Mux Buffer
Switch
Fabric A
Switch
Fabric B
FPGA
or
ASIC
Backplane or Cable
LVDS
LVDS
DS15MB200
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SNLS196E –NOVEMBER 2005–REVISED MARCH 2013
DS15MB200 Dual 1.5 Gbps 2:1/1:2 LVDS Mux/Buffer with Pre-Emphasis
Check for Samples: DS15MB200
1FEATURES DESCRIPTION
The DS15MB200 is a dual-port 2 to 1 multiplexer and
2• 1.5 Gbps Data Rate Per Channel 1 to 2 repeater/buffer. High-speed data paths and
• Configurable Off/On Pre-emphasis Drives flow-through pinout minimize internal device jitter and
Lossy Backplanes and Cables simplify board layout, while pre-emphasis overcomes
• LVDS/BLVDS/CML/LVPECL Compatible Inputs, ISI jitter effects from lossy backplanes and cables.
The differential inputs and outputs interface to LVDS
LVDS Compatible Outputs or Bus LVDS signals such as those on Texas
• Low Output Skew and Jitter Instrument's 10-, 16-, and 18-bit Bus LVDS SerDes,
• On-chip 100ΩInput and Output Termination or to CML or LVPECL signals.
• 15 kV ESD Protection on LVDS Inputs/Outputs The 3.3V supply, CMOS process, and robust I/O
• Hot Plug Protection ensure high performance at low power over the entire
industrial -40 to +85°C temperature range.
• Single 3.3V Supply
• Industrial -40 to +85°C Temperature Range
• 48-pin WQFN Package
Typical Application
Figure 1.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Channel 1
Channel 0
LI_0 SOA_0
SOB_0
SIA_0
SIB_0
MUX_S0
PREA_0
ENA_0
PREB_0
ENB_0
LO_0
PREL_0
ENL_0
DS15MB200
SNLS196E –NOVEMBER 2005–REVISED MARCH 2013
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Block Diagram
Figure 2.
PIN DESCRIPTIONS
Pin WQFN Pin I/O, Type Description
Name Number
SWITCH SIDE DIFFERENTIAL INPUTS
SIA_0+ 30 I, LVDS Switch A-side Channel 0 inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or
SIA_0−29 LVPECL compatible.
SIA_1+ 19 I, LVDS Switch A-side Channel 1 inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or
SIA_1−20 LVPECL compatible.
SIB_0+ 28 I, LVDS Switch B-side Channel 0 inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or
SIB_0−27 LVPECL compatible.
SIB_1+ 21 I, LVDS Switch B-side Channel 1 inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or
SIB_1−22 LVPECL compatible.
LINE SIDE DIFFERENTIAL INPUTS
LI_0+ 40 I, LVDS Line-side Channel 0 inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or
LI_0−39 LVPECL compatible.
LI_1+ 9 I, LVDS Line-side Channel 1 inverting and non-inverting differential inputs. LVDS, Bus LVDS, CML, or
LI_1−10 LVPECL compatible.
SWITCH SIDE DIFFERENTIAL OUTPUTS
SOA_0+ 34 O, LVDS Switch A-side Channel 0 inverting and non-inverting differential outputs. LVDS compatible(1)(2).
SOA_0−33
SOA_1+ 15 O, LVDS Switch A-side Channel 1 inverting and non-inverting differential outputs. LVDS compatible(1)(2).
SOA_1−16
SOB_0+ 32 O, LVDS Switch B-side Channel 0 inverting and non-inverting differential outputs. LVDS compatible(1)(2).
SOB_0−31
SOB_1+ 17 O, LVDS Switch B-side Channel 1 inverting and non-inverting differential outputs. LVDS compatible(1)(2).
SOB_1−18
LINE SIDE DIFFERENTIAL OUTPUTS
LO_0+ 42 O, LVDS Line-side Channel 0 inverting and non-inverting differential outputs. LVDS compatible(1)(2).
LO_0−41
LO_1+ 7 O, LVDS Line-side Channel 1 inverting and non-inverting differential outputs. LVDS compatible(1)(2).
LO_1−8
(1) For interfacing LVDS outputs to CML or LVPECL compatible inputs, refer to the applications section of this datasheet (planned).
(2) The LVDS outputs do not support a multidrop (BLVDS) environment. The LVDS output characteristics of the DS15MB200 device have
been optimized for point-to-point backplane and cable applications.
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VDD
GND
VDD
ENL_0
PREL_0
VDD
LO_0+
LO_0-
LI_0+
LI_0-
MUX_S0
VDD
48
47
46
45
44
43
42
41
40
39
38
37
ENA_1
ENB_1
SOA_1+
SOA_1-
SOB_1+
SOB_1-
SIA_1+
SIA_1-
SIB_1+
SIB_1-
PREA_1
PREB_1
13
14
15
16
17
18
19
20
21
22
23
24
VDD
MUX_S1
LI_1-
LI_1+
LO_1-
LO-1+
VDD
PREL_1
ENL_1
GND
VDD
N/C
12 11 10 9 8 7 6 5 4 3 2 1
PREB_0
PREA_0
SIB_0-
SIB_0+
SIA_0-
SIA_0+
SOB_0-
SOB_0+
SOA_0-
SOA_0+
ENB_0
ENA_0
25 26 27 28 29 30 31 32 33 34 35 36
DAP
(GND)
VDD
GND
VDD
ENL_0
PREL_0
VDD
LO_0+
LO_0-
LI_0+
LI_0-
MUX_S0
VDD
ENA_1
ENB_1
SOA_1+
SOA_1-
SOB_1+
SOB_1-
SIA_1+
SIA_1-
SIB_1+
SIB_1-
PREA_1
PREB_1
VDD
MUX_S1
LI_1-
LI_1+
LO_1-
LO-1+
VDD
PREL_1
ENL_1
GND
VDD
N/C
PREB_0
PREA_0
SIB_0-
SIB_0+
SIA_0-
SIA_0+
SOB_0-
SOB_0+
SOA_0-
SOA_0+
ENB_0
ENA_0
Channel 0
Channel 1
DS15MB200
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SNLS196E –NOVEMBER 2005–REVISED MARCH 2013
PIN DESCRIPTIONS (continued)
Pin WQFN Pin I/O, Type Description
Name Number
DIGITAL CONTROL INTERFACE
MUX_S0 38 I, LVTTL Mux Select Control Inputs (per channel) to select which Switch-side input, A or B, is passed through
MUX_S1 11 to the Line-side.
PREA_0 26 I, LVTTL Output pre-emphasis control for Switch-side outputs. Each output driver on the Switch A-side and B-
PREA_1 23 side has a separate pin to control the pre-emphasis on or off.
PREB_0 25
PREB_1 24
PREL_0 44 I, LVTTL Output pre-emphasis control for Line-side outputs. Each output driver on the Line A-side and B-side
PREL_1 5 has a separate pin to control the pre-emphasis on or off.
ENA_0 36 I, LVTTL Output Enable Control for Switch A-side and B-side outputs. Each output driver on the A-side and
ENA_1 13 B-side has a separate enable pin.
ENB_0 35
ENB_1 14
ENL_0 45 I, LVTTL Output Enable Control for The Line-side outputs. Each output driver on the Line-side has a separate
ENL_1 4 enable pin.
POWER
VDD 2, 6, 12, I, Power VDD = 3.3V ±0.3V.
37, 43, 46,
48
GND 3, 47(3) I, Power Ground reference for LVDS and CMOS circuitry.
For the WQFN package, the DAP is used as the primary GND connection to the device. The DAP is
the exposed metal contact at the bottom of the WQFN-48 package. It should be connected to the
ground plane with at least 4 vias for optimal AC and thermal performance.
(3) Note that the DAP on the backside of the WQFN package is the primary GND connection for the device when using the WQFN
package.
Connection Diagrams
Figure 3. WQFN Top View Figure 4. Directional Signal Paths Top View
DAP = GND (Refer to pin names for signal polarity)
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Output Characteristics
The output characteristics of the DS15MB200 have been optimized for point-to-point backplane and cable
applications, and are not intended for multipoint or multidrop signaling.
A 100Ωoutput (source) termination resistor is incorporated in the device to eliminate the need for an external
resistor, providing excellent drive characteristics by locating the source termination as close to the output as
physically possible.
Pre-Emphasis Controls
The pre-emphasis is used to compensate for long or lossy transmission media. Separate pins are provided for
each output to minimize power consumption. Pre-emphasis is programmable to be off or on per the Pre-
emphasis Control Table.
PREx_n(1) Output Pre-Emphasis
0 0%
1 100%
(1) Applies to PREA_0, PREA_1, PREB_0, PREB_1, PREL_0, PREL_1
Multiplexer Truth Table(2)(3)
Data Inputs Control Inputs Output
SIA_0 SIB_0 MUX_S0 ENL_0 LO_0
X valid 0 1 SIB_0
valid X 1 1 SIA_0
X X X 0 Z
(2) Same functionality for channel 1
(3) X = Don't Care
Z = High Impedance (TRI-STATE)
Repeater/Buffer Truth Table(1)(2)
Data Input Control Inputs Outputs
LI_0 ENA_0 ENB_0 SOA_0 SOB_0
X 0 0 Z Z
valid 0 1 Z LI_0
valid 1 0 LI_0 Z
valid 1 1 LI_0 LI_0
(1) Same functionality for channel 1
(2) X = Don't Care
Z = High Impedance (TRI-STATE)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
Value Unit
Supply Voltage (VDD)−0.3 to +4.0 V
CMOS Input Voltage -0.3 to
(VDD+0.3) V
LVDS Receiver Input Voltage(2) -0.3 to
(VDD+0.3) V
LVDS Driver Output Voltage -0.3 to
(VDD+0.3) V
LVDS Output Short Circuit Current +40 mA
Junction Temperature +150 °C
Storage Temperature −65 to +150 °C
Lead Temperature (Solder, 4sec) 260 °C
Max Pkg Power Capacity @ 25°C 5.2 W
Thermal Resistance (θJA) 24 °C/W
Package Derating above +25°C 41.7 mW/°C
HBM, 1.5kΩ, 100pF 8 kV
LVDS pins to GND only 15 kV
ESD Last Passing Voltage EIAJ, 0Ω, 200pF 250 V
CDM 1000 V
(1) Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met,
without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables.
Texas Instruments does not recommend operation of products outside of recommended operation conditions.
(2) VID max < 2.4V
Recommended Operating Conditions Min Max Unit
Supply Voltage (VCC) 3.0 3.6 V
Input Voltage (VI)(1) 0 VCC V
Output Voltage (VO) 0 VCC V
Operating Temperature (TA) Industrial −40 +85 °C
(1) VID max < 2.4V
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Electrical Characteristics
Over recommended operating supply and temperature ranges unless other specified.
Symbol Parameter Conditions Min Typ(1) Max Units
LVTTL DC SPECIFICATIONS (MUX_Sn, PREA_n, PREB_n, PREL_n, ENA_n, ENB_n, ENL_n)
VIH High Level Input Voltage 2.0 VDD V
VIL Low Level Input Voltage GND 0.8 V
IIH High Level Input Current VIN = VDD = VDDMAX −10 +10 µA
IIHR High Level Input Current PREA_n, PREB_n, PREL_n 40 200 µA
IIL Low Level Input Current VIN = VSS, VDD = VDDMAX −10 +10 µA
CIN1 Input Capacitance Any Digital Input Pin to VSS 2.0 pF
COUT1 Output Capacitance Any Digital Output Pin to VSS 4.0 pF
VCL Input Clamp Voltage ICL =−18 mA −1.5 −0.8 V
LVDS INPUT DC SPECIFICATIONS (SIA±, SIB±, LI±)
VTH Differential Input High Threshold(2) VCM = 0.8V or 1.2V or 3.55V, 0 100 mV
VDD = 3.6V
VTL Differential Input Low Threshold(2) VCM = 0.8V or 1.2V or 3.55V, −100 0 mV
VDD = 3.6V
VID Differential Input Voltage VCM = 0.8V to 3.55V, VDD = 3.6V 100 2400 mV
VCMR Common Mode Voltage Range VID = 150 mV, VDD = 3.6V 0.05 3.55 V
CIN2 Input Capacitance IN+ or IN−to VSS 2.0 pF
IIN Input Current VIN = 3.6V, VDD = VDDMAX or 0V −15 +15 µA
VIN = 0V, VDD = VDDMAX or 0V −15 +15 µA
LVDS OUTPUT DC SPECIFICATIONS (SOA_n±, SOB_n±, LO_n±)
VOD Differential Output Voltage, RLis the internal 100Ωbetween OUT+ 250 360 500 mV
0% Pre-emphasis(2) and OUT−
ΔVOD Change in VOD between -35 35 mV
Complementary States
VOS Offset Voltage(3) 1.05 1.22 1.475 V
ΔVOS Change in VOS between -35 35 mV
Complementary States
IOS Output Short Circuit Current OUT+ or OUT−Short to GND −21 -40 mA
COUT2 Output Capacitance OUT+ or OUT−to GND when TRI- 4.0 pF
STATE
SUPPLY CURRENT (Static)
ICC Supply Current All inputs and outputs enabled and
active, terminated with external load of 225 275 mA
100Ωbetween OUT+ and OUT-.
ICCZ Supply Current - Powerdown Mode ENA_0 = ENB_0 = ENL_0 = ENA_1 = 0.6 4.0 mA
ENB_1 = ENL_1 = L
SWITCHING CHARACTERISTICS—LVDS OUTPUTS
tLHT Differential Low to High Transition Use an alternating 1 and 0 pattern at 200 170 250 ps
Time Mb/s, measure between 20% and 80% of
VOD.(4)
tHLT Differential High to Low Transition 170 250 ps
Time
tPLHD Differential Low to High Propagation Use an alternating 1 and 0 pattern at 200 1.0 2.5 ns
Delay Mb/s, measure at 50% VOD between
input to output.
tPHLD Differential High to Low Propagation 1.0 2.5 ns
Delay
tSKD1 Pulse Skew |tPLHD–tPHLD|(4) 25 75 ps
tSKCC Output Channel to Channel Skew Difference in propagation delay (tPLHD or 50 115 ps
tPHLD) among all output channels.(4)
(1) Typical parameters are measured at VDD = 3.3V, TA= 25°C. They are for reference purposes, and are not production-tested.
(2) Differential output voltage VOD is defined as ABS(OUT+–OUT−). Differential input voltage VID is defined as ABS(IN+–IN−).
(3) Output offset voltage VOS is defined as the average of the LVDS single-ended output voltages at logic high and logic low states.
(4) Not production tested. Guaranteed by statistical analysis on a sample basis at the time of characterization.
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Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless other specified.
Symbol Parameter Conditions Min Typ(1) Max Units
tJIT Jitter (0% Pre-emphasis)(5) RJ - Alternating 1 and 0 at 750MHz(6) 1.1 1.5 psrms
DJ - K28.5 Pattern, 1.5 Gbps(7) 20 34 psp-p
TJ - PRBS 27-1 Pattern, 1.5 Gbps(8) 14 28 psp-p
tON LVDS Output Enable Time Time from ENA_n, ENB_n, or ENL_n to 0.5 1.5 µs
OUT± change from TRI-STATE to active.
tON2 LVDS Output Enable Time from Time from ENA_n, ENB_n, or ENL_n to
Powerdown Mode OUT± change from Powerdown Mode to 10 20 µs
active.
tOFF LVDS Output Disable Time Time from ENA_n, ENB_n, or ENL_n to
OUT± change from active to TRI-STATE 12 ns
or Powerdown mode.
(5) Jitter is not production tested, but guaranteed through characterization on a sample basis.
(6) Random Jitter, or RJ, is measured RMS with a histogram including 1500 histogram window hits. The input voltage = VID = 500mV, 50%
duty cycle at 750MHz, tr= tf= 50ps (20% to 80%).
(7) Deterministic Jitter, or DJ, is measured to a histogram mean with a sample size of 350 hits. Stimulus and fixture jitter have been
subtracted. The input voltage = VID = 500mV, K28.5 pattern at 1.5 Gbps, tr= tf= 50ps (20% to 80%). The K28.5 pattern is repeating bit
streams of (0011111010 1100000101).
(8) Total Jitter, or TJ, is measured peak to peak with a histogram including 3500 window hits. Stimulus and fixture jitter have been
subtracted. The input voltage = VID = 500mV, 27-1 PRBS pattern at 1.5 Gbps, tr= tf= 50ps (20% to 80%).
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TOTAL JITTER (ps)
30
0
TEMPERATURE (°C)
-40 100
0
25
20
15
10
5
-20 20 40 60 80
POWER SUPPLY CURRENT (mA)
350
0
BIT DATA RATE (Mbps)
0 2000
50
100
150
200
500 1000 1500
250
300
PRE-EMPHASIS ON
PRE-EMPHASIS OFF
TOTAL JITTER (ps)
60
0
BIT DATA RATE (Mbps)
0 2000
10
20
30
40
50
500 1000 1500
VCM = 3.0V
VCM = 0.25V
VCM = 1.2V
DS15MB200
SNLS196E –NOVEMBER 2005–REVISED MARCH 2013
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WQFN Performance Characteristics
Power Supply Current vs. Bit Data Rate Total Jitter vs. Bit Data Rate
Dynamic power supply current was measured with all channels Total Jitter measured at 0V differential while running a PRBS 27-1
pattern with one channel active, all other channels are disabled.
active and toggling at the bit data rate. Data pattern has no effect VDD = 3.3V, TA= +25°C, VID = 0.5V, pre-emphasis off.
on the power consumption.
VDD = 3.3V, TA= +25°C, VID = 0.5V, VCM = 1.2V
Figure 5. Figure 6.
Total Jitter vs. Temperature
Total Jitter measured at 0V differential while running a PRBS 27-1 pattern with one channel active, all other channels are disabled. VDD =
3.3V, VID = 0.5V, VCM = 1.2V, 1.5 Gbps data rate, pre-emphasis off. Figure 7.
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LVPECL
R2
150:
R1
150:
50:
50:
15MB200
DS15MB200
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SNLS196E –NOVEMBER 2005–REVISED MARCH 2013
TRI-STATE AND POWERDOWN MODES
The DS15MB200 has output enable control on each of the six onboard LVDS output drivers. This control allows
each output individually to be placed in a low power TRI-STATE mode while the device remains active, and is
useful to reduce power consumption on unused channels. In TRI-STATE mode, some outputs may remain active
while some are in TRI-STATE.
When all six of the output enables (all drivers on both channels) are deasserted (LOW), then the device enters a
Powerdown mode that consumes only 0.5mA (typical) of supply current. In this mode, the entire device is
essentially powered off, including all receiver inputs, output drivers and internal bandgap reference generators.
When returning to active mode from Powerdown mode, there is a delay until valid data is presented at the
outputs because of the ramp to power up the internal bandgap reference generators.
Any single output enable that remains active will hold the device in active mode even if the other five outputs are
in TRI-STATE.
When in Powerdown mode, any output enable that becomes active will wake up the device back into active
mode, even if the other five outputs are in TRI-STATE.
Input Failsafe Biasing
External pull up and pull down resistors may be used to provide enough of an offset to enable an input failsafe
under open-circuit conditions. This configuration ties the positive LVDS input pin to VDD thru a pull up resistor
and the negative LVDS input pin is tied to GND by a pull down resistor. The pull up and pull down resistors
should be in the 5kΩto 15kΩrange to minimize loading and waveform distortion to the driver. The common-
mode bias point ideally should be set to approximately 1.2V (less than 1.75V) to be compatible with the internal
circuitry. Please refer to application note AN-1194, “Failsafe Biasing of LVDS Interfaces” (SNLA051) for more
information.
Interfacing LVPECL to LVDS
An LVPECL driver consists of a differential pair with coupled emitters connected to GND via a current source.
This drives a pair of emitter-followers that require a 50 ohm to VCC-2.0 load. A modern LVPECL driver will
typically include the termination scheme within the device for the emitter follower. If the driver does not include
the load, then an external scheme must be used. The 1.3 V supply is usually not readily available on a PCB,
therefore, a load scheme without a unique power supply requirement may be used.
Figure 8. DC Coupled LVPECL to LVDS Interface
Figure 8 is a separated πtermination scheme for a 3.3 V LVPECL driver. R1 and R2 provides proper DC load for
the driver emitter followers, and may be included as part of the driver device(1). The DS15MB200 includes a 100
ohm input termination for the transmission line. The common mode voltage will be at the normal LVPECL
levels – around 2 V. This scheme works well with LVDS receivers that have rail-to-rail common mode voltage,
VCM, range. Most Texas Instrument's LVDS receivers have wide VCM range. The exceptions are noted in devices’
respective datasheets. Those LVDS devices that do have a wide VCM range do not vary in performance
significantly when receiving a signal with a common mode other than standard LVDS VCM of 1.2 V.
(1) The bias networks shown above for LVPECL drivers and receivers may or may not be present within the driver device. The LVPECL
driver and receiver specification must be reviewed closely to ensure compatibility between the driver and receiver terminations and
common mode operating ranges.
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15MB200
R2
50:
R1
50:
50:
50:
LVPECL
VT
LVPECL
R2
150:
R1
150:
50:
50:
15MB200
0.1 PF
0.1 PF
DS15MB200
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Figure 9. AC Coupled LVPECL to LVDS Interface
An AC coupled interface is preferred when transmitter and receiver ground references differ more than 1 V. This
is a likely scenario when transmitter and receiver devices are on separate PCBs. Figure 9 illustrates an AC
coupled interface between a LVPECL driver and LVDS receiver. R1 and R2, if not present in the driver device(2),
provide DC load for the emitter followers and may range between 140-220 ohms for most LVPECL devices for
this particular configuration. The DS15MB200 includes an internal 100 ohm resistor to terminate the transmission
line for minimal reflections. The signal after AC coupling capacitors will swing around a level set by internal
biasing resistors (i.e. fail-safe) which is either VDD/2 or 0 V depending on the actual failsafe implementation. If
internal biasing is not implemented, the signal common mode voltage will slowly wander to GND level.
Interfacing LVDS to LVPECL
An LVDS driver consists of a current source (nominal 3.5mA) which drives a CMOS differential pair. It needs a
differential resistive load in the range of 70 to 130 ohms to generate LVDS levels. In a system, the load should
be selected to match transmission line characteristic differential impedance so that the line is properly
terminated. The termination resistor should be placed as close to the receiver inputs as possible. When
interfacing an LVDS driver with a non-LVDS receiver, one only needs to bias the LVDS signal so that it is within
the common mode range of the receiver. This may be done by using separate biasing voltage which demands
another power supply. Some receivers have required biasing voltage available on-chip (VT, VTT or VBB).
Figure 10. DC Coupled LVDS to LVPECL Interface
Figure 10 illustrates interface between an LVDS driver and a LVPECL with a VTpin available. R1 and R2, if not
present in the receiver(2), provide proper resistive load for the driver and termination for the transmission line,
and VTsets desired bias for the receiver.
(2) The bias networks shown above for LVPECL drivers and receivers may or may not be present within the driver device. The LVPECL
driver and receiver specification must be reviewed closely to ensure compatibility between the driver and receiver terminations and
common mode operating ranges.
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Figure 11. AC Coupled LVDS to LVPECL Interface
Figure 11 illustrates AC coupled interface between an LVDS driver and LVPECL receiver without a VTpin
available. The resistors R1, R2, R3, and R4, if not present in the receiver(2), provide a load for the driver,
terminate the transmission line, and bias the signal for the receiver.
Packaging Information
The Leadless Leadframe Package (WQFN) is a leadframe based chip scale package (CSP) that may enhance
chip speed, reduce thermal impedance, and reduce the printed circuit board area required for mounting. The
small size and very low profile make this package ideal for high density PCBs used in small-scale electronic
applications such as cellular phones, pagers, and handheld PDAs. The WQFN package is offered in the no
Pullback configuration. In the no Pullback configuration the standard solder pads extend and terminate at the
edge of the package. This feature offers a visible solder fillet after board mounting.
The WQFN has the following advantages:
• Low thermal resistance
• Reduced electrical parasitics
• Improved board space efficiency
• Reduced package height
• Reduced package mass
For more details about WQFN packaging technology, refer to applications note AN-1187, "Leadless Leadframe
Package" (SNOA401).
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REVISION HISTORY
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS15MB200TSQ/NOPB ACTIVE WQFN RHS 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 85 15M200
DS15MB200TSQX/NOPB ACTIVE WQFN RHS 48 2500 RoHS & Green SN Level-3-260C-168 HR -40 to 85 15M200
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS15MB200TSQ/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
DS15MB200TSQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS15MB200TSQ/NOPB WQFN RHS 48 250 210.0 185.0 35.0
DS15MB200TSQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
SEE TERMINAL
DETAIL
48X 0.30
0.18
5.1 0.1
48X 0.5
0.3
0.8
0.7
(A) TYP
0.05
0.00
44X 0.5
2X
5.5
2X 5.5
A7.15
6.85 B
7.15
6.85
0.30
0.18
0.5
0.3
(0.2)
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
DIM A
OPT 1 OPT 2
(0.1) (0.2)
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
12 25
36
13 24
48 37
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05
EXPOSED
THERMAL PAD
49 SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 1.800
DETAIL
OPTIONAL TERMINAL
TYPICAL
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
48X (0.25)
48X (0.6)
( 0.2) TYP
VIA
44X (0.5)
(6.8)
(6.8)
(1.25) TYP
( 5.1)
(R0.05)
TYP
(1.25)
TYP
(1.05) TYP
(1.05)
TYP
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
SYMM
1
12
13 24
25
36
37
48
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
49
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
METAL EDGE
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL
www.ti.com
EXAMPLE STENCIL DESIGN
48X (0.6)
48X (0.25)
44X (0.5)
(6.8)
(6.8)
16X
( 1.05)
(0.625) TYP
(R0.05) TYP
(1.25)
TYP
(1.25)
TYP
(0.625) TYP
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
49
SYMM
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X
SYMM
1
12
13 24
25
36
37
48
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