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DS-XAA170-R03 1
XAA170
Dual Single Pole OptoMOS® Relay
Part # Description
XAA170 8 Pin DIP (50/Tube)
XAA170P 8 Pin Flatpack (50/Tube)
XAA170PTR 8 Pin Flatpack T&R (1000/Reel)
XAA170S 8 Pin Surface Mount (50/Tube)
XAA170STR 8 Pin Surface Mount T&R (1000/Reel)
CPC1219YA Units
Blocking Voltage 350 VP
Load Current 100 mA
Max RON 50 Ω
Applications
Features
Description
Ordering Information
Pin Configuration
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket
Size)
Hook Switch
Dial Pulsing
Ground Start
Ringing Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
Small 8 Pin Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
3750Vrms Input/Output Isolation
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Surface Mount Tape & Reel Version Available
The dual 1-Form-A XAA170 solid state relay has
two independent, optically coupled, normally open
single-pole relays in a single 8-pin package. Clare's
patented OptoMOS architecture makes available the
optically coupled technology necessary to activate the
output's efficient MOSFET switches while providing
a 3750Vrms input-to-output isolation barrier. Control
of the isolated output is accomplished by means of a
highly effective GaAlAs infrared LED at the input.
By incorporating two independent single-pole relays
into a single 8-pin package, the XAA170 saves board
space by providing a more compact design solution
than two discrete single-pole relays in a variety of
applications.
Approvals
UL Recognized: File Number E76270
CSA Certified: File Number LR 43639-10
EN/IEC 60950-1 compliant
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
CONTROL
ILOAD
10%
90%
TON
TOFF
+
+
Switching Characteristics of
Normally Open (Form A) Devices
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2
XAA170
R03
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings (@ 25˚ C)
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Load Current, Continuous - IL- - 100 mA
Peak Load Current t=10ms ILPK - - 350 mA
On-Resistance IL=100mA RON -3350
Ω
Off-State Leakage Current VL=350V ILEAK --1µA
Switching Speeds
Turn-On IF = 5mA, VL = 10V TON --5ms
Turn-Off TOFF --5ms
Output Capacitance VL=50V, f=1MHz COUT -25 -pF
Input Characteristics @ 25°C
Input Control Current IL = 100mA IF--5mA
Input Dropout Current - - 0.4 0.7 - mA
Input Voltage Drop IF = 5mA VF0.9 1.2 1.4 V
Reverse Input Current VR = 5V IR--10μA
Common Characteristics @ 25°C
Capacitance Input to Output - - - 3 - pF
Electrical Characteristics
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate Linearly 1.33 mw / ºC
2 Derate Linearly 6.67 mw / ºC
XAA170
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R03
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA*
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
XAA170
Typical LED Forward Voltage Drop
(N=50, TA=25ºC, IF=5mA)
25
20
15
10
5
0
29.09 30.63 32.16 33.7029.86 31.40 32.93
Device Count (N)
XAA170
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=100mADC)
On-Resistance (Ω)
XAA170
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
25
20
15
10
5
0
424.0 434.5 444.9 455.4429.3 439.7 450.1
Blocking Voltage (VP)
Device Count (N)
XAA170
Typical IF for Switch Operation
(N=50, TA=25ºC, IL=100mADC)
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
XAA170
Typical IF for Switch Dropout
(N=50, TA=25ºC, IL=100mADC)
25
20
15
10
5
0
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
XAA170
Typical Turn-On Time
(N=50, TA=25ºC, IF=5mA, IL=100mADC)
0.67 0.83 0.99 1.140.75 0.91 1.06
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
XAA170
Typical Turn-Off Time
(N=50, TA=25ºC, IF=5mA, IL=100mADC)
0.11 0.17 0.22 0.280.250.190.14
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
XAA170
Typical Load Current vs. Temperature
Load Current (mA)
160
140
120
100
80
60
0
20
40
-40 -20 120100806040200
IF=10mA
IF=2mA
IF=5mA
Temperature (ºC) Temperature (OC)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
XAA170
Typical Leakage vs. Temperature
(Measured Across Pins 4 & 6)
Leakage (μA)
Temperature (ºC)
Blocking Voltage (VP)
-40
455
450
445
440
435
430
425
420 -20 0 20 40 60 80 100
XAA170
Typical Blocking Voltage vs. Temperature
Temperature (OC)
IF=5mA
IF=10mA
IF=20mA
Turn-On (ms)
-40
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0
-20 0 20 40 60 80 100 120
XAA170
Typical Turn-On vs. Temperature
(IL=100mADC)
XAA170
Typical Turn-Off vs. Temperature
(IL=120mADC, IF=5mA)
Temperature (ºC)
Turn-Off (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100 120
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4
XAA170
R03
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA*
XAA170
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
XAA170
Typical Turn-On vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-Off (ms)
05 1015202530354045
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
XAA170
Typical Turn-Off vs. LED Forward Current
(IL=100mADC)
Temperature (OC)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100 120
On-Resistance (Ω)
XAA170
Typical On-Resistance vs. Temperature
(IL=100mADC, IF=5mA)
Temperature (OC)
LED Current (mA)
-40
6.0
5.0
4.0
3.0
2.0
1.0
0
-20 0 20 40 60 80 100 120
XAA170
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (OC)
LED Current (mA)
-40
6.0
5.0
4.0
3.0
2.0
1.0
0
-20 0 20 40 60 80 100 120
XAA170
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
Load Voltage (V)
Load Current (mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120 -3-4 -2 -1 0 1 2 3 4
XAA170
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=5mA)
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms 100ms 1s10ms 10s 100s
XAA170
Energy Rating Curve
10μs 100μs
XAA170
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R03
MECHANICAL DIMENSIONS
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
8.077 ± 0.127
(0.318 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
8-Pin DIP Through-Hole Package
7.239 TYP.
(0.285)
3.302
(0.130)
9.144 TYP.
(0.360 TYP.)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 Typ
(0.160 Typ)
0.889 ± 0.102
(0.035 ± 0.004)
PC Board Pattern
Dimensions
mm
(inches)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
8 Pin Flatpack Package
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
8.077 ± 0.127
(0.318 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
2.159 TYP.
(0.085 TYP.)
2.286 MAX.
(0.090 MAX.)
0.203
(0.008)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 TYP.
(0.085 TYP.)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
8-Pin Surface Mount Package
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
8.077 ± 0.127
(0.318 ± 0.005)
4.064 Typ
(0.160 Typ)
0.889 ± 0.102
(0.035 ± 0.004)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
3.302
(0.130)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-XAA170-R03
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
11/9/07
For additional information please visit our website at: www.clare.com
6
MECHANICAL DIMENSIONS
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
P = 12.00
(0.472)
User Direction of Feed
W = 16.30 max
(0.642 max)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
18
K1= 4.20
(0.165)
Top Cover
Ta p e
K0= 4.90
(0.193)
Tape and Reel Packaging for 8-Pin Surface Mount Package
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)
Tape and Reel Packaging for 8 Pin Flatpack Package
User Direction of Feed
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
18
P = 12.00
(0.472)
W = 16.30 max
(0.642 max)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1= 2.00
(0.079)
Top Cover
Ta p e
K0= 2.70
(0.106)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)