DF2S10FS
1
ESD Protection Diodes Silicon Epitaxial Planar
DF2S10FS
DF2S10FS
DF2S10FS
DF2S10FS
Start of commercial production
2005-09
1.
1.
1.
1. Applications
Applications
Applications
Applications
ESD Protection
Note: This product is designed for protection against electrostatic discharge (ESD) and is not intended for any other
purpose, including, but not limited to, voltage regulation.
2.
2.
2.
2. Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
SOD-923
1: Cathode
2: Anode
fSC
1: Cathode
2: Anode
The SOD-923 package is recommended.
Package
SOD-923
fSC
Product name
DF2S10FS,L3M (Note 1)
DF2S10FS,L3J , DF2S10FS,L3F
Note 1: The product name of the devices housed in the SOD-923 package are suffixed with
the "M".
2014-07-09
Rev.3.0
DF2S10FS
2
3.
3.
3.
3. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Electrostatic discharge voltage (IEC61000-4-2)(Contact)
Junction temperature
Storage temperature
Symbol
VESD
Tj
Tstg
Rating
±30
150
-55 to 150
Unit
kV
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
4.
4.
4.
4. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
VRWM: Working peak reverse
voltage
VZ: Zener voltage
VBR: Reverse breakdown voltage
ZZ: Dynamic impedance
IZ: Zener current
IBR: Reverse breakdown current
IR: Reverse current
VC: Clamp voltage
IPP: Peak pulse current
RDYN: Dynamic resistance
IF: Forward current
VF: Forward voltage
Fig.
Fig.
Fig.
Fig. 4.1
4.1
4.1
4.1 Definitions of Electrical Characteristics
Definitions of Electrical Characteristics
Definitions of Electrical Characteristics
Definitions of Electrical Characteristics
Characteristics
Working peak reverse voltage
Zener voltage
(Reverse breakdown voltage)
Dynamic impedance
Reverse current
Total capacitance
Symbol
VRWM
VZ
(VBR)
ZZ
IR
Ct
Note Test Condition
IZ = 5 mA
(IBR)
IZ = 5 mA
(IBR)
VRWM = 8 V
VR = 0 V, f = 1 MHz
Min
9.4
Typ.
10.0
16
Max
8
10.6
30
0.5
Unit
V
V
µA
pF
2014-07-09
Rev.3.0
DF2S10FS
3
5.
5.
5.
5. Guaranteed ESD Protection (Note)
Guaranteed ESD Protection (Note)
Guaranteed ESD Protection (Note)
Guaranteed ESD Protection (Note)
Test Condition
IEC61000-4-2 (Contact discharge)
ESD Protection
±30 kV
Note: Criterion: No damage to devices.
6.
6.
6.
6. Marking
Marking
Marking
Marking
Fig.
Fig.
Fig.
Fig. 6.1
6.1
6.1
6.1 Marking
Marking
Marking
Marking
7.
7.
7.
7. Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Fig.
Fig.
Fig.
Fig. 7.1
7.1
7.1
7.1 SOD-923 (unit: mm)
SOD-923 (unit: mm)
SOD-923 (unit: mm)
SOD-923 (unit: mm) Fig.
Fig.
Fig.
Fig. 7.2
7.2
7.2
7.2 fSC (unit: mm)
fSC (unit: mm)
fSC (unit: mm)
fSC (unit: mm)
2014-07-09
Rev.3.0
DF2S10FS
4
8.
8.
8.
8. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 8.1
8.1
8.1
8.1 I
I
I
IZ
Z
Z
Z - V
- V
- V
- VZ
Z
Z
Z (I
(I
(I
(IBR
BR
BR
BR - V
- V
- V
- VBR
BR
BR
BR)
)
)
) Fig.
Fig.
Fig.
Fig. 8.2
8.2
8.2
8.2 I
I
I
IR
R
R
R - V
- V
- V
- VR
R
R
R
Fig.
Fig.
Fig.
Fig. 8.3
8.3
8.3
8.3 C
C
C
Ct
t
t
t - V
- V
- V
- VR
R
R
R
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2014-07-09
Rev.3.0
DF2S10FS
5
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
The shapes and dimensions of the package vary, depending on the manufacturing plant. For details, contact the
Toshiba sales representative.
Weight: 0.55 mg (typ.)
Package Name(s)
TOSHIBA: 1-1AH1A
Nickname: SOD-923
2014-07-09
Rev.3.0
DF2S10FS
6
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
The shapes and dimensions of the package vary, depending on the manufacturing plant. For details, contact the
Toshiba sales representative.
Weight: 0.6 mg (typ.)
Package Name(s)
TOSHIBA: 1-1L1S
Nickname: fSC
2014-07-09
Rev.3.0
DF2S10FS
7
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
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TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
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PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
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EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
("UNINTENDED USE").
("UNINTENDED USE").
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IF YOU USE PRODUCT FOR
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IF YOU USE PRODUCT FOR
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ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
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for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2014-07-09
Rev.3.0