PESD5V0F1BSF,315 - NEXPERIA

PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection

diode

10 April 2018 Product data sheet

1. General description

Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a

DSN0603-2 (SOD962) leadless ultra small Surface-Mounted Device (SMD) package designed to

protect one signal line from the damage caused by ESD and other transients.

2. Features and benefits

•Bidirectional ESD protection of one line

•Extremely low diode capacitance Cd = 0.25 pF

•Minimized capacitance variation over voltage

•ESD protection up to ±10 kV according to IEC 61000-4-2

•Ultra small SMD package

3. Applications

•Cellular handsets and accessories

•Portable electronics

•Communication systems

•Computers and peripherals

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff

voltage

Tamb = 25 °C - - 5 V

Cddiode capacitance f = 1 MHz; VR = 0 V; Tamb = 25 °C 0.2 0.25 0.3 pF

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

5. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 K1 cathode (diode 1)

2 K2 cathode (diode 2)

Transparent

top view

2 1

DSN0603-2 (SOD962)

sym045

K2K1

6. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

PESD5V0F1BSF DSN0603-2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch;

0.6 x 0.3 x 0.3 mm body

SOD962

7. Marking

Table 4. Marking codes

Type number Marking code

PESD5V0F1BSF F

Product data sheet 10 April 2018 2 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

PPPM rated peak pulse power [1] - 28 W

IPPM rated peak pulse current

tp = 8/20 µs

[1] - 2.2 A

Tjjunction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

ESD maximum ratings

IEC 61000-4-2 (contact discharge) [2] - 10 kV

IEC 61000-4-2 (air discharge) [2] - 10 kV

VESD electrostatic discharge

voltage

MIL-STD-883 (human body model) - 10 kV

[1] Non-repetitive current pulse 8/20 μs exponentially decaying waveform according to IEC 61000-4-5.

[2] Device stressed with ten non-repetitve ESD pulses.

t (µs)

0 403010 20

001aaa630

120

IPP

(%)

e-t

100 % IPP; 8 µs

50 % IPP; 20 µs

Fig. 1. 8/20 µs pulse waveform according to

IEC 61000-4-5

001aaa631

IPP

100 %

90 %

30 ns

60 ns

10 %

tr = 0.6 ns to 1 ns

Fig. 2. ESD pulse waveform according to

IEC 61000-4-2

Product data sheet 10 April 2018 3 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

9. Characteristics

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff

voltage

Tamb = 25 °C - - 5 V

VBR breakdown voltage IR = 1 mA; Tamb = 25 °C 6 - 10 V

IRM reverse leakage

current

VRWM = 5 V; Tamb = 25 °C - 1 100 nA

Cddiode capacitance f = 1 MHz; VR = 0 V; Tamb = 25 °C 0.2 0.25 0.3 pF

IPP = 0.5 A; Tamb = 25 °C [1] - - 10 VVCL clamping voltage

IPPM = 2.2 A; Tamb = 25 °C [1] - - 12.8 V

Rdyn dynamic resistance IR = 10 A; Tamb = 25 °C [2] - 1.3 - Ω

[1] Non-repetitive current pulse 8/20 μs exponential decay waveform according to IEC 61000-4-5.

[2] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse; ANS/IESD STM5.5.1-2008.

VR (V)

0.0 5.04.02.0 3.01.0

018aaa061

0.4

0.6

0.2

0.8

1.0

(pF)

0.0

f = 1 MHz; Tamb = 25 °C

Fig. 3. Diode capacitance as a function of reverse

voltage; typical values

006aab325

-VCL -VBR -VRWM

VCL

VBR

VRWM

-IRM

IRM

-IR

-IPP

IPP

IPPM

-IPPM

Fig. 4. V-I characteristics for a bidirectional ESD

protection diode

Product data sheet 10 April 2018 4 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

aaa-005706

0 5 10 15 20 25 30

2.5

7.5

12.5

VCL (V)

IPP

(A)(A)

tp = 100 ns; Transmission Line Pulse (TLP)

Fig. 5. Dynamic resistance; typical values

Product data sheet 10 April 2018 5 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

50 Ω

DUT

(DEVICE

UNDER

TEST)

GND

450 Ω

RG 223/U

50 Ω coax

ESD TESTER

IEC 61000-4-2 network

Cs = 150 pF; Rd = 330 Ω

4 GHz DIGITAL

OSCILLOSCOPE

10x

ATTENUATOR

unclamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

unclamped -8 kV ESD pulse waveform

(IEC 61000-4-2 network)

GND

clamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

aaa-003133

GND

clamped -8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 2 kV/div

horizontal scale = 10 ns/div

vertical scale = 2 kV/div

horizontal scale = 10 ns/div

vertical scale = 50 V/div

horizontal scale = 50 ns/div

vertical scale = 50 V/div

horizontal scale = 50 ns/div

Fig. 6. ESD clamping test setup and waveforms

Product data sheet 10 April 2018 6 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

10. Application information

The PESD5V0F1BSF is designed for the protection of one data or signal line from surge pulses

and ESD damage. The device is suitable on lines where the signal polarities are both, positive and

negative with respect to ground. It provides protection against surges with up to 28 W per line.

aaa-002737

ESD protection diode

GND

line to be protected

Fig. 7. Application diagram

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge

transients. The following guidelines are recommended:

1. Place the device as close to the input terminal or connector as possible.

2. Minimize the path length between the device and the protected line.

3. Keep parallel signal paths to a minimum.

4. Avoid running protected conductors in parallel with unprotected conductors.

5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.

6. Minimize the length of the transient return path to ground.

7. Avoid using shared transient return paths to a common ground point.

8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.

Product data sheet 10 April 2018 7 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

11. Package outline

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOD962

sod962_po

10-11-03

10-11-11

Unit

max

nom

min

0.32

0.28

0.0076 0.325

0.275

0.625

0.575

0.4

0.15

0.13

A(1)

Dimensions

Note

1. Dimension A is including coating foil thickness.

2. The marking bar indicates the cathode.

Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962

A1b

0.25

0.23

D E e1L

0 0.5 mm

scale

(2)

1 2

Fig. 8. Package outline DSN0603-2 (SOD962)

Product data sheet 10 April 2018 8 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

12. Soldering

Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962

sod962_fr

occupied area solder paste

solder lands

Dimensions in mm

16-01-07

16-01-26

0.676

0.16

0.2

0.4

0.20.2

0.2560.256

0.6

0.85

0.280.4

Fig. 9. Reflow soldering footprint for DSN0603-2 (SOD962)

Product data sheet 10 April 2018 9 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

13. Revision history

Table 7. Revision history

Data sheet ID Release date Data sheet status Change notice Supersedes

PESD5V0F1BSF v.2 20180410 Product data sheet - PESD5V0F1BSF v.1

Modifications: • The format of this data sheet has been redesigned to comply with the identity guidelines of

Nexperia.

• Legal texts have been adapted to the new company name where appropriate.

PESD5V0F1BSF v.1 20121210 Product data sheet - -

Product data sheet 10 April 2018 10 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

14. Legal information

Data sheet status

Document

status [1][2]

Product

status [3]

Definition

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Product

[short] data

sheet

Production This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nexperia.com.

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Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

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In the event that customer uses the product for design-in and use in

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Product data sheet 10 April 2018 11 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

customer uses the product for automotive applications beyond Nexperia’

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Product data sheet 10 April 2018 12 / 13

Nexperia PESD5V0F1BSF

Extremely low capacitance bidirectional ESD protection diode

15. Contents

1. General description......................................................1

2. Features and benefits.................................................. 1

3. Applications.................................................................. 1

4. Quick reference data....................................................1

5. Pinning information......................................................2

6. Ordering information....................................................2

7. Marking.......................................................................... 2

8. Limiting values............................................................. 3

9. Characteristics.............................................................. 4

10. Application information............................................. 7

11. Package outline.......................................................... 8

12. Soldering..................................................................... 9

13. Revision history........................................................10

14. Legal information..................................................... 11

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release: 10 April 2018

Product data sheet 10 April 2018 13 / 13