Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to adopt. Developers may notice difficulty controlling software development, particularly when implementing wear leveling, bad block management, device mapping and error handling. Developers may also experience issues related to die shrinkage, including page size and error correcting code (ECC) management. To meet current trends for advanced mobile device designs, manufacturers require memory that is increasingly dense, robust and small: * * * Dense. Sophisticated mobile devices require high-density content storage that supports high-definition video playback and other high-end multimedia features. As a result, memory densities are advancing at rapid rates. Robust. Today's fastest and most demanding embedded uses require strong memory management solutions. Embedded uses include multifunctional smartphones, portable media players and tablet computers. Small. The Joint Electron Device Engineering Council (JEDEC) requires memory to be produced in extremely compact sizes to allow space for other components. Conversely, Samsung eMMC is designed to be easy to adopt. It is suitable for the latest consumer electronics, including tablets, smartphones, GPS systems and e-readers. Chipset validation means that eMMC is a thoroughly tested solution. Samsung eMMC incorporates a standard, mature interface by JEDEC, and key functionality yields strong power management and performance optimization. Samsung eMMC provides enhanced storage capabilities, a reduced controller footprint and streamlined data reads and writes. Standardized packaging and device specifications plus intelligent firmware ease design work and provide a common footprint for the use of embedded and removable NAND. Samsung offers a single footprint combining boot, embedded storage and external mass storage in one device. To focus on these demands, developers need an efficient way to control software development by simplifying mass storage designs and improving device production. Developers also require the ability to create efficient mobile device designs with minimal costs and brief time to market. Finally, they need superior storage capabilities to augment device production. In addition, Samsung offers a wide range of eMMC solutions based on low (4 GB or 8 GB) to high (16 GB, 32 GB, 64 GB or 128 GB) density requirements. Samsung has a wide range of eMMC solutions based on performance requirements. NAND Flash memory eMMC interface HOST interface layer Samsung embedded multimedia card (eMMC) addresses these needs with advanced embedded NAND Flash. It helps simplify mass storage designs for the latest consumer electronics. Samsung eMMC is produced in very compact sizes (typically smaller than a postage stamp) to create room within devices for additional parts. Key application areas that can leverage Samsung eMMC include advanced mobile devices and handsets. These products use eMMC to expand computing power and content storage. They also use eMMC to provide booting functionality. Flash transfer layer Virtual address Virtual Flash layer Physical address Flash interface layer NAND Flash memory Figure 1. MMC user BROCHURE 2 Enhanced ability to proceed directly from concept to testing Reduce development time and control costs Increase storage capabilities for diverse applications In the past, a product using NAND memory required changes in the chipset or the OS. At times, the NAND memory also required changes to be made in the Flash translation layer (FTL). The changes then needed to be tested at the NAND level, which could lead to significant delays for product-level testing. In contrast, developers using Samsung eMMC can move forward directly from product concept to product testing. Samsung eMMC isolates the host from changes in NAND memory technology and bypasses the FTL, which reduces design, development and testing time, and helps control costs. Advanced mobile devices and handsets can use Samsung eMMC to expand computing power and content storage. Enhanced storage solutions for mobile devices that provide high-density solid state memory can be integrated into system designs. Traditional storage media, as a result of the high storage capacity of eMMC, can be replaced by lowerpower solid-state drives (SSDs). Including SSDs enables increased storage densities, reduced costs and low power consumption. Content storage supports high-definition video playback and other complex multimedia features. Computing power provides booting functionality. Samsung eMMC incorporates simplified system design and integration of multi-level cell (MLC)-type NAND and triplelevel cell (TLC) memory, leading to faster overall time to market. This approach makes Samsung eMMC memory an excellent choice for deployment across a variety of segments, including low-cost legacy chipsets. Samsung eMMC operates at standard 4.41 and 4.5 voltage levels, so there is no need to develop or use separate firmware. This interface turns memory accesses into straightforward read-write operations with advanced security and reliability features. Samsung eMMC comprises high-density MLC and TLC NAND, and an MMC controller in a Ball Grid Array (BGA) package. It supports x1, x4 or x8 bus widths and interface voltages of 1.8 V or 3.3 V. Product concept NAND porting Flash translation layer Platform adaptation (Chipset dependent) OS adaptation (OS dependent) Low level driver (NAND dependent) NAND level testing Figure 3. 20 nm class eMMC Product level testing Figure 2. Samsung eMMC memory enables users to proceed from product concept directly to product testing. BROCHURE 3 Intelligent mobile device development Create an efficient way to develop welldesigned mobile devices Samsung eMMC contributes to successful mobile device development. The intelligent interface is designed for ease of use, and enhanced storage solutions improve device designs. Samsung eMMC also helps developers go straight from concept to testing, reducing time to market. To maintain the required data rates and throughput for high-density chips, the eMMC standard was developed to enhance storage capabilities, reduce controller footprint and streamline data reads and writes. Advanced Samsung technology helps reduce the cost of application development and increase work efficiency, enabling developers to stay competitive by building better and faster. Features and benefits Features Benefits Density of 4 GB to 64 GB Contributes to a variety of mobile designs Small size Enhanced storage capabilities Helps meet today's mobile design requirements Frees up space for other components Enhances robust mobile devices Enables traditional storage media to be replaced by lower-power SSDs Helps simplify mass storage designs Advanced embedded NAND Flash Aids in expanding computing power and content storage Is designed for easier adoption Standard, mature interface by JEDEC Intelligent firmware Provides strong power management and performance optimization Facilitates easier design work Provides a common footprint for the use of embedded and removable NAND Single footprint Combines boot, embedded storage and external mass storage in one device Isolation of the host from changes in NAND memory technology Enables developers to move directly from product concept to product testing FTL bypass Reduces design, development and testing time Simplified system design and integration of SLC-type and MLC-type NAND memory Contributes to faster overall time to market Operation at standard 4.41 and 4.5 voltage levels Eliminates the need to develop or use separate firmware Turns memory access into straightforward read-write operations BROCHURE 4 Samsung eMMC Specifications Part number Density Organization Voltage Package Package type Production status KLM4G1YE4C 4 GB x8 1.7 - 1.95 2.7 - 3.6 153 FBGA* 1 chip (mono) Mass production KLM8G1WE4A 8 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 1 chip (mono) Customer sample KLMAG2GE2A 16 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 2 chip (DDP) Customer sample KLMAG2WE4A 16 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 2 chip (DDP) Customer sample KLMBG4GE2A 32 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 4 chip (QDP) Customer sample KLMBG4WE4A 32 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 4 chip (QDP) Customer sample KLMCG8GE2A 64 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 8 chip (ODP) Customer sample KLMCG8WE4A 64 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 8 chip (ODP) Customer sample KLMDGAGE2A 128 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 16 chip (HDP) Customer sample KLM2G1HE3F 2 GB x8 1.7 - 1.95 2.7 - 3.6 153 FBGA 1 chip (mono) Mass production KLM4G1FE3B 4 GB x8 1.7 - 1.95 2.7 - 3.6 153 FBGA 1 chip (mono) Mass production KLM8G2FE3B 8 GB x8 1.7 - 1.95 2.7 - 3.6 153 FBGA 2 chip (DDP) Mass production KLMAG2GE4A 16 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 2 chip (DDP) Mass production KLMAG4FE3B 16 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 4 chip (QDP) Mass production KLMBG4GE4A 32 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 4 chip (QDP) Mass production KLMBG8FE3B 32 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 8 chip (ODP) Mass production KLMCG8GE4A 64 GB x8 1.7 - 1.95 2.7 - 3.6 169 FBGA 8 chip (ODP) Mass production * FBGA: Fine-Pitch Ball Grid Array BROCHURE 5 Legal and additional information About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2011 consolidated sales of US$143.1 billion. Employing approximately 222,000 people in 205 offices across 71 countries, the company operates two separate organizations to coordinate its nine independent business units: Digital Media & Communications, comprising Visual Display, Mobile Communications, Telecommunication Systems, Digital Appliances, IT Solutions, and Digital Imaging; and Device Solutions, consisting of Memory, System LSI and LCD. Recognized for its industry-leading performance across a range of economic, environmental and social criteria, Samsung Electronics was named the world's most sustainable technology company in the 2011 Dow Jones Sustainability Index. For more information, please visit www.samsung.com. Copyright (c) 2012 Samsung Electronics Co. Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co. Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. Giheung Campus, 95, Samsung 2-ro, Giheung-Gu, Yongin, Gyeonggi-Do Korea www.samsung.com 2012-09 For more information For more information about Samsung eMMC, visit www.samsung.com/semiconductor. 6