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This literature is subject to all applicable copyright laws and is not for resale in any manner. 74LCX541 Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Features General Description 5V tolerant input and outputs The LCX541 is an octal buffer/line driver designed to be employed as memory and address drivers, clock drivers and bus oriented transmitter/receivers. The LCX541 is a non inverting option of the LCX540. 2.3V-3.6V VCC specifications provided 6.5ns tPD max (VCC = 3.3V), 10A ICC max Power-down high impedance inputs and outputs Supports live insertion/withdrawal(1) 24 mA output drive (VCC = 3.0V) Implements proprietary noise/ EMI reduction circuitry Latch-up performance exceeds JEDEC 78 conditions ESD performance - Human body model > 2000V - Machine model > 200V Leadless DQFN package Note: 1. To ensure the high impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value of the resistor is determined by the current-sourcing capability of the driver. This device is similar in function to the LCX244 while providing flow-through architecture (inputs on opposite side from outputs). This pinout arrangement makes this device especially useful as an output port for microprocessors, allowing ease of layout and greater PC board density. The LCX541 is designed for low voltage applications with capability of interfacing to a 5V signal environment. The LCX541 is fabricated with an advanced CMOS technology to achieve high speed operation while maintaining CMOS low power dissipation. Ordering Information Order Number 74LCX541WM 74LCX541SJ Package Number Package Description M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LCX541BQX(2) MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm 74LCX541MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LCX541MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Note: 2. DQFN package available in Tape and Reel only. Device also available in Tape and Reel. Specify by appending suffix letter "X" to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs December 2013 Logic Symbol Pin Assignments for SOIC, SOP, SSOP, TSSOP OE1 I0 I1 I2 I3 I4 I5 I6 I7 GND 1 20 2 19 3 18 4 17 5 16 6 7 15 14 8 13 9 12 10 11 IEEE/IEC VCC OE2 O0 O1 O2 O3 O4 O5 O6 O7 O0 O1 O2 O3 O4 O5 O6 O7 Truth Table OE1 VCC Inputs 20 I0 2 19 OE2 I1 3 18 O0 I2 4 17 O1 I3 5 16 O2 I4 6 15 O3 I5 7 14 O4 I6 8 13 O5 I7 9 12 O6 10 EN I0 I1 I2 I3 I4 I5 I6 I7 Pad Assignment for DQFN 1 & OE1 OE2 Outputs OE1 OE2 I On L L H H H X X Z X H X Z L L L L H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance 11 GND O7 (Bottom View) (Top View) Pin Descriptions Pin Names Description OE1, OE2 3-STATE Output Enable Inputs I0-I7 Inputs O0-O7 Outputs DAP No Connect Note: DAP (Die Attach Pad) (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 2 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Connection Diagrams Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Value Units Supply Voltage -0.5 to +7.0 V VI DC Input Voltage -0.5 to +7.0 V VO DC Output Voltage -0.5 to +7.0 V VCC Parameter Conditions Output in 3-STATE Output in HIGH or LOW State(3) -0.5 to VCC + 0.5 IIK DC Input Diode Current VI < GND -50 mA IOK DC Output Diode Current VO < GND -50 mA VO > VCC +50 IO DC Output Source/Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature -65 to +150 C Recommended Operating Conditions(4) The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol VCC Parameter Supply Voltage VI Input Voltage VO Output Voltage IOH / IOL Output Current Conditions Min. Max. Units Operating 2.0 3.6 V Data Retention 1.5 3.6 0 5.5 V HIGH or LOW State 0 VCC V 3-STATE 0 5.5 VCC = 3.0V-3.6V 24 VCC = 2.7V-3.0V 12 VCC = 2.3V-2.7V TA t / V Free-Air Operating Temperature Input Edge Rate VIN = 0.8V-2.0V, VCC = 3.0V mA 8 -40 85 C 0 10 ns /V Notes: 3. IO Absolute Maximum Rating must be observed. 4. Unused inputs must be held HIGH or LOW. They may not float. (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 3 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Absolute Maximum Ratings TA = -40C to +85C Symbol VIH VIL VOH VOL Parameter HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage LOW Level Output Voltage II Input Leakage Current IOFF Power-Off Leakage Current ICC Quiescent Supply Current ICC Increase in ICC per Input VCC (V) Conditions Min. 2.3-2.7 1.7 2.7-3.6 2.0 Max. V 2.3-2.7 0.7 2.7-3.6 0.8 2.3-3.6 IOH = -100A Units V VCC - 0.2 2.3 IOH = -8mA 1.8 2.7 IOH = -12mA 2.2 3.0 IOH = -18mA 2.4 IOH = -24mA 2.2 V IOL = 100A 0.2 2.3 IOL = 8mA 0.6 2.7 IOL = 12mA 0.4 3.0 IOL = 16mA 0.4 IOL = 24mA 0.55 0 VI 5.5V 5.0 A 10 A VI = VCC or GND 10 A 3.6V VI, VO 10 2.3-3.6 2.3-3.6 0 2.3-3.6 2.3-3.6 VI or VO = 5.5V 5.5V(5) VIH = VCC = 0.6V V 500 A AC Electrical Characteristics TA = -40C to +85C, RL = 500 VCC = 3.3V 0.3V, CL = 50pF Symbol Parameter VCC = 2.7V, CL = 50pF VCC = 2.5V 0.2V, CL = 30pF Min. Max. Min. Max. Min. Max. Units tPHL, tPLH Propagation Delay 1.5 6.5 1.5 7.5 1.5 7.8 ns tPZL, tPZH Output Enable Time 1.5 8.5 1.5 9.5 1.5 10.5 ns tPLZ, tPHZ Output Disable Time 1.5 7.5 1.5 8.5 1.5 9.0 ns tOSHL, tOSLH Output to Output Skew(6) 1.0 ns Notes 5. Outputs disabled or 3-STATE only. 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 4 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs DC Electrical Characteristics TA = 25C Symbol VOLP VOLV Parameter Quiet Output Dynamic Peak VOL Quiet Output Dynamic Valley VOL VCC (V) Conditions Typical Units V 3.3 CL = 50 pF, VIH = 3.3V, VIL = 0V 0.8 2.5 CL = 30 pF, VIH = 2.5V, VIL = 0V 0.6 3.3 CL = 50 pF, VIH = 3.3V, VIL = 0V -0.8 2.5 CL = 30 pF, VIH = 2.5V, VIL = 0V -0.6 Conditions Typical Units V Capacitance Symbol Parameter CIN Input Capacitance VCC = Open, VI = 0V or VCC 7 pF COUT Output Capacitance VCC = 3.3V, VI = 0V or VCC 8 pF CPD Power Dissipation Capacitance VCC = 3.3V, VI = 0V or VCC, f = 10 MHz 25 pF (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 5 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Dynamic Switching Characteristics VCC OPEN 500 TEST SIGNAL tPLH, tPHI tPZH, tPHZ tPZL, tPLZ GND DUT VI CL 500 Figure 1. AC Test Circuit (CL includes probe and jig capacitance) Test Switch tPLH, tPHL tPZL, tPLZ Open 6V at VCC = 3.3 0.3V VCC x 2 at VCC = 2.5 0.2V GND tPZH, tPHZ DATA IN VCC Vmi tpxx OUTPUT CONTROL GND tpxx DATA OUT tPZL DATA OUT Vmo tW tS OUTPUT Vmi tS tPLH MR OR CLEAR Vmo tPZH DATA OUT VCC GND Vmi tf VCC GND tPHZ Vmo GND trec tr Vmi VCC Setup Time, Hold Time and Recovery Time for Logic Propagation Delay, Pulse Width and trec Waveforms OUTPUT CONTROL tH CONTROL INPUT Vmi Vmo VX VOL Vmi GND trec tPHL Vmo DATA IN VCC Vmi CLOCK GND tPLZ 3-STATE Output High Enable and Disable Times for Logic Waveform for Inverting and Non-Inverting Functions CONTROL IN VCC Vmi ANY OUTPUT VOH VY 90% 10% 90% 10% VOH VOL trise and tfall 3-STATE Output Low Enable and Disable Times for Logic Figure 2. Waveforms (Input Characteristics; f = 1MHz, tr = tf = 3ns) Symbol 3.3V 0.3V VCC 2.7V Vmi Vmo Vx Vy 1.5V 1.5V VOL + 0.3V VOH - 0.3V 1.5V 1.5V VOL + 0.3V VOH - 0.3V (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 2.5V 0.2V VCC / 2 VCC / 2 VOL + 0.15V VOH - 0.15V www.fairchildsemi.com 6 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs AC Loading and Waveforms (Generic for LCX Family) Input Stage P2 P1 VCC Data ESD P5 D2 N+/P- X1 VDD N1 N2 GTOTM Output Input Stage D6 N+/P- P4 P3 N5 Enable N4 ESD D4 N+/P- N3 (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 7 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Schematic Diagram (Generic for LCX Family) Tape Format for DQFN Package Designator Tape Section Number Cavities Cavity Status Cover Tape Status BQX Leader (Start End) 125 (typ) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed Tape Dimensions inches (millimeters) Reel Dimensions inches (millimeters) Tape Size A B C D N W1 W2 12mm 13.0 (330.0) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) 0.488 (12.4) 0.724 (18.4) (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 8 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Tape and Reel Specification 13.00 12.60 A 11.43 20 11 B 9.50 10.65 7.60 10.00 7.40 2.25 1 10 0.51 0.35 PIN ONE INDICATOR 0.25 M 0.65 1.27 1.27 C B A LAND PATTERN RECOMMENDATION 2.65 MAX SEE DETAIL A 0.33 0.20 C 0.75 0.25 X 45 SEATING PLANE NOTES: UNLESS OTHERWISE SPECIFIED (R0.10) GAGE PLANE (R0.10) 0.10 C 0.30 0.10 0.25 8 0 A) THIS PACKAGE CONFORMS TO JEDEC MS-013, VARIATION AC, ISSUE E B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS. D) CONFORMS TO ASME Y14.5M-1994 1.27 0.40 SEATING PLANE E) LANDPATTERN STANDARD: SOIC127P1030X265-20L (1.40) DETAIL A F) DRAWING FILENAME: MKT-M20BREV3 SCALE: 2:1 Figure 3. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 9 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Physical Dimensions 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Physical Dimensions (Continued) Figure 4. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 10 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Physical Dimensions (Continued) Figure 5. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 11 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Physical Dimensions (Continued) Figure 6. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 12 74LCX541 -- Low Voltage Octal Buffer/Line Driver with 5V Tolerant Inputs and Outputs Physical Dimensions (Continued) Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ (c)2006 Fairchild Semiconductor Corporation 74LCX541 Rev. 1.6.1 www.fairchildsemi.com 13 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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