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Pin 1. Input

2. Ground

3. Output

Tab/Case is Ground

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TO-220

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM341

LM78M05

SNVS090G –MAY 2004–REVISED JUNE 2020

LM341 and LM78M05 Series 3-Terminal 500-mA Positive Voltage Regulators

1 Features

1• For a lower cost alternative, see the UA78M

• Output current in excess of 0.5 A

• No external components

• Internal thermal overload protection

• Internal short circuit current-limiting

• Output transistor safe-area compensation

• Available in 3-pin TO-220, TO-252, and TO

packages

• Output voltages of 5 V and 15 V

2 Applications

•Electronic point-of-sale

•Motor drives

•Building automation

•Appliances and white goods

•TVs and set-top boxes

3 Description

The LM341 and LM78M05 three-pin positive voltage

regulators employ built-in current limiting, thermal

shutdown, and safe-operating area protection, which

makes them virtually immune to damage from output

overloads.

With adequate heat sinking, they can deliver in

excess of 0.5-A output current. Typical applications

would include local (on-card) regulators which can

eliminate the noise and degraded performance

associated with single-point regulation.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM341 TO-220 (3) 10.16 mm × 14.986 mm

LM78M05 TO-220 (3) 10.16 mm × 14.986 mm

TO-252 (3) 6.10 mm × 6.58 mm

TO (3) 9.14 mm × 9.14 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Available Pinouts Typical Application

LM341

LM78M05

SNVS090G –MAY 2004–REVISED JUNE 2020

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Product Folder Links: LM341 LM78M05

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Device Comparison Table..................................... 3

6 Pin Configuration and Functions......................... 4

7 Specifications......................................................... 4

7.1 Absolute Maximum Ratings ...................................... 4

7.2 Recommended Operating Conditions....................... 4

7.3 Thermal Information.................................................. 5

7.4 Electrical Characteristics: LM341 (5 V) and

LM78M05................................................................... 5

7.5 Electrical Characteristics: LM341 (12 V)................... 5

7.6 Electrical Characteristics: LM341 (15 V)................... 6

7.7 Typical Characteristics.............................................. 7

8 Detailed Description.............................................. 9

8.1 Overview................................................................... 9

8.2 Functional Block Diagram......................................... 9

8.3 Feature Description................................................. 10

8.4 Device Functional Modes........................................ 10

9 Application and Implementation ........................ 11

9.1 Application Information............................................ 11

9.2 Typical Application.................................................. 11

10 Power Supply Recommendations ..................... 12

11 Layout................................................................... 12

11.1 Layout Guidelines ................................................. 12

11.2 Layout Example .................................................... 15

12 Device and Documentation Support................. 16

12.1 Documentation Support ........................................ 16

12.2 Related Links ........................................................ 16

12.3 Receiving Notification of Documentation Updates 16

12.4 Support Resources ............................................... 16

12.5 Trademarks........................................................... 16

12.6 Electrostatic Discharge Caution............................ 16

12.7 Glossary................................................................ 16

13 Mechanical, Packaging, and Orderable

Information........................................................... 16

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (December 2016) to Revision G Page

• Added lower cost alternative bullet to Features section ........................................................................................................ 1

• Changed Applications section................................................................................................................................................ 1

• Added Device Comparison Table .......................................................................................................................................... 3

• Changed OUTPUT from pin 2 to pin 3 in Pin Functions table ............................................................................................... 4

Changes from Revision E (August 2005) to Revision F Page

• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,

Recommended Operating Conditions table, Thermal Information table, Detailed Description section, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1

• Deleted parts marked as obsolete: LM78M12 and LM78M15................................................................................................ 1

• Changed package type names throughout............................................................................................................................. 1

• Deleted 12-V output voltage option from Features................................................................................................................. 1

• Changed RθJA values in Thermal Information table From: 60°C/W To: 22.6°C/W (NDE), From: 92°C/W To: 38°C/W

(NDP), and From: 120°C/W To: 162.4°C/W (NDT)................................................................................................................ 5

• Changed RθJC(top) values in Thermal Information table From: 5°C/W To: 17.8°C/W (NDE), From: 10°C/W To:

48.4°C/W (NDP), and From: 18°C/W To: 23.9°C/W (NDT).................................................................................................... 5

• Updated Thermal Considerations section ............................................................................................................................ 13

LM341

LM78M05

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5 Device Comparison Table

IOUT PARAMETER LM78xx UA78 LM340 LM340A UNIT

1.5 A

Input voltage range 7 - 35 7 - 38 7 - 35 7 - 35 V

Fixed output voltage option 5, 12, 15 5, 8, 10, 12, 15,

24 5, 12, 15 5, 12, 15 V

Load regulation accuracy 4 4 4 2 %

PSRR (120 Hz) 80 78 80 80 dB

Recommended operating temperature 0 - 125 0 - 125 0 - 125 0 - 125 °C

TO-220 TJA 23.9 19 23.9 23.9 °C/W

SOT-223 TJA 62.1 N/A 62.1 62.1 °C/W

TO-3 TJA 39 N/A 39 39 °C/W

TO-263 TJA 44.8 25.3 44.8 44.8 °C/W

0.5 A

LM78Mxx UA78MxxC UA78MxxI LM341

Input voltage range 7.2 - 35 5.3 - 30 5.3 - 30 7.2 - 35 V

Fixed output voltage option 5 3.3, 5, 6, 8, 9,

10, 12 3.3, 5 5 V

Load regulation accuracy 4 3 3 4 %

PSRR (120 Hz) 78 80 80 78 dB

Recommended operating temperature -40 - 125 0 - 125 -40 - 125 -40 - 125 °C

TO-220 TJA 22.6 19 19 22.6 °C/W

SOT-223 TJA N/A 53 53 N/A °C/W

TO-3 TJA 162.4 N/A N/A N/A °C/W

TO-252 Powerflex TJA N/A 28 28 N/A °C/W

TO-252 TJA 38 30.3 30.3 N/A °C/W

0.1 A

LM78LxxAC LM78LxxAI /

LM78LxxIT UA78LxxC UA78LxxI

Input voltage range 7.0 - 30 7.0 - 30 4.75 - 30 4.75 - 30 V

Fixed output voltage option 5, 6.2, 12, 15 5, 9 2.6, 5, 6.2, 8, 9,

10, 12, 15 5 V

Load regulation accuracy (A/non -A) 4 4 4/8 4/8 %

PSRR (120 Hz) 62 62 51 51 dB

Recommended operating temperature 0 - 125 -40 - 125 0 - 125 -40 - 125 °C

SOT-89 TJA N/A N/A 54.7 54.7 °C/W

SO-8 TJA 128.8 128.8 115 115 °C/W

DSBGA TJA N/A 108.4 N/A N/A °C/W

TO-92 TJA 158.7 N/A 143.6 143.6 °C/W

LM341

LM78M05

SNVS090G –MAY 2004–REVISED JUNE 2020

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6 Pin Configuration and Functions

NDE Package

3-Pin TO-220

Top View

NDP Package

3-Pin TO-252

Top View

NDT Package

3-Pin TO

Top View

Pin Functions

I/O DESCRIPTION

NAME NO.

TO-220 TO-252 TO

GND 2/TAB 2/TAB 3 — Tab is GND

INPUT 1 1 1 I Input

OUTPUT 3 3 2 O Output

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)

MIN MAX UNIT

Input voltage VO= 5 V to 15 V 35 V

Power dissipation Internally limited

Lead temperature (Soldering, 10 s) TO package (NDT) 300 °C

TO-220 package (NDE) 260

Operating junction temperature –40 125 °C

Storage temperature, Tstg –65 150 °C

7.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

Input voltage VOUT + 1.8 35 V

Output current 0.5 A

LM341

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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

7.3 Thermal Information

THERMAL METRIC(1) LM341 LM78M05

UNITNDE (TO-220) NDP (TO-252) NDT (TO)

3 PINS 3 PINS 3 PINS

RθJA Junction-to-ambient thermal resistance 22.6 38 162.4 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 17.8 48.4 23.9 °C/W

RθJB Junction-to-board thermal resistance 6 17.7 — °C/W

ψJT Junction-to-top characterization parameter 3.3 6.7 — °C/W

ψJB Junction-to-board characterization parameter 6 17.9 — °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3 4.4 — °C/W

7.4 Electrical Characteristics: LM341 (5 V) and LM78M05

VIN = 10 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or

correlation techniques using standard Statistical Quality Control (SQC) methods.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage IL= 500 mA 4.8 5 5.2 V

IL= 5 mA to 500 mA, PD≤7.5 W,

VIN = 7.5 V to 20 V, TJ= –40°C to 125°C 4.75 5 5.25

VRLINE Line regulation VIN = 7.2 V to 25 V IL= 100 mA 50 mV

IL= 500 mA 100

VRLOAD Load regulation IL= 5 mA to 500 mA 100 mV

IQQuiescent current IL= 500 mA 4 10 mA

ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA

VIN = 7.5 V to 25 V, IL= 500 mA 1

VnOutput noise voltage f = 10 Hz to 100 kHz 40 µV

ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 78 dB

VIN Input voltage required to maintain

line regulation IL= 500 mA 7.2 V

ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 20 mV/khrs

7.5 Electrical Characteristics: LM341 (12 V)

VIN = 19 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or

correlation techniques using standard Statistical Quality Control (SQC) methods.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage IL= 500 mA 11.5 12 12.5 V

IL= 5 mA to 500 mA, PD≤7.5 W, VIN = 14.8 V

to 27 V, TJ= –40°C to 125°C 11.4 12 12.6

VRLINE Line regulation VIN = 14.5 V to 30 V IL= 100 mA 120 mV

IL= 500 mA 240

VRLOAD Load regulation IL= 5 mA to 500 mA 240 mV

IQQuiescent current IL= 500 mA 4 10 mA

ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA

VIN = 14.8 V to 30 V, IL= 500 mA 1

VnOutput noise voltage f = 10 Hz to 100 kHz 75 µV

ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 71 dB

VIN Input voltage required to maintain

line regulation IL= 500 mA 14.5 V

ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 48 mV/khrs

LM341

LM78M05

SNVS090G –MAY 2004–REVISED JUNE 2020

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Product Folder Links: LM341 LM78M05

7.6 Electrical Characteristics: LM341 (15 V)

VIN = 23 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or

correlation techniques using standard Statistical Quality Control (SQC) methods.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOOutput voltage IL= 500 mA 14.4 15 15.6 V

IL= 5 mA to 500 mA, PD≤7.5 W, VIN = 18 V

to 30 V, TJ= –40°C to 125°C 14.25 15 15.75

VRLINE Line regulation VIN = 17.6 V to 30 V IL= 100 mA 150 mV

IL= 500 mA 300

VRLOAD Load regulation IL= 5 mA to 500 mA 300 mV

IQQuiescent current IL= 500 mA 4 10 mA

ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA

VIN = 18 V to 30 V, IL= 500 mA 1

VnOutput noise voltage f = 10 Hz to 100 kHz 90 µV

ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 69 dB

VIN Input voltage required to maintain

line regulation IL= 500 mA 17.6 V

ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 60 mV/khrs

LM341

LM78M05

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7.7 Typical Characteristics

Figure 1. Peak Output Current Figure 2. Ripple Rejection

Figure 3. Ripple Rejection Figure 4. Dropout Voltage

Normalized to 1 V TJ= 25°C

Figure 5. Output Voltage Figure 6. Quiescent Current

LM341

LM78M05

SNVS090G –MAY 2004–REVISED JUNE 2020

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Typical Characteristics (continued)

Figure 7. Quiescent Current Figure 8. Output Impedance

Figure 9. Line Transient Response Figure 10. Load Transient Response

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LM78M05

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SNVS090G –MAY 2004–REVISED JUNE 2020

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8 Detailed Description

8.1 Overview

The LM341 and LM78M05 devices are a family of fixed positive voltage regulators. They can accept up to 35 V

at the input and regulate it down to outputs of 5 V, 12 V, or 15 V. The devices are capable of supplying up to 500

mA of output current, although it is important to ensure there is adequate heat sinking to avoid exceeding thermal

limits. However, in the case of accidental overload the device has built in current limiting, thermal shutdown and

safe-operating area protection to prevent damage from occurring.

8.2 Functional Block Diagram

LM341

LM78M05

SNVS090G –MAY 2004–REVISED JUNE 2020

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8.3 Feature Description

The LM341 and LM78M05 fixed voltage regulators have built-in thermal overload protection which prevents the

device from being damaged due to excessive junction temperature.

The regulators also contain internal short-circuit protection which limits the maximum output current, and safe-

area protection for the pass transistor which reduces the short-circuit current as the voltage across the pass

transistor is increased.

Although the internal power dissipation is automatically limited, the maximum junction temperature of the device

must be kept below 125°C to meet data sheet specifications. An adequate heat sink must be provided to assure

this limit is not exceeded under worst-case operating conditions (maximum input voltage and load current) if

reliable performance is to be obtained.

8.4 Device Functional Modes

8.4.1 Normal Operation

The device OUTPUT pin sources current necessary to make the voltage at the OUTPUT pin equal to the fixed

voltage level of the device.

8.4.2 Operation With Low Input Voltage

The device requires up to 2-V headroom (VI– VO) to operate in regulation. With less headroom, the device may

drop out of regulation in which the OUTPUT voltage would equal INPUT voltage minus dropout voltage.

8.4.3 Operation in Self Protection

When an overload occurs, the device shuts down Darlington NPN output stage or reduce the output current to

prevent device damage. The device automatically resets from the overload. The output may be reduced or

alternate between on and off until the overload is removed.

LM341

LM78M05

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SNVS090G –MAY 2004–REVISED JUNE 2020

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The LM341 and LM78Mxx devices are fixed voltage regulators meaning no external feedback resistors are

required to set the output voltage. Input and output capacitors are also not required for the device to be stable.

However input capacitance helps filter noise from the supply and output capacitance improves the transient

response.

9.2 Typical Application

*Required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used).

**Optional for improved transient response.

Figure 11. Typical Application

9.2.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design Parameters

PARAMETER VALUE

CIN 0.33 µF

COUT 0.1 µF

9.2.2 Detailed Design Procedure

9.2.2.1 Input Voltage

Regardless of the output voltage option being used (5 V, 12 V, 15 V), the input voltage must be at least 2 V

greater to ensure proper regulation (7 V, 14 V, 17 V).

9.2.2.2 Output Current

Depending on the input-output voltage differential, the output current must be limited to ensure maximum power

dissipation is not exceeded. The graph in Figure 1 shows the appropriate current limit for a variety of conditions.

9.2.2.3 Input Capacitor

If no power supply filter capacitor is used or if the device is placed more than four inches away from the capacitor

of the power supply, an additional capacitor placed at the input pin of the device helps bypass noise.

LM341

LM78M05

SNVS090G –MAY 2004–REVISED JUNE 2020

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Product Folder Links: LM341 LM78M05

9.2.2.4 Output Capacitor

These devices are designed to be stable with no output capacitance and can be omitted from the design if

needed. However if large changes in load are expected, an output capacitor is recommended to improve the

transient response.

9.2.3 Application Curves

Figure 12. RθJA vs 2-oz Copper Area for PFM Figure 13. Maximum Allowable Power Dissipation

vs Ambient Temperature for PFM

Figure 14. Maximum Allowable Power Dissipation vs 2-oz Copper Area for PFM

10 Power Supply Recommendations

The LM341 and LM78M05 devices are designed to operate from an input voltage supply range between

VOUT + 2 V to 35 V. If the device is more than four inches from the power supply filter capacitors, an input bypass

capacitor 0.1-µF or greater of any type is recommended.

11 Layout

11.1 Layout Guidelines

Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.

TI recommends that the input terminal be bypassed to ground with a bypass capacitor. The optimum placement

is closest to the input terminal of the device and the system GND. Take care to minimize the loop area formed by

the bypass-capacitor connection, the input terminal, and the system GND. Traces carrying the load current must

be wide to reduce the amount of parasitic trace inductance. In cases when VIN shorts to ground, an external

diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the IC.

This diode must be placed close to the corresponding IC pins to increase their effectiveness.

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Layout Guidelines (continued)

11.1.1 Thermal Considerations

When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important

to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by

summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the

operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in

Figure 15. The heat generated at the device junction flows through the die to the die attach pad, through the lead

frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment.

There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which

includes the following.

Component variables (RθJC)

• Leadframe size and material

• Number of conduction pins

• Die size

• Die attach material

• Molding compound size and material

Application variables (RθCA)

• Mounting pad size, material, and location

• Placement of mounting pad

• PCB size and material

• Traces length and width

• Adjacent heat sources

• Volume of air

• Ambient temperature

• Shape of mounting pad

The case temperature is measured at the point where the leads contact the mounting pad surface

Figure 15. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board

The LM341 and LM78M05 regulators have internal thermal shutdown to protect the device from overheating.

Under all possible operating conditions, the junction temperature of the LM341 and LM78M05 must be within the

range of 0°C to 125°C. A heat sink may be required depending on the maximum power dissipation and maximum

ambient temperature of the application. To determine if a heat sink is needed, the power dissipated by the

regulator (PD) is calculated using Equation 1.

IIN = IL+ IG(1)

PD= (VIN – VOUT)×IL+ (VIN × IG) (2)

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SNVS090G –MAY 2004–REVISED JUNE 2020

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Layout Guidelines (continued)

Figure 16 shows the voltages and currents which are present in the circuit.

Figure 16. Power Dissipation Diagram

The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX).

TR(MAX) = TJ(MAX) – TA(MAX)

where

• TJ(MAX) is the maximum allowable junction temperature (125°C)

• TA(MAX) is the maximum ambient temperature encountered in the application

Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal

resistance (RθJA) can be calculated with Equation 3.

RθJA = TR(MAX) / PD(3)

As a design aid, Table 2 lists the value of the RθJA of TO-252 for different heat sink area. The copper patterns

that we used to measure these RθJA are shown at the end of the AN–1028 Maximum Power Enhancement

Techniques for Power Packages application note.Figure 12 reflects the same test results as what are in the

Table 2.

Figure 13 illustrates the maximum allowable power dissipation versus ambient temperature for the PFM device.

Figure 14 illustrates the maximum allowable power dissipation versus copper area (in2) for the TO-252 device.

For power enhancement techniques to be used with TO-252 package, see the AN–1028 Maximum Power

Enhancement Techniques for Power Packages application note.

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Layout Guidelines (continued)

(1) Tab of device is attached to topside copper.

Table 2. RθJA Different Heat Sink Area

LAYOUT COPPER AREA (in2)THERMAL RESISTANCE: RθJA

(°C/W)

TOP SIDE(1) BOTTOM SIDE TO-252

1 0.0123 0 103

2 0.066 0 87

3 0.3 0 60

4 0.53 0 54

5 0.76 0 52

6 1 0 47

7 0 0.2 84

8 0 0.4 70

9 0 0.6 63

10 0 0.8 57

11 0 1 57

12 0.066 0.066 89

13 0.175 0.175 72

14 0.284 0.284 61

15 0.392 0.392 55

16 0.5 0.5 53

11.2 Layout Example

Figure 17. Layout Recommendation

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12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

Texas Instruments, AN–1028 Maximum Power Enhancement Techniques for Power Packages application

note

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to order now.

Table 3. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LM341 Click here Click here Click here Click here Click here

LM78M05 Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM341T-15/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM341T-15

LM78M15CT

LM341T-5.0 NRND TO-220 NDE 3 45 Non-RoHS &

Non-Green Call TI Call TI -40 to 125 LM341T-5.0

LM78M05CT

LM341T-5.0/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0

LM78M05CT

LM78M05CDT NRND TO-252 NDP 3 75 Non-RoHS &

Non-Green Call TI Call TI -40 to 125 LM78M05

CDT

LM78M05CDT/NOPB ACTIVE TO-252 NDP 3 75 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM78M05

CDT

LM78M05CDTX NRND TO-252 NDP 3 2500 Non-RoHS &

Non-Green Call TI Call TI -40 to 125 LM78M05

CDT

LM78M05CDTX/NOPB ACTIVE TO-252 NDP 3 2500 RoHS & Green SN Level-2-260C-1 YEAR -40 to 125 LM78M05

CDT

LM78M05CT NRND TO-220 NDE 3 45 Non-RoHS &

Non-Green Call TI Call TI -40 to 125 LM341T-5.0

LM78M05CT

LM78M05CT/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0

LM78M05CT

LM78M15CT/NOPB ACTIVE TO-220 NDE 3 45 RoHS & Green SN Level-1-NA-UNLIM -40 to 125 LM341T-15

LM78M15CT

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM78M05CDTX TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LM78M05CDTX/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Jun-2020

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM78M05CDTX TO-252 NDP 3 2500 367.0 367.0 35.0

LM78M05CDTX/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 17-Jun-2020

Pack Materials-Page 2

MECHANICAL DATA

NDE0003B

www.ti.com

PACKAGE OUTLINE

10.42

9.40

6.73

6.35

6.22

5.97 1.27

0.88

5.46

4.96

2.285

4.57

1.02

0.64

3X 0.88

0.64

2.55 MAX

0.88

0.46

1.14

0.89

0.60

0.46

0.17

0.51 MIN

4.32 MIN

(2.345)

(2.5)

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Reference JEDEC registration TO-252.

0.25 C A B

TOP & BOTTOM

PKG

OPTIONAL

SEATING PLANE

SCALE 1.500

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ALL AROUND 0.07 MIN

ALL AROUND

(4.57)

2X (1.3) 2X (2.15) (5.7)

(5.5)

(2.285)(4.38)

(R0.05) TYP

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers

SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).

5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 8X

SYMM

PKG

SEE SOLDER MASK

DETAIL

EXPOSED

METAL

METAL EDGE

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED) SOLDER MASK DETAIL

EXPOSED

METAL

METAL UNDER

SOLDER MASK

OPENING

SOLDER MASK DEFINED

www.ti.com

EXAMPLE STENCIL DESIGN

2X (2.15)

2X (1.3)

(4.57)

(4.38)

(1.32) TYP

(1.35) TYP

(0.26) (R0.05) TYP

16X (1.12)

16X (1.15)

TO-252 - 2.55 mm max heightNDP0003B

TRANSISTOR OUTLINE

4219870/A 03/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

PKG

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 8X

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