Intel® XWAY™ SmartSLIC SLIC
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Specifications
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Supplemental Information
Package Specifications
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Essentials
Product Collection Intel® XWAY™ Products
Code Name Products formerly Britton
Status Launched
Launch Date Q3'12
Recommended Customer Price -
Supplemental Information
Embedded Options Available No
Description
Intel® XWAY™ SmartSLIC family is a family of two channel telephone line interface (FXS)
chips twith industry benchmark power consumption, minimized design effort and
unparalleled RBOM cost for PBX or CPE applications
Package Specifications
Sockets Supported LQFP64, VQFN48, VQFN68, VQFN88
Low Halogen Options Available See MDDS
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Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-
2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or
reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine
monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may
vary depending on system configuration.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?
wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See
www.intel.com/technology/turboboost/ for more information.
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System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as
purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The
replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see http://www.intel.com/performance.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.
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