP6
DIP6
DIP6
DIP6
DIP6
DIP6
DIP8
DIP8
DIP8
DIP8
DIP8
DIP6
DIP6
DIP4
DIP4
DIP6
DIP6
DIP6
DIP8
DIP8
DIP8
DIP8
DIP8
IC
IC
IC
IC
IC
Triac
Triac
Triac
Triac
Darlington transistor
Darlington transistor
Darlington transistor
Photovoltaic
Photovoltaic
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay
MOSFET (Photorelay)
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Darlington transistor
Darlington transistor
Darlington transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
IC
Transistor
Transistor
Transistor
Transistor
Thyristor
IC
IC
IC
IC
IC
Triac
Triac
Transistor
Transistor
MOSFET (Photorelay)
MOSFET (Photorelay)
MOSFET (Photorelay)
IC
IC
IC
IC
IC
Package Output
1Product Index
4
Functional Schematic (TLP2451)
2.6
6.0
3.95
5.1
1.27
2+
3–
VCC
(M1)
(M2) VO
GND
SHIELD
8
6
5
Small Surface-Mount IC-Output Photocouplers in the SO8 Package
IGBT/MOSFET Gate-Drive IC-Output Photocouplers with an Extended Operating Temperature Range
1: N.C.
2: Anode
3: Cathode
4: N.C.
5: GND
6: VO(Output)
7: N.C.
8: VCC
TLP2403
TLP2404
TLP2409
TLP2405
TLP2408
TLP2105
TLP2108
TLP2466*
TLP2160*
TLP2418
TLP2118E
TLP2468*
TLP2168*
TLP2116
TLP2166A
TLP2467*
TLP2167*
TLP2451
TLP2451A*
0.1 Mbit/s
1 Mbit/s
5 Mbit/s
15 Mbit/s
20 Mbit/s
50 Mbit/s
Driver Propagation
Delay: 0.7 μs
(max)
Driver Propagation
Delay: 0.5 μs
(max)
1-ch
1-ch
1-ch
1-ch
1-ch
2-ch
2-ch
1-ch
2-ch
1-ch
2-ch
1-ch
2-ch
2-ch
2-ch
1-ch
2-ch
1-ch
1-ch
Data rate
(typ.) Part Number # of Circuits
Darlington
Output
Up to 18 V
4.5 V to 30 V
Up to 30 V
Totem-pole 4.5 V to 20 V
Totem-pole 3.3 V/5 V
Open-collector
Open-collector
5 V
Open-collector 3.3 V/5 V
5 V
Totem-pole 3.3 V
Totem-pole 3.3 V/5 V
±0.6-A peak current 10 V to 30 V
±0.6-A peak current 10 V to 30 V
Supply Voltage
TLP351H*
TLP701H*
TLP2451
TLP2451A*
TLP151*
TLP151A*
TLP700H*
TLP350H*
±0.6 A 10 V to 30 V
15 V to 30 V
Peak
Output
Current Part Number
Supply
Voltage
(VCC)
2 mA
(max)
Supply
Current
(ICC)
DIP8
SDIP6
SO8
SO8
SO6
SO6
SDIP6
DIP8
Package
700 ns
700 ns
500 ns
±2.0 A
±2.5 A
500 ns
Propagation
Delay
(max)
5 mA
(max)
Input
Threshold
Current
Yes
Yes
UVLO
SO8
SO8
TLP351H
TLP701H
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package.
To meet customer needs, Toshiba has released photocouplers featuring various data rates,
dual-channel configurations and power device drivers.
Printed circuit boards are becoming smaller and denser as a result of product miniaturization.
This is driving the need for electronic components with an extended operating temperature
range.
To meet this need, Toshiba has been expanding its portfolio of IC-output photocouplers that
are guaranteed up to 125°C instead of the conventional 100°C limit.
Wide packaging options: SO6, SO8, SDIP6, DIP8
Key specifications are guaranteed over –40°C to 125°C (–40°C to 110°C for the TLP151)
Low current consumption: ICC = 2 mA (max)
to
2New Products
5
2.6
6.0
3.95
5.1
1.27
4.0
9.7
6.8
4.58
1.27
2.6
7.0
4.4
3.6
1: Anode 1
2: Cathode 1
3: Cathode 2
4: Anode 2
5: GND
6: Output 2
7: Output 1
8: VCC
1
2
3
4
8
5
7
6
VCC
GND
SHIELD
TLP2105
TLP105
1: Anode
3: Cathode
4: GND
5: VO (Output)
6: VCC
1
3
6
4
5
VCC
GND
SHIELD
1+
3–
VCC
VO
GND
6
5
4
SHIELD
Functional Schematic (TLP104)
1.27
General-Purpose 5-Mbit/s IC-Output Photocouplers
IC-output photocouplers with a date rate of 5 Mbits/s are beneficial for applications where the
user needs a data rate that is not achievable with transistor-output photocouplers. In
conjunction with various packaging options, the fast IC-output photocouplers simplify system
design and provide extra performance for future upgrades.
Packaging options: MFSOP6, SDIP6, SO8
Available in positive and negative polarity versions.
Key specifications guaranteed over –40°C to 100°C
Low input current: 1.6 mA max (3 mA for the TLP715 and TLP718)
Totem-pole output: Eliminates the need for an external load resistor.
Wide supply voltage range: 4.5 V to 20 V
Available in dual-channel versions (TLP2105/TLP2108)
EN60747-5-2-certified
IC-Output Photocouplers for IPM Drive Applications
Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the
conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay
times, a wider operating temperature range and digital output. Thus, they help to simplify
system design and improve system performance. The TLP104 and TLP2404 in a small
surface-mount package are now available in mass-production quantities, while those in the
SDIP6 and DIP8 packages will shortly be available.
Wide packaging options: SO6, SO8, SDIP6, DIP8
Key specifications are guaranteed over –40°C to 125°C.
Low current consumption: 5 mA (max)
Wide supply voltage range: 4.5 to 30 V
Propagation delay times: tpHL = 400 ns (max), tpLH = 550 ns (max)
Propagation delay skew: |tpHL tpLH| = 400 ns (max)
MFSOP6
SDIP6
SO8
TLP105
TLP108
TLP715
TLP718
TLP2405
TLP2408
TLP2105
TLP2108
1-ch
1-ch
1-ch
1-ch
1-ch
1-ch
2-ch
2-ch
Positive
Negative
Positive
Negative
Positive
Negative
Positive
Negative
Package Part Number # of Channels Logic Polarity
TLP104
TLP2404
TLP714*
TLP754*
SO6
SO8
SDIP6
DIP8
Small surface-mount package with a 2.3-mm PCB mounted height (max)
Standard 8-pin small surface-mount package
Small surface-mount SDIP6 package
Standard DIP8 package
Part Number Package Feature
SO8
SO6
SDIP6MFSOP6
Pin Configuration
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative. 1: Anode
3: Cathode
4: GND
5: VO (Output)
6: VCC
2New Products
6
1.65
3.25
2.85
2.2
1.27
14
23
Photorelays in the Ultra-Small USOP4 Package: TLP33xx Series
There is a strong market need for smaller photorelays.
To meet this need, Toshiba has developed photorelays
in the ultra-small USOP4 package, which are suitable
for high-density board assembly. These photorelays
help to reduce system size and cost. They are ideal
for use in small measuring instruments such as
semiconductor testers that require numerous relays.
The TLP3312 and TLP3375 provide well-balanced
off-state voltage and on-state current, making them
suitable not only for tester applications but also for
various applications requiring high-density board
assembly such as battery-controlled devices.
TLP3312
TLP3375
60 V
50 V
0.4 A
0.3 A
1.5 Ω
1.5 Ω
20 pF
12 pF
Part Number Off-State Voltage
(max)
On-State Current
(max)
On-State
Resistance (max)
Total Capacitance
(typ.)
3 mA
3 mA
LED Trigger
Current (max)
Pin Configuration
1. Anode
2. Cathode
3. Drain
4. Drain
USOP4
USOP4
SSOP4
High-ION Photorelays: TLP354x Series (Under Development)
Package
VOFF
ION
RON
BVS
V
A
mΩ
Vrms
40
2.5
100
2500
20
4
50
2500
40
3.5
60
2500
60
3
70
2500
100
2
200
2500
DIP6
Characteristic Symbol Unit Available Under Development
Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current.
Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc
current respectively. They are suitable for various applications such as factory equipment, power supplies and security systems.
Peak Off-State Voltage
(min)
On-State Current
(max)
On-State Resistance
(max)
Isolation Voltage
(min)
TLP3542 TLP3543 TLP3544 TLP3545 TLP3546
−−
Scheduled for mass production in April
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
7
2.3
7.0
4.55
3.7
1.27
TLP104
TLP109
TLP116A
TLP2366*
TLP118
TLP2368*
TLP2367*
1 Mbit/s Open-collector, optimized for IPM drive
Open-collector
Totem-pole inverting logic
Open-collector inverting logic
Totem-pole inverting logic
1 Mbit/s
20 Mbit/s
50 Mbit/s
20 Mbit/s
4.5 V to 30 V
4.5 V to 30 V
5 V
3.3 V/5 V
5 V
3.3 V/5 V
3.3 V/5 V
Part Number Data rate
(typ.) Output Supply voltage
5 mA
5 mA
5 mA
5 mA
5 mA
5 mA
Input Threshold
Current (max)
SO6
SO6
IC-Output Photocouplers in the SO6 Package Certified for Reinforced Insulation
Despite the same footprint size as the MFSOP6 package, the new SO6 package provides
reinforced insulation, offering clearance and creepage distances of 5 mm; an internal
isolation thickness of 0.4 mm; and an isolation voltage of 3750 Vrms.
Additionally, the SO6 features the maximum PCB mounted height of 2.3 mm, approximately
20% lower than the MFSOP6. This makes the photocouplers in SO6 ideal for low-profile
applications.
Clearance/creepage: 5 mm
Thin package: 2.3 mm
Internal Faraday shield: 0.4 mm
Thin package: 2.3 mm
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
General-Purpose Photorelays Certified for Reinforced Insulation:
TLP220 Series and TLP221A (Under Development)
Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter
applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage
between input and output, as well as for international safety standards certification. Housed in the DIP4 package, the new photorelays
save board space and provide an isolation voltage of 5 kV. The TLP220 Series is available in versions with 60-V, 200-V, 350-V, 400-V
and 600-V peak off-state voltages. The TLP221A provides a 60-V peak off-state voltage and a 1.5-A on-state current.
Package
VOFF
ION
RON
BVS
V
A
Ω
Vrms
60
0.5
2
5000
350
0.12
50
5000
60
0.5
2
5000
200
0.25
8
5000
350
0.1
50
5000
400
0.12
35
5000
600
0.09
60
5000
60
1.5
0.2
5000
DIP4
Characteristic Symbol Unit
Existing Photorelay Examples
Under Development
Peak Off-State Voltage
(min)
On-State Current
(max)
On-State Resistance
(max)
Isolation Voltage
(min)
TLP222A TLP222G TLP220A TLP220D TLP220G TLP220GA TLP221ATLP220J
−−
Scheduled for mass production in June to August
2 New Products
8
VCC
GND
Vcc
GND
ZC
Photocoupler Product Tree
DIP4
DIP4
SDIP6
SDIP6
SO6
SO6
SO8
DIP8
DIP8
DIP16
DIP16
DIP6
DIP6
SOP16
SO16
SOP16
2.54SOP8
2.54SOP8
2.54SOP6
2.54SOP6
2.54SOP4
2.54SOP4
SSOP4
USOP4
SSOP4
MFSOP6
MFSOP6
SOP4
SOP4
General-purpose packages
Lead-forming options for surface mounting
Package
Transistor-Output
Transistor-Output IC-Output
Photorelays
Thyristor- and Triac-Output Photovoltaic-Output
Triac Output Thyristor Output Photovoltaic-Output
Darlington-Transistor Output
Logic Output
Gate Drive
Photorelays
7-mm clearance/creepage; 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
5-mm clearance/creepage; 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
USOP4 Ultra-small; SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SO16
SO8 8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
Output Choices
3 Photocoupler Product Tree
9
Transistor-Output and Darlington-Transistor-Output Photocouplers
1
Isolation Voltage Channel Single Quad Single Single Single Dual Quad
SOP4 SOP16SOP16
Quad
SO16 MFSOP6
Single
SO6 DIP4DIP6 DIP8 DIP16
5000 Vrms
5000 Vrms
5000 Vrms
5000 Vrms
5000 Vrms
5000 Vrms
5000 Vrms
5000 Vrms
4000 Vrms
3750 Vrms
3750 Vrms
3750 Vrms
3750 Vrms
2500 Vrms
2500 Vrms
2500 Vrms
2500 Vrms
TLP280 TLP280-4
TLP284 TLP284-4 TLP184*
TLP290-4*
TLP285
TLP124
TLP137
TLP131
TLP181
TLP126
TLP130
TLP180
TLP127
TLP731
TLP732
TLP733
TLP734
TLP331
TLP332
TLP631
TLP632
TLP624
TLP781
TLP785
TLP624-2 TLP624-4
TLP330 TLP320 TLP320-2
TLP281 TLP281-4
TLP285-4 TLP185*
TLP291-4*TLP531
TLP532
TLP504A
TLP630
TLP626 TLP626-2 TLP626-4
TLP620 TLP620-2 TLP620-4
TLP320-4
TLP570
TLP571
TLP572
TLP523 TLP523-2 TLP523-4
TLP371
TLP372
TLP373
TLP627 TLP627-2 TLP627-4
TLP628 TLP628-2 TLP628-4
TLP629 TLP629-2 TLP629-4
High VCEO
General-purpose
High IF
High IF
Low IF
AC input
Low IF
Darlington
High VCEO
Package
Features
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
4Selection Guide
10
4
1
3
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
4
1
3
2
4
1
3
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
1
64
3
6
1
54
3
6
1
54
3
6
1
4
3
New Products with Reinforced Insulation in a Small, Surface-Mount SOP Package
( 5-mm Clearance/Creepage and 0.4-mm Internal Isolation Thickness)
Part Number Pin Configuration Features VCEO BVs
Rank Min Max VDE BSI IEC
Safety Standards(2)
TÜV
CTR (%)(3)
@IF, VCE
UL/
C
UL
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
±5 mA,
5 V
GB 100
TLP284-4
50 600
600
SOP16
4-channel version of
the TLP284
Lead pitch = 1.27 mm
AC Input
SEMKO-approved
3750
Vrms
80 V /(1)
50 600
Y 50 150
GR 100 300
BL 200
GB 100
600
600
TLP284(4)
SOP4
Lead pitch = 1.27 mm
AC Input
SEMKO-approved
TST part recm’ed
±5 mA,
5 V
3750
Vrms
80 V / (1)
TLP285(4)
SOP4
Lead pitch = 1.27 mm
SEMKO-approved
TST part recm’ed
50 600
Y 50 150
GR 100 300
BL 200
GB 100
YH 75 150
GRL 100 200
GRH 150 300
BLL 200 400
600
600 5 mA,
5 V
3750
Vrms
80 V /(1)(1)
5 mA,
5 V
GB 100
TLP285-4
50 600
600
SOP16
4-channel version of
the TLP285
Lead pitch = 1.27 mm
SEMKO-approved
3750
Vrms
80 V /(1)
General-Purpose, Transistor-Output Photocouplers
Part Number Pin Configuration Features VCEO BVs
Rank Min Max VDE BSI IEC
Safety Standards(2)
TÜV
CTR (%)(3)
@IF, VCE
UL/
C
UL
Mini-flat
MFSOP6
Low input drive current
1 mA,
0.5 V
BV
200
TLP124
100
1200
1200
3750
Vrms
80 V /
50
600
Y
50
150 5 mA,
5 V
GR
100
300
BL
200
GB
100
TLP131
600
600
Mini-flat
MFSOP6
Internal base
connection
3750
Vrms
80 V /
Mini-flat
MFSOP6
Low input drive current
Internal base
connection BV
200
TLP137
100
3750
Vrms
1 mA,
0.5 V
1200
1200
80 V /
50
600
Y
50
150
GR
100
300
BL
200
GB
100
YH
75
150
GRL
100
200
GRH
150
300
BLL
200
400
600
600
TLP181(4)
Mini-flat
MFSOP6
SEMKO-approved
TST part recm’ed
5 mA,
5 V
3750
Vrms
80 V /(1)
TLP281(4)
SOP4
Lead pitch = 1.27 mm
SEMKO-approved
TST part recm’ed
50 600
Y 50 150
GR 100 300
BL 200
GB 100
YH 75 150
GRL 100 200
GRH 150 300
BLL 200 400
600
600 5 mA,
5 V
2500
Vrms
80 V /(1)(1)
11
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
8
1
65
43
7
2
6
1
54
32
6
1
54
32
6
1
54
32
6
1
54
32
4
1
3
2
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
4
1
3
2
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
General-Purpose, Transistor-Output Photocouplers (Continued)
Part Number Pin Configuration Features VCEO BVs
Rank Min Max VDE BSI IEC
Safety Standards(2)
TÜV
CTR (%)(3)
@IF, VCE
UL/
C
UL
5 mA,
5 V
GB 100
TLP281-4
50 600
600
SOP16
4-channel version
of the TLP281
Lead pitch = 1.27 mm
SEMKO-approved
2500
Vrms
80 V /(1)
50
GB 100
TLP504A DIP8 5 mA,
5 V
2500
Vrms
600
600
55 V / –
DIP6
Low input drive current
Internal base
connection
DIP6
Low input drive current
BV 200
BV 200
TLP332
100
TLP331
100
1 mA,
0.5 V
5000
Vrms
1200
1200
55 V /
1 mA,
0.5 V
5000
Vrms
1200
1200
55 V /
TLP531
50 600
Y50 150
GR 100 300
BL 200
GB 100
600
DIP6
Internal base
connection
5 mA,
5 V
2500
Vrms
55 V /
5 mA,
5 V
2500
Vrms
55 V /
TLP532
50 600
Y50 150
GR 100 300
BL 200
GB 100
600
DIP6
High EMI immunity
600
600
TLP624 DIP4
Low input drive current
1 mA,
5 V
BV 200
100 1200
1200
5000
Vrms
55 V / −
BV 200
TLP624-2
100 1200
DIP8
Dual-channel version
of the TLP624
1 mA,
5 V
5000
Vrms
55 V / –
1200
BV 200
TLP624-4
100
DIP16
4-channel version of
the TLP624
1 mA,
5 V
5000
Vrms
1200
55 V / –
DIP4
High VCEO
GB 100
TLP628
–50 5 mA,
5 V
5000
Vrms
600
350 V / –
1200
600
4Selection Guide
12
4
1
3
2
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
6
1
54
32
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
6
1
54
32
6
1
54
32
6
1
54
32
6
1
54
32
DIP4
High input current
IF = 150 mA
TLP629 100 mA,
1 V
5000
Vrms
–2080 55 V / –
80
TLP629-2 20
DIP8
Dual-channel version
of the TLP629
100 mA,
1 V
5000
Vrms
55 V / –
TLP629-4
DIP16
4-channel version of
the TLP629
100 mA,
1 V
5000
Vrms
–2080 55 V / –
50 600
600
GR 100 300
GB 100
TLP631
DIP6
Internal base
connection
5 mA,
5 V
5000
Vrms
55 V /
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
General-Purpose, Transistor-Output Photocouplers (Continued)
Part Number Pin Configuration Features VCEO BVs
Rank Min Max VDE BSI IEC
Safety Standards(2)
TÜV
CTR (%)(3)
@IF, VCE
UL/
C
UL
GB 100
600
TLP628-2
50
DIP8
Dual-channel version
of the TLP628
5 mA,
5 V
5000
Vrms
350 V / –
GB 100
TLP628-4
50
DIP16
4-channel version of
the TLP628
5 mA,
5 V
600
600
600
350 V 5000
Vrms / –
50 600
GR 100 300
TLP632
DIP6
High EMI immunity 5 mA,
5 V
5000
Vrms
55 V /
GB 100
5 mA,
5 V
4000
Vrms
55 V /
50 600
GB 100
TLP731
GR 100 300
DIP6
SEMKO-approved
Internal base
connection
600
600
TLP732
50 600
GR 100 300
GB 100
DIP6
SEMKO-approved 5 mA,
5 V
4000
Vrms
55 V /
5 mA,
5 V
4000
Vrms
55 V / –
50 600
GB 100
600
600
TLP733
TLP733F
GR 100 300
DIP6
SEMKO-approved
Internal base
connection
13
6
1
54
32
4
1
3
2
6
1
4
3
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
6
1
4
3
4
1
3
2
6
1
54
3
4
1
3
2
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative.
Note 6: About the package dimensions and lead form options, see each datasheet.
General-Purpose, Transistor-Output Photocouplers (Continued)
Part Number Pin Configuration Features VCEO BVs
Rank Min Max VDE BSI IEC
Safety Standards(2)
TÜV
CTR (%)(3)
@IF, VCE
UL/
C
UL
5 mA,
5 V
4000
Vrms
55 V / –
50 600
600
TLP734
TLP734F GR 100 300
GB 100
DIP6
SEMKO-approved
TLP781(6)
TLP781F(6)
DIP 4
High isolation voltage
UL-approved (double
protection)
/
5 mA,
5 V
5000
Vrms
80 V
50 600
Y 50 150
GR 100 300
BL 200
GB 100
YH 75 150
GRL 100 200
GRH 150 300
BLL 200 400
600
600
AC-Input, Transistor-Output Photocouplers
Part Number Pin Configuration Features VCEO BVs
Rank Min Max VDE BSI IEC
Safety Standards(2)
TÜV
CTR (%)(3)
@IF, VCE
UL/
C
UL
Mini-flat
MFSOP6
AC input
Low input drive current
±1 mA,
0.5 V
1200
TLP126 100 3750
Vrms
80 V /
±5 mA,
5 V
GB 100
TLP280-4
50 600
600
SOP16
4-channel version
of the TLP280
Lead pitch = 1.27 mm
AC input
SEMKO-approved
2500
Vrms
80 V /(1)
50 600
Y 50 150
GR 100 300
BL 200
GB 100
50 600
Y 50 150
GR 100 300
BL 200
GB 100
600
600
TLP280(4)
600
600
TLP180(4)
Mini-flat
MFSOP6
AC input
SEMKO-approved
TST part recm’ed
SOP4
Lead pitch = 1.27 mm
AC input
SEMKO-approved
TST part recm’ed
/
±5 mA,
5 V
2500
Vrms
80 V /
±5 mA,
5 V
3750
Vrms
80 V (1)
(1)
(1) (1)
50 ±5 mA,
5 V
GB 100
TLP130
600
600
Mini-flat
MFSOP6
AC input
Internal base
connection
3750
Vrms
80 V /
(5)
TLP785*(6)
TLP785F*(6)
DIP 4
High isolation voltage
UL-approved (double
protection)
/
5 mA,
5 V
5000
Vrms
80 V
50 600
Y 50 150
GR 100 300
BL 200
GB 100
YH 75 150
GRL 100 200
GRH 150 300
BLL 200 400
600
600
(5)
4Selection Guide
14
4
1
3
2
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
6
12
54
3
4
1
3
2
6
1
54
32
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
4
1
3
2
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
VCEO BVs
Rank Max VDE BSI IECTÜV@IF, VCEMin
UL/
C
UL
DIP4
Low input drive current
AC input
±1 mA,
0.5 V
BV 200
1200
TLP626
100 5000
Vrms
55 V / −
BV 200
TLP626-2
100
DIP8
Dual-channel version
of the TLP626
±1 mA,
0.5 V
5000
Vrms
1200 55 V / –
BV 200
TLP626-4
TLP630
100
DIP16
4-channel version of
the TLP626
±1 mA,
0.5 V
5000
Vrms
1200 55 V / –
–50
GB 100
600
DIP6
AC input
High isolation voltage
Internal base
connection
±5 mA,
5 V
5000
Vrms
55 V /
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
AC-Input, Transistor-Output Photocouplers (Continued)
Part Number Pin Configuration Features VCEO BVs Safety Standards(2)
CTR (%)(3)
DIP4
High input current
AC input
IF = 150 mA
TLP320 ±100 mA,
1 V
5000
Vrms
–2080 55 V /
DIP6
High input current
AC input
IF = 150 mA
Internal base
connection
TLP330 5000
Vrms
±100 mA,
1 V
–2080 55 V /
TLP320-2
DIP8
Dual-channel version
of the TLP320 –20 ±100 mA,
1 V
5000
Vrms
80 55 V /
TLP320-4
DIP16
4-channel version of
the TLP320
±100 mA,
1 V
5000
Vrms
–2080 55 V /
50 600
TLP620(4)
TLP620F(4)
Y50150
BL 200
GB 100
GR 100 300
600
600
DIP4
AC input
SEMKO-approved
TST part recm’ed
±5 mA,
5 V
5000
Vrms
55 V /
GB 100
TLP620-2(4)
TLP620F-2(4)
–50
DIP8
Dual-channel version
of the TLP620
SEMKO-approved
TST part recm’ed
±5 mA,
5 V
5000
Vrms
600
600
55 V /
GB 100
TLP620-4
–50
DIP16
4-channel version of
the TLP620
±5 mA,
5 V
5000
Vrms
600
600
55 V /
15
6
1
4
3
6
1
54
32
6
1
54
32
6
1
4
32
4
1
3
2
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
6
1
54
32
6
1
54
32
6
1
54
32
4
1
3
2
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item.
Darlington-Transistor-Output Photocouplers
Part Number Pin Configuration Features VCEO BVs
Min Max VDE BSI IEC
Safety Standards(2)
TÜV
CTR (%)(3)
@IC, IF
@I
F
, V
CE
VCE (sat)
UL/
C
UL
TLP127
Mini-flat
MFSOP6
High VCEO
1 mA,
1 V
100 mA,
10 mA
2500
Vrms
1.2 V 300 V
1000 /(1)
TLP372
TLP371
DIP6
High VCEO
SEMKO-approved
Internal base
connection
DIP6
High VCEO
SEMKO-approved
TLP373
DIP6
High VCEO
Long emitter-collector
distance
SEMKO-approved
/
1 mA,
1 V
100 mA,
10 mA
5000
Vrms
1000 1.2 V 300 V
/
1 mA,
1 V
100 mA,
10 mA
5000
Vrms
1000 1.2 V 300 V
/
1 mA,
1 V
100 mA,
10 mA
5000
Vrms
1000 1.2 V 300 V
TLP523 50 mA,
10 mA
2500
Vrms
1 V 55 V /
500
DIP4 1 mA,
1 V
TLP523-2 1 mA,
1 V
50 mA,
10 mA
2500
Vrms
500 1 V 55 V /
DIP8
Dual-channel version
of the TLP523
DIP16
4-channel version of
the TLP523
TLP523-4 50 mA,
10 mA
1 mA,
1 V
2500
Vrms
500 1 V 55 V /
TLP570 1 mA,
1 V
100 mA,
10 mA
2500
Vrms
1000 1.2 V 35 V /
1 mA,
1 V
100 mA,
10 mA
2500
Vrms
1000 1.2 V 35 V / –
DIP6
High EMI immunity
TLP572 / –
1 mA,
1.2 V
100 mA,
10 mA
2500
Vrms
1000 1.2 V 55V
TLP571
DIP6
Internal base
connection
DIP6
Built-in RBE
TLP627(4)
DIP4
High VCEO
SEMKO-approved
TST part recm’ed
100 mA,
10 mA
5000
Vrms
1.2 V 300 V1000 1 mA,
1 V /
TLP627-2(4)
DIP8
Dual-channel version
of the TLP627
SEMKO-approved
TST part recm’ed
1 mA,
1 V
100 mA,
10 mA
5000
Vrms
1000 1.2 V 300 V /
DIP16
4-channel version of
the TLP627
TLP627-4 100 mA,
10 mA
1 mA,
1 V
5000
Vrms
1000 1.2 V 300 V /
4Selection Guide
16
SHIELD
6
1
54
3
Vcc
GND
VCC
GND
8
1
65
43
7
2
SHIELD
SHIELD
6
1
54
3
Vcc
GND
1 Mbit/s
IPM
drive
Dual
polarity
input
5 Mbit/s
5 V
5 V
3.3 V
3.3 V/5 V
3.3 V/5 V
3.3 V/5 V
5 V
10 Mbit/s
15 to 20
Mbit/s
50 Mbit/s
0.3 Mbit/s
(TLP112)*2TLP109 TLP719 TLP512
TLP2403
TLP2409
TLP553
TLP550 TLP2530
6N138
6N139
6N135
(TLP112A)
*2TLP551 TLP2531 6N136
(TLP114A)
*2TLP559
TLP651
TLP750
TLP751
TLP759
(TLP114A(IGM))
*3
TLP559(IGM)
TLP2409(IGM)
TLP759(IGM)
TLP109(IGM)
TLP105 TLP715
TLP2405
TLP108 TLP718
TLP2408
TLP2105
TLP2108
TLP2095
TLP2098
TLP104
TLP714*1
TLP2404
TLP754*1
TLP555
TLP558
TLP2200
(TLP113)*4TLP513 TLP552 TLP2630 6N137
(TLP115)*4TLP554 TLP2631
(TLP115A)
*4TLP2601
TLP2366*1
TLP116A
TLP2368*1
TLP118
TLP2367*1TLP2467*1
TLP2466*1TLP2160*1
TLP2168*1
TLP2116
TLP2118
TLP2166A
TLP2766*1
TLP708
TLP716
TLP2768*1
TLP2767*1
TLP2167*1
TLP2468*1
TLP2418
TLP117
TLP2066
(TLP116)*5
SDIP6 DIP6 JEDEC
1ch 2ch 1ch 2ch
MFSOP6 SO6 SO8 DIP8
Data Rate
(Typ.) Output
Open-collector
(Darlington)
Open-collector
Open-collector
Open-
collector
Totem-pole
Totem-
pole
Totem-
pole
3-state
Package
Features
*1: Under development as of January 2011. For the latest information, please contact your nearest Toshiba sales representative.
*2: TLP109 recommended
*3: TLP109(IGM) recommended
*4: TLP118 recommended
*5: TLP116A recommended
Photocouplers for Logic Signal Transmission
2
Photocouplers for Logic Signal Transmission at 40 to 50 Mbit/s (Typ.)
Mini-flat
MFSOP6
Propagation delay time:
30 ns (max)
VCC = 5 V
SO8
VCC = 3.3 or 5 V
Topr (max) 125˚C
SO6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr (max) 125˚C
TLP117
TLP2167*
TLP2367*
3750
Vrms
2500
Vrms
3750
Vrms
50 Mbit/s
40 Mbit/s
40 Mbit/s
Totem pole
output
(Inverter logic)
Totem pole
output
(Inverter logic)
Totem pole
output
(Inverter logic)
5 mA
5 mA
5 mA
/
/
/
(1)
(2)
(1) (1)
Output Form VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Data Rate
(NRZ) (Typ.)
IFHL
(Max)
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
17
SHIELD
6
1
54
3
Vcc
GND
SHIELD
6
1
54
3
2
Vcc
GND
SHIELD
6
1
54
3
Vcc
GND
VCC
GND
8
1
65
43
7
2
SHIELD
6
1
54
3
SHIELD
VCC
GND
6
1
54
32
SHIELD
VCC
GND
VCC
GND
8
1
65
43
7
2
SHIELD SHIELD
6
1
54
3
2
Vcc
GND
VCC
GND
8
1
65
43
7
2
SHIELD
VCC
GND
8
1
65
43
7
2
SHIELD
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.)
SO6 (reinforced insulation)
High speed: 20 Mbit/s
VCC = 5 V
SO6 (reinforced insulation)
High speed: 20 Mbit/s
VCC = 5 V
Topr = 125°C (max)
TLP116A (1)
60 ns
60 ns
75 ns
3750
Vrms
Totem pole
output
(Inverter logic)
5 mA
5 mA
/
(1)
/
(1)
SDIP6
High speed: 15 Mbit/s
VCC = 5 V
High isolation voltage
TLP716
TLP716F 75 ns
Totem pole
output
(Inverter logic)
6.5 mA 5000
Vrms /
/
Mini-flat
MFSOP6
High speed: 20 Mbit/s
VCC = 3.3 V
TLP2066 3750
Vrms
60 ns
Totem pole
output
(Inverter logic) 5 mA
SO8
High speed: 15 Mbit/s
VCC = 5 V
Dual-channel version
(1)
(1)
(1)
(1)
/ (1)
(1)
SDIP6
High speed: 15 Mbit/s
VCC = 5 V
High isolation voltage
5000
Vrms
2500
Vrms
75 ns Open-collector
(Inverter logic) 5 mA /
/
TLP2116
Totem pole
output
(Inverter logic)
3750
Vrms
2500
Vrms
75 ns 5 mA /
/
SO8
High speed: 15 Mbit/s
VCC = 5 V
Open-collector
(Inverter logic)
3750
Vrms
TLP2118E*
TLP708*
TLP2418*
TLP118 5 mA
5 mA
Open-collector
(Inverter logic)
Output Form VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Propagation
Delay Time
(Max)
IFHL
(Max)
Photocouplers for Logic Signal Transmission at 40 to 50 Mbit/s (Typ.) (Continued)
Output Form VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Data Rate
(NRZ) (Typ.)
IFHL
(Max)
SO8
High speed: 15 Mbit/s
VCC = 5 V
TLP2767* 5000
Vrms
40 Mbit/s
Totem pole
output
(Inverter logic)
75 ns Open-collector
(Inverter logic)
5 mA
SDIP6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr (max) 125˚C
/
SO8
VCC = 3.3 or 5 V
Topr (max) 125˚C
TLP2467* 3750
Vrms
40 Mbit/s
Totem pole
output
(Inverter logic) 5 mA (1)
4Selection Guide
18
VCC
GND
6
1
5
2
4
3
VCC
8
1
65
43
7
2
SHIELD
GND
VCC
8
1
65
43
7
2
SHIELD
GND
VCC
8
1
65
43
7
2
GND SHIELD
6
1
54
3
Vcc
GND
VCC
GND
8
1
65
43
7
2
SHIELD
6
1
54
3
SHIELD
VCC
GND
VCC
GND
8
1
65
43
7
2
SHIELD
VCC
GND
8
1
65
43
7
2
SHIELD
SHIELD
6
1
54
3
2
Vcc
GND
6
1
54
32
SHIELD
VCC
GND
VCC
GND
8
1
65
43
7
2
SHIELD
VCC
GND
8
1
65
43
7
2
SHIELD
15 Mbit/s
TLP2166A
Totem pole
output
(Inverter logic)
2500
Vrms
5000
Vrms
5000
Vrms
3 mA
SO8
Propagation delay time: 75 ns
VCC = 3.3 V
Dual-channel version
/
/
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
Dual-channel version
3750
Vrms
3750
Vrms
3750
Vrms
3750
Vrms
3750
Vrms
20 Mbit/s
20 Mbit/s
20 Mbit/s
20 Mbit/s
20 Mbit/s
20 Mbit/s
20 Mbit/s
Open-collector
(Inverter logic) 5 mA
3.5 mA
5 mA
3.5 mA
5 mA
3.5 mA
5 mA
/ (1)
/
/
/
/
/
TLP2168*
TLP2366*
TLP2368*
TLP2466*
TLP2468
TLP2766*
TLP2768*
Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.) (Continued)
Output Form VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Data Rate
(NRZ) (Typ.)
IFHL
(Max)
(1)
(1)
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Photocouplers for Logic Signal Transmission at 10 Mbit/s (Typ.)
Output Form VDE BSI IECUL/cUL TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Propagation
Delay Time
(Max)
IFHL,
IFLH
(Max)
DIP8
High CMR
VCC = 5 V
/ –
/
/
DIP6
6-pin package version of
the TLP552
VCC = 5 V
TLP513 5 mA
DIP8
Logic output
VCC = 5 V
TLP552 5 mA
DIP8
High CMR version of
the TLP552
VCC = 5 V
2500
Vrms
/ –
2500
Vrms
TLP554 5 mA
TLP2601
120 ns
(Topr = 25˚C)
120 ns
(Topr = 25˚C)
75 ns
(Topr = 25˚C)
120 ns
(Topr = 25˚C) Open-collector
Open-collector
Open-collector
Open-collector 5 mA 2500
Vrms
2500
Vrms
Open-collector
(Inverter logic)
SO6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr = 125˚C (max)
SO6 (reinforced insulation)
VCC = 3.3 or 5 V
Topr = 125˚C (max)
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
SDIP6
VCC = 3.3 or 5 V
Topr = 125˚C (max)
SDIP6
VCC = 3.3 or 5 V
Topr = 125˚C (max)
Totem pole
output
(Inverter logic)
Open-collector
(Inverter logic)
Totem pole
output
(Inverter logic)
Open-collector
(Inverter logic)
Totem pole
output
(Inverter logic)
2500
Vrms
3.5 mA (1)
(1)
(1)
(1)
/
TLP2160*
SO8
VCC = 3.3 or 5 V
Topr = 125˚C (max)
Dual-channel version
20 Mbit/s
Totem pole
output
(Inverter logic)
19
SHIELD
6
12
54
3
Vcc
GND
SHIELD
6
12
54
3
Vcc
GND
VCC
8
1
65
43
7
2
SHIELD
GND
VCC
8
1
65
43
7
2
SHIELD
GND
SHIELD
6
1
54
3
Vcc
GND
SHIELD
6
1
54
3
Vcc
GND
VCC
GND
8
1
65
43
7
2
SHIELD SHIELD
6
1
54
3
Vcc
GND
SHIELD
6
1
54
3
Vcc
GND
VCC
GND
8
1
65
43
7
2
SHIELD
8
1
65
43
7
2
VCC
GND
VCC
GND
8
1
65
43
7
2
SHIELD
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
1.6 mA (1)
SO8
VCC = 4.5 to 20 V
Low input operation
IPM drive
/
250 ns
Totem pole
output
(Inverter logic)
3750
Vrms
Output Form VDE BSI IECUL/cUL TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Propagation
Delay Time
(Max)
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.)
IFHL,
IFLH
(Max)
SDIP6
IPM drive
High CMR
VCC = 4.5 to 20 V
SDIP6
IPM drive
High CMR
VCC = 4.5 to 20 V
Totem pole
output
(Inverter logic)
TLP718
TLP718F
TLP715
TLP715F
5000
Vrms
Totem pole
output
(Buffer logic)
3 mA
3 mA
5000
Vrms /
/
DIP8
Inverting logic version of
the TLP555
VCC = 4.5 to 20 V
2500
Vrms
TLP558 /
2500
Vrms /
DIP8
Low input current
VCC = 4.5 to 20 V
TLP555
TLP2408
1.6 mA
400 ns
(Topr = 25˚C)
250 ns
250 ns
3-state
(Inverter logic)
1.6 mA
400 ns
(Topr = 25˚C)
3-state
(Buffer logic)
3 mA
Mini-flat
MFSOP6
Dual polarity input version
of the TLP105
VCC = 3 to 20 V
TLP2095
Totem pole
output
(Buffer logic)
Totem pole
output
(Inverter logic)
3750
Vrms
3750
Vrms
Mini-flat
MFSOP6
Dual polarity input version
of the TLP108
VCC = 3 to 20 V
TLP2098 3 mA250 ns
250 ns / (1)
/ (1)
(1)
1.6 mA (1)
Mini-flat
MFSOP6
VCC = 4.5 to 20 V
Low input operation
IPM drive
/
TLP105 250 ns
Totem pole
output
(Buffer logic)
3750
Vrms
1.6 mA (1)
SO8
VCC = 4.5 to 20 V
Low input operation
IPM drive
/
250 ns
Totem pole
output
(Buffer logic)
3750
Vrms
(1)
1.6 mA (1)
Mini-flat
MFSOP6
VCC = 4.5 to 20 V
Low input operation
IPM drive
/
TLP108 250 ns
Totem pole
output
(Inverter logic)
3750
Vrms
TLP2405
/
/
Open-collector
Open-collector
DIP8
Dual-channel version of
the 6N137 and the TLP552
VCC = 5 V
DIP8
High CMR
Dual-channel version of
the TLP554
VCC = 5 V
2500
Vrms
2500
Vrms
TLP2630 75 ns
(Topr = 25˚C)
TLP2631 75 ns
(Topr = 25˚C)
5 mA
5 mA
Photocouplers for Logic Signal Transmission at 10 Mbit/s (Typ.) (Continued)
Output Form VDE BSI IECUL/cUL TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Propagation
Delay Time
(Max)
IFHL,
IFLH
(Max)
4Selection Guide
20
VCC
8
1
65
43
7
2
SHIELD
GND
VCC
GND
8
1
65
43
7
2
SHIELD
VCC
GND
8
1
65
43
7
2
SHIELD
SHIELD
6
1
54
3
8
1
65
43
7
2
SHIELD
8
1
65
43
7
2
SHIELD
6
1
5
2
4
3
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
SHIELD
321
654
8
1
65
43
7
2
8
1
65
43
7
2
(1)
(1)
1.6 mA
1.6 mA
(1)
(1)
SO8
Dual-channel version for
the TLP105
VCC = 4.5 to 20 V
SO8
Dual-channel version for
the TLP108
VCC = 4.5 to 20 V
/
/
TLP2105
TLP2108
Totem pole
output
(Buffer logic)
Totem pole
output
(Inverter logic)
3750
Vrms
3750
Vrms
2500
Vrms /
DIP8
Low input current
VCC = 4.5 to 20 V
TLP2200 1.6 mA
400 ns
250 ns
250 ns
3-state
(Buffer logic)
SO6 (reinforced insulation)
TLP109
TLP2409
3750
Vrms
1 Mbit/s 20% (min) 16 mA (1)
/
SO8
Topr = 125˚C(max)
SO8 version of the TLP109
16 mA1 Mbit/s 20% (min) /(1)
3750
Vrms
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)
CTR VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Data Rate
(NRZ) (Typ.) @IF
DIP6
6-pin package version
of the TLP550
DIP8
High CMR
TLP512
TLP550
2500
Vrms
1 Mbit/s 20% (min) 16 mA / –
10% (min)
(19% min for rank 0)
2500
Vrms
1 Mbit/s 16 mA /
DIP8
Internal base connection
TLP551
TLP2403
2500
Vrms
10% (min)
(19% min for rank 0)
1 Mbit/s 16 mA /
DIP8
Low input drive current 2500
Vrms
TLP553 300 kbit/s 400% (min)
0.5 mA
/ –
DIP8
Internal base connection
TLP651 10% (min)
(19% min for rank 0)
1 Mbit/s 16 mA /
SDIP6
High CMR
TLP719
TLP719F
5000
Vrms
5000
Vrms
1 Mbit/s 20% (min) 16 mA /
DIP8
High CMR version
of the TLP550
2500
Vrms
TLP559 20% (min) 16 mA /
1 Mbit/s
SO8
Low input current
SO8 version of the TLP553 0.5 mA300 kbit/s 400% (min) /(1)
3750
Vrms
Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)
Output Form VDE BSI IECUL/cUL TÜV
Part Number Pin Configuration Features Safety Standards(2)
Propagation
Delay Time
(Max)
IFHL,
IFLH
(Max)
BVs
21
SHIELD
6
1
54
3
8
1
65
43
7
2
SHIELD
SHIELD
6
1
54
3
SHIELD
6
1
54
3
8
1
765
42 3
SHIELD
8
1
765
42 3
SHIELD
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
SHIELD
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
IPM-Drive Photocouplers
Output Form/CTR
VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Propagation
Delay Time
(Max)
IFHL,
IFLH
(Max)
SO8
IPM drive
High CMR
3750
Vrms
800 ns 20% (min) 10 mA
SO6 (reinforced insulation)
IPM drive
High CMR
3750
Vrms
25% (min) 10 mA / (1)
(1)
800 ns
5 mA
SO6 (reinforced insulation)
IPM drive
Topr = 125°C (max)
TLP104 550 ns Open-collector /
3750
Vrms
5 mA
SDIP6
(reinforced insulation)
IPM drive
Topr = 125°C (max)
High isolation voltage
550 ns Open-collector
(Inverter logic)
/
5000
Vrms
5 mA
DIP8
IPM drive
TLP754*
TLP754F*
TLP109(IGM)
TLP2409(IGM)
TLP714
TLP714F
TLP2404
Open-collector 5000
Vrms
550 ns /
/ (1)
5 mA (1)
SO8
IPM drive
Topr = 125°C (max)
SO8 version of the TLP104
/
550 ns Open-collector
(Inverter logic)
3750
Vrms
DIP8
High CMR
SEMKO-approved
DIP8
Internal base connection
SEMKO-approved
5000
Vrms
1 Mbit/s 10% (min) 16 mA
TLP750
TLP750F
TLP751
TLP751F
10% (min)
(19% min for rank 0)
1 Mbit/s 16 mA /
5000
Vrms /
DIP8
IEC60950-compliant
version of the TLP559
SEMKO-approved
TLP759
TLP759F
5000
Vrms
1 Mbit/s 20% (min) 16 mA /
/
DIP8
Dual-channel version of
the 6N135 and the TLP550
DIP8
Dual-channel version of
the 6N136 and the TLP550
TLP2530 1 Mbit/s 7% (min)
TLP2531 1 Mbit/s 19% (min)
16 mA
/
16 mA
2500
Vrms
2500
Vrms
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.) (Continued)
CTR VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Data Rate
(NRZ) (Typ.) @IF
4Selection Guide
22
8
1
65
43
7
2
SHIELD
8
1
65
43
7
2
SHIELD
VCC
GND
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
DIP8
IPM drive
High CMR
TLP559
(IGM)
2500
Vrms
800 ns 25% (min) 10 mA /
5000
Vrms
25% (min) 10 mA
DIP8
IPM drive
High CMR
SEMKO-approved
TLP759(IGM)
TLP759F(IGM)
/
800 ns
± 0.25 A
± 0.45 A (max)
± 0.6 A (max)
± 2.0 A (max)
± 2.5 A (max)
Output Peak
Current
Package
SDIP6 DIP8 SO6 SO8
TLP705 (High speed)
TLP701
TLP700H*
TLP700
TLP701A*
TLP701H*
TLP705A*
TLP350H*
TLP352*
TLP151*
TLP557
TLP351
TLP351E
TLP351A*
TLP351H*
TLP155E
TLP151A*
TLP350
TLP2451
TLP2451A*
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Photocouplers for IGBT/MOSFET Gate Drive
3
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
JEDEC-Compliant Photocouplers
CTR VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Data Rate
(NRZ) (Typ.)
I
FHL
,I
FLH
(Max)
JEDEC-compliant
JEDEC-compliant
JEDEC-compliant
JEDEC-compliant
High CTR
JEDEC-compliant
High CTR
6N135 7% (min)
2500
Vrms
6N136 19% (min)
2500
Vrms
2500
Vrms
2500
Vrms
2500
Vrms
6N138 300 kbit/s 300% (min) 1.6 mA
400% (min) 0.5 mA
1 Mbit/s 16 mA
6N137 10 Mbit/s 700% (Typ.) 5 mA
/ –
300 kbit/s / –
/ –
1 Mbit/s 16 mA / –
/ –
6N139
IPM-Drive Photocouplers (Continued)
Output Form/CTR
VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards(2)
Propagation
Delay Time
(Max)
IFHL,
IFLH
(Max)
23
6
1
54
3
6
1
54
3
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
8
1
65
43
7
2
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Photocouplers for IGBT/MOSFET Gate Drive
Output VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards (2)
Propagation
Delay Time (Max)
IFHL
(Max)
SO6 (reinforced Insulation)
Topr = 110°C (max)
Direct drive of a
small-power
IGBT/MOSFET
TLP151*
TLP155E
TLP2451
3750
Vrms
3750
Vrms
0.7 μs
0.2 μs
Peak output
current (max):
±0.6 A
Peak output
current (max):
±0.6 A
5 mA
7.5 mA
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
Low power dissipation
SO8
Topr = 125°C (max)
Direct drive of a
small-power
IGBT/MOSFET
High CMR
TLP350
TLP350F
TLP350H*
TLP350HF*
3750
Vrms
0.5 μsPeak output
current (max):
±2.5 A
5 mA /
DIP8
Topr = 125°C (max)
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
3750
Vrms
0.5 μsPeak output
current (max):
±2.5 A
Peak output
current (max):
±2.5 A
5 mA /
/
/
/
/
TLP151A* 0.5 μs/
/
(1)
(1)
3750
Vrms
0.7 μsPeak output
current (max):
±0.6 A
5 mA
/
TLP2451A* 0.5 μs/
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
TLP351
TLP351F
TLP351A*
TLP351AF*
TLP351H*
TLP351HF*
TLP352*
TLP352F*
3750
Vrms
3750
Vrms
0.7 μs
0.7 μs
Peak output
current (max):
±0.6 A
Peak output
current (max):
±0.6 A
5 mA
5 mA
/
3750
Vrms
3750
Vrms
0.7 μs
0.2 μs
Peak output
current (max):
±6.0 A
5 mA
5 mA
DIP8
Topr = 125°C (max)
Direct drive of a
small-power
IGBT/MOSFET
High CMR
SO6 (reinforced Insulation)
Topr = 100°C (max)
Direct drive of a
small-power
IGBT/MOSFET
DIP8
Direct drive of a
small-power
IGBT/MOSFET
Low power dissipation
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
Topr = 125°C (max)
4Selection Guide
24
8
1
65
43
7
2
6
12
54
3
6
12
54
3
6
12
54
3
6
12
54
3
6
12
54
3
6
12
54
3
6
12
54
3
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Photocouplers for IGBT/MOSFET Gate Drive (Continued)
Output VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards (2)
Propagation
Delay Time (Max)
IFHL
(Max)
DIP8
Direct drive of a power
transistor
TLP557 2500
Vrms
5μsConstant current
output : 0.25 A 5 mA /
SDIP6
Topr = 125°C (max)
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
5000
Vrms
0.5 μsPeak output
current (max):
±2.0 A
5 mA /
SDIP6
Topr = 125°C (max)
Direct drive of a
small-power
IGBT/MOSFET
High CMR
5000
Vrms
0.7 μs
0.7 μs
Peak output
current (max):
±0.6 A
5 mA /
/
/
SDIP6
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
TLP701
TLP701F
TLP701H*
TLP701HF*
TLP705A*
TLP705AF*
TLP701A*
TLP701AF*
TLP705
TLP705F
SDIP6
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
TLP700
TLP700F
TLP700H*
TLP700HF*
5000
Vrms
5000
Vrms
0.7 μsPeak output
current (max):
±0.6 A
Peak output
current (max):
±0.6 A
5 mA
5 mA
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
High speed (250 kHz)
Low power dissipation
8 mA
7.5 mA
5000
Vrms
5000
Vrms
0.2 μs
0.2 μs
Peak output
current (max):
±0.45 A
5000
Vrms
0.5 μsPeak output
current (max):
±2.0 A
5 mA
/
/
/
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
Low power dissipation
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
High speed
Low power dissipation
Peak output
current (max):
±0.6 A
25
Photorelays (1-Form-A and 2-Form-A)
4
20
40
60
80
100
50
350
200
400
600
8
5
1.2
1.2
0.05
35
15
14
10
3
1.5
0.13
0.06
2
2
0.7
0.2
0.1
25
20
12
8
1.2
0.15
14
50
35
35
35
12
35
4
60
0.16
0.2
0.3
0.45
2.5
0.05 4
0.08
0.12
0.12
0.14
0.25
2.5
0.06 3.5
0.3
1
50 0.07
50 0.1
0.4
0.5
1
0.07 3
1.5
0.2 1.4
0.2 2
2.5
0.04
0.1
0.12
0.2
0.35
1.25
0.08
0.05
0.2
0.11
0.12
0.12
0.15
0.12
0.2
0.09
TLP3230
TLP3250
TLP3231
0.22 0.9 TLP3203
TLP3213
TLP3216
TLP3240
TLP3241
TLP3214
TLP3215
TLP3375
TLP3123
TLP3217
TLP3220
TLP3130
TLP3131
TLP3113
TLP3116
TLP3114
TLP3115
TLP172A
TLP170A
TLP176A
TLP3122
TLP3105
TLP3118TLP3218
TLP3111
TLP3119TLP3219
TLP3121
TLP179D
TLP176D
8
0.258
TLP170D
TLP172G
50 0.1 TLP170G
TLP176G
TLP174G
TLP176GA
TLP174GA
TLP3100
TLP3102
TLP192A
TLP197A
TLP3120
TLP199D
TLP197D
TLP192G
TLP197G
TLP197GA
TLP202A
TLP173A
1.5 0.3 TLP3275
TLP206A
TLP209D
TLP200D
TLP202G
TLP206G
TLP220J*
TLP220GA*
TLP206GA
TLP3125
TLP221A*
TLP220D*
TLP220G*
TLP222A
TLP227A
TLP222G
TLP227G
TLP224G
TLP227GA
TLP224GA
TLP598AATLP220A*
TLP592A
TLP597A
TLP3542
TLP3544*
TLP3543*
TLP3545*
TLP3546*
0.07 2.3 TLP3103
TLP592G
TLP597G
TLP597GA
TLP797GA
TLP598GA
TLP798GA
TLP170J
35 0.1 TLP797J
TLP222A-2
TLP227A-2
0.4 TLP3312
1
1.1 0.5 TLP225A
1.2 0.35 TLP3110
1.5 0.4 TLP3212
TLP222G-2
TLP227G-2
TLP224G-2
TLP227GA-2
TLP224GA-2
DIP6DIP42.54SOP82.54SOP62.54SOP4SSOP4 SO6USOP4 DIP8
Off-State
Voltage
(max)
(V)
On-State
Resistance
(max)
(Ω)
On-State
Current
(max)
(A)
Package
Features
Dual-channel : MFSOP6
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
TLP175A*
4Selection Guide
26
1
43
2
1
43
2
1
64
3
MOSFET-Output Photorelays, 1-Form-A in a USOP4 Package
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
IEC
500
Vrms
60 V
TLP3312* 1Ω
3 mA 5 mA 0.4 A
USOP4
COFF: 20 pF (typ.)
500
Vrms
50 V
TLP3375* 1.5 Ω
3 mA 5 mA
50 Ω2 mA
0.3 A
USOP4
COFF: 12 pF (typ.)
MOSFET-Output Photorelays, 1-Form-A in a SO6 Package
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
3750
Vrms
60 V
TLP175A* 1 mA 0.1 A
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
MOSFET-Output Photorelays, 1-Form-A in a SSOP4 Package
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
SSOP4
COFF: 20 pF (typ.)
SSOP4
COFF: 40 pF (typ.)
/ –
/ –
TLP3212
TLP3203
5 mA 1.5 Ω5 mA 0.4 A
3 mA 0.22 Ω5 mA 0.9 A 20 V
60 V
40 V
40 V
40 V
40 V
SSOP4
COFF: 5 pF (typ.)
SSOP4
COFF: 2.5 pF (typ.)
SSOP4
COFF: 6.5 pF (typ.) / –
/
TLP3219
/ –
TLP3218
TLP3217 / –
80 V
80 V
80 V
20 V
20 V
3 mA
5 mA
5 mA
8Ω
12 Ω
25 Ω
5 mA
10 mA
5 mA
0.2 A
0.12 A
0.04 A
IEC
SSOP4
COFF: 6 pF (typ.) / –
TLP3220 100 V5 mA 14 Ω10 mA 0.08 A
/ –
TLP3213 35 Ω
4 mA 5 mA 0.08 A
SSOP4
COFF: 0.6 pF (typ.)
/ –
TLP3214 3Ω
4 mA 5 mA 0.25 A
SSOP4
COFF: 5 pF (typ.)
TLP3215 1.5 Ω
4 mA 5 mA 0.3 A
SSOP4
COFF: 10 pF (typ.) / –
TLP3216 15 Ω
4 mA 5 mA 0.12 A
SSOP4
COFF: 1 pF (typ.) / –
TLP3230 / –
8Ω
4 mA 5 mA 0.16 A
SSOP4
COFF: 1 pF (typ.)
TLP3231 / –
1.2 Ω
4 mA 5 mA 0.45 A
SSOP4
COFF: 5 pF (typ.)
/ –
TLP3240 14 Ω
3 mA 5 mA 0.12 A
SSOP4
COFF: 0.45 pF (typ.)
/ –
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
40 V
40 V
TLP3241 10 Ω
3 mA 5 mA 0.14 A
SSOP4
COFF: 0.7 pF (typ.)
/ –
1500
Vrms
20 V
TLP3250 5Ω
3 mA 5 mA 0.2 A
SSOP4
COFF: 0.8 pF (typ.)
/ –
1500
Vrms
50 V
TLP3275 1.5 Ω
3 mA 5 mA 0.3 A
SSOP4
COFF: 12 pF (typ.)
SO6
General-purpose
Low trigger current
27
1
43
2
1
43
2
1
64
3
TLP176A 1500
Vrms (1)
/
2Ω
3 mA 5 mA 0.4 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 130 pF (typ.) 60 V
TLP173A 3750
Vrms /
50 Ω
2 mA 3 mA 0.07 A
Mini-flat
MFSOP6
Low trigger LED current 60 V
1500
Vrms / –
TLP3110 1.2 Ω
4 mA 5 mA 0.35 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 100 pF (typ.) 60 V
/ –
1500
Vrms
TLP3116
/ –
TLP3113 35 Ω
4 mA 5 mA 40 V
1500
Vrms
40 V
15 Ω
4 mA 5 mA 0.12 A
0.08 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 0.6 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 1 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 2.5 pF (typ.) / –
1500
Vrms
TLP3118 80 V3 mA 25 Ω5 mA 0.04 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 11 pF (typ.) / –
1500
Vrms
TLP3111 80 V4 mA 20 Ω5 mA 0.1 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 15 pF (typ.) /
TLP179D 1500
Vrms
200 V3 mA 50 Ω5 mA 0.05 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 100 pF (typ.)
TLP176D /(1)
1500
Vrms
200 V3 mA 8Ω5 mA 0.2 A
/ –
TLP3115
/ –
TLP3114 1500
Vrms
40 V
1500
Vrms
40 V
1.5 Ω
4 mA 5 mA 0.3 A
3Ω
4 mA 5 mA 0.25 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 5 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 10 pF (typ.)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
1500
Vrms /(1)
TLP176G 350 V
35 Ω
3 mA 5 mA 0.12 A
2.54SOP4
Lead pitch: 2.54 mm
SEMKO-approved
COFF: 40 pF (typ.)
TLP176GA 1500
Vrms /
400 V
35 Ω
3 mA 5 mA 0.12 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 70 pF (typ.)
1500
Vrms
1500
Vrms
TLP174G /
350 V
400 V
35 Ω
3 mA 5 mA 0.12 A
2.54SOP4
Lead pitch: 2.54 mm
SEMKO-approved
Current-limiting function
Limit current: 150 to 300 mA
TLP174GA /
35 Ω
3 mA 5 mA 0.12 A
2.54SOP4
Lead pitch: 2.54 mm
Current-limiting function
Limit current: 150 to 300 mA
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
/
60 V
TLP170A 2Ω
1 mA 2 mA 0.4 A
2.54SOP4
Lead pitch: 2.54 mm
Low trigger LED current
/
200 V
TLP170D 8Ω
1 mA 2 mA 0.2 A
2.54SOP4
Lead pitch: 2.54 mm
Low trigger LED current
/
350 V
TLP170G 50 Ω
1 mA 2 mA 0.1 A
2.54SOP4
Lead pitch: 2.54 mm
Low trigger LED current
/
600 V
60 V
TLP170J 60 Ω
1 mA 2 mA 0.09 A
2.54SOP4
Lead pitch: 2.54 mm
Low trigger LED current
TLP172A /
2Ω
3 mA 5 mA 0.4 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 130 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 30 pF (typ.) /
TLP172G 35 Ω
3 mA 5 mA 0.11 A 350 V
4Selection Guide
28
6
1
54
32
1
8765
32 4
1
43
2
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP6 or 2.54SOP8 Package
TLP192A 1500
Vrms /
2.54SOP6
Lead pitch: 2.54 mm
COFF: 130 pF (typ.
)
60 V
1500
Vrms
60 V
3 mA 2Ω5 mA 0.4 A
TLP197A /
2.54SOP6
Lead pitch: 2.54 mm
COFF: 130 pF (typ.
)
3 mA 2Ω5 mA 0.4 A
2.54SOP6
Lead pitch : 2.54 mm
ION: 1.25 A (max) /
TLP3120 1500
Vrms
80 V5 mA 0.15 Ω5 mA 1.25 A
2.54SOP6
Lead pitch: 2.54 mm
COFF: 15 pF (typ.
)
TLP199D /
1500
Vrms
200 V
3 mA 50 Ω5 mA 0.05 A
2.54SOP6
Lead pitch: 2.54 mm
COFF: 100 pF (typ.
)
TLP197D /
8Ω3 mA 5 mA 200 V0.2 A 1500
Vrms
1500
Vrms /
TLP192G 350 V35 Ω3 mA 5 mA 0.11 A
2.54SOP6
Lead pitch: 2.54 mm
COFF: 30 pF (typ.
)
1500
Vrms /(1)
TLP197G 350 V
TLP197GA / –
1500
Vrms
400 V
35 Ω3 mA 5 mA 0.12 A
2.54SOP6
Lead pitch: 2.54 mm
COFF: 70 pF (typ.
)
35 Ω3 mA 5 mA 0.12 A
2.54SOP6
Lead pitch: 2.54 mm
SEMKO-approved
TLP3125 /
1500
Vrms
400 V4Ω3 mA 5 mA 0.2 A
2.54SOP8
Lead pitch: 2.54 mm
COFF: 410 pF (typ.
)
1500
Vrms /
TLP3100 20 V
0.05 Ω5 mA 2.5 A3 mA
2.54SOP6
Lead pitch : 2.54 mm
ION: 2.5 A (max) @Ta: up to 50˚C
MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package (Continued)
20 V
20 V
1500
Vrms
40 V
/
1500
Vrms
0.7 Ω
3 mA 5 mA 1.0 A
TLP3122 60 V
/
TLP3123 0.13 Ω
3 mA 5 mA 1.0 A
1500
Vrms
1500
Vrms
/ –
TLP3131 / –
1.2 Ω
8Ω
4 mA
4 mA
5 mA
5 mA
TLP3130
0.3 A
0.16 A
2.54SOP4
Lead pitch: 2.54 mm
COFF: 1 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
ION: 1 A (max)@Ta: up to 50˚C
COFF: 90 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
ION: 1 A (max)@Ta: up to 50˚C
COFF: 300 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 5 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 6.5 pF (typ.)
2.54SOP4
Lead pitch: 2.54 mm
COFF: 30 pF (typ.) /
TLP3121
/ –
TLP3119 1500
Vrms
80 V
1500
Vrms
80 V4 mA
3 mA
1.2 Ω
8Ω
5 mA
5 mA
0.35 A
0.2 A
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
1500
Vrms /
TLP3102 40 V0.06 Ω5 mA 2.5 A3 mA
2.54SOP6
ION (DC) = 5 A (max); C-connection
1500
Vrms /
TLP3103 60 V0.07 Ω5 mA 2.3 A3 mA
2.54SOP6
ION (DC) = 4.6 A (max); C-connection
1500
Vrms /
TLP3105 100 V0.2 Ω5 mA 1.4 A3 mA
2.54SOP6
ION (DC) = 2.8 A (max); C-connection
29
1
43
2
4
1
3
2
8
1
65
4
3
7
2
MOSFET-Output Photorelays, 1-Form-A in a DIP4 Package
DIP4
COFF: 130 pF (typ.)
2500
Vrms /
TLP222A 60 V
3 mA 2Ω5 mA 0.5 A
DIP4 SEMKO-approved
COFF: 130 pF (typ.) /
2500
Vrms
TLP227A 60 V
3 mA 2Ω5 mA 0.5 A
2500
Vrms /
TLP225A 1.1 Ω5 mA 10 mA 0.5 A
DIP4
Designed for DC output modules 60 V
/
TLP222G 2500
Vrms
/
2500
Vrms
350 V
TLP224G 35 Ω3 mA 5 mA 0.12 A
DIP4 SEMKO-approved
Current-limiting function
Limit current: 150 to 300 mA
350 V
50 Ω3 mA 5 mA 0.12 A
DIP4
COFF: 30 pF (typ.)
/ –
2500
Vrms
TLP224GA 400 V
35 Ω3 mA 5 mA 0.12 A
DIP4 For modems
Current-limiting function
Limit current: 150 to 300 mA
/ –
2500
Vrms
TLP227GA 400 V
35 Ω3 mA 5 mA 0.12 A
DIP4
SEMKO-approved
TLP227G /
2500
Vrms
350 V
35 Ω3 mA 5 mA 0.12 A
DIP4
SEMKO-approved
COFF: 40 pF (typ.)
5000
Vrms /
/
/
/
/
/
TLP220A* 60 V2 mA 2Ω5 mA ±0.5 A
5000
Vrms
TLP220J* 600 V2 mA 60 Ω5 mA ±0.09 A
TLP220D* 5000
Vrms
5000
Vrms
350 V
TLP220G* 50 Ω2 mA 5 mA ±0.1 A
200 V8Ω2 mA 5 mA ±0.25 A
5000
Vrms
TLP220GA* 400 V
35 Ω2 mA 5 mA ±0.12 A
TLP221A* 5000
Vrms
60 V
0.2 Ω2 mA 5 mA ±1.5 A
MOSFET-Output Photorelays, 2-Form-A in a 2.54SOP8 Package
1500
Vrms
TLP200D / –
200 V
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP176D 8Ω5 mA3 mA 0.2 A
1500
Vrms / –
TLP202A 60 V
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP172A 2Ω5 mA3 mA 0.4 A
1500
Vrms
TLP202G / –
350 V
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP172G 50 Ω5 mA3 mA 0.11 A
TLP206A / –
1500
Vrms
60 V
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP176A 2Ω5 mA3 mA 0.4 A
1500
Vrms
TLP206G 350 V
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP176G 35 Ω5 mA3 mA 0.12 A / – (1)
1500
Vrms
TLP206GA / –
400 V
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP176GA
35 Ω5 mA3 mA 0.12 A
1500
Vrms / –
TLP209D 200 V
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP179D 50 Ω5 mA3 mA 0.05 A
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
DIP4
General-purpose
Reinforced insulation
DIP4
General-purpose
Reinforced insulation
DIP4
General-purpose
Reinforced insulation
DIP4
General-purpose
Reinforced insulation
DIP4
General-purpose
Reinforced insulation
DIP4
General-purpose
Reinforced insulation
4Selection Guide
30
8
1
65
4
3
7
2
6
1
54
32
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
MOSFET-Output Photorelays, 2-Form-A in a DIP8 Package
/
TLP222A-2 2500
Vrms
60 V
DIP8
Dual-channel version of the TLP222A 2Ω5 mA3 mA 0.5 A
TLP222G-2 2500
Vrms /
350 V
DIP8
Dual-channel version of the TLP222G
SEMKO-approved
50 Ω5 mA3 mA 0.12 A
TLP224G-2 /
2500
Vrms
350 V
DIP8
Dual-channel version of the TLP224G
SEMKO-approved
35 Ω5 mA3 mA 0.12 A
/ –
TLP224GA-2 2500
Vrms
400 V
DIP8
Current-limiting function
Limit current: 150 to 300 mA
35 Ω5 mA3 mA 0.12 A
TLP227A-2 /
2500
Vrms
60 V
DIP8
Dual-channel version of the TLP227A
SEMKO-approved
2Ω5 mA3 mA 0.5 A
MOSFET-Output Photorelays, 1-Form-A in a DIP6 Package
DIP6
COFF: 130 pF (typ.) / –
2500
Vrms
DIP6
SEMKO-approved
COFF: 130 pF (typ.)
/ –
TLP597A 2500
Vrms
60 V3 mA 2Ω5 mA 0.5 A
TLP592A 60 V3 mA 2Ω5 mA 0.5 A
DIP6
COFF: 130 pF (typ.) / –
TLP598AA 2500
Vrms
DIP6
High output current: 2.5 A (max)
COFF: 400 pF (typ.)
TLP3542 /
2500
Vrms
60 V3 mA 0.1 Ω10 mA 2.5 A
60 V3 mA 2Ω5 mA 0.5 A
/ –
2500
Vrms
350 V
TLP592G 50 Ω
3 mA 5 mA 0.12 A
DIP6
COFF: 30 pF (typ.)
2500
Vrms / –
350 V
35 Ω
3 mA 5 mA
TLP597G 0.12 A
DIP6
SEMKO-approved
COFF: 40 pF (typ.)
5000
Vrms / –
400 V
35 Ω
3 mA 5 mA
TLP797GA
TLP797GAF 0.12 A
DIP6
COFF: 40 pF (typ.)
5000
Vrms / –
400 V
12 Ω
5 mA 5 mA
TLP798GA 0.15 A
DIP6
5000
Vrms /
600 V
35 Ω
5 mA 10 mA
TLP797J
TLP797JF 0.1 A
DIP6
COFF: 120 pF (typ.)
DIP6
SEMKO-approved
COFF: 70 pF (typ.)
2500
Vrms / –
3 mA
TLP597GA 35 Ω5 mA 400 V
DIP6 2500
Vrms / –
3 mA
TLP598GA 12 Ω5 mA 400 V0.15 A
0.12 A
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
2500
Vrms /
TLP3543* 20 V
DIP6
High output current: 4 A (max)
DIP6
High output current: 3.5 A (max)
DIP6
High output current: 3 A (max)
DIP6
High output current: 2 A (max)
0.05 Ω5 mA3 mA 4 A
2500
Vrms /
TLP3544* 40 V0.06 Ω5 mA3 mA 3.5 A
2500
Vrms /
TLP3545* 60 V0.07 Ω5 mA3 mA 3 A
2500
Vrms /
TLP3546* 100 V0.2 Ω5 mA3 mA 2 A
31
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
1
43
2
6
1
54
3
2
1
43
2
6
1
54
3
2
6
1
54
3
2
1
43
2
8
1
65
4
3
7
2
Photorelays (1-Form-B, 2-Form-B and 1-Form-A/1-Form-B)
5
MOSFET-Output Photorelays, 1-Form-B
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
2.54SOP4
Lead pitch: 2.54 mm
1-Form-B
2.54SOP6
Lead pitch: 2.54 mm
1-Form-B
DIP4
1-Form-B
DIP6
1-Form-B
2.54SOP4
Lead pitch: 2.54 mm
1-Form-B
2.54SOP6
Lead pitch: 2.54 mm
1-Form-B
TLP4197G / –
1500
Vrms
1500
Vrms
/ –
TLP4176G
TLP4592G / –
/ –
TLP4222G
2500
Vrms
2500
Vrms
TLP4192G / –
1500
Vrms
1500
Vrms
/ –
25 Ω
25 Ω
50 Ω
50 Ω
50 Ω
50 Ω
3 mA
3 mA
3 mA
3 mA
3 mA
3 mA
0 mA
0 mA
0 mA
0 mA
0 mA
0 mA
TLP4172G
350 V
350 V
350 V
350 V
350 V
350 V
0.12 A
0.12 A
0.1 A
0.1 A
0.09 A
0.09 A
On-State
Current
(max)
(A)
Off-State
Voltage
(max)
(V)
On-State
Resistance
(max)
(Ω)
Features
Package
0.0950
0.1050
350
1-Form-B,
2-Form-B
1-Form-A/
1-Form-B
0.1225
0.1525
0.0950
0.1050350
0.1225
2.54SOP4 2.54SOP6 2.54SOP8 DIP4 DIP6 DIP8
TLP4172G TLP4192G TLP4202G*
TLP4222G TLP4592G TLP4222G-2*
TLP4176G TLP4197G TLP4206G*
TLP4227G TLP4597G TLP4227G-2*
TLP4027G*
TLP4007G*
TLP4026G*TLP4006G*
* Dual-channel
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
TLP227G-2 2500
Vrms /
350 V
DIP8
Dual-channel version of the TLP227G
SEMKO-approved
35 Ω5 mA3 mA 0.12 A
DIP8
Dual-channel version of the TLP227GA
SEMKO-approved
TLP227GA-2 2500
Vrms / –
400 V
35 Ω5 mA3 mA 0.12 A
MOSFET-Output Photorelays, 2-Form-A in a DIP8 Package (Continued)
4Selection Guide
32
8
1
65
43
7
2
8
1
65
43
7
2
MOSFET-Output Photorelays, 2-Form-B
MOSFET-Output Photorelays, 1-Form-A/1-Form-B
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP4172G
2-Form-B
DIP8
Dual-channel version of the TLP4222G
2-Form-B
2.54SOP8
Lead pitch: 2.54 mm
Dual-channel version of the TLP4176G
2-Form-B
DIP8
Dual-channel version of the TLP4227G
2-Form-B
SEMKO-approved
TLP4227G-2 0.15 A
25 Ω
3 mA 2500
Vrms / –
1500
Vrms / –
25 Ω
3 mA
TLP4222G-2 0.1 A
50 Ω
3 mA 2500
Vrms / –
1500
Vrms / –
50 Ω
0 mA
0 mA
0 mA
0 mA3 mA
TLP4202G 350 V
350 V
350 V
350 V
0.09 A
TLP4206G 0.12 A
2.54SOP8
Lead pitch: 2.54
1a1b (N.C. + N.O.)
DIP8
1a1b (N.C. + N.O.)
2.54SOP8
Lead pitch: 2.54
1a1b (N.C. + N.O.)
DIP8
1a1b (N.C. + N.O.)
TLP4006G 0.12 A25 Ω3 mA 2500
Vrms / –
1500
Vrms / –
25 Ω3 mA
TLP4007G 0.1 A50 Ω3 mA 2500
Vrms / –
1500
Vrms / –
50 Ω
(Form-A)
5 mA
(Form-B)
0 mA
(Form-A)
5 mA
(Form-B)
0 mA
(Form-A)
5 mA
(Form-B)
0 mA
(Form-A)
5 mA
(Form-B)
0 mA
3 mA
TLP4027G 350 V
350 V
350 V
350 V
0.09 A
TLP4026G 0.12 A
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Part Number Pin Configuration Features RON (Max) BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
Safety Standards (2)
6
1
54
3
2
1
43
2
MOSFET-Output Photorelays, 1-Form-B (Continued)
DIP4
1-Form-B
SEMKO-approved
DIP6
1-Form-B
SEMKO-approved
TLP4597G / –
/ –
TLP4227G
2500
Vrms
2500
Vrms
25 Ω
25 Ω
3 mA
3 mA
0 mA
0 mA 350 V
350 V0.15 A
0.15 A
Part Number Pin Configuration Features RON (Max)
VDE BSI IEC
UL/cUL
TÜV
BVsVOFF
IFT
(Max) @IF
ION
(Max)
Safety Standards (2)
33
6
1
4
3
6
1
4
3
ZC
6
1
4
3
6
1
4
3
ZC
6
1
4
3
ZC
Triac-Output Photocouplers
6
V
DRM Isolation
voltage
Features
Package
2500 Vrms
NZC
2500 Vrms
3000 Vrms
3750 Vrms
4000 Vrms
5000 Vrms
5000 Vrms
5000 Vrms
MFSOP6 DIP6 DIP4/8/16 SO6
TLP160G
TLP160J
TLP165J
TLP260J
ZC
TLP161G
TLP161J
TLP163J
TLP166J
TLP261J
TLP168J
NZC
TLP560G
TLP3022(S)
TLP3023(S)
TLP3042(S)
TLP3043(S)
TLP3762(S)
TLP3062(S)
TLP3063(S)
TLP3064(S)
TLP3082(S)
TLP3782(S)
TLP3783(S)
TLP3052(S) TLP361J
TLP363J
TLP360J
TLP560J
TLP762J
ZC
TLP561G
TLP561J
TLP763J
NZC
TLP525G/-2/-4
ZC NZC ZC
400 V
600 V
800 V
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
NZC: Non-zero cross
ZC: Zero cross
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Triac-Output Photocouplers for Solid State Relays (SSRs)
VDRMPart Number Pin Configuration Features BVs
Rank VDE BSI IEC
Safety Standards (2)
UL/c-UL
TÜV
IFT (Max)
@ITM
VTM (Max)
2500
Vrms
2500
Vrms
2500
Vrms
2500
Vrms
2500
Vrms
2500
Vrms
TLP160J
TLP165J
TLP161J
TLP166J
(1)
(1)
TLP160G
400 V
400 V /
/
/
/
/
/
TLP161G
2.8 V
2.8 V
2.8 V
70 mA
2.8 V 70 mA
70 mA
70 mA
100 mA
(1)
(1)
TLP168J
TLP163J
10 mA
7 mA 2.8 V
2.8 V
5 mA
10 mA
7 mA
5 mA
7 mA
7 mA
10 mA
10 mA
3 mA
10 mA
IFT7
IFT5
IFT7
IFT5
IFT7
IFT7
600 V
600 V
600 V
600 V
Mini-flat
MFSOP6
Non-zero cross
Mini-flat
MFSOP6
Zero cross
Mini-flat
MFSOP6
Non-zero cross
Mini-flat
MFSOP6
Zero cross
Mini-flat
MFSOP6
Zero cross
Low trigger current
Mini-flat
MFSOP6
Zero cross
High impulse noise
immunity
VN=2000 V (typ.)
70 mA
4Selection Guide
34
8
1
65
43
7
2
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
4
1
3
2
6
1
4
32
4
1
3
2
4
1
3
2
ZC
4
1
3
2
ZC
6
1
4
3
6
1
4
3
ZC
TLP525G-2 10 mA
TLP525G-4 10 mA
/
DIP8
Dual-channel version
of the TLP525G
DIP16
4-channel version
of the TLP525G
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Triac-Output Photocouplers for AC 100 to 120 V Lines
VDE BSI IECTÜV@ITM
10 mA
IFT7 7 mA
IFT5 5 mA
TLP525G
TLP560G
10 mA /
2500
Vrms
/ –
VDRMPart Number Pin Configuration Features BVs
Rank
Safety Standards (2)
IFT (Max) VTM (Max)
UL/c-UL
DIP4
DIP6
General-purpose
Non-zero cross
100 mA 400 V3 V
2500
Vrms
100 mA 400 V
3 V
/
2500
Vrms
100 mA 400 V3 V
2500
Vrms
100 mA 400 V3 V
Triac-Output Photocouplers for Office Equipment
VDRMPart Number Pin Configuration Features BVs
Rank
Safety Standards (2)
IFT (Max) VTM (Max)
VDE BSI IEC
UL/c-UL
TÜV@ITM
TLP360J
TLP360JF 7 mA
TLP363J
TLP363JF
10 mA
7 mA
10 mA
/
IFT7
10 mA /
IFT7
TLP361J
TLP361JF
5000
Vrms
70 mA
2.8 V /
600 V
5000
Vrms
70 mA2.8 V 600 V
5000
Vrms
70 mA2.8 V 600 V
DIP4
Non-zero cross
DIP4
Zero cross
DIP4
Zero cross
High impulse noise
immunity
VN = 2000 V (typ.)
Triac-Output Photocouplers for Solid State Relays (SSRs) (Continued)
VDRMPart Number Pin Configuration Features BVs
Rank VDE BSI IEC
Safety Standards (2)
UL/c-UL
TÜV
IFT (Max)
@ITM
VTM (Max)
(1)
/ –
/ –
70 mA
70 mA
TLP260J
3000
Vrms
3000
Vrms
(1)
TLP261J
10 mA
10 mA
600 V
600 V
Mini-flat
MFSOP6
Non-zero cross
Mini-flat
MFSOP6
Zero cross
2.8 V
2.8 V
35
6
1
4
3
2
ZC
6
1
4
3
2
6
1
4
32
ZC
6
1
4
32
6
1
4
32
ZC
6
1
4
32
6
1
4
3
2
ZC
6
1
4
3
2
Triac-Output Photocouplers for AC 200 to 240 V Line
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Part Number Pin Configuration Features BVsVDRM
Rank VDE BSI IEC
Safety Standards (2)
UL/c-UL
TÜV
IFT (Max)
@ITM
VTM (Max)
DIP6
Internal creepage: 4 mm (min)
SEMKO-approved
Non-zero cross-on
DIP6
Internal creepage: 4 mm (min)
SEMKO-approved
Zero cross
DIP6
High VDRM
SEMKO-approved
Non-zero cross-on
TLP762J
TLP762JF
TLP763J
TLP763JF
TLP3052(S)
TLP3052F(S)
10 mA
10 mA
10 mA
/ –
/ –
/
4000
Vrms
4000
Vrms
5000
Vrms
10 mA
IFT7 7 mA
IFT5 5 mA
TLP561G
IFT7 7 mA
IFT7 7 mA
TLP560J
10 mA
TLP561J
10 mA
/ –
3 V 600 V
/ –
2500
Vrms
100 mA
3 V 600 V100 mA
3 V 600 V100 mA
3 V 600 V100 mA
3 V 600 V 2500
Vrms
100 mA
DIP6
General-purpose
Zero cross
DIP6
General-purpose
Non-zero cross
DIP6
General-purpose
Zero cross
DIP6
Direct replacement
for XXX3020/3021/3022
SEMKO-approved
Non-zero cross
DIP6
Direct replacement
for XXX3023
SEMKO-approved
Non-zero cross
10 mA
5 mA
/
/ –
5000
Vrms
100 mA 400 V3 V
5000
Vrms
2500
Vrms
100 mA 400 V3 V
100 mA 400 V3 V
100 mA 400 V
3 V
/
TLP3022(S)
TLP3022F(S)
TLP3023(S)
TLP3023F(S)
Triac-Output Photocouplers for AC 100 to 120 V Lines (Continued)
VDE BSI IECTÜV@ITM VDRMPart Number Pin Configuration Features BVs
Rank
Safety Standards (2)
IFT (Max) VTM (Max)
UL/c-UL
DIP6
Direct replacement
for XXX3040/3041/3042
SEMKO-approved
Zero cross
10 mA
5 mA
5000
Vrms /
100 mA 400 V3 V 5000
Vrms /
TLP3042(S)
TLP3042F(S)
TLP3043(S)
TLP3043F(S)
DIP6
Direct replacement
for XXX3043
SEMKO-approved
Zero cross
4Selection Guide
36
6
1
54
3
6
1
54
32
2
65
413
7
6
1
54
32
ZC
6
1
4
3
2
Part Number Pin Configuration Features VDRM BVs VDE BSI IEC
Safety Standards (2)
UL/cUL TÜV
IFT
(Max) @ITM
VTM (Max)
TLP148G
Mini-flat
MFSOP6 1.45 V 400 V100 mA10
mA
2500
Vrms
TLP548J DIP6
Low trigger current
2500
Vrms
1.45 V7
mA
100 mA 600 V
TLP549J
DIP8
Long
anode-cathode
distance (SCR)
2500
Vrms
1.45 V7
mA
100 mA 600 V
TLP748J
TLP748JF
DIP6
SEMKO-approved
4000
Vrms
1.45 V10
mA
100 mA 600 V
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
/
/
/
/
Replacement Devices
V
DRM Isolation
voltage
Features
New Device
Package
2500 Vrms
2500 Vrms
4000 Vrms
MFSOP6 DIP8DIP6
TLP148G
TLP148G
TLP548J
TLP549J
TLP748J
Discontinued Devices
TLP141G
TLP541J
TLP542G
TLP641G/J
TLP545J
TLP543J
TLP741G/J TLP747G/J
TLP548J
TLP748J
TLP549J
400 V
600 V
The new and discontinued devices are not exactly identical in terms of
electrical characteristics. For device replacement, hardware evaluation
must be performed in the real-world environment.
Thyristor-Output Photocouplers
7
Triac-Output Photocouplers for AC 200 to 240 V Line (Continued)
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Part Number Pin Configuration Features BVsVDRM
Rank VDE BSI IEC
Safety Standards (2)
UL/c-UL
TÜV
IFT (Max)
@ITM
VTM (Max)
DIP6
SEMKO-approved
High VDRM
Zero cross
DIP6
SEMKO-approved
High VDRM
Zero cross
DIP6
SEMKO-approved
Low trigger current
Zero cross
DIP6
High impulse noise immunity
VN = 1500 V (typ.)
Zero cross
DIP6
Zero cross
High impulse noise immunity
VN = 2000 V (typ.)
DIP6
Zero cross
TLP3062(S)
TLP3062F(S)
TLP3063(S)
TLP3063F(S)
TLP3064(S)
TLP3064F(S)
TLP3082(S)
TLP3082F(S)
TLP3762(S)
TLP3762F(S)
TLP3782(S)
TLP3782F(S)
TLP3783(S)
TLP3783F(S)
3 V
10 mA
5 mA
3 mA
600 V
600 V
600 V
/
5000
Vrms
5000
Vrms
5000
Vrms
5000
Vrms
5000
Vrms
5000
Vrms
100 mA
3 V 100 mA
3 V 100 mA
600 V 5000
Vrms
3 V 100 mA
3 V 100 mA
3 V 100 mA
3 V 100 mA
10 mA
10 mA
800 V
800 V
800 V
10 mA
/
/
5 mA
/
/
/
/
37
6
1
4
3
6
1
4
3
6
1
4
32
6
1
4
32
6
1
4
3
4
1
3
2
6
1
4
3
4
1
6
3
Photovoltaic-Output photocouplers
8
VDE BSI IEC
UL/cUL
TÜV@IF@IF
2500
Vrms
2500
Vrms
2500
Vrms
2500
Vrms
2500
Vrms
1500
Vrms
1500
Vrms
1500
Vrms
12 μA
C20 20 μA
24 μA
C40 40 μA
TLP190B —12μA
5μA
10 mA 7 V 10 mA
TLP191B 24 μA
5μA
20 mA 7 V 20 mA
TLP590B 10 mA 7 V 10 mA
TLP591B
TLP3904
TLP3914
TLP3924
20 mA 7 V 20 mA
Mini-flat
MFSOP6
Mini-flat
MFSOP6
Built-in shunt resistor
Mini-flat
MFSOP6
DIP6
10 mA 7 V 10 mA
20 μA10 mA 7 V 10 mA
4μA10 mA 30 V 10 mA
5μA
TLP3902 10 mA 7 V 10 mA
/
/
/ –
/ –
/ –
/ –
/ –
/ –
SSOP4
High open-circuit voltage
DIP6
Built-in shunt resistor
Part Number Pin Configuration Features BVs
Rank
Safety Standards (2)
Short-Circuit Current (
Min
)Open-Circuit Voltage (
Min
)
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
SSOP4
SSOP4
*Built-in shunt resistor
Open
Voltage
Short-Circuit
Current
Features
Package
1500 Vrms 2500 Vrms
SSOP4 DIP6MFSOP6
TLP3904
TLP3914
TLP3924
TLP3902
TLP190B TLP590B
TLP191B* TLP591B*
7 V
12 μA7 V
20 μA7 V
24 μA7 V
4μA30 V
(1)
TLP181 (1)
TLP180 3750
Vrms
80 V
3750
Vrms
80 V
(1)
Mini-flat
MFSOP6
AC input
SEMKO-approved
Mini-flat
MFSOP6
Transistor output
General-purpose
Products Manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. (TST)
9
VCEO VDE BSI IECUL TÜVc-UL
Part Number Pin Configuration Features BVs
@1 Minute
Safety Standards (2)
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
Transistor-Output and Darlington-Transistor-Output Photocouplers
4Selection Guide
38
4
1
3
2
4
1
3
2
4
1
3
2
8
1
65
43
7
2
4
1
3
2
8
1
65
43
7
2
4
1
6
3
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
6
1
54
3
6
1
4
3
4
1
3
2
4
1
3
2
VCEO VDE BSI IECUL TÜV
TLP627 300 V
TLP627-2
5000
Vrms
300 V 5000
Vrms
5000
Vrms
5000
Vrms
TLP620
55 V
55 V
TLP620-2
2500
Vrms
2500
Vrms
TLP185*
TLP281
TLP280
TLP284
TLP285 3750
Vrms
3750
Vrms
80 V
80 V
80 V
80 V
3750
Vrms
80 V
c-UL
Part Number Pin Configuration Features BVs
@1 Minute
Safety Standards (2)
(1)
(1)
(1)(1)
(1)
(1)
(1)
(1)(1)
DIP4
Transistor output
AC input
SEMKO-approved
DIP8
Dual-channel version of
the TLP620
SEMKO-approved
DIP4
Darlington transistor output
High VCEO
SEMKO-approved
DIP8
Dual-channel version of
the TLP627
SEMKO-approved
SOP4
Lead pitch = 1.27 mm
General-purpose
SEMKO-approved
SOP4
Lead pitch = 1.27 mm
AC input
SOP4 (reinforced insulation)
Lead pitch = 1.27 mm
Creepage/clearance 5 mm
Isolation thickness 0.4 mm
AC input
SOP4 (reinforced insulation)
Lead pitch = 1.27 mm
Creepage/clearance 5 mm
Isolation thickness 0.4 mm
SEMKO-approved
SO6 (reinforced insulation)
TLP184* 3750
Vrms
80 V (1)
(1)
SO6 (reinforced insulation)
AC input
TLP290-4*
TLP291-4*
2500
Vrms
2500
Vrms
80 V
80 V
(2)
(2)
SO16
4-channel version
Lead pitch = 1.27 mm
AC input
SO16
4-channel version
Lead pitch = 1.27 mm
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
Transistor-Output and Darlington-Transistor-Output Photocouplers (Continued)
TLP155E 3750
Vrms
0.2 μs
Peak output
current (max):
±0.6 A
7.5 mA
/
SO6 (reinforced Insulation)
Topr = 100°C (max)
Direct drive of a
small-power
IGBT/MOSFET
Photocouplers for IGBT/MOSFET Gate Drive
Output VDE BSI IEC
UL/cUL
TÜV
Part Number Pin Configuration Features BVs Safety Standards (2)
Propagation
Delay Time
(Max)
IFHL
(Max)
39
ZC
6
1
4
32
6
1
4
3
2
ZC
6
1
4
3
2
4
1
3
2
4
1
3
2
ZC
6
1
4
32
Triac-Output Photocouplers
TLP3042 (S)
TLP3043 (S)
TLP3062 (S)
TLP3062F (S)
TLP3063 (S)
TLP3063F (S)
TLP3064 (S)
TLP3082 (S)
TLP3782 (S)
TLP3782F (S)
TLP3783 (S)
TLP3783F (S)
TLP360J
TLP360JF
TP560G
TLP361J
TLP361JF
TLP363J
TLP363JF
TLP3022 (S)
TLP3022F (S)
TLP3023 (S)
TLP3023F (S)
TLP3052 (S)
TLP3052F (S)
TP560J
TP561G
TP561J
DIP4
Non-zero cross
DIP6
General-purpose
Non-zero cross
DIP6
General-purpose
Zero cross
DIP6
SEMKO-approved
Non-zero cross
DIP6
High VDRM
SEMKO-approved
Non-zero cross
DIP4
Zero cross
DIP4
Zero cross
High impulse noise
immunity
VN = 2000 V (typ.)
DIP6
SEMKO-approved
Zero cross
DIP6
SEMKO-approved
Zero cross
DIP6
Zero cross
DIP6
High impulse noise
immunity
VN = 1500 V (typ.)
DIP6
SEMKO-approved
High VDRM
Zero cross
100 mA
100 mA
100 mA
100 mA
100 mA
100 mA
5000
Vrms
5000
Vrms
5000
Vrms
2500
Vrms
10 mA
7 mA
7 mA
10 mA
7 mA
7 mA
5 mA
10 mA
5 mA
10 mA
5 mA
10 mA
10 mA
10 mA
5 mA
5 mA
3 mA
10 mA
10 mA
10 mA
7 mA
7 mA
5 mA
10 mA
10 mA
10 mA
IFT7
IFT7
IFT7
IFT7
IFT5
IFT7
IFT7
IFT5
3.0 V
3.0 V
3.0 V
3.0 V
3.0 V
3.0 V
600 V
600 V
400 V
600 V
400 V
600 V
Off-State
Output
Terminal
Voltage
V
DRM
BVs
@1 Minute
Rank Max VDE BSI IECTÜV
@I
TM
Max UL c-UL
Part Number Pin Configuration Features
Safety Standards(2)
Tingger LED Current,
I
FT
Peak On-State
Voltage, VTM
Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
V and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011
EN 60747-5-2-approved with option V4 or D4
For the latest information, please contact your nearest Toshiba sales representative.
Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales
representative.
400 V
600 V
400 V
600 V
600 V
600 V
4Selection Guide
40
1. Transistor-Output, Darlington-Transistor-Output and IC-Output Photocouplers
TLP F F )( ,,
Part number
Wide-spaced leads
Specify this option, if necessary.
Safety standard option
Specify either “D4” or “V4” for
EN60747-5-2-approved devices.
CTR rank
See respective datasheets.
RoHS COMPATIBLE*
Revision code
The revision code may be added to identify a
revision of a device. For details, contact your
nearest Toshiba sales representative.
Lead form option for DIP packages
Select one of the lead form options shown on page 40.
Carrier tape option
Select one of the carrier tape options shown on pages 51.
Example 1: TLP781(D4-GB-TP6,F
[D4] = EN60747-5-2 option
[GB] = CTR rank
[TP6] = LF6 lead form
Tape-and-reel packing
[,F] = RoHS COMPATIBLE*
The right parenthesis is omitted due to the limit to the number of characters.
Example 2: TLP781F(GR,F)
[F] = Wide-spaced leads
[GR] = CTR rank
[,F] = RoHS COMPATIBLE*
2. Triac-Output and Thyristor-Output Photocouplers
FF
)( ,, TLP
Part number
VDRM
G: 400 V
J: 600 V
L: 800 V
Wide-spaced leads
Safety standard option
IFT rank
No character: No IFT rank specified
IFTx: For example, IFT5 denotes the 5-mA rank.
The available IFT ranks differ from product to product.
See datasheets.
RoHS COMPATIBLE*
Revision code
Lead form option for DIP packages
Carrier tape option
Example 3: TLP361J(D4-IFT7-TP1,S,F)
TLP361J(D4T7TP1S,F)
(Abbreviated due to the limit to
the number of characters.)
[J] = VDRM: 600 V
[D4] = EN60747-5-2 option
[IFT7] = [T7] = IFT = 7 mA
[TP1] = LF1 lead form
Tape-and-reel packing
[,S] = [S] = Revision code: S
[,F] = RoHS COMPATIBLE*
3. Photorelays
Example 5: TLP3110(TP,F)
[TP] = Tape-and-reel packing
[,F] = RoHS COMPATIBLE*
F(TLP
Part number
VOFF
A: 60 V
D: 200 V
G: 350 V
GA: 400 V
J: 600 V
Some photorelays do not have
aV
OFF code in their names.
See respective datasheets.
Wide-spaced leads
Safety standard option
F)
, ,
RoHS COMPATIBLE*
Revision code
Lead form option for DIP packages
Carrier tape option
Example 4: TLP227A(TP1,F)
[A] = VOFF: 60 V
[TP1] = LF1 lead form
Tape-and-reel packing
[,F] = RoHS COMPATIBLE*
*: “F” identifies the indication of product Labels with “[[G]]/RoHS COMPATIBLE.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the “-“ character and/or using shorthand symbols. However, be sure to give
full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative.
5Part Naming Conventions
41
43
12
4-pin DIP
645
123
6-pin DIP
16
1
9
8
16-pin DIP
85
14
8-pin DIP
A
B
C
10.16
10 to 12
Lead Form Options for DIP Packages
1
Lead Form
Lead Form Code
Carrier Tape Code
Appearance
Package Outlines
* Tape-and-reel packing is not available with (LF2).
(LF1) (LF4) (LF5) (LF2)
(TP1) (TP4) (TP5) Not available*
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Example 1: Standard part: TLP620(F)
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
Standard part names should be used when applying for safety standard approval.
The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
See the TLP781, TLP785 datasheet.
All other package dimensions are the same as for each standard package
specification.
Unit: mm
Dimensions
Version (LF1) (LF4) (LF5)
Dimension
6.4
12.0
8.0
(0.25 typ.)
10.0
(0.35 typ.)
6.4
10.0
0.2
A
B
C
Min Max Min Min MaxMax
Surface-Mount Wide-Spaced
6Package Information
42
43
12
6.4 ± 0.25
7.85 to 8.80
7.62 ± 0.25
0.25
+0.1
-0.05
3.65+0.15
-0.25
1.2 ±0.15
0.5 ±0.1
2.54 ±0.25
4.58 ±0.25
0.8 ±0.25
2.5 min
43
12
6.4 ± 0.25
10.0 max
1.0 min
7.62 ± 0.25
3.65+0.15
-0.25
4.58 ±0.25
2.54 ±0.25
1.2 ±0.15
4.0+0.25
-0.20
12.0 max
0.75 ± 0.25
7.62 ± 0.25
3.65 +0.15
-0.25
4.58 ±0.25
2.54 ±0.25
1.2 ±0.15
0.25 +0.1
-0.05 3.9 +0.25
-0.20
43
12
6.4 ± 0.25
0.5 ±0.15
43
12
6.4 ± 0.25
10 to 12
0.25
7.62 ± 0.25
3.65+0.15
-0.25
1.2 ±0.15
0.5 ±0.1
2.54 ±0.25
4.58 ±0.25
0.25 min
2.5 min
10.16 ± 0.25
+0.1
-0.05
43
12
6.4 ± 0.25
10.0 max
1.0 min
7.62 ± 0.25
3.65 +0.15
-0.25
0.25+0.1
-0.05
4.58 ±0.25
2.54 ±0.25
1.2 ±0.15
3.85 +0.25
-0.20
0.2 max
0.5 ±0.1
Package Dimensions (4-Pin DIP)
2
Standard DIP4
DIP4 (LF2) DIP4 (LF4) / (TP4)
DIP4 (LF5) / (TP5)
Unit: mmUnit: mm
Unit: mmUnit: mm
Unit: mm
DIP4 (LF1) / (TP1)
43
654
123
7.12 ±0.25
6.4 ±0.25
1.2 ±0.15
2.54 ±0.25
3.65
7.62 ±0.25
10.0 max
1.0 min
+0.15
-0.25
4.0 +0.25
-0.20
654
123
7.12 ±0.25
6.4 ±0.25
0.5 ±0.1 1.2 ±0.15
2.54 ±0.25
2.5 min 0.25 min 3.65
7.62 ±0.25
10.16 ±0.25
10 to 12
+0.15
-0.25
0.25 +0.1
-0.05
654
123
7.12 ±0.25
6.4 ±0.25
1.2 ±0.15
0.5 ±0.1
2.54 ±0.25
3.65
7.62 ±0.25
12.0 max
0.75 ±0.25
+0.15
-0.25
0.25 +0.1
-0.05
3.9 +0.25
-0.20
654
123
7.12 ±0.25
6.4 ±0.25
1.2 ±0.15
0.5 ±0.1
2.54 ±0.25
3.65
7.62 ±0.25
10.0 max
1.0 min
+0.15
-0.25
0.25 +0.1
-0.05
3.85
0.2 max +0.25
-0.20
654
123
7.12 ±0.25
6.4 ±0.25
0.5 ±0.1 1.2 ±0.15
2.54 ±0.25
2.5 min 0.8 ±0.25 3.65
7.62 ±0.25
0.25+0.1
-0.05
7.85 to 8.80
+0.15
-0.25
DIP6 (LF4) / (TP4)
DIP6 (LF5) / (TP5)
DIP6 (LF1) / (TP1)
DIP6 (LF2)
DIP6
Standard
Package Dimensions (6-Pin DIP)
Unit: mmUnit: mm
Unit: mmUnit: mm
Unit: mm
2
6Package Information
44
8765
12
9.66 ± 0.25
34
6.4 ± 0.25
0.8 ± 0.25
2.5 min 3.65 +0.15
-0.25
2.54 ± 0.25
1.2 ± 0.15
0.5 ± 0.1
7.85 to 8.80
0.25
+0.1
-0.05
7.62 ± 0.25
8765
12
9.66 ± 0.25
34
6.4 ± 0.25
0.25 min
2.5 min 3.65 +0.15
-0.25
2.54 ± 0.25
1.2 ± 0.15
0.5 ± 0.1
10 to 12
0.25 +0.1
-0.05
7.62 ± 0.25
10.16 ± 0.25
8765
12
9.66 ± 0.25
34
6.4 ± 0.25
3.65 +0.15
-0.25
2.54 ± 0.25 1.2 ± 0.15 10.0 max
1.0 min
7.62 ± 0.25
4.0+0.25
-0.20
8765
12
9.66 ± 0.25
34
6.4 ± 0.25
+0.15
-0.25
+0.1
-0.05
2.54 ± 0.25
1.2 ± 0.15 12.0 max
0.75 ± 0.25
7.62 ± 0.25
3.9+0.25
-0.20
3.65
0.25
8765
12
9.66 ± 0.25
34
6.4 ± 0.25
3.65 +0.15
-
0.25
0.25 +0.1
-
0.05
2.54 ± 0.25 1.2 ± 0.15 10.0 max
0.2 max
1.0 min
7.62 ± 0.25
3.85 +0.25
-
0.20
Standard
DIP8 (LF2) DIP8 (LF4) / (TP4)
DIP8 DIP8 (LF1) / (TP1)
DIP8 (LF5) / (TP5)
Package Dimensions (8-Pin DIP)
Unit: mmUnit: mm
Unit: mmUnit: mm
Unit: mm
2
45
6.4 ± 0.25
7.85 to 8.80
0.25+0.1
-0.05
7.62 ± 0.25
0.5 ± 0.1 1.2 ± 0.15
2.54 ± 0.25
19.82 ± 0.25
2.5 min 0.8 ± 0.25 3.65 +0.15
-0.25
16 15 10 9
12 78
13 12 11
456
14
3
321
7.85 to 8.80
0.25 +0.1
-0.05
3.65 +0.15
-0.25
7.62 ±0.25
0.8 ±0.25 6.4 ±0.25
2.5 min
0.5 ±0.1 1.2 ±0.15
2.54 ±0.25
46
7.12 ±0.25
46
10 to 12
0.25 +0.1
-0.05
3.65 +0.15
-0.25
7.62 ±0.25
10.16 ±0.25
0.25 min
6.4 ±0.25
2.5 min
0.5 ±0.1 1.2 ±0.15
2.54 ±0.25
321
7.12 ±0.25
321
7.85 to 8.80
0.25
+0.1
-0.05
3.65 +0.15
-0.25
7.62 ±0.25
0.8 ±0.25 6.4 ±0.25
2.5 min
0.5 ±0.1 1.2 ±0.15
2.54 ±0.25
46
7.12 ±0.25
64
13
4.55 + 0.25
− 0.15
0.5 min
0.15
7.0 ± 0.4
3.7 + 0.25
− 0.15
2.54
1.27
0.4
0.1 2.1 ± 0.1
5
0.305 min
6.0 ± 0.2
5.1 ± 0.2
0.38
1.27 ± 0.15
0.1 ± 0.1 2.5 ± 0.2 3.95 ± 0.25
8 567
1 432
DIP165-pin DIP (with Pin 5 Cut)
SO6 SO8
5-pin DIP6 5-pin DIP6 (LF2)
Package Dimensions (Other DIP Packages)
Package Dimensions (Surface Mount)
Unit: mmUnit: mm
Unit: mmUnit: mm
Unit: mm Unit: mm
2
2
6Package Information
46
7.0 ± 0.4
0.6 ± 0.3
0.15
43
12
4.4 ± 0.25
2.6 ± 0.25
2.1 max
0.4 ± 0.1
1.27 ± 0.2
0.1 ± 0.1 1.9
4.58 ± 0.25
0.4 ± 0.1
1.27 ± 0.2 1.25 ± 0.2
7.62 ± 0.25
6.8 ± 0.2
3.65
9.7 ± 0.3
123
654
+0.15
-
0.25
0.25 +0.10
-
0.05
4.0 +0.25
-
0.20
4.58 ± 0.25
6.8 ± 0.2
123
654
0.4 ± 0.1
1.27 ± 0.2
3.65 +0.15
-
0.25
0.75 ± 0.25
7.62 ± 0.2
11.7 ± 0.3
0.25 +0.10
-
0.05
3.9 +0.25
-
0.20
654
13
4.4 ± 0.25
0.5 min
0.15
7.0 ± 0.4
3.6 ± 0.2
0.1 2.5 ± 0.2
0.4 ± 0.1
1.27 ± 0.2
2.54 ± 0.25
64
13
4.4 ± 0.25
0.5 min
0.15
7.0 ± 0.4
3.6 ± 0.2
0.4 ± 0.1
0.1 2.5 ± 0.2
2.54 ± 0.25
7.0 ± 0.4
31
46
4.4 ± 0.25
0.5 min
0.15
3.6 ± 0.2
1.27 ± 0.2
0.1 2.5 ± 0.2
0.4 ± 0.1
2.54 ± 0.25
4-pin MFSOP6
SDIP6 (F type)
4-pin MFSOP6 (with Pin 5 Cut)
5-pin MFSOP6
SOP4
SDIP6
Package Dimensions (Surface Mount) (Continued)
Unit: mmUnit: mm
Unit: mmUnit: mm
Unit: mmUnit: mm
2
47
0.15
0.6 ± 0.3
7.0 ± 0.4
9.4 ± 0.25
2.1 max
0.1 ± 0.1
2.54 ± 0.25
0.4 ± 0.1
8765
4.4 ± 0.25
12 3 4
0.15
0.6 ± 0.3
7.0 ± 0.4
4.4 ± 0.25
654
123
6.3 ± 0.25
2.1 max
0.1 ± 0.1
2.54 ± 0.25
0.4 ± 0.1
φ1.4
4.2
0.46 ± 0.2
1
2
3.65
1.9
2.04
1.27
0.3
3.8
0.2 0.2
1.8
0.15
4
3
1516 10 9
217
8
12 11
56
1314
4
3
7.0 ± 0.4
0.6 ± 0.3
0.15
4.4 ± 0.25
10.3 ± 0.25
2.1 max
0.4 ± 0.1
1.27 ± 0.2
0.1 ± 0.1 1.9
0.15
0.6 ± 0.3
7.0 ± 0.4
3.9 ± 0.25
2.1 max
0.1 ± 0.1
2.54 ± 0.25
0.4 ± 0.1
43
12
4.4 ± 0.25
φ1.2
3.25
0.35
3
4
2.05
2.2
1.27
0.4
0.2 0.2
1.65
2
1
3
4
2
1
2.54SOP62.54SOP4
2.54SOP8 SOP16
SSOP4
Package Dimensions (Surface Mount) (Continued)
Unit: mmUnit: mm
Unit: mmUnit: mm
Unit: mm Unit: mm
Unless Otherwise Specified, Tolerance ±0.2 mmUnless Otherwise Specified, Tolerance ±0.1 mm
2
USOP4
6Package Information
48
Rank Marking
Transistor-output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers
are ranked according to their maximum IFT value. The following gives the rank classifications and rank marks printed on packages.
Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets.
Available CTR Rank Selection ( : Available, : Contact Toshiba)
Part Marking when No CTR Rank Is Specified
TLP180
TLP181
TLP280
TLP280-4
TLP281
TLP281-4
TLP531/532
TLP620
TLP620-2
TLP620-4
TLP630
TLP631/632
TLP731/732
TLP733F/734F
Part Number Rank Marking
Group
None GB Y GR BL YH GRL GRH BLL
Rank Name
None
Y
GR
GB
BL
GRL
GRH
Rank
Name
50 to 600%
50 to 150%
100 to 300%
100 to 600%
200 to 600%
100 to 200%
150 to 300%
CTR Other than
TLP421
See the
right-side
tables
YE
GR
GB
BL
G
G
YE
GR
GB
BL
G
G+
Blank,Y,Y+,YE,
G,G+,GR,B,B+,
BL,GB
TLP421
Blank,
Y,
Y,
YE,
G,
G,
GR,
B,
B,
BL,
GB
Blank,
YE,
GR,
BL,
GB
None
Rank
Marking
Group
Part Number None
Rank
Marking
Group
Part Number
TLP180
TLP280
TLP531/532
TLP630
TLP181
TLP281
TLP531
TLP621
TLP631
TLP632
TLP731
TLP732
TLP733F
TLP734F
Blank,
GB
TLP280-4
TLP281-4
TLP620-2
TLP620-4
CTR Rank
1
1
1
1
1
1
3
3
3
3
3
2
2
1
2
2
2
1. CTR Rank Name and Rank Marking
3
49
P
Lot No.
Part number minus "TL"
CTR or IFT rank marking
Pin No. 1
or
P421F
Lot No. (Monthly code)
Part number (P421 or P421F)
Lot No.
CTR rank marking
Pin No. 1
Lot No.
CTR rank marking
Part number (P280 or P281)
Pin No. 1
TLP620
TLP
Lot No.
Part number
CTR or IFT rank marking
or
Pin No. 1
(a) 4-pin mini-flat 1-channel type
(d) Others
(b) TLP421, TLP421F
(c) TLP280, TLP281
P620
Example
: TLP626: P626
TLP620: P620
TLP181: P181
TLP620
Examples: TLP620: TLP620
TLP666GF: TLP666GF TLP620
P280
3. Marking Examples
Note: When ordering a standard photocoupler, add a CTR or IFT rank in parentheses to the standard part number.
Examples: TLP181(GB)TLP532(GR)
Use the standard part number when applying for safety standard approval.
Example Part number
TLP181(GB)
Use this part number
TLP181
2. LED Trigger Current (IFT) Ranking and Marking
7 mA max
IFT max
5 mA max
2 mA max
Blank, T7, T5
T7, T5
T5
T2 (only for photorelays)
Rank Name
None
IFT7
IFT5
IFT2
IFT IFT Rank Marking
6Package Information
50
1
11.3
10.3
5.5
10.3
9.3
4.5 4.3
14
5.5
6.7
2.7
4.4
9.5
1.4
B
A
X
Y
C
B
A
X
Y
C
Photocoupler Magazine Packing Specifications
Standard DIP DIPs with LF1, LF2, LF4 and LF5 Lead Forming
Magazine
Dimensions
Device
Quantities
per Magazine
Packing
Dimensions
Length = 525
Thickness = 0.5
Length = 525
Thickness = 0.5
Unit: mm Unit: mm
60 x 13 x 531
135 x 58 x 568
Dimensions
(A x B x C)
Label
Position
Y
X
4
40
Number of
Magazines
50 x 12 x 531
67 x 51 x 559
123 x 76 x 568
Dimensions
(A x B x C)
Y
Y
X
Label
Position
4
20
60
Number of
Magazines
Package Pin Count
Quantity (pcs)
4
100
6
50
8
50
12
25
16
25
7Packing Information
51
B
A
X
Y
C
B
A
X
Y
C
10.5
4.9
4.7
3.4
6.2
1.3
10.5
4.2(0.8)
5.2
2.8 3.4
6.2
1.6
10.5
4.8
4.7
3.4
6.2
1.7
10.5
4.4
4.3
3.4
6.2
1.8
Mini-Flat Coupler (MFP) SOP Photocoupler
Magazine
Dimensions
Device
Quantities
per Magazine
Packing
Dimensions
Length = 555
Thickness = 0.5
Length = 555
Thickness = 0.5
Length = 555
Thickness = 0.5
Unit: mmUnit: mmUnit: mm Unit: mm
4
24
40
Y
Y
X
29 x 13 x 563
77 x 31 x 586
67 x 55 x 586
Dimensions
(A x B x C)
Label
Position
Number of
Magazines
40
4
24
X
Y
Y
70 x 55 x 585
29 x 13 x 563
77 x 31 x 586
40 X67 x 55 x 586
24
SO6
MFSOP6
SO8 X75 x 29 x 579
Dimensions
(A x B x C)
Label
Position
Number of
Magazines
Package
Package
Pin Count
Quantity (pcs)
5
(SO6)
125
Package
Pin Count
Quantity (pcs)
4
(MFSOP6)
150
Package
Pin Count
Quantity (pcs)
8
(SO8)
100
Quantity
(pcs)
TLP160J, TLP180, TLP190B
TLP104, TLP109, TLP116A
TLP176G, TLP176A
TLP206G, TLP206A
TLP197G
TLP2105, TLP2108, TLP2116, TLP2118E, TLP2405, TLP2408
TLP280, TLP281
TLP280-4, TLP281-4, TLP270D, TLP270G
Typical DevicesPhotocoupler Package Type
Package
Pin Count
Quantity
(pcs)
Package
Pin Count
4
(SOP4)
16
(SOP16)
6
(2.54SOP6)
4
(2.54SOP4)
8
(2.54SOP8)
150 50
100 75 50
MFSOP6
SO6
SO8
SOP4
SOP16
2.54SOP4
2.54SOP6
2.54SOP8
SO6 MFSOP6 SO8
Length = 555
Thickness = 0.5
7Packing Information
52
t
KO
K
JF
A
G
DE
C
B
2.0 ± 0.1
2
Tape-and-Reel Specifications
The tape specifications differ for photocouplers manufactured in Thailand.
1. Embossed Tape Specifications for Surface-Mount Lead Form Options
2. Tape Dimensions
Unit: mm
Unit: mm
1: Typical devices
Photocoupler Package Types
MFSOP6, SO6
SO8
SOP16
2.54SOP4
2.54SOP6
2.54SOP8
DIP(LF1, LF5)
DIP(LF4)
Tape Option Symbol
(TPL) or (TPR)
(TP)
(TP)
(TP)
(TP)
(TP)
(TP1) or (TP5)
(TP4)
Typical Devices
TLP165J, TLP181, TLP190B
TLP2105, TLP2108, TLP2405, TLP2408
SOP4 (TP) TLP280, TLP281
TLP280-4, TLP281-4
TLP176G, TLP176A, TLP176D
TLP197G
TLP200D,TLP206A,TLP206G
TLP550, TLP560G
SSOP4 (TP15) TLP3212 to 3217, TLP3230 to TLP3250
SDIP6 (TP) TLP701, TLP705, TLP719
TLP560G
A
B
Photocoupler
Package Type
Tape Option
MFSOP6
(TPL), (TPR)
4.2 ± 0.1
SO6
(TPL), (TPR)
4.0 ± 0.1
7.6 ± 0.1
C
D
SOP4
(TP)
SO8
(TP)
SOP16
(TP)
2.54SOP4
(TP)
2.54SOP6
(TP)
2.54SOP8
SSOP4
(TP)(
TP15)
SDIP6
(TP)
SDIP6
F type
(TP)
2.5 ± 0.2
2.3 ± 0.1
2.4 ± 0.2 2.4 ± 0.2
2.2 ± 0.1 2.1 ± 0.1
4.55 ± 0.2
4.1 ± 0.1
0.4 ± 0.050.3 ± 0.05
DIP(LF1, LF5)
(TP1), (TP5)
DIP(LF4)
(TP4)
3.1 ± 0.1
7.5 ± 0.1
6.5 ± 0.1
5.6 ± 0.1
7.5 ± 0.1
10.5 ± 0.1
4.3 ± 0.1
7.5 ± 0.1
3.15 ± 0.2
2.8 ± 0.1
2.5 ± 0.2
2.3 ± 0.1
3.4 ± 0.2
3.1 ± 0.1
2.9 ± 0.2
2.6 ± 0.1
2.4 ± 0.2
2.2 ± 0.1
2.6 ± 0.2
2.4 ± 0.1
16.0 ± 0.3
7.5 ± 0.1
12.0 ± 0.3
5.5 ± 0.1
8.0 ± 0.1
12.0 ± 0.3
5.5 ± 0.1
1.75 ± 0.1
4.0 ± 0.1
1.5
12.0 ± 0.3
5.5 ± 0.1
16.0 ± 0.3
7.5 ± 0.1
16.0 ± 0.3
7.5 ± 0.1
12.0 ± 0.1 8.0 ± 0.1
6.7 ± 0.1
7.5 ± 0.1
10.5 ± 0.1
4.0 ± 0.112.0 ± 0.1 12.0 ± 0.1
10.4 ± 0.12.35 ± 0.2
4.5 ± 0.1 5.1 ± 0.1
12.0 ± 0.1
10.4 ± 0.1
16.0 ± 0.1
12.3 ± 0.1 12.3 ± 0.1
E
F
G
J
K
K0
t
DIP4
DIP6 (short package)
DIP8
TLP620
TLP631, TLP734, TLP747G
TLP555, TLP2601
5.1 ± 0.1
7.6 ± 0.1
10.1 ± 0.1 (TP4) is not available
+ 0.1
– 0
16.0 ± 0.1
Symbol (See figure above)
Dimensions
1
1
53
E
U
W2
W1
C
B
A
B
C
E
A
W2
W1
ø380 mm ø330 mm ø180 mm
ø380 ± 2
ø80 ± 1
ø13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
ø60
ø13
4.0 ± 0.5
2± 0.5
ø80 ± 1
ø13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
13.5 ± 0.5
17.5 ± 1.0
ø380 ± 2
13.5 ± 0.5
17.5 ± 1.0
13 ± 0.3
15.4 ± 1.0
17.5 ± 0.5
21.5 ± 1.0
17.5 ± 0.5
21.5 ± 1.0
ø330 ± 2
B
C
E
U
W1
W2
A
17.5 ± 0.5
21.5 ± 1.0
Unit: mm
Photocoupler
Package Type
Tape Option
MFSOP, SO6
(TPL), (TPR)
SOP4
(TP)
SO8
(TP)
SOP16
(TP)
2.54SOP4
(TP)(
TP)(
TP)(TP15)
DIP(LF4)
(TP4)
DIP(LF1, LF5)
2.54SOP8
SSOP4 SDIP6
SDIP6 F type
2.54SOP6
(TP1), (TP5)
180 + 0
– 4
Symbol (See figure above)
Dimensions
ø380 ± 2
ø80 ± 1
ø13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
13.5 ± 0.5
17.5 ± 1.0
ø330 ± 2
B
C
E
U
W1
W2
A
17.5 ± 0.5
21.5 ± 1.0
Photocoupler
Package Type
Tape Option
MFSOP
(TPL), (TPR)
DIP6(LF1,LF5,LF4)
(TP1), (TP5), (TP4)
DIP4(LF1,LF5,LF4)
(TP1), (TP5), (TP4)(
TP1), (TP5)
DIP8(LF1,LF5)
Symbol (See figure above)
Dimensions
Photocouplers Manufactured in Thailand
3. Reel Dimensions
7Packing Information
54
User direction of feed
A)
B)
C)
4. Other Packing Information
a) Device orientation on tape
Photocouplers are oriented in cavity, as shown below.
b) Tape Specifications
SOP16, SO8
2.54SOP6/8
SDIP6
MFSOP6, SO6
SOP4, 2.54SOP4
Photocoupler Package Type
MFSOP6, SO6
DIP(LF1, LF5)
DIP(LF4)
TP
TP
TP
TPL
TP
SSOP4 TP15
Tape Option
Photocoupler Package Type Tape Option
Photocoupler Package Type Tape Option
TPR
TP1, TP5
TP4
A)
B)
C)
Quantities Per Reel
Empty Cavities
2: 6 pcs max/reel for DIP and SDIP packages
Item
Consecutive empty cavities
Non-consecutive empty cavities
Specification
Zero
0.2% max/reel 2
Note
Any 40-mm portion of tape except leader and trailer.
Except leader and trailer.
Photocoupler Package Type
Quantity (pcs)
MFSOP6, SO6
3000
SOP4, SO8
2500
SOP16
2500
SSOP4
1500
2.54SOP4
/
6
/
8
2500
DIP(LF1, LF5)
1500
DIP(LF4)
1000
SDIP6
1500
SDIP6 F type
1000
Photocouplers Manufactured in Thailand
Photocoupler Package Type
Quantity (pcs)
MFSOP
3000
DIP4/6(LF1,LF5)
1500
DIP4/6(LF4)
1000
DIP8(LF1,LF5)
1000
c) Packing boxes
d) Label
One or five reels per box
Two or five reels per box for photocouplers manufactured
in Thailand
The reel label includes the following information:
1. Part number 2. Tape type 3. Quantity 4. Lot number
*1: Must be a multiple of the quantity per-reel.
*2: “F” identifies the indication of product Labels with [[G]]/RoHS COMPATIBLE.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
e) Purchase order
Specify the part number, tape and quantity as follows.
Example TLP181 3000 units
(GB-TPR, F )
Quantity*1
RoHS COMPATIBLF*2
Tape option
CTR rank
Photocoupler part number
55
2.54 2.54
1.5
1.6
10.4
2.54 2.54
1.5
1.6
8.7
1.27 1.27
0.8
1.7
8.8
1.27 1.27
0.8
1.6
10.4
MFSOP6 (4-Pin) [e.g., TLP181]
2.54SOP4 [e.g., TLP197G]
SO6 (4-Pin) [e.g., TLP265J]
MFSOP6 (5-Pin) [e.g., TLP114A]
SO6 (5-Pin) [e.g., TLP109]
SOP4 [e.g., TLP280]
SO8 [e.g., TLP2105]
(LF1)&(LF5) [e.g., TLP734(LF1)] (LF4) [e.g., TLP734(LF4)] SDIP6 [e.g., TLP719] SDIP6 (F type) [e.g., TLP719F]
For the example land patterns for the TLP781, see its datasheet.
0.8
2.54
1.2
6.3
0.8
1.27 1.27
2.54
1.2
6.3
0.8
1.27
1.2
6.3
0.8
2.54
1.271.27
1.2
6.3
0.8
1.271.271.27
1.2
5.5
1.27
0.8
3.73
0.95
SSOP4 [e.g., TLP3213]
1
Example Land Patterns
Mini-flat and SOP couplers
Surface-Mount Lead-Formed Photocouplers
Below are the example land patterns for surface-mount packages.
Unit: mm
Unit: mmUnit: mm
Example: 6-pin DIP package Example: 6-pin SDIP package
8Board Assembly
56
Example of temperature profile of lead (Pb) solder
(°C)
240
210
150
Package surface
temperature
60 to 90 seconds 30 seconds or less Time
Example of temperature profile of lead (Pb)-free solder
(°C)
260
230
180
190
Package surface
temperature
60 to 120 seconds 30 to 50 seconds Time
Board Assembly Considerations
1. Soldering 2. Flux Cleaning
When using a soldering iron or medium infrared ray/hot air reflow,
avoid a rise in device temperature as much as possible by
observing the following conditions.
1.1) Using a soldering iron
a. Solder once within 10 seconds for a lead temperature of
up to 260°C.
b. Solder once within 3 seconds for a lead temperature of up
to 350°C.
1.2) Using medium infrared ray/hot air reflow
a. Complete the infrared ray/hot air reflow process at once
within 30 seconds at a package surface temperature
between 210°C and 240°C.
b. Example of temperature profile of lead (Pb) solder
When cleaning circuit boards to remove flux, make sure that
no residual reactive ions such as sodium(Na+) or chloride(Cl)
ions remain. Note that organic solvents react with water to
generate hydrogen chloride and other corrosive gases, which
can degrade device performance.
Washing devices with water will not cause any problems.
However, make sure that no reactive ions such as
sodium(Na+) or chloride(Cl) ions are left as residue. Also, be
sure to dry devices sufficiently after washing.
Do not rub device markings with a brush or with your hand
during cleaning or while the devices are still wet from the
cleaning agent. Doing so can rub off the markings.
Dip cleaning, shower cleaning and steam cleaning processes
all involve the chemical action of a solvent. Use only
recommended solvents for these cleaning methods. When
immersing devices in a solvent or steam bath, make sure
that the temperature of the liquid is 50°C or below and that
the circuit board is removed from the bath within one minute.
If a device package allows ultrasonic cleaning, keep the
duration of ultrasonic cleaning as short as possible, since
long hours of ultrasonic cleaning degrade the adhesion
between the mold resin and the frame material.
Suspend the circuit board in the solvent bath during ultrasonic
cleaning in such a way that the ultrasonic vibrator does not come
into direct contact with the circuit board or the device.
Conventional cleaning solvents that contain freon are not
recommended due to its adverse effection the earth’s ozone layer.
Alternative freon-free products are available on the market. Some
of these alternative cleaning agents are listed in the table below.
Contact Toshiba or a Toshiba distributor regarding cleaning
conditions and other relevant information for each product type.
1.3)Dip soldering (flow soldering)
Keeping packages at high temperature for a long period of
time can degrade the quality and reliability of devices.
Soldering time has to be kept as short as possible to
avoid a rise in package temperature.
When using a halogen lamp or infrared heater, avoid
direct irradiation of packages, since this may cause a rise
in package temperature.
The thermal shock of dip soldering increases thermal stress
on devices. To avoid stress, the use of a soldering iron or
medium infrared ray/hot air reflow is recommended. If you
want to use dip soldering, contact your nearest Toshiba
sales representative.
d. Precautions for heating
The profile below shows only the typical temperature profile
and conditions, which might not apply to all Toshiba
photocouplers. Temperature profiles and conditions may
differ from product to product. Refer to the relevant technical
datasheets and databooks when mounting a device.
The following ultrasonic cleaning conditions
are recommended.
Frequency: 27 kHz to 29 kHz
Ultrasonic output power: 300 W or less (0.25 W/cm2 or less)
Cleaning time: 30 seconds or less
Examples of Alternative Cleaning Agents
Technocare GE Toshiba Silicon
Asahi Clean Asahi Glass Co., Ltd
Clean Through
AK-225AES
750H Kao Co., Ltd.
Pine Alpha Arakawa Chemical Co., Ltd.
FRW-1, FRW-17,
FRV-100
ST-100S,
ST-100SX
c. Example of temperature profile of lead (Pb)-free solder
2
57
1
Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on
page 57 shows the types of LED used in photocouplers and the figures on pages 58 to 60 show projections of long-term light output
performance and operating life. Note that these operating life data are estimates extrapolated from long-term light output degradation
over a single wafer lot and are shown as reference only.
F50% operating life
1,300,000 h
540,000 h
1,000,000 h
260,000 h
100,000 h
200,000 h
Projected Operating Life
Ta = 40°C, IF = 20 mA, failure criteria:
degradation rate Δ PO < –50%
F0.1% operating life
Photocouplers
GaAs LED
GaA As(SH) LED
GaA As(DH) LED
3
1
2
Projected Operating Life Based on LED Light Output Degradation
Mainly for phototransistor output devices
and phototriac output devices
Mainly for photorelays (MOSFET output),
photovoltaic couplers and photo-IC couplers
Mainly for photo-IC couplers
Ask your local Toshiba sales representative.
GaA As(MQW) LED
4Mainly for photo-IC couplers
F50% (cumulative failure rate 50%) operating life: Time period until the projected long-term light output degradation curve of
the average light output change (X) shown on pages 58 to 60 reaches the
failure criteria.
F0.1% (cumulative failure rate 0.1%) operating life: Time period until the projected long-term light output degradation curve of
X - 3σ shown on pages 58 to 60 reaches the failure criteria.
The relationship between LED light output degradation and optical coupling characteristics is shown below.
(1) The relationship between LED light output degradation
and current transfer ratio (CTR)/short circuit current (ISC) is 1:1.
CTR (t)
CTR (o)
Po(t)
Po (o)
=
(2) The relationship between a reciprocal value of LED light output degradation
and IFT/IFLH/IFHL/IFH change is 1:1. IFT (t)
IFT (o)
Po(t)
Po (o)
=
()
-
1
9Device Degradation
58
LEDs Used in Photocouplers
LED: GaAs LED GaA As (SH) LED 3
12GaA As (DH) LED 4GaA As (MQW) LED
4N25 (SHORT)
4N25A (SHORT)
4N26 (SHORT)
4N27 (SHORT)
4N28 (SHORT)
4N29 (SHORT)
4N29A (SHORT)
4N30 (SHORT)
4N31 (SHORT)
4N32 (SHORT)
4N32A (SHORT)
4N33 (SHORT)
4N35 (SHORT)
4N36 (SHORT)
4N37 (SHORT)
4N38 (SHORT)
4N38A (SHORT)
6N135
6N136
6N137
6N138
6N139
TLP102
TLP106
TLP112
TLP112A
TLP113
TLP114A
TLP115
TLP116TLP116
TLP117
TLP115A
TLP124
TLP126
TLP127
TLP130
TLP131
TLP137
LED
TLP141G
TLP160 Series
TLP161 Series
TLP163
TLP165J
TLP166J
TLP168J
TLP172 Series
TLP174G
TLP176 Series
TLP180
TLP181
TLP190B
TLP191B
TLP192 Series
TLP197 Series
TLP200D
TLP202 Series
TLP206 Series
TLP222 Series
TLP224G Series
TLP225A
TLP227 Series
TLP250 Series
TLP251 Series
TLP260J
TLP270 Series
TLP280 Series
TLP281 Series
TLP283 Series
TLP296G
TLP320 Series
LED
TLP330
TLP331
TLP371
TLP372
TLP373
TLP421 Series
TLP504A
TLP512
TLP513
TLP521-1
TLP521-2
TLP521-4
TLP523 Series
TLP525G Series
TLP531
TLP532
TLP541G
TLP542G
TLP543J
TLP545J
TLP550
TLP551
TLP552
TLP553
TLP554
TLP555
TLP557
TLP558
TLP559
LED
TLP560 Series
TLP561 Series
TLP570
TLP594 Series
TLP597 Series
TLP598 Series
TLP599 Series
TLP620 Series
TLP621 Series
TLP624 Series
TLP626 Series
TLP627 Series
TLP628 Series
TLP629 Series
TLP630
TLP631
TLP632
TLP641 Series
TLP3022(S) Series
TLP651
TLP731
TLP719
TLP705
TLP701
TLP700
TLP732
TLP733 Series
LED
TLP734 Series
TLP741 Series
TLP763J Series
TLP797 Series
TLP798GA
TLP2200
TLP2066
TLP2530
TLP2531
TLP2601
TLP260J
TLP2630
TLP2631
TLP31xx Series
TLP32xx Series
TLP4xxx Series
LED
TLP3762(S) Series
TLP3063(S) Series
TLP3042(S) Series
3
3
3
3
3
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
TLP3230
TLP3231
TLP3240
TLP3241
TLP3250
TLP706
TLP716
TLP702
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
1
1
1
3
3
3
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
2
TLP332
TLP351
TLP351A
TLP360 Series
TLP361 Series
TLP363 Series
TLP350
1
2
2
2
TLP571
TLP572
TLP590B
TLP591B
3
3
1
1
TLP592 Series
TLP747 Series
TLP750 Series
TLP759 Series
TLP762J Series
3
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
2
3
1
1
1
1
1
2
2
2
2
2
2
1
2
2
TLP751 Series
1
1
1
2
TLP3904
TLP3914
TLP3924
3
3
1
2
2
2
2
3
1
1
1
1
1
1
1
1
2
2
3
3
1
3
3
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
TLP104
TLP118
TLP151
TLP350H
TLP351H
TLP700H
TLP701H
TLP708
TLP714
TLP754
TLP2168
TLP2368
TLP2404
TLP2409
TLP2418
TLP2451
TLP2468
TLP2768
Photocouplers Photocouplers Photocouplers Photocouplers Photocouplers
59
Test time (h)
Test conditions: IF= 50 mA, Ta = 40°C
Light output (PO) relative change (%)
Test time (h)
Test conditions: IF= 10 mA, Ta = 40°C
Light output (PO) relative change (%)
Test time (h)
Test conditions: IF= 20 mA, Ta = 40°C
Light output (PO) relative change (%)
Failure criteria light output degradation Δ PO < –50%
Projected operating life (h)
Failure criteria light output degradation Δ PO < –30%
Projected operating life (h)
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000 1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
X-3σ
X
2.0 3.0 4.0 5.0
100
1000
10000
100000
1000000
10000000
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
Projected F50%
operating life
Projected F0.1%
operating life
2.0 3.0 4.0 5.0
100
1000
10000
100000
1000000
10000000
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
Projected F50%
operating life
Projected F0.1%
operating life
227 150 60 025 –30 –50 –7385100
1 / K (x10-3)
Ambient Temperature (°C) Ambient Temperature (°C)
227 150 60 025 –30 –50 –7385100
1 / K (x10-3)
GaAs LED Projected Light Output Degradation Data
1
GaAs LED Projected Operating Life Data
1
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as
reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
9Device Degradation
60
Failure criteria light output degradation Δ PO < –30%
Projected operating life (h)
Failure criteria light output degradation Δ PO < –50%
Projected operating life (h)
Test time (h)
Test conditions: IF= 50 mA, Ta = 40°C
Light output (PO) relative change (%)
Test time (h)
Test conditions: IF= 10 mA, Ta = 40°C
Light output (PO) relative change (%)
Test time (h)
Test conditions: IF= 20 mA, Ta = 40°C
Light output (PO) relative change (%)
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
2.0 3.0 4.0 5.0
100
1000
10000
100000
1000000
10000000
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
Projected F50%
operating life
Projected F0.1%
operating life
2.0 3.0 4.0 5.0
100
1000
10000
100000
1000000
10000000
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
Projected F50%
operating life
Projected F0.1%
operating life
227 150 60 025 –30 –50 –7385100
1 / K (x10-3)
227 150 60 025 –30 –50 –7385100
1 / K (x10-3)
Ambient Temperature (°C)Ambient Temperature (°C)
2
2GaA As (SH) LED Projected Light Output Degradation Data
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are
shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
GaA As (SH) LED Projected Operating Life Data
61
Failure criteria light output degradation Δ PO < –30%
Projected operating life (h)
Failure criteria light output degradation Δ PO < –50%
Projected operating life (h)
Test time (h)
Test conditions: IF= 50 mA, Ta = 40°C
Light output (PO) relative change (%)
Test time (h)
Test conditions: IF= 10 mA, Ta = 40°C
Light output (PO) relative change (%)
Test time (h)
Test conditions: IF= 20 mA, Ta = 40°C
Light output (PO) relative change (%)
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
1
0
20
40
60
80
100
120
140
10 100 1000 10000 100000
X-3σ
X
2.0 3.0 4.0 5.0
100
1000
10000
100000
1000000
10000000
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
Projected F50%
operating life
Projected F0.1%
operating life
2.0 3.0 4.0 5.0
100
1000
10000
100000
1000000
10000000
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
IF= 20 mA
IF= 30 mA
IF= 40 mA
IF= 50 mA
IF= 10 mA
Projected F50%
operating life
Projected F0.1%
operating life
227 150 60 025 –30 –50 –7385100
1 / K(×10−3)
Ambient Temperature (°C)
227 150 60 025 –30 –50 –7385100
1 / K(×10−3)
Ambient Temperature (°C)
The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are
shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed.
GaA As (DH) LED Projected Light Output Degradation Data
3
GaA As (DH) LED Projected Operating Life Data
3
9Device Degradation
62
Note
Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs.
These data are available for individual LEDs. Ask your local Toshiba sales representative.
GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data
4
63
227 150 100 85 60 40 25 0 −20 −50 −73
2.0
110
140
120
100
80
70
60
40
20
0100 1000 10000 100000
80000
3.0 4.03.19 5.0
Ambient Temperature (°C)
Test time (h)
Failure criteria for light output degradation Δ PO < –30%
Test conditions: IF= 20 mA, Ta = 40°C
Projected operating life (h)
Light output (PO) relative change (%)
Projected F50%
operating life
IF = 10mA
IF = 20mA
IF = 30mA
IF = 40mA
IF = 50mA
IF = 10mA
IF = 20mA
IF = 30mA
IF = 40mA
IF = 50mA
Projected F0.1%
operating life
1/K(×10–3)
10000000
1000000
100000
80000
10000
1000
100
–30%
X-3σ
X
Reading the Projected LED Operating Life Graph
For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 60.
Here is an example of how to read an operating life, assuming that the ambient temperature (Ta) is 40°C and that the failure
criterion is a 30% decrease in light output.
Suppose that the initial LED current, IF, is 20 mA. Since the horizontal axis of the failure criteria graph is the reciprocal of absolute
temperature, it is necessary to convert the ambient temperature (Ta) to the reciprocal of absolute temperature (T):
The graph shows the projected lifetimes for F50% and F0.1% cumulative failure probabilities in solid and dashed lines respectively.
Normally, it is recommended to use F0.1% lines.
As X = 3.19, its intersection with the IF = 20 mA line for F0.1% is approximately 80,000 hours. (This figure is for reference only.)
You can also estimate the projected operating life from the projected light output degradation data.
T = =
1
Ta + 273.15
1
40 + 273.15
3.19 × 10−3
9Device Degradation
64
Coupling Medium
(Window)
Photo Detector Chip
LED Chip
Lead
Package
(Body) Coupling Medium
(Window)
Photo Detector Chip
LED Chip
Lead
Package
(Body)
Transmissive Photocouplers in Single-Molded Packages
Reflective Photocouplers in
Single-Molded Packages
Mechanical Construction
4.0 4.0 4.0 4.2 4.0 6.4/7.0 8.05.0
4.0 4.0 4.0 4.2 4.0 6.4/7.0 8.05.0
0.4 0.4 (0.4) (0.4)0.4
––––––
565 Vpk
4000 Vpk
707 Vpk
6000 Vpk
565 Vpk
6000 Vpk
565 Vpk
4000 Vpk
565 Vpk
4000 Vpk
565 Vpk
2500 Vpk
630 Vpk
/890 Vpk
4000 Vpk
1140 Vpk
6000 Vpk
SOP4/SOP16 MFSOP6 MFSOP6 DIP
SO8
(2 ch)
2.54SOP
4/6/8
DIP
(F type)
Construction
Mechanical
Ratings
(min)
VDE/TÜV
DIN
EN
60747-5-2
Isolation Creepage
Path (mm)
IC Output
Transistor Output
Triac/Thyrsitor
Output
Photorelay
Certified
Devices
Isolation Clearance
(mm)
Isolation Thickness
(mm)
Internal Creepage
Path (mm)
Max.
Working Insulation
Voltage (Viorm)
Highest Allowable
Overvoltage
(Viotm)
Internal
Construction
Package
TLP280
TLP280-4
TLP281
TLP281-4
TLP284
TLP284-4
TLP285
TLP285-4
TLP180
TLP181
TLP260J
TLP261J
TLP127
TLP560G
TLP560J
TLP561G
TLP561J
TLP160G
TLP160J
TLP161G
TLP161J
TLP176A
TLP176D
TLP176G
TLP197G
TLP206G
TLP227G
TLP227G-2
TLP597G
TLP2105
TLP2108
TLP2166A
TLP2116
TLP2117
TLP350
TLP351
TLP350F
TLP351F
Safety Standard Approvals for Photocouplers (DIN EN60747-5-2)
Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photore-
lays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden).
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
10
Safety Standard Approvals
65
Coupling Medium
(Window)
Photo Detector Chip
LED Chip
Lead
Package
(Body)
Coupling Medium
(Window)
Photo Detector Chip
LED Chip Film
Lead
Package
(Body)
TLP620
TLP620-2
TLP620-4
TLP627
TLP627-2
TLP627-4
TLP731
TLP732
TLP620F
TLP620F-2
TLP621F
TLP621F-2
TLP360J
TLP361J
TLP363J
TLP3022(S)
TLP3023(S)
TLP3042(S)
TLP3043(S)
TLP3052(S)
TLP3062(S)
TLP3063(S)
TLP3064(S)
TLP3082(S)
TLP3762(S)
TLP3782(S)
TLP3783(S)
TLP360JF
TLP361JF
TLP363JF
TLP3022F(S)
TLP3023F(S)
TLP3042F(S)
TLP3043F(S)
TLP3052F(S)
TLP3062F(S)
TLP3063F(S)
TLP3064F(S)
TLP3082F(S)
TLP3762F(S)
TLP3782F(S)
TLP3783F(S)
TLP733
TLP734
TLP781
TLP165J
TLP166J
TLP733F
TLP734F
TLP781F
TLP265J
TLP266J
TLP762J
TLP763J
TLP748J
TLP762JF
TLP763JF
TLP748JF
Transmissive Photocouplers in
Double-Molded Packages
Transmissive Photocouplers with an Insulating Film in
Single-Molded Packages
7.0 8.0 4.0 5.0 8.08.0
7.0 8.0 4.0 5.0 8.08.0
0.4 0.4/0.5 0.4
6.4/7.0
6.4/7.0
0.4/0.5
6.5/7.0
6.5/7.0
0.4/0.5 0.4/0.50.4
––––4.04.0
890 Vpk
8000 Vpk
1140 Vpk
8000 Vpk
890 Vpk 1140 Vpk 565 Vpk 707 Vpk
6000 Vpk
890 Vpk
/1130 Vpk
890 Vpk
/1130 Vpk
6000 Vpk
/8000 Vpk
6000 Vpk
/8000 Vpk
4000 Vpk
/6000 Vpk
6000 Vpk
/8000 Vpk
6000 Vpk
/8000 Vpk
DIP MFSOP6 DIP
SDIP6 SDIP6
(F type)
DIP
(F type) SO6 DIP
(F type)
Construction
Mechanical
Ratings
(min)
VDE/TÜV
DIN
EN
60747-5-2
Isolation Creepage
Path (mm)
IC Output
Transistor
Output
Triac/Thyrsitor
Output
Certified
Devices
Isolation Clearance
(mm)
Isolation Thickness
(mm)
Internal Creepage
Path (mm)
Max.
Working Insulation
Voltage (Viorm)
Highest Allowable
Overvoltage
(Viotm)
Internal
Construction
Package
TLP105
TLP108
TLP114A
TLP116
TLP117
TLP2066
TLP350HF
TLP351HF
TLP750F
TLP751F
TLP759F
TLP350H
TLP351H
TLP750
TLP751
TLP759
TLP701F
TLP705F
TLP715F
TLP716F
TLP718F
TLP719F
TLP701
TLP705
TLP715
TLP716
TLP718
TLP719
TLP109
TLP116A
TLP104
TLP151
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
Safety Standard Approvals for Photocouplers (DIN EN60747-5-2) (Continued)
Mechanical Construction
4.2
4.2
0.4
565 Vpk
6000 Vpk
SO8
(1 ch)
TLP2403
TLP2405
TLP2408
TLP2409
10
Safety Standard Approvals
66
VCC
VCC
LSTTL
0.1 μF
LSTTL
5 V
VCC
5 V
7.5 mA
390 Ω
1 kΩ
TLP118, TLP2601
VCC
VCC
LSTTL
LSTTL
5 V
VCC
5 V
2 kΩ1.6 mA
120 pF
TLP2200
5 V
VCC
RL
VCC
VCC = 5 V RL= 3 kΩ
VCC = 20 V RL= 12 kΩ
CMOS
VCC 3 mA
1.1 kΩ
0.1 μF
LSTTL
TLP558
VCC
LSTTL
0.1 μF
CMOS
5 V
VCC
5 V
4.7 kΩ
0.5 mA
15 kΩ
6.8 kΩ
510 kΩ
TLP553
1
The TLP2601 allows high-speed data
transmission at up to approximately 5 MHz.
Data rate of left-side circuit
f (typ.): 5 Mbit/s (duty cycle 1/2)
No Pull-up Resistor Required
When the TLP2200 with a 3-state output is used,
the next-stage logic gate can be actuated
without using a pull-up resistor.
Data rate of left-side circuit
f (typ.): 1 Mbit/s (duty cycle 1/2)
By using the TLP558 which tolerates VCC up to
20 V, CMOS logic gates and other components
can be driven without design restrictions on VCC.
Data rate of left-side circuit
f (typ.): 1 Mbit/s (duty cycle 1/2)
Digital Interface Applications
The high-CTR (current transfer ratio) TLP553
allows operation with low input current (0.5 mA)
and direct driving with a CMOS signal.
Data rate of left-side circuit
f (typ.): 50 kbit/s (duty cycle 1/2)
Low Input Current Drive
High Speed
High VCC Tolerance
11
Photocoupler Application Circuit Examples
67
MM
Base/Gate Drive Circuit
DC Servo
(Numerical control, Robotics)
Base/Gate Drive Circuit
AC Servo
Inverter (PWM)
TLP557 VCC
47 μF
LSTTL
6 V
VCC
5 V
8 mA
390 Ω
Rex 4.3 Ω
TLP557 VCC
100 μF
LSTTL
8 V
VCC
5 V
8 mA
390 Ω
Rex 4.3 Ω2Ω150 Ω
TLP351/ TLP2541
VCC
VEE
LSTTL
0.1 μF
5 V
8 mA 1
2
3
45
6
7
8
390 Ω
2
TLP557
(for medium-power IGBTs): TLP350/ TLP358/ TLP700
(for small-power IGBTs): TLP351/ TLP701/ TLP705
TLP118 / TLP554
GTR Direct Drive
IGBT /
Power MOS Direct Drive
High-Speed
TLP109 / TLP2409
TLP550 / TLP559
TLP759
The TLP557 drives the base of a GTR directly.
An external resistor, Rex, is connected between
pins 6 and 7. This resistor causes the base current
to become constant and stabilizes the GTR drive.
The TLP557 photo-IC coupler and two booster
transistors can drive a high-power GTR.
The TLP151,TLP351,TLP701,TLP705 and
TLP2541 high-speed photo-IC photocouplers can
drive a low-power IGBT directly.
[Photo-IC couplers: high-speed base/gate drive applications
]
Inverter and AC-DC Servo Applications
Driving the Base of a 15-A-Class GTR (Giant Transistor) Module
Driving the Base of a 100-A-Class GTR Module
Driving the Gate of a 15-A-Class IGBT (Insulated Gate Bipolar Transistor) Module
11
Photocoupler Application Circuit Examples
68
TLP109 (IGM)
TLP559 (IGM)
TLP759 (IGM)
10 mA
0.1μF
20 kΩ
+15 V
–10 V
TLP351/ TLP2541
VCC
VEE
LSTTL
0.1 μF
5 V
8 mA 1
2
3
45
6
7
8
390 Ω
TLP350
VCC
VEE
LSTTL
0.1 μF
5 V
8 mA 1
2
3
45
6
7
8
390 Ω
IGM Selection
20 V / 30 V
max
25% min
75% max
@IF = 10 mA
VCC = 4.5 V
VO = 0.4 V
0.7 μs max
@IF = 10 mA
RL = 20 kΩ
10000 V / μs min
@IF = 0 mA
RL = 20 kΩ
VCM = 1500 Vp-p
– 10000 V / μs min
@IF = 10 mA
RL= 20 kΩ
VCM = 1500 Vp-p
Part Number Package BVs
(Vrms) VO/VCC CTR CMHCML
tPLHtPHL
TLP559 (IGM)
TLP759 (IGM)
SO6
TLP109 (IGM)3750
DIP8 2500
DIP8 5000
Driving the Gate of an IGBT Module Using an IGM Photocoupler
IGM photocouplers are suitable for driving an
intelligent power module (IPM). These
photocouplers guarantee symmetrical low-to-high
and high-to-low propagation delays (
l
tPLH - tPHL
l)
and provides a high common mode transient
immunity.
The TLP351,TLP701,TLP705 or TLP2541
high-speed photo-IC photocoupler and two booster
transistors can drive a high power IGBT.
Driving the Gate of a 400-A-Class IGBT Module
The TLP350 and TLP700 can drive a medium-power
IGBT directly.
Driving the Gate of a 50-A-Class IGBT Module
69
TLP560G + main triac
TLP560G + main triac
TLP560G + main triac
TLP560G + main triac
TLP560G + main triac
(TLP560G)
Panel Input
Microcontroller
Door Switch
Temperature Sensor
Compressor
Defroster Heater
(for refrigerator/
freezer compartment)
Damper Motor
(for refrigerator/
freezer compartment)
Defroster Heater
(for Freezer Compartment)
Interior Lamp
Interior Fan
Photocouplers
used for control applications
H
TLP560G
TLP560G
TLP560J M
120 Vac
50/60 Hz
Oven-
Cavity
Lamp
Magnetron
Thermo-Switch
Door-Open
Monitor Switch
H.V. Transformer Magnetron Tube
Blower Motor
Turntable Motor
Grill Heater
Weight Sensor
Door-Detector Circuit
Gas Sensor
Microcontroller
Control Panel
Electric Oven/Grills
Refrigerator Block Diagram
Home Appliance Applications
3
11
Photocoupler Application Circuit Examples
70
(1)Block Diagram
Main Switch
Adjustment Switches
Display
Speaker
M
TLP560G
RT
IF
PC1
Th1
TLP560G
RT
IF
PC2
Th2
TLP560G
RT
IF
PC3
Th3
TLP560J IF
AC-Input Photocoupler
TLP620 (GB)
100 Vac
Drain Valve
Water Supply
Valve
Microcontroller
Power
Supply
Operating Panel (Key Input)
Operation Detection
Operation Modes (Manual/automatic)
Water Flow Speed
Spinning Period
Number of Rinsing
Washing Period
Circuit Configuration
Microcontroller
100 Vac
P
M
TLP561G
ZC
ZC
ZC
IF1
VT1
TLP561J
IM1
M
IF2
VT2
TLP561J
IG
TLP781
TLP373
IM2
Panel
Temperature Limit Switch
Burner Overheat Prevention Switch
Drive
Circuit
Room
Temperature
Sensor
Preheat
Sensor
Earthquake
Sensor
Ignition
Burner Motor
(60 W)
Electric Heater
(1 kW)
Fan Motor
(30 W)
Electromagnetic
Fuel Pump
Microcontroller
Automatic Washing Machines
Fan Heaters
71
Trigger Point
Top: IF1 20 mA/div
Medium: VT1 100 V/div
Bottom: IM1 1 A/div
Horizontal: time 50 ms/div
Top: IF2 20 mA/div
Medium: VT2 100 V/div
Bottom: IM2 0.5 A/div
Horizontal: time 50 ms/div
Trigger Point
1. Example of Operating Waveform for Burner Motor 2. Example of Operating Waveform for Fan Motor
TLP560G
M
M
100 Vac
TLP781
TLP548J
TLP560G
TLP351 x6
M
TLP781
TLP548J
VCC
VO
ZC
Fan Motor for
Room Unit
Motor for Air-Flow
Direction Control
Control Panel
Remote Control
Panel
Room Temperature
Sensor
Temperature Sensor
Indoor Unit
Outdoor Unit
Fan Motor for
Outdoor Unit
Temperature Fuse
Rectifier
Compressor
Motor
IGBT Module
IGBT Gate
Drive Circuit
Two-Way Valve /
Four-Way Valve
Filter
Microcontroller
for Indoor
Unit
Microcontroller
for Outdoor
Unit
waveforms waveforms
(2)Waveform Examples
Inverter Air Conditioners
4
Home Appliance Applications (Continued)
11
Photocoupler Application Circuit Examples
72
+100 V
Load
IF= 10 mA
TLP127/TLP627
+100 V
Load
IF= 2 mA
TLP127/TLP627
+48 V
Load
IF= 10 mA
TLP225A /TLP222A
AC
Outputs
Logic
Inputs
Logic
Processor
Motor
Transformer
Lamp
TLP160G /TLP525G
TLP166J /TLP561J
ZC
240 VAC
120 VAC
Limit Switches
Thermostats
Transducer
Logic
Processor
1O1
VCC
TLP280-4
2O2
3O3
4O4
GND
COMMON
DC-AC
Inputs Logic
Outputs
DC Output for Sequencers
Programmable Controller Applications
120-/240-Vac Output for Sequencers and Solid State Relays (SSRs)
AC Input for Sequencers
5
73
RS
RG
RF
VCC
CSTNR
AC Load
ZC
G: 120 Vac
J: 240 Vac
Lamp Load (1-A tungsten lamp) L load (2.5-A pure inductive load)
Lamp Load (1-A tungsten lamp) L load (2.5-A pure inductive load)
TLP161G/ TLP561G/ TLP3042(S)
TLP166J / TLP561J / TLP3062(S)/ TLP3082(S)/ TLP3782(S)
Top: IF 20 mA/div
Medium: VT 100 V/div
Bottom: IT 5 A/div
Waveforms
Top: IF 20 mA/div
Medium: VT 100 V/div
Bottom: IT 5 A/div
Waveforms
IF = 20 mA
RG = 47 Ω
RS = 47 Ω, CS = 0.033 μF
IF = 20 mA
RT = 100 Ω/200 Ω
RG = 47 Ω
RS = 47 Ω, CS = 0.033 μF
Recommended
conditions
Recommended
conditions
TLP160G/ TLP560G / TLP3022(S)
TLP260J / TLP560J / TLP3052(S)
RS
RG
RF
RT
G : 100 Ω
J : 200 Ω
VCC
CSTNR
AC Load
G: 120 Vac
J: 240 Vac
SSR and Power Control Circuit Applications
6
Zero-Crossing Phototriac Output: TLP561G/TLP561J and Mini-Flat TLP161G/TLP166J
Non-Zero Crossing Phototriac Output: TLP560G/TLP560J and Mini-Flat TLP160G/TLP260J
11
Photocoupler Application Circuit Examples
74
TLP181
TLP285
TLP781
TLP148G
TLP548J
TLP549J
TLP748J
Filter
Switching
Control Circuit
(IC)
Regulated
Voltage
Error Amplification Feedback
+
+
+
Overvoltage Protection
7
Switching Power Supply Circuit Application
Transistor Output (: Approved, as of January 2010)
Thyristor Output (: Approved, as of January 2010)
Note 1: EN60747-approved with option (D4)
Note 2: The EN60747-5-2 safety standard for compact packages is different from those for standard DIP packages. Since the mini-flat package is a compact package,
please contact your nearest Toshiba sales representative for more details.
*: Double protection
Safety Standard Approvals CTR (IC / IF) Rank (%)
Package
Type UL
1577
EN60747
(Note 1)
Nordic
SEMKO
BSI
7002(EN60950)
Part Number Min Max
Isolation
Voltage
Package
Type UL
1577
EN60747
(Note 1)
Safety Standard Approvals
Part Number Isolation
Voltage IFT (mA) VDRM (V)
No Rank
(GB) Rank
(Y) Rank
(GR) Rank
(BL) Rank
(GRL) Rank
(GRH) Rank
No Rank
(O) Rank
TLP181/TLP285
TLP781
TLP750 (high-speed)
MFSOP6/SOP4
DIP4
DIP8
*
(Note 2)
50
100
50
100
200
100
150
19
10
600
600
150
300
600
200
300
DIP6
TLP148G
TLP548J
TLP748J
MFSOP6
3750 Vrms
5000 Vrms
5000 Vrms
2500 Vrms
4000 Vrms
10
7
10 600
600
400
75
TLP180
TLP620
TLP222G-2
CPU
L1
L2
+V
TLP629
TLP320
+V
TLP627
Dial PulsingRing Detector Line SwitchLine Detector
Push-Button
Telephone
Line
Control
Circuit
Dial
Circuit
Main Unit
Push-Button Telephone Application
8
A variety of photocouplers are used to isolate between telephone lines (L1 and L2) and a CPU.
Application Package Type Features
Part Number
DC Input AC Input
General single transistor output in
compact packages
Good cost performance
High-VCEO (300 V) Darlington transistor
output in compact packages
Suitable to generate a pulse dial signal
MOSFET-output photorelay
with VOFF = 400 V
Crosspoint relay replacement
(*: VOFF = 350 V, **: VOFF = 200 V)
High LED current rating = 150 mA
Directly connectable to telephone lines
High-VCEO (350 V) single transistor output
Ring
Detector
Dial
Pulsing
Line
Detector
Line
Switch
DIP4
MFSOP6 SOP4
DIP4
MFSOP6
DIP4
DIP4
DIP4
DIP6
2.54SOP4
2.54SOP6
TLP781
TLP181 TLP281 TLP285
TLP627
TLP127
TLP628
TLP629
TLP620
TLP180 TLP280
TLP320
TLP222G* TLP227G*
TLP592G* TLP597G*
TLP222G-2* TLP227G-2*
TLP170G* TLP176D** TLP176G*
TLP192G* TLP197G*
TLP200D** TLP202G* TLP206G*
DIP8 (Dual)
2.54SOP8 (Dual)
11
Photocoupler Application Circuit Examples
76
100 Aac
DC Outputs
TLP590B x n
RSH
TLP190B
TLP590B
TLP191B
TLP591B
TLP222G-2
TLP227G-2
TLP227G-2
TLP222G-2
L1
L2
Switch Signal
Switch Signal
Example of Terminal Switching Application
+5 V
+ 5 V
F A X
Timing Generator
CPU
OUT
Waveform Squaring Circuit
Power Source
DC Test Unit
Logic Comparator
Pattern Generator
TLP3120 /TLP3122 /TLP3542 TLP3113 to TLP3116
TLP3130 /TLP3131
TLP3213 to TLP3216
TLP3230 to TLP3231
TLP3240 /TLP3241
TLP3250
TLP3312 /TLP3375
Transformerless AC-DC converter
Photovoltaic Coupler Applications
Photorelay (MOSFET Output) Application
Photorelays for Tester Application
10
9
11
This is the simplest power MOSFET drive circuit.
The resistor RSH for discharging the gate capacitor
reduces turn-off time.
RSH is not required for the TLP591B, which has a
built-in resistor.
(TON, TOFF several ms)
Both AC and DC drivers become possible by
connecting power MOSFETs in a common-source
configuration.
Photovoltaic couplers in a parallel-serial
configuration convert AC power to DC without a
transformer.
This type of configuration requires tens to hundreds
of photovoltaic couplers.
77
TLP280
TLP281
TLP172G/170G
176G/192G
176D/197G
SOP
Photorelay
Off-Hook Relay
Dial Pulsing Relay
No need for output snubber circuit
No need for reverse-blocking diode in input side
NCU circuit (fax modem card)
Half-Pitch
Mini-Flat
Coupler
Line transformer
shorting
+5 V +5 V
Line
Modem
CPU
Controller
Ring Detector
L1
L2
NCU Circuit (Fax Modem Card) Application
Competitor Part Number Cross Reference Search
12
13
The Toshiba Semiconductor webpage at
http://www.semicon.toshiba.co.jp/eng/product/opto/selection/coupler/xref/index.html
offers a cross reference search tool for photocouplers and photorelays.
11
Photocoupler Application Circuit Examples
78
Note: For details of equivalent devices such as electrical performance and package dimensions,
please refer to the latest datasheets.
Avago
SHARPPanasonicNEC
COSMO
K1010
K2010
K3010
KP3020
KP4010
KP4020
K5010
K6010
KPS2801
KPC354NT
KPC355NT
KPC357NT
KPC452
TLP781
TLP631
TLP620
TLP620-2
TLP627
TLP627-2
TLP371
TLP630
TLP281
TLP180
TLP127
TLP181
TLP127
HCPL-M600
HCPL-M601
HCPL-M611
HCPL-M452
HCPL-M453
HCPL-M456
HCPL-2601
HCPL-2611
HCPL-2201
HCPL-2530
HCPL-2531
HCPL-2630
HCPL-2631
HCPL-3120
HCPL-3140
HCPL-3150
HCPL-3180
HCPL-314J
HCPL-4504
HCPL-0708
HCPL-181
HCPL-354
HCPL-814
TLP118
TLP118
TLP118
TLP109
TLP109
TLP109
TLP2601
TLP2601
TLP555
TLP2530
TLP2531
TLP2631
TLP2631
TLP350
TLP351
TLP351
TLP350
TLP701 x2
TLP559
TLP116A
TLP181
TLP180
TLP620
Vishay
SFH614A
SFH615A
SFH617A
SFH618A
TCET1100
SFH690xT
TCMT1100
TCMT4100
SFH628A
K815P
SFH612A
SFH619A
TLP628
TLP781
TLP781
TLP624
TLP781
TLP181
TLP281
TLP281-4
TLP620
TLP627
TLP627
TLP627
SFH655A TLP627
SFH692AT TLP127
TCED1100 TLP627
IL66 TLP371
IL66B TLP372
IL255 TLP330
Fairchild
H11A617
H11A817
H11AA814
H11B815
HMA121
HMA124
HMA2701
HMHA2801
HMHA281
HMAA2705
HMHAA280
H11A1
H11AA1
H11AG1
H11B1
H11C1
H11D1
H11G1
MOC3021-M
MOC3022-M
MOC3023-M
MOC3041-M
MOC3042-M
MOC3043-M
MOC3051-M
MOC3052-M
MOC3061-M
MOC3062-M
MOC3063-M
TLP781
FOD617 TLP781
FOD814 TLP620
FOD815 TLP627
FOD817 TLP781
FOD852 TLP627
FODM3021 TLP160G
FODM3022 TLP160G
FODM3051 TLP160J
FODM3052 TLP160J
TLP781
TLP620
TLP627
TLP181
TLP124
TLP181
TLP281
TLP281
TLP180
TLP280
TLP631
TLP630
TLP331
TLP571
TLP541G
TLP371
TLP371
TLP3021 (S)
TLP3022 (S)
TLP3023 (S)
TLP3041 (S)
TLP3042 (S)
TLP3043 (S)
TLP3051 (S)
TLP3052 (S)
TLP3061 (S)
TLP3062 (S)
TLP3063 (S)
LITEON
LTV-123
LTV-816
LTV-817
LTV-851
LTV-356T
LTV-357T
LTV-814
LTV-814H
LTV-354T
LTV-815
LTV-852
LTV-352T
LTV-355T
MOC3020
TLP781
TLP781
TLP781
TLP628
TLP181
TLP181
TLP620
TLP320
TLP180
TLP627
TLP627
TLP127
TLP127
MOC3021
MOC3022
MOC3023
MOC3051
MOC3052
MOC3061
MOC3062
MOC3063
TLP3020 (S)
TLP3021 (S)
TLP3022 (S)
TLP3023 (S)
TLP3051 (S)
TLP3052 (S)
TLP3061 (S)
TLP3062 (S)
TLP3063 (S)
PC123
PC817
PC813
PC815
PC357NT
PC354NT
PC355NT
PC3H7
PC3H3
PC3H21
PC410
PC942
PC923
S2S3
TLP781
TLP781
TLP620
TLP627
TLP181
TLP180
TLP127
TLP281
TLP280
TLP525G
TLP118
TLP351
TLP351
TLP260J
S2S4 TLP161J
PR36MF11NSZ
TLP3506
PR36MF12NSZ
TLP3506
S21MD3V TLP3051 (S)
S201D01 TLP3526
S201D02 TLP3527
AQV210
AQV210E
AQV210EH
AQV210S
AQV212
AQV212S
AQV214
AQV214E
AQV214EH
AQV214H
AQV214S
AQV215
AQV216
AQV217S
AQV410EH
AQV414
AQV414E
AQV414S
AQW210
AQW210S
AQW212
AQW214S
AQW214
AQW215
TLP592G
TLP597G
TLP797GA
TLP192G
TLP592A
TLP197A
TLP597GA
TLP597G
TLP797GA
TLP797GA
TLP197GA
TLP597A
TLP797J
TLP197D
TLP4592G
TLP4592G
TLP4597G
TLP4197G
TLP222G-2
TLP202G
TLP222A-2
TLP227GA-2
TLP206GA
AQW217
TLP222A-2
TLP222G-2
AQW414 TLP4222G-2
AQW610S TLP4026G
AQW614 TLP4007G
AQY210EH TLP227G
AQY210LS TLP174G
AQY210S TLP174G
AQY214EH TLP227G
AQY214S TLP176GA
AQY410EH TLP4227G
AQY414EH TLP4227G
AQY414S TLP4176G
AQY221N1S
TLP3113 /TLP3116
AQY221N2S
TLP3113 /TLP3116
AQY221R2V TLP3215
AQY221N2V TLP3216
PS2501-1
PS2561-1
PS2571-1
PS2581L1
PS2505-1
PS2565-1
PS2502-1
PS2562-1
PS2532-1
PS2533-1
PS2521-1
PS2525-1
PS2701-1
PS2761-1
PS2705-1
PS2765-1
PS2702-1
PS2801-1
PS2801-4
PS2861-1
PS2805-1
PS2805-4
PS2865-1
PS8601
PS8602
PS9613
PS8701
TLP781
TLP781
TLP781
TLP781F
TLP620
TLP620
TLP627
TLP627
TLP627
TLP627
TLP629
TLP320
TLP181
TLP181
TLP180
TLP180
TLP127
TLP281
TLP281-4
TLP281
TLP280
TLP280-4
TLP280
TLP759
TLP759
TLP759 (IGM)
TLP109
PS8101 TLP109
PS9713 TLP109 (IGM)
PS9113 TLP109 (IGM)
PS9601 TLP554
PS9614 TLP554
PS9714 TLP118
PS9114 TLP118
PS9715 TLP118
PS9115 TLP118
PS9701 TLP118
PS7141-1A TLP597GA
PS7141-2A TLP227GA-2
PS7141-1B TLP4597G
PS7141-2B TLP4227G-2
PS7141-1C TLP4006G
PS7341C-1A TLP594G
PS7141C-2A TLP224G-2
PS7241-1A TLP176GA
PS7241-2A TLP206GA
PS7241-1B TLP4176G
PS7241-2B TLP4206G
PS7241-1C TLP4026G
Part Number
Toshiba Part Number
Part Number
Toshiba Part Number
Part Number
Toshiba Part Number
Part Number
Toshiba Part Number
Part Number
Toshiba Part Number
Part Number
Toshiba Part Number
Part Number
Toshiba Part Number
Part Number
Toshiba Part Number
12 Competitor Cross Reference
79