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DS-LAA108-R02 1
LAA108
Dual Single-Pole OptoMOS® Relay
RoHS
2002/95/EC e3
Pb
Part # Description
LAA108 8-Pin DIP (50/Tube)
LAA108S 8-Pin Surface Mount (50/Tube)
LAA108STR 8-Pin Surface Mount (1,000/Reel)
LAA108P 8-Pin Flat Pack (50/Tube)
LAA108PTR 8-Pin Flat Pack (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 100 VP
Load Current 300 mA
Max RON 8Ω
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
Switching Characteristics of
Normally Open (Form A) Devices
Control
ILOAD
10%
90%
tON
+
+
tOFF
Small 8-pin Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
High Reliability
Arc-Free With No Snubbing Circuits
3750Vrms Input/Output Isolation
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Surface Mount Tape & Reel Versions Available
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Clare's LAA108 is a 100V, 300mA, 8Ω dual
1-Form-A (single-pole normally open)
Solid State Relay that has two independently
controlled, optically coupled outputs.
The output MOSFET switches and photovoltaic die
use Clare’s patented OptoMOS architecture to provide
3750 Vrms of input-to-output isolation. The optically
coupled output is controlled by a highly efficient
GaAIAs infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than two discrete single-
pole relays in a variety of applications, saving board
space by incorporating both switches in a single 8-Pin
package.
UL Recognized Component: File # E76270
CSA Certified Component: Certificate # 1172007
Certified to:
IEC 60950-1: 2005
EN 60950-1: 2006
TUV Certificate # B 09 07 49410 004
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
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2
LAA108
R02
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Load Current
Continuous 1-I
L- - 300 mA
Peak t =10ms ILPK - - 400
On-Resistance 2IL=300mA RON - 4.5 8 Ω
Off-State Leakage Current VL=100VPILEAK --1μA
Switching Speeds
Turn-On IF=5mA, VL=10V tON - 0.43 3 ms
Turn-Off tOFF - 0.17 3
Output Capacitance 50V, f=1MHz COUT - 110 - pF
Input Characteristics @ 25°C
Input Control Current 3IL=300mA IF- 0.5 2 mA
Input Dropout Current - - 0.2 0.3 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10μA
Common Characteristics @ 25°C
Input to Output Capacitance - CI/O -3-pF
1 If both poles operate simultaneously, the load current must be derated so as not to exceed the package total power dissipation value.
2 Measurement taken within one (1) second of on time.
3 For applications requiring high-temperature operation (T>60ºC), an LED drive currrent of 4mA is recommended.
Parameter Ratings Units
Blocking Voltage 100 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate Linearly 1.33 mw/˚C
2 Derate Linearly 6.67 mw/˚C
Electrical absolute maximum ratings are at 25°C
Absolute Maximum Ratings
Electrical Characteristics
LAA108
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R02
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.26 1.27 1.28 1.29 1.30 1.31
Device Count (N)
0
5
10
15
20
25
30
LED Forward Voltage Distribution
(IF=5mA, TA=25ºC)
0.40 0.45 0.50 0.55 0.60 0.65 0.70
Device Count (N)
0
5
10
15
20
LED Current to Operate Distribution
(IL=100mA, TA=25ºC)
LED Current to Operate (mA) On-Resistance (Ω)
4.46 4.48 4.50 4.52 4.54 4.56 4.58
Device Count (N)
0
5
10
15
20
On-Resistance Distribution
(IF=2mA, IL=200mA, TA=25ºC)
Turn-On Time (ms)
0.135 0.150 0.165 0.180 0.195 0.210 0.225
Device Count (N)
0
5
10
15
20
Turn-On Time Distribution
(IF=5mA, IL=200mA, TA=25ºC)
Turn-Off Time (ms)
0.34 0.38 0.42 0.46 0.50 0.54 0.58
Device Count (N)
0
5
10
15
20
25
Turn-Off Time Distribution
(IF=5mA, IL=200mA, TA=25ºC)
Blocking Voltage (VP)
139 140 141 142 143 144
Device Count (N)
0
5
10
15
20
25
Blocking Voltage Distribution
(TA=25ºC)
-40 -20 0 20 40 60 80 100
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Temperature (ºC)
LED Forward Voltage (V)
LED Forward Voltage vs. Temperature
IF=20mA
IF=50mA
IF=5mA
IF=10mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
LED Current to Operate
vs. Temperature
(IL=100mA)
Load Voltage (V)
-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3
Load Current (mA)
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
Typical Load Current vs. Load Voltage
(IF=2mA, TA=25ºC)
LED Forward Current (mA)
0 1020304050
Turn-On Time (ms)
0
0.1
0.2
0.3
0.4
0.5
Turn-On Time vs. LED Forward Current
(IL=80mA, TA=25ºC)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (ms)
0.425
0.430
0.435
0.440
0.445
0.450
Turn-Off Time vs. LED Forward Current
(IL=80mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (Ω)
4.0
4.5
5.0
5.5
6.0
6.5
On-Resistance vs. Temperature
(IF=2mA, IL=200mA)
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4
LAA108
R02
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.14
0.16
0.18
0.20
0.22
0.24
0.26
Turn-On Time vs. Temperature
(IF=5mA, IL=80mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
Turn-Off Time vs. Temperature
(IF=5mA, IL=80mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
100
150
200
250
300
350
400
450
500
Maximum Load Current
vs. Temperature
(IF=5mA)
Single Pole Operating
Total Current - Both Poles Operating *
* Neither pole to exceed
single pole limits
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
134
136
138
140
142
144
146
148
150
Blocking Voltage vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (nA)
0
5
10
15
20
25
Leakage Current vs. Temperature
Measured Across Pins 5 & 6, 7 & 8
(VL=100V)
Time
10μs 100μs 1ms 10ms 100ms 1s 10s 100s
Load Curent (A)
Energy Rating Curve
(Single Pole, IF=5mA, TA=25ºC)
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.2
LAA108
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R02
MECHANICAL DIMENSIONS
RoHS
2002/95/EC e3
Pb
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
8-Pin DIP Through-Hole Package
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.889 ± 0.102
(0.035 ± 0.004)
PC Board Pattern
Dimensions
mm
(inches)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 TYP
(0.01)
8-Pin Surface Mount Package
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
0.813 ± 0.120
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
8 Pin Flatpack Package
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare,
Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LAA108-R02
©Copyright 2009, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
11/13/09
For additional information please visit our website at: www.clare.com
6
LAA108
MECHANICAL DIMENSIONS
Tape and Reel Packaging for 8 Pin Flatpack Package
User Direction of Feed
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
18
P = 12.00
(0.472)
W = 16.30 max
(0.642 max)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1= 2.00
(0.079)
Top Cover
Tape
K0= 2.70
(0.106)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
P = 12.00
(0.472)
User Direction of Feed
W = 16.30 max
(0.642 max)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
18
K1= 4.20
(0.165)
Top Cover
Ta p e
K0= 4.90
(0.193)
Tape and Reel Packaging for 8-Pin Surface Mount Package
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)