TFDU6300-TT3 - Vishay Presicion Group

TFDU6300

www.vishay.com Vishay Semiconductors

Rev. 2.1, 13-Jul-12 1Document Number: 84763

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Fast Infrared Transceiver Module (FIR, 4 Mbit/s)

for IrDA Application

DESCRIPTION

The TFDU6300 transceiver is an infrared transceiver module

compliant to the latest IrDA® physical layer low-power

standard for fast infrared data communication, supporting

IrDA speeds up to 4 Mbit/s (FIR), HP-SIR®, Sharp ASK® and

carrier based remote control modes up to 2 MHz. Integrated

within the transceiver module is a photo PIN diode, an

infrared emitter (IRED), and a low-power control IC to

provide a total front-end solution in a single package.

This new Vishay FIR transceiver is built in a new smaller

package using the experiences of the lead frame BabyFace

technology. The transceivers are capable of directly

interfacing with a wide variety of I/O devices, which perform

the modulation/demodulation function. At a minimum, a VCC

bypass capacitor is the only external component required

implementing a complete solution. TFDU6300 has a tri-state

output and is floating in shutdown mode with a weak

pull-up.

FEATURES

• Compliant to the latest IrDA physical layer

specification (up to 4 Mbit/s) with an extended

low power range of > 70 cm (typ. 1 m) and TV

remote control (> 9 m)

• Operates from 2.4 V to 3.6 V within specification

• Low power consumption (1.8 mA typ. supply

current)

• Power shutdown mode (0.01 μA typ. shutdown current)

• Surface mount package

- universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)

• Tri-state-receiver output, floating in shutdown with a weak

pull-up

• Low profile (universal) package capable of surface mount

soldering to side and top view orientation

• Directly interfaces with various super I/O and controller

devices

• Only one external component required

• Split power supply, transmitter and receiver can be

operated from two power supplies with relaxed

requirements saving costs

• Qualified for lead (Pb)-free and Sn/Pb processing (MSL4)

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Notebook computers, desktop PCs, tablet PC

• Digital cameras and video cameras

• Printers, fax machines, photocopiers, screen projectors

• Telecommunication products (cellular phones, pagers)

• Internet TV boxes, video conferencing systems

• External infrared adapters (dongles)

• Medical and industrial data collection

20101

PRODUCT SUMMARY

PART NUMBER DATA RATE

(kbit/s)

DIMENSIONS

H x L x W

(mm x mm x mm)

LINK DISTANCE

(m)

OPERATING

VOLTAGE

(V)

IDLE SUPPLY

CURRENT

(mA)

TFDU6300 4000 2.5 x 8.5 x 3.1 0 to ≥ 0.7 2.4 to 3.6 2

PARTS TABLE

PART DESCRIPTION QTY/REEL OR TUBE

TFDU6300-TR3 Oriented in carrier tape for side view surface mounting 2500 pcs

TFDU6300-TT3 Oriented in carrier tape for top view surface mounting 2500 pcs

TFDU6300-TR1 Oriented in carrier tape for side view surface mounting 750 pcs

TFDU6300-TT1 Oriented in carrier tape for top view surface mounting 750 pcs

TFDU6300

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Rev. 2.1, 13-Jul-12 2Document Number: 84763

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FUNCTIONAL BLOCK DIAGRAM

Fig. 1 - Functional Block Diagram

PINOUT

Weight 0.075 g

Fig. 2 - Pinning

Definitions:

In the Vishay transceiver datasheets the following

nomenclature is used for defining the IrDA operating modes:

SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial

infrared standard with the physical layer version IrPhy 1.0

MIR: 576 kbit/s to 1152 kbit/s

FIR: 4 Mbit/s

VFIR: 16 Mbit/s

MIR and FIR were implemented with IrPhy 1.1, followed by

IrPhy 1.2, adding the SIR low power standard. IrPhy 1.3

extended the low power option to MIR and FIR and VFIR

was added with IrPhy 1.4. A new version of the standard in

any case obsoletes the former version. With introducing the

updated versions the old versions are obsolete. Therefore

the only valid IrDA standard is the actual version IrPhy 1.4 (in

Oct. 2002).

PIN DESCRIPTION

NUMBER SYMBOL DESCRIPTION I/O ACTIVE

1VCC2

IRED anode

IRED anode to be externally connected to VCC2 (VIRED). For higher voltages

than 3.6 V an external resistor might be necessary for reducing the internal

power dissipation. This pin is allowed to be supplied from an uncontrolled

power supply separated from the controlled VCC1 - supply

2 IRED cathode IRED cathode, internally connected to driver transistor

3TXD

This input is used to transmit serial data when SD is low. An on-chip

protection circuit disables the IRED driver if the TXD pin is asserted for

longer than 100 μs. When used in conjunction with the SD pin, this pin is also

used to control the receiver mode. Logic reference: VCC1

IHigh

4RXD

Received data output, push-pull CMOS driver output capable of driving

standard CMOS. No external pull-up or pull-down resistor is required.

Floating with a weak pull-up of 500 kΩ (typ.) in shutdown mode.

High/low levels related to VCC1. RXD echoes the TXD signal

OLow

5SD

Shutdown, also used for dynamic mode switching. Setting this pin active

places the module into shutdown mode. On the falling edge of this signal,

the state of the TXD pin is sampled and used to set receiver low bandwidth

(TXD = low: SIR) or high bandwidth (TXD = high: MIR and FIR) mode

IHigh

CC1 Supply voltage

7 NC Internally not connected I

8 GND Ground

Contro lle d

Dr iv er

Tr i- Stat e

Dr iv er

GND

TXD

RXD

CC2

CC1

Am pl if ie r Co mp ar ator

Logic

and

Control

18468_1

19531

TFDU6300

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Note

• Reference point pin 8, (ground) unless otherwise noted.

Typical values are for design aid only, not guaranteed nor subject to production testing.

Note

• Vishay transceivers operating inside the absolute maximum ratings are classified as eye safe according the above table.

ABSOLUTE MAXIMUM RATINGS

PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage range,

transceiver 0 V < VCC2 < 6 V VCC1 - 0.5 6 V

Supply voltage range,

transmitter 0 V < VCC1 < 6 V VCC2 - 0.5 6.5 V

Voltage at all I/O pins Vin < VCC1 is allowed - 0.5 6 V

Input currents For all pins, except IRED anode pin 10 mA

Output sinking current 25 mA

Power dissipation PD500 mW

Junction temperature TJ125 °C

Ambient temperature range

(operating) Tamb - 25 + 85 °C

Storage temperature range Tstg - 25 + 85 °C

Soldering temperature See section

“Recommended Solder Profiles” 260 °C

Average output current IIRED (DC) 150 mA

Repetitive pulse output current < 90 μs, ton < 20 % IIRED (RP) 700 mA

ESD protection Human body model 1 kV

EYE SAFETY INFORMATION

STANDARD CLASSIFICATION

IEC/EN 60825-1 (2007-03), DIN EN 60825-1 (2008-05) “SAFETY OF LASER PRODUCTS -

Part 1: equipment classification and requirements”, simplified method Class 1

IEC 62471 (2006), CIE S009 (2002) “Photobiological Safety of Lamps and Lamp Systems” Exempt

DIRECTIVE 2006/25/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 5th April 2006

on the minimum health and safety requirements regarding the exposure of workers to risks arising from

physical agents (artificial optical radiation) (19th individual directive within the meaning of article 16(1)

of directive 89/391/EEC)

Exempt

ELECTRICAL CHARACTERISTICS

PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

TRANSCEIVER

Supply voltage VCC 2.4 3.6 V

Dynamic Supply current

Receive mode only, idle

In transmit mode, add additional 85 mA (typ) for IRED current.

Add RXD output current depending on RXD load.

SIR mode ICC 1.8 3 mA

MIR/FIR mode ICC 23.3mA

Shutdown supply current

SD = high

T= 25 °C, not ambient light

sensitive, detector is disabled in

shutdown mode

ISD 0.01 μA

Shutdown supply current

SD = high, full specified

temperature range, not ambient

light sensitive

ISD 1μA

Operating temperature range TA- 25 + 85 °C

Input voltage low (TXD, SD) VIL - 0.5 0.5 V

TFDU6300

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Rev. 2.1, 13-Jul-12 4Document Number: 84763

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Notes

•T

amb = 25 °C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.

Typical values are for design aid only, not guaranteed nor subject to production testing.

(1) The typical threshold level is 0.5 x VCC1 (VCC1 = 3 V) . It is recommended to use the specified min./max. values to avoid increased operating

current.

TRANSCEIVER

Input voltage high (TXD, SD) CMOS level (1) VIH VCC - 0.3 6 V

Input leakage current (TXD, SD) VIN = 0.9 x VCC1 IICH - 1 + 1 μA

Input capacitance, TXD, SD CI5pF

Output voltage low IOL = 500 μA VOL 0.4 V

Cload = 15 pF

Output voltage high IOH = - 250 μA VOH 0.9 x VCC1 V

Cload = 15 pF

Output RXD current limitation

high state

low state

Short to ground

Short to VCC1

SD shutdown pulse duration Activating shutdown 30 ∞μs

RXD to VCC1 impedance RRXD 400 500 600 kΩ

SD mode programming pulse

duration All modes tSDPW 200 ns

OPTOELECTRONIC CHARACTERISTICS

PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

RECEIVER

Minimum irradiance Ee (1) in

angular range (2)

9.6 kbit/s to 115.2 kbit/s

λ = 850 nm to 900 nm,

VCC = 2.4 V

Ee50

(5)

(8)

mW/m2

(μW/cm2)

Minimum irradiance Ee in angular

range, MIR mode

1.152 Mbit/s

λ = 850 nm to 900 nm,

VCC = 2.4 V

Ee100

(10)

mW/m2

(μW/cm2)

Minimum irradiance Ee inangular

range, FIR mode

4 Mbit/s

λ = 850 nm to 900 nm,

VCC = 2.4 V

Ee130

(13)

200

(20)

mW/m2

(μW/cm2)

Maximum irradiance Ee in angular

range (3) λ = 850 nm to 900 nm Ee5

(500)

kW/m2

(mW/cm2)

Rise time of output signal 10 % to 90 %, CL = 15 pF tr (RXD) 10 40 ns

Fall time of output signal 90 % to 10 %, CL = 15 pF tf (RXD) 10 40 ns

RXD pulse width of output signal,

50 %, SIR mode

Input pulse length

1.4 μs < PWopt < 25 μs tPW 1.6 2.2 3 μs

RXD pulse width of output signal,

50 %, MIR mode

Input pulse length

PWopt = 217 ns, 1.152 Mbit/s tPW 105 250 275 ns

RXD pulse width of output signal,

50 %, FIR mode

Input pulse length

PWopt = 125 ns, 4 Mbit/s tPW 105 125 145 ns

RXD pulse width of output signal,

50 %, FIR mode

Input pulse length

PWopt = 250 ns, 4 Mbit/s tPW 225 250 275 ns

Stochastic jitter, leading edge

Input irradiance = 100 mW/m2,

4 Mbit/s

1.152 Mbit/s

≤ 115.2 kbit/s

350

Receiver start up time

After completion of shutdown

programming sequence

power on delay

250 μs

Latency tL40 100 μs

ELECTRICAL CHARACTERISTICS

PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

TFDU6300

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Notes

•T

amb = 25 °C, VCC = 2.4 V to 3.6 V unless otherwise noted. Typical values are for design aid only, not guaranteed nor subject to production

testing. All timing data measured with 4 Mbit/s are measured using the IrDA FIR transmission header. The data given here are valid 5 μs after

starting the preamble.

(1) IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.

(2) IrDA sensitivity definition (equivalent to threshold irradiance): minimum irradiance Ee in angular range, power per unit area. The receiver must

meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angular range at

the maximum link length.

(3) Maximum irradiance Ee in angular range, power per unit area. The optical delivered to the detector by a source operating at the maximum

intensity in angular range at minimum link length must not cause receiver overdrive distortion and possible related link errors. If placed at

the active output interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER) specification. For more

definitions see the document “Symbols and Terminology” on the Vishay website

(4) Maximum value is given by eye safety class 1, IEC 60825-1, simplified method.

(5) Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the

standard remote control applications with codes as e.g. Philips RC5/RC6® or RECS 80. When operated under IrDA full range conditions

(125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control receivers are used.

TRANSMITTER

IRED operating current, switched

current limiter

Note: no external resistor current

limiting resistor is needed ID330 440 600 mA

Output pulse width limitation

Input pulse width t < 20 μs tPW tμs

Input pulse width 20 μs < t < 150 μs tPW 18 150 μs

Input pulse width t ≥ 150 μs tPW_lim 150 μs

Output leakage IRED current IIRED - 1 1 μA

Output radiant intensity,

see figure 3,

recommended appl. circuit

VCC = VIRED = 3.3 V, α = 0°

TXD = high, SD = low Ie65 180 468 (4) mW/sr

Output radiant intensity,

see figure 3,

recommended appl. circuit

VCC = VIRED = 3.3 V, α = 0°, 15°

TXD = high, SD = low Ie50 125 468 (4) mW/sr

Output radiant intensity

VCC1 = 3.3 V, α = 0°, 15°

TXD = low or SD = high (receiver is

inactive as long as SD = high)

Ie0.04 mW/sr

Output radiant intensity, angle of

half intensity α± 24 deg

Peak - emission wavelength (5) λp875 886 900 nm

Spectral bandwidth Δλ 45 nm

Optical rise time,

optical fall time

tropt,

tfopt 10 40 ns

Optical output pulse duration Input pulse width 217 ns,

1.152 Mbit/s topt 207 217 227 ns

Optical output pulse duration Input pulse width 125 ns,

4 Mbit/s topt 117 125 133 ns

Optical output pulse duration Input pulse width 250 ns,

4 Mbit/s topt 242 250 258 ns

Optical overshoot 25 %

OPTOELECTRONIC CHARACTERISTICS

PARAMETER TEST CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

TFDU6300

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RECOMMENDED CIRCUIT DIAGRAM

Operated at a clean low impedance power supply the

TFDU6300 needs no additional external components.

However, depending on the entire system design and board

layout, additional components may be required

(see figure 3).

Fig. 3 - Recommended Application Circuit

The capacitor C1 is buffering the supply voltage and

eliminates the inductance of the power supply line. This one

should be a tantalum or other fast capacitor to guarantee the

fast rise time of the IRED current. The resistor R1 is only

necessary for high operating voltages and elevated

temperatures.

Vishay transceivers integrate a sensitive receiver and a

built-in power driver. The combination of both needs a

careful circuit board layout. The use of thin, long, resistive

and inductive wiring should be avoided. The inputs (TXD,

SD) and the output RXD should be directly (DC) coupled to

the I/O circuit.

The capacitor C2 combined with the resistor R2 is the low

pass filter for smoothing the supply voltage.

R2, C1 and C2 are optional and dependent on the quality of

the supply voltages VCCx and injected noise. An unstable

power supply with dropping voltage during transmission

may reduce the sensitivity (and transmission range) of the

transceiver.

The placement of these parts is critical. It is strongly

recommended to position C2 as close as possible to the

transceiver power supply pins. A tantalum capacitor should

be used for C1 while a ceramic capacitor is used for C2.

In addition, when connecting the described circuit to the

power supply, low impedance wiring should be used.

When extended wiring is used the inductance of the power

supply can cause dynamically a voltage drop at VCC2. Often

some power supplies are not able to follow the fast current

rise time. In that case another 4.7 μF (type, see table under

C1) at VCC2 will be helpful.

Keep in mind that basic RF-design rules for circuit design

should be taken into account. Especially longer signal lines

should not be used without termination. See e.g. “The Art of

Electronics” Paul Horowitz, Winfield Hill, 1989, Cambridge

University Press, ISBN: 0521370957.

I/O AND SOFTWARE

In the description, already different I/Os are mentioned.

Different combinations are tested and the function verified

with the special drivers available from the I/O suppliers. In

special cases refer to the I/O manual, the Vishay application

notes, or contact directly Vishay Sales, Marketing or

Application.

MODE SWITCHING

The TFDU6300 is in the SIR mode after power on as a

default mode, therefore the FIR data transfer rate has to be

set by a programming sequence using the TXD and SD

inputs as described below. The low frequency mode covers

speeds up to 115.2 kbit/s. Signals with higher data rates

should be detected in the high frequency mode. Lower

frequency data can also be received in the high frequency

mode but with reduced sensitivity. To switch the

transceivers from low frequency mode to the high frequency

mode and vice versa, the programming sequences

described below are required.

SETTING TO THE HIGH BANDWIDTH MODE

(0.576 Mbit/s to 4 Mbit/s)

1. Set SD input to logic “high”.

2. Set TXD input to logic “high”. Wait ts ≥ 200 ns.

3. Set SD to logic “low” (this negative edge latches state of

TXD, which determines speed setting).

4. After waiting th ≥ 200 ns TXD can be set to logic “low”.

The hold time of TXD is limited by the maximum allowed

pulse length.

TXD is now enabled as normal TXD input for the high

bandwidth mode.

IRED Anode

Ground

TXD

RXD

IRED Cathode

CC2

CC1

GND

TXD

RXD

C1 C2

19307

TABLE 1 - RECOMMENDED APPLICATION CIRCUIT COMPONENTS

COMPONENT RECOMMENDED VALUE VISHAY PART NUMBER

C1 4.7 μF, 16 V 293D 475X9 016B

C2 0.1 μF, ceramic VJ 1206 Y 104 J XXMT

R1 No resistor necessary, the internal controller is able to control the current

R2 10 Ω, 0.125 W CRCW-1206-10R0-F-RT1

TFDU6300

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SETTING TO THE LOWER BANDWIDTH MODE

(2.4 kbit/s to 115.2 kbit/s)

1. Set SD input to logic “high”.

2. Set TXD input to logic “low”. Wait ts ≥ 200 ns.

3. Set SD to logic “low” (this negative edge latches state of

TXD, which determines speed setting).

4. TXD must be held for th ≥ 200 ns.

TXD is now enabled as normal TXD input for the high

bandwidth mode.

Note

• When applying this sequence to the device already in the lower

bandwidth mode, the SD pulse is interpreted as shutdown. In

this case the RXD output of the transceiver may react with a

single pulse (going active low) for a duration less than 2 μs. The

operating software should take care for this condition.

In case the applied SD pulse is longer than 4 μs, no RXD pulse

is to be expected but the receiver startup time is to be taken into

account before the device is in receive condition.

Fig. 4 - Mode Switching Timing Diagram

RECOMMENDED SOLDER PROFILES

Solder Profile for Sn/Pb Soldering

Fig. 5 - Recommended Solder Profile for Sn/Pb soldering

Lead (Pb)-free, Recommended Solder Profile

The TFDU6300 is a lead (Pb)-free transceiver and qualified

for lead (Pb)-free processing. For lead (Pb)-free solder paste

like Sn(3.0 - 4.0)Ag(0.5 - 0.9)Cu, there are two standard reflow

profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike

(RTS). The Ramp-Soak-Spike profile was developed

primarily for reflow ovens heated by infrared radiation. With

widespread use of forced convection reflow ovens the

Ramp-To-Spike profile is used increasingly. Shown in

figure 4 and 5 are Vishay’s recommended profiles for use

with the TFDU6300 transceivers. For more details please

refer to the application note “SMD Assembly Instructions”.

A ramp-up rate less than 0.9 °C/s is not recommended.

Ramp-up rates faster than 1.3 °C/s could damage an optical

part because the thermal conductivity is less than compared

to a standard IC.

Wave Soldering

For TFDUxxxx and TFBSxxxx transceiver devices wave

soldering is not recommended.

Manual Soldering

Manual soldering is the standard method for lab use.

However, for a production process it cannot be

recommended because the risk of damage is highly

dependent on the experience of the operator. Nevertheless,

we added a chapter to the above mentioned application

note, describing manual soldering and desoldering.

Storage

The storage and drying processes for all Vishay transceivers

(TFDUxxxx and TFBSxxx) are equivalent to MSL4.

The data for the drying procedure is given on labels on the

packing and also in the application note “Taping, Labeling,

Storage and Packing”.

TXD

50 %

High: FIR

Low: SIR

50 %

14873

TABLE 2 - TRUTH TABLE

INPUTS OUTPUTS

SD TXD OPTICAL INPUT IRRADIANCE mW/m2RXD TRANSMITTER

High x x Weakly pulled (500 kΩ) to VCC1 0

Low

High x Low (echo) Ie

High > 150 μs x High 0

Low < 4 High 0

Low > min. detection threshold irradiance

< max. detection threshold irradiance Low (active) 0

Low > max. detection threshold irradiance x 0

100

120

140

160

180

200

220

240

260

0 50 100 150 200 250 300 350

Time/s

Temperature (°C)

2 to 4 °C/s

10 s max. at 230 °C

120 to180 s

160 °C max.

240 °C max.

90 s max.

19535

TFDU6300

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Fig. 6 - Solder Profile, RSS Recommendation Fig. 7 - RTS Recommendation

PACKAGE DIMENSIONS in millimeters

TFDU6300 (universal) package

Fig. 8 - Package Drawing

100

125

150

175

200

225

250

275

0 50 100 150 200 250 300 350

Time/s

Temperature/°C

30 s max.

2 °C/s to 3 °C/s

2 °C/s to 4 °C/s

90 s to 120 s

T ≥ 217 °C for 70 s max.

peak

= 260 °C

70 s max.

T ≥ 255 °C for 10 s....30 s

19532

120

160

200

240

280

0 50 100 150 200 250 300

Time/s

Temperature/°C

< 4 °C/s

1.3 °C/s

Time above 217 °C t ≤

70 s

Time above 250 °C t

≤ 40 s

Peak temperature Tpeak = 260 °C

< 2 °C/s

Tpeak = 260 °C max.

TFDU Fig3

20627

Footprint

20626

Mounting Center

Top View

Mounting Center

Side View

7 x 0.95 = 6.65

0.2* 0.95

0.7 (8 x)

1.4

min 0.2 Photoimageable

solder mask recommended

between pads to prevent bridgeing

0.4

1.4

0.7

1.2

(0.25)

(1.82)

TFDU6300

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REEL DIMENSIONS in millimeters

Fig. 9 - Reel Drawing

TAPE WIDTH

(mm)

A MAX.

(mm)

W1 MIN.

(mm)

W2 MAX.

(mm)

W3 MIN.

(mm)

W3 MAX.

(mm)

16 180 60 16.4 22.4 15.9 19.4

16 330 60 16.4 22.4 15.9 19.4

14017

Drawing-No.: 9.800-5090.01-4

Issue: 1; 29.11.05

TFDU6300

www.vishay.com Vishay Semiconductors

Rev. 2.1, 13-Jul-12 10 Document Number: 84763

For technical questions within your region: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TAPE DIMENSIONS in millimeters

Fig. 10 - Tape Drawing, TFDU6300 for Top View Mounting

19855

Drawing-No.: 9.700-5280.01-4

Issue: 1; 03.11.03

TFDU6300

www.vishay.com Vishay Semiconductors

Rev. 2.1, 13-Jul-12 11 Document Number: 84763

For technical questions within your region: irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TAPE DIMENSIONS in millimeters

Fig. 11 - Tape Drawing, TFDU6300 for Side View Mounting

19856

Drawing-No.: 9.700-5279.01-4

Issue: 1; 08.12.04

Legal Disclaimer Notice

www.vishay.com Vishay

Revision: 12-Mar-12 1Document Number: 91000

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE

RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,

“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,

consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular

purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical

requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements

about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular

product with the properties described in the product specification is suitable for use in a particular application. Parameters

provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All

operating parameters, including typical parameters, must be validated for each customer application by the customer’s

technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,

including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

applications or for any other application in which the failure of the Vishay product could result in personal injury or death.

Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree

to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and

damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay

or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to

obtain written terms and conditions regarding products designed for such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by

any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Material Category Policy

Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the

definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council

of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment

(EEE) - recast, unless otherwise specified as non-compliant.

Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that

all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.