MBRA120T3 thru MBRA1100T3
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O Utilizing Flame
Retardant Epoxy Molding Compound.
For surface mounted applications.
Exceeds environmental standards of MIL-S-19500 /
228
Low leakage current.
Mechanical data
Case : Molded plastic, JEDEC DO-214AC
Terminals : Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity : Indicated by c athode band
Mounting Position : Any
Weight : 0.0015 ounce, 0.05 gram
(V) (V) (V) (V) (oC)
MBRA120T3 SS12 20 14 20
MBRA130T3 SS13 30 21 30
MBRA140T3 SS14 40 28 40
MBRA150T3 SS15 50 35 50
MBRA160T3 SS16 60 42 60
MBRA180T3 SS18 80 56 80
MBRA1100T3 S110 100 70 100
0.50
0.70
0.85
-55 to +125
-55 to +150
SYMBOLS MARKING
CODE
Operating
temperature
VRRM
*1 VRMS
*2 VR
*3 VF
*4
MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)
PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT
Forward rectified current See Fig.1 IO1.0 A
Forward surge current 8.3ms single half sine-wave superimposed on
rate load (JEDEC methode) IFSM 30 A
VR = VRRM TA = 25oC0.5 mA
VR = VRRM TA = 125oC10 mA
Thermal resistance Junction to ambient RqJA 88 oC / w
Diode junction capacitance f=1MHz and applied 4vDC reverse voltage CJ120 pF
Storage temperature TSTG -55 +150 oC
Reverse current IR
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage
Chip Schottky Barrier Diodes
Silicon epitaxial planer type
Formosa MS
0.205(5.2)
0.189(4.8) 0.012(0.3) Typ.
0.110(2.8)
0.094(2.4)
0.181(4.6)
0.165(4.2)
0.075(1.9)
0.067(1.7)
0.040 (1.0) Typ.0.040(1.0) Typ.
Dimensions in inches and (millimeters)
SMA-L