Low IQ, Low Dropout 900mA Fixed Voltage Regulator
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Features
Applications
• Notebook Computer
• PDA or Portable Equipments
• Noise-Sensitive Instrumentation Systems
• Low Noise : 50µVRMS (100Hz to 100kHz)
• Low Quiescent Current : 50µA (No load)
• Low Dropout Voltage : 210mV (@900mA)
• Very low Shutdown Current : < 1µA
• Fixed Output Voltage : 1.3V ~ 3.4V
• Stable with 4.7µF Output Capacitor
• Stable with Aluminum , Tantalum or Ceramic
Capacitors .
• Reverse Current Protection
• No Protection Diodes Needed
• Built in Thermal Protection
• Built in Current Limit Protection
• Controlled Short Circuit Current : 200mA
• Fast Transient Response
• Short Setting Time
• SOT-89, SOT-89-5, SOT-223, SO-8 ,TO-252
and TO-252-5 Packages
• Lead Free Available (RoHS Compliant)
Pin Configuration
SOT-89 (Top View)
VIN GND VOUT
1 2 3
TAB is GND
SO-8 (Top View)SOT-223 (Top View)
1
2
3
4 5
6
7
8IN
GND
GND
SHDN BYP
GND
GND
OUT
VOUTGNDVIN
1 2 3
TAB is GND
TO-252-5 (Top View)
TAB is GND
1 2 3
VOUTVIN
General Description
The APL5901/2 is micropower, low noise, low dropout
linear regulator. Operate from 2.7V to 6V input voltage
and deliver up to 900mA. Typical output noise is just
50µVRMS with the addition of an external 0.1µF bypass
capacitor in BP pin and typical dropout voltage is only
210mV at 900mA loading. Designed for use in bat-
tery-powered system, the low 50µA quiescent cur-
rent makes it an ideal choice.TO-252 (Top View)
APL5901
BP
VOUT
GND
VIN
1 2 3 4 5
TAB is GND
SHDN
SOT-89-5 (Top View)
VIN
GND
VOUT
1 2 3
5 4
SHDN
BP GND
Design with an internal P-channel MOSFET pass
transistor, the APL5901/2 maintains a low supply
current, independent of the load current and dropout
voltage. Other features include reverse current
protection, thermal-shutdown protection, current limit
protection to ensure specified output current and con-
trolled short-circuit current. The APL5901/2 regulator
come in a miniature SOT-89, SOT-89-5, SOT-223, SO-
8, TO-252 and TO-252-5 packages.
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw2
Package Code
D : S OT-89 D5 : SOT-89-5 U : TO-252
U5 : TO-252-5 V : SOT-223 K : SO-8
Temp. Range
C : 0 to 70 C
Handling Code
TR : Tape & Reel
Voltage Code :
13 : 1.3V ~ 34 : 3.4V
Lead Free Code
L : Lead Free Device Blank : Original Device
APL5901/2 -
Handling Code
Temp. Range
Package Code
Voltage Code
APL5901/2
XXXXX13
APL5901/2 - 13 D/V/K :XXXXX - Date Code , 13 - 1.3V
13
APL5901/2
XXXXX
APL5901/2 - 13 U :XXXXX - Date Code , 13 - 1.3V
Lead Free Code
Pin Description
PIN
No. Name I/O Description
1 VIN I Supply voltage input.
2 GND
Ground pins of the circuitry, and all ground pins must be soldered to
PCB with proper power dissipation.
3 SHDN(Note1) I Shutdown control pin, low = off , high = normal. Don’t leave open.
4 BP(Note1) O Bypass signal pin in fixed output type device
5 VOUT O Output pin of the regulator.
Ordering and Marking Information
Pin Configuration (Cont.)
SOT-223 (Top View)
VINVOUTGND
1 2 3
TAB is VOUT
APL5902
°
Note1 : These pins do not exist in 3-pin package.
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termina-
tion finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-
tion at lead-free peak reflow temperature.
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw3
Symbol Parameter Rating Unit
VIN, VOUT Input Voltage or Out Voltage 6.5 V
SHDN Shutdown Control Pin
6.5 V
RTH,JA Thermal Resistance – Junction to Ambient
SOT-89 : 180
SOT-223 : 135
SO-8 : 150
TO
-
252 : 50
°C/W
RTH,JC Thermal Resistance – Junction to Case
SOT-89 : 38
SOT-223 : 15
SO-8 : 20
TO
-
252 : 6
°C/W
PD Power Dissipation Internally Limited W
TJ Operating Junction Temperature °C
Control Section 0 to 125
Power Transistor 0 to 150
TSTG Storage Temperature Range -65 to +150 °C
TL Lead Temperature (Soldering, 10 second) 260 °C
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF,
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.
Absolute Maximum Ratings
Electrical Characteristics
APL5901/2
Symbol
Parameter Test Conditions Min. Typ.
Max.
Unit
VIN Input Voltage 2.7 6 V
VOUT Output Voltage VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX
VOUT -2%
VOUT
VOUT +2%
V
ILIMIT Circuit Current Limit VIN=4.3V
1.5
A
ISHORT Short Current VOUT=0V 200
mA
IOUT Load Current
900 mA
REGLINE
Line Regulation VOUT+0.5V< VCC<6.0V, I = 1mA 4 10 mV
REGLOAD
Load Regulation
VIN =VOUT+1.0V, 0mA< IOUT < IMAX
515X
1
0.1
6 mV
%
1.3V≤VOUT<1.5V 1100
1300
1.5V≤VOUT<2V 900
1050
2V≤VOUT<2.5V 500
700
VDROP Dropout Voltage(Note2)
IOUT =900mA
2.5V≤VOUT<3.4V 280
380
mV
PSRR
Ripple Rejection F≤1kHz, 1Vpp at VIN = VOUT+1.0V
C
=10nf
55 65
dB
No load 50
100
IQ Quiescent Current IOUT=900mA 370
450 µA
Shutdown Supply
Current(Note3) Shutdown = low
IOUT=0, VCC =6.0V 0.01
1 µA
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw4
APL5901/2
Symbol
Parameter Test Conditions Min. Typ.
Max.
Unit
100Hz<f<100kHz, typical load,
C
BP
=0.01
µ
F
, C
OUT
= 1
µ
F
50
Noise(Note3) 100Hz<f<100kHz, typical load,
CBP=0.1µF, COUT = 1µF 40
µVrms
CBP=0.01µF,COUT=1µF, no load 7
IQ
Shutdown Recovery
Delay(Note3) CBP=0.1µF,COUT=1µF, no load 70
ms
OTS Over Temperature
Shutdown
150
°C
Over Temperature
Shutdown Hysteresis Hysteries 10
°C
TC Output Voltage
Temperature
Coefficient 50
ppm/°C
COUT Output Capacitor 4.2 4.7
5.2 µF
ESR 0.02 0.1
1 Ohm
Shutdown Input
Threshold(Note3) VOUT+1.0V< VIN
<6.0V
0.4 0.7
1.6 V
ISHDN Shutdown input Bias
current(Note3) VSHDN =VIN 0.01
100 nA
Input R
everse Leakage
current VOUT-VIN=0.1V 0.1
0.5 µA
Reverse Protection
Threshold 11 50 mV
Application Circuit
BP
VOUTVIN
GND
SHDN
VOUT
CIN
1µFoff
on
APL5901
INPUT
2.7V to 6V
0.01µFCBP
COUT
4.7µF
Electrical Characteristics (Cont.)
Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V
Note 3 : For 5-pin devices only.
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF,
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw5
APL5901/2-33
APL5901/2-33
APL5901/2-33
0
0.5
1
1.5
2
2.5
3
3.5
0123456
0
50
100
150
200
250
300
350
0123456
0
50
100
150
200
250
300
350
400
0150 300 450 600 750 900
0
0.5
1
1.5
2
2.5
3
3.5 44.5 55.5 6
Typical Characteristics
Current Limit vs. Input Voltage
Input Voltage (V)
Current Limit (mA)
Ground Pin Current vs. Output Current
Ground Pin Current vs. Load Current (uA)
Output Current (mA)
Ground Pin Current vs. Input Voltage
Input Voltage (V)
Ground Pin Current vs. Load Current (uA)
Input Voltage vs. Output Voltage
Input Voltage (V)
Output Voltage (V)
APL5901/2-33
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw6
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
0 150 300 450 600 750 900
APL5901/2-33
-100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
20
200k
50
100
200
500
1k
2k
5k
10k
20k
50k
100k
0.4
0.5
0.6
0.7
0.8
0.9
1
33.5 44.5 55.5 6
-12
-10
-8
-6
-4
-2
0
00.5 11.5 22.5 3
Typical Characteristics
SHDN Threshold Voltage vs. Input Voltage
SHDN Threshold Voltage (V)
Input Voltage (V)
PSRR vs. Frequency
Frequency (HZ)
PSRR (dB)
IOUT =50mA
COUT=10uF
CBP=0.1uF
Output Current vs. Output Voltage
Output Current (uA)
Output Voltage (V)Output Current (mA)
Dropout Voltage (mV)
VIN=0V
VIN=0VVIN=4V
VIN=5V
APL5901/2-33
APL5901/2-33
Dropout Voltage vs. Output Current
VOUT=1.5V
VOUT=1.8V
VOUT=3.3V
VOUT=2.5V
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw7
0
50
100
150
200
250
300
350
400
450
500
00.1 0.2 0.3 0.4
-100u
100u
-80u
-60u
-40u
-20u
0
20u
40u
60u
80u
010m
2m 4m 6m 8m
Typical Characteristics
Output Noise
Time (s)
VOUT (50uV/div)
VIN=4.3V
IOUT =0mA
COUT=10uF
CBP=0.1uF
Output Noise vs. Bypass Capacitor
Output Noise (uV)
Bypass Capacitor (uF)
Load-Transient Response
Output Voltage (50mV/div)
Time (10µs/div)
VOUT
IOUT=1mA~900mA
Time (40µs/div)
VOUT
VIN
Line-Transient Response
VIN=VOUT+1V
COUT=4.7µF
Output Voltage (20mV/div)
APL5901/2-33 APL5901/2-33
APL5901/2-33APL5901/2-33
4V
3V
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw8
0.001
0.01
0.1
1
0 150 300 450 600 750 900
VOUT
COUT=1µF
No Load
Typical Characteristics
Entering Shutdown
Time (1ms/div)
VOUT
vSHDN
Shutdown Exit Delay
Time (20ms/div)
VOUT
vSHDN
CBP=100nF
No Load
Time (200ms/div)
VOUT=3.3V
Region of Stable ESR vs. Load Current
Load Current (mA)
COUT ESR (Ω)
Shutdown Exit Delay
unstable
stable
APL5901/2-33 APL5901/2-33
APL5901/2-33
APL5901/2-33
3.3V
4V
3.3V
4V
0V
0V
0V
0V
3.3V
4V
0V
0V
CBP=10nF
No Load
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw9
3.25
3.27
3.29
3.31
3.33
3.35
-40 040 80 120
Typical Characteristics
Output Voltage vs. Temperature
Temperature (°C )
Output Voltage (V)
APL5901/2-33
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw10
The minimum input-output voltage difference (dropout)
determines the lowest usable supply voltage. In bat-
tery-powered systems, this will determine the useful
end-of-life battery voltage. Because the APL5901/2
use a p-channel MOSFET pass transistor, the drop-
out voltage is a function of drain-to-source on-resis-
tance (RDS(ON)) multiplied by the load current.
The APL5901/2 load-transient response graphs in typi-
cal characteristics show the transient response. A
step change in the load current from 10mA to 900mA
at 10µs will cause a 20mV transient spike. Larger
output capacitor and lower ESR can reduce transient
spike.
Application Information
Capacitor Selection and Regulator
Stability
The APL5901/2 use at least a 1µF capacitor on the
input, and this capacitor can be Aluminum, Tantalum
or Ceramic capacitor. The input capacitor with larger
value and lower ESR provides better PSRR and line-
transient response. The output capacitor also can use
Aluminum, Tantalum or Ceramic capacitor, and a mini-
mum value of 4.7µF and ESR above 0.02Ω is
recommended. A larger output capacitor can reduce
noise and improve load-transient response, stability,
and PSRR. Note that some ceramic dielectrics ex-
hibit large capacitance and ESR variation with
temperature. When using this capacitor, a minimum
10uF or more may be required to ensure the stability
at low temperature operation. Use a bypass capaci-
tor at BP pin for low output nvise. Increasing the ca-
pacitance will slightly decrease the output noise, but
increase the start-up time.
Load-Transient Considerations
Input-Output (Dropout)Voltage
Reverse Current Protection
The APL5901/2 have an internal reverse protection, it
does not need an external schottky diode to connect
the regulator input and output. If the output voltage is
forced above the input voltage by more than 11mV,
the IC will be shutdown and the ground pin current is
below 0.1uA.
Current Limit
The APL5901/2 have a current limit protection. The
ouptut voltage will drop close to zero volt, when load
current reaches the limit, and then the load current
will be limited at 200mA after output voltage is below
0.7V. When the load current back to the value where
limiting started, the output voltage and current will re-
turn to normal value. When output is shorted to
ground, the APL5901/2 will keep short circuit current
at 200mA .
Shutdown/Enable
The APL5901/2 have an active high enable function.
Force EN high (>1.6V) enables the regulator, EN low
(<0.4V) disables the regulator and enter the shutdown
mode. In shutdown mode, the quiescent current can
reduce below 1uA. The EN pin cannot be floating, a
floating EN pin may cause an indeterminate state on
the output. If it is no use, connect to VIN for normal
operation.
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw11
Thermal protection limits total power dissipation in the
device. When the junction temperature exceeds
TJ=+150℃, the thermal sensor generates a logic sig-
nal to turn off the pass transistor and allows IC to
cool. When the IC’s junction temperature is down by
10℃, the thermal sensor will turn the pass transistor
on again, resulting in a pulsed output during continu-
ous thermal protection. Thermal protection is designed
to protect the APL5901/2 in the event of fault
conditions. For continuous operation, do not exceed
the absolute maximum junction temperature of
TJ=+150℃.
Operating Region and Power Dis-
sipation
The thermal resistance of the case to circuit board,
and the rate of air flow all control the APL5901/2’s
maximum power dissipation. The power dissipation
across the device is PD = IOUT (VIN-VOUT) and the maxi-
mum power dissipation is:
PDMAX = (TJ-TA) / (θJC +θCA)
where TJ-TA is the temperature difference between the
junction and ambient air, θJC is the thermal resis-
tance of the package, andθCA is the thermal resis-
tance through the printed circuit board, copper traces,
and other materials to the ambient air.
The GND pin of the APL5901 provide an electrical con-
nection to ground and channeling heat away. If power
dissipation is large, connect the GND pin to ground
using a large pad or ground plane, can improve the
problem of over heat of IC.
Thermal Protection
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw12
Packaging Information
Millimeters Inches
Dim Min. Max. Min. Max.
A1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
D4.80 5.00 0.189 0.197
E3.80 4.00 0.150 0.157
H5.80 6.20 0.228 0.244
L0.40 1.27 0.016 0.050
e1 0.33 0.51 0.013 0.020
e2 1.27BSC 0.50BSC
φ 1 8°8°
HE
e1 e2
0.015X45
D
A
A1
0.004max.
1
L
SOP-8 pin ( Reference JEDEC Registration MS-012)
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw13
SOT-223( Reference JEDEC Registration SOT-223)
B1
D
HE
K
e
e1
A
c
L
A1
a
B
b
Millimeters InchesDim Min. Max. Min. Max.
A1.50 1.80 0.06 0.07
A1 0.02 0.08
B0.60 0.80 0.02 0.03
B1 2.90 3.10 0.11 0.12
c0.28 0.32 0.01 0.01
D6.30 6.70 0.25 0.26
E3.30 3.70 0.13 0.15
e2.3 BSC 0.09 BSC
e1 4.6 BSC 0.18 BSC
H6.70 7.30 0.26 0.29
L0.91 1.10 0.04 0.04
K1.50 2.00 0.06 0.08
α0°10°0°10°
β13°13°
Packaging Information
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw14
Packaging Information
D
D1
e
B1
e1
B
1 2 3
L
HE
C
a
a
A
SOT-89 (Reference EIAJ ED-7500A Reg stration SC-62)
Millimeters Inches
Dim Min. Max. Min. Max.
A1.40 1.60 0.055 0.063
B0.40 0.56 0.016 0.022
B1 0.35 0.48 0.014 0.019
C0.35 0.44 0.014 0.017
D4.40 4.60 0.173 0.181
D1 1.35 1.83 0.053 0.072
e1.50 BSC 0.059 BSC
e1 3.00 BSC 0.118 BSC
E2.29 2.60 0.090 0.102
H3.75 4.25 0.148 0.167
L0.80 1.20 0.031 0.047
α10°10°
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw15
Packaging Information
SOT-89-5
Millimeters Inches
Dim Min. Max. Min. Max.
A4.40 4.60 0.17 0.18
B4.05 4.25 0.16 0.17
C1.50 1.70 0.06 0.07
D1.30 1.50 0.05 0.06
E2.40 2.60 0.09 0.1
F0.80 -0.03 -
G3.00 REF 0.12 REF
H1.50 REF 0.06 REF
I0.40 0.52 0.01 0.02
J1.40 1.60 0.05 0.06
K0.35 0.41 0.01 0.02
L5 TYP 0.2 TYP
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw16
Packaging Information
TO-252-5
Millimeters Inches
Dim Min. Max. Min. Max.
A6.40 6.80 0.25 0.26
B5.20 5.50 0.20 0.21
C6.80 7.20 0.26 0.27
D2.20 2.80 0.08 0.11
P1.27 REF 0.05 REF
S0.50 0.80 0.02 0.03
H2.20 2.40 0.08 0.09
J0.45 0.55 0.01 0.02
K00.15 00.006
L0.90 1.50 0.03 0.06
M5.40 5.80 0.21 0.22
L
K
J
H
B
A
C
M
D
PS
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw17
TO-252( Reference JEDEC Registration TO-252)
Packaging Information
Millimeters Inches
Dim Min. Max. Min. Max.
A2.18 2.39 0.086 0.094
A1 0.89 1.27 0.035 0.050
b0.508 0.89 0.020 0.035
b2 5.207 5.461 0.205 0.215
C0.46 0.58 0.018 0.023
C1 0.46 0.58 0.018 0.023
D5.334 6.22 0.210 0.245
E6.35 6.73 0.250 0.265
e1 3.96 5.18 0.156 0.204
H9.398 10.41 0.370 0.410
L0.51 0.020
L1 0.64 1.02 0.025 0.040
L2 0.89 2.032 0.035 0.080
L2
D
L1
b
b2
E
C1
A
H
L
C
A1
e1
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw18
Physical Specifications
t 25 C to Peak
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Zone
TL to TP
°
Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
Classificatin Reflow Profiles
(mm)
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate
(TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL) 183°C
60-150 seconds 217°C
60-150 seconds
Peak/Classificatioon Temperature (Tp)
See table 1 See table 2
Time within 5°C of actual
Peak Temperature (tp) 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw19
Carrier Tape & Reel Dimensions
t
Ao
E
W
Po P
Ko
Bo
D1
D
F
P1
Test item Method Description
SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC
HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C
PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C
TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles
ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V
Latch-Up JESD 78 10ms, 1tr > 100mA
Reliability Test Program
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm3
≥350
<2.5 mm 240 +0/-5°C 225 +0/-5°C
≥2.5 mm 225 +0/-5°C 225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness Volume mm3
<350 Volume mm 3
350-2000 Volume mm3
>2000
<1.6 mm 260 +0°C* 260 +0°C* 260 +0°C*
1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C*
≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0°C.
For example 260°C+0°C) at the rated MSL level.
Classification Reflow Profiles(Cont.)
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw20
Reel Dimensions
Application
A
B
C
T1
T2
W
P
E
330 ± 1 62 +1.5
12.75+ 0.15
2 ± 0.5
12.4
±
0.2
2 ± 0.2
12
±
0. 3
8± 0.1 1.75±0.1
FDD1 Po P1 Ao Bo Ko t
SOP- 8
5.5± 1
1.55 +0.1
1.55+ 0.25
4.0
±
0.1
2.0
±
0.1
6.4
±
0.1
5.2
±
0. 1
2.1
±
0.1
0.3
±
0.013
Application
ABCJT1 T2 WP E
178 ±170 ± 2
13.5
±
0.15
3
±
0.15
14 ± 2
1.3
±
0.3
12 + 0.3
12 - 0.1 8 ± 0.1
1.75
±
0.1
FDD1 Po P1 Ao Bo Ko t
SOT-89
5.5
±
0.05 1.5
±
0.1 1.5
±
0.1 4.0
±
0.1 2.0
±
0.1 4.8
±
0.1 4.5
±
0.1 1.80
±
0.1 0.3
±
0.013
Application
ABCJT1 T2 WP E
330±162±1.5 12.75±
0.15 2 ± 0.6 12.4 +0.2 2± 0.2 12
±
0.3 8 ± 0.1 1.75
±
0.1
FDD1 Po P1 Ao Bo Ko t
SOT-223
5.5
±
0.05
1.5+ 0.1
1.5+ 0.1
4.0
±
0.1
2.0
±
0.05
6.9
±
0.1
7.5
±
0.1
2.1
±
0.1
0.3
±
0.05
Application
ABCJT1 T2 WP E
330 ±3100
±
2 13
±
0. 5 2 ± 0.5 16.4 + 0.3
-0.2 2.5
±
0.5 16+ 0.3
- 0.1 8 ± 0.1 1.75
±
0.1
FDD1 Po P1 Ao Bo Ko t
TO-252
7.5
±
0.1 1.5 +0.1 1.5
±
0.25 4.0
±
0.1 2.0
±
0.1 6.8
±
0.1 10.4
±
0.1 2.5
±
0.1 0.3
±
0.05
(mm)
Carrier Tape & Reel Dimensions(Cont.)
A
J
B
T2
T1
C
Cover Tape Dimensions
Application Carrier Width Cover Tape Width Devices Per Reel
SOP- 8 12 9.3 2500
SOT- 89 12 9.3 1000
SOT- 223 12 9.3 2500
TO- 252 16 13.3 2500
Copyright ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5901/2
www.anpec.com.tw21
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Customer Service