BSZ0589NS MOSFET OptiMOSTM5Power-MOSFET,30V TSDSON-8FL (enlarged source interconnection) Features *OptimizedforhighperformanceWirelesscharger *VerylowFOMQOSSforhighfrequencySMPS *LowFOMSWforhighfrequencySMPS *ExcellentgatechargexRDS(on)product(FOM) *Verylowon-resistanceRDS(on)@VGS=4.5V *100%avalanchetested *Superiorthermalresistance *N-channel *QualifiedaccordingtoJEDEC1)fortargetapplications *Pb-freeleadplating;RoHScompliant *Halogen-freeaccordingtoIEC61249-2-21 Table1KeyPerformanceParameters Parameter Value Unit VDS 30 V RDS(on),max 4.4 m ID 17 A QOSS 7.2 nC QG(0V..4.5V) 5.2 nC S1 8D S2 7D S3 6D G4 5D Type/OrderingCode Package Marking RelatedLinks BSZ0589NS PG-TSDSON-8 FL 0589NS - 1) J-STD20 and JESD22 Final Data Sheet 1 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Final Data Sheet 2 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS 1Maximumratings atTA=25C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Continuous drain current Values Unit Note/TestCondition 17 10 A VGS=10V,TA=25C VGS=10V,TA=100C - 68 A TA=25C - - 20 A TC=25C EAS - - 20 mJ ID=20A,RGS=25 Gate source voltage VGS -20 - 20 V - Power dissipation Ptot - 2.1 - W TA=25C,RthJA=60K/W Operating and storage temperature Tj,Tstg -55 - 150 C IEC climatic category; DIN IEC 68-1: 55/150/56 Unit Note/TestCondition Min. Typ. Max. ID - - ID,pulse - Avalanche current, single pulse IAS Avalanche energy, single pulse Pulsed drain current1) 2) 2Thermalcharacteristics Table3Thermalcharacteristics Parameter Symbol Thermal resistance, junction - case Device on PCB, 6 cm2 cooling area3) Values Min. Typ. Max. RthJC - - 4.6 K/W - RthJA - - 60 K/W - Unit Note/TestCondition 3Electricalcharacteristics Table4Staticcharacteristics Parameter Symbol Drain-source breakdown voltage Values Min. Typ. Max. V(BR)DSS 30 - - V VGS=0V,ID=1mA Gate threshold voltage VGS(th) 1.2 1.6 2 V VDS=VGS,ID=250A Zero gate voltage drain current IDSS - 0.1 10 1 100 A VDS=24V,VGS=0V,Tj=25C VDS=24V,VGS=0V,Tj=125C Gate-source leakage current IGSS - 10 100 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) - 4.4 3.5 5.3 4.4 m VGS=4.5V,ID=8A VGS=10V,ID=8A Gate resistance4) RG - 1 1.7 - Transconductance gfs 28 56 - S |VDS|>2|ID|RDS(on)max,ID=10A 1) See Diagram 3 for more detailed information See Diagram 13 for more detailed information 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 4) Defined by design. Not subject to production test. 2) Final Data Sheet 3 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS Table5Dynamiccharacteristics Parameter Symbol Values Unit Note/TestCondition 950 pF VGS=0V,VDS=15V,f=1MHz 220 300 pF VGS=0V,VDS=15V,f=1MHz - 16 - pF VGS=0V,VDS=15V,f=1MHz td(on) - 2.3 - ns VDD=15V,VGS=10V,ID=8A, RG,ext=1.6 Rise time tr - 2.4 - ns VDD=15V,VGS=10V,ID=8A, RG,ext=1.6 Turn-off delay time td(off) - 13 - ns VDD=15V,VGS=10V,ID=8A, RG,ext=1.6 Fall time tf - 2.0 - ns VDD=15V,VGS=10V,ID=8A, RG,ext=1.6 Unit Note/TestCondition Min. Typ. Max. Ciss - 700 Output capacitance Coss - Reverse transfer capacitance Crss Turn-on delay time Input capacitance1) 1) Table6Gatechargecharacteristics2) Parameter Symbol Gate to source charge Values Min. Typ. Max. Qgs - 1.7 - nC VDD=15V,ID=8A,VGS=0to4.5V Gate charge at threshold Qg(th) - 1.1 - nC VDD=15V,ID=8A,VGS=0to4.5V Gate to drain charge Qgd - 1.3 - nC VDD=15V,ID=8A,VGS=0to4.5V Switching charge Qsw - 1.9 - nC VDD=15V,ID=8A,VGS=0to4.5V Gate charge total Qg - 5.2 - nC VDD=15V,ID=8A,VGS=0to4.5V Gate plateau voltage Vplateau - 2.4 - V VDD=15V,ID=8A,VGS=0to4.5V Gate charge total Qg - 11 15 nC VDD=15V,ID=8A,VGS=0to10V Gate charge total, sync. FET Qg(sync) - 4.8 - nC VDS=0.1V,VGS=0to4.5V Output charge Qoss - 7.2 - nC VDD=15V,VGS=0V Unit Note/TestCondition 1) Table7Reversediode Parameter Symbol Diode continuous forward current Values Min. Typ. Max. IS - - 2.1 A TA=25C Diode pulse current IS,pulse - - 68 A TA=25C Diode forward voltage VSD - 0.71 1.1 V VGS=0V,IF=2.1A,Tj=25C Reverse recovery charge Qrr - 10 - nC VR=15V,IF=30A,diF/dt=400A/s 1) 2) Defined by design. Not subject to production test. See Gate charge waveforms for parameter definition Final Data Sheet 4 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS 4Electricalcharacteristicsdiagrams Diagram1:Powerdissipation Diagram2:Draincurrent 2.5 20 2.0 15 ID[A] Ptot[W] 1.5 10 1.0 5 0.5 0.0 0 40 80 120 0 160 0 40 80 TA[C] 120 160 TA[C] Ptot=f(TA) ID=f(TA);parameter:VGS Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance 2 102 10 10 s 1 s 0.5 1 ms 101 0.2 100 s 101 0.1 0.05 0 10 ZthJA[K/W] ID[A] 10 ms DC -1 10 0.02 10 0 0.01 single pulse 10-1 -2 10 10-3 10-1 100 101 102 10-2 10-5 10-4 10-3 10-2 VDS[V] 100 101 102 103 tp[s] ID=f(VDS);TA=25C;D=0;parameter:tp Final Data Sheet 10-1 ZthJA=f(tp);parameter:D=tp/T 5 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS Diagram5:Typ.outputcharacteristics Diagram6:Typ.drain-sourceonresistance 160 8 10 V 5V 140 7 4.5 V 3.5 V 120 6 3.5 V 5 80 RDS(on)[m] ID[A] 100 3.2 V 60 4V 4.5 V 5V 6V 7V 4 10 V 8V 3 3V 40 2 2.8 V 20 0 1 0 1 2 0 3 0 5 VDS[V] 10 15 20 120 160 ID[A] ID=f(VDS);Tj=25C;parameter:VGS RDS(on)=f(ID);Tj=25C;parameter:VGS Diagram7:Typ.transfercharacteristics Diagram8:Typ.forwardtransconductance 160 200 160 120 gfs[S] ID[A] 120 80 80 40 40 150 C 0 0 1 25 C 2 3 4 5 0 0 VGS[V] 80 ID[A] ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj Final Data Sheet 40 gfs=f(ID);Tj=25C 6 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS Diagram9:Drain-sourceon-stateresistance Diagram10:Typ.gatethresholdvoltage 7 2.5 6 2.0 5 1.5 VGS(th)[V] RDS(on)[m] 4 typ 3 1.0 2 0.5 1 0 -60 -20 20 60 100 140 0.0 -60 180 -20 20 Tj[C] 60 100 140 180 Tj[C] RDS(on)=f(Tj);ID=8A;VGS=10V VGS(th)=f(Tj);VGS=VDS;ID=250A Diagram11:Typ.capacitances Diagram12:Forwardcharacteristicsofreversediode 4 103 10 25 C 150 C 103 102 IF[A] C[pF] Ciss Coss 102 101 Crss 101 0 5 10 15 20 25 100 0.0 0.2 VDS[V] 0.6 0.8 1.0 1.2 VSD[V] C=f(VDS);VGS=0V;f=1MHz Final Data Sheet 0.4 IF=f(VSD);parameter:Tj 7 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS Diagram13:Avalanchecharacteristics Diagram14:Typ.gatecharge 2 10 12 10 15 V 6V 24 V 25 C 101 VGS[V] IAV[A] 8 100 C 6 125 C 4 2 100 100 101 102 103 0 0 tAV[s] 4 8 12 Qgate[nC] IAS=f(tAV);RGS=25;parameter:Tj(start) VGS=f(Qgate);ID=8Apulsed;parameter:VDD Diagram15:Drain-sourcebreakdownvoltage Gate charge waveforms 34 32 VBR(DSS)[V] 30 28 26 24 22 20 -60 -20 20 60 100 140 180 Tj[C] VBR(DSS)=f(Tj);ID=1mA Final Data Sheet 8 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS 5PackageOutlines Figure1OutlinePG-TSDSON-8FL,dimensionsinmm/inches Final Data Sheet 9 Rev.2.0,2016-07-11 OptiMOSTM5Power-MOSFET,30V BSZ0589NS RevisionHistory BSZ0589NS Revision:2016-07-11,Rev.2.0 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2016-07-11 Release of final version TrademarksofInfineonTechnologiesAG AURIXTM,C166TM,CanPAKTM,CIPOSTM,CoolGaNTM,CoolMOSTM,CoolSETTM,CoolSiCTM,CORECONTROLTM,CROSSAVETM,DAVETM,DI-POLTM,DrBladeTM, EasyPIMTM,EconoBRIDGETM,EconoDUALTM,EconoPACKTM,EconoPIMTM,EiceDRIVERTM,eupecTM,FCOSTM,HITFETTM,HybridPACKTM,InfineonTM, ISOFACETM,IsoPACKTM,i-WaferTM,MIPAQTM,ModSTACKTM,my-dTM,NovalithICTM,OmniTuneTM,OPTIGATM,OptiMOSTM,ORIGATM,POWERCODETM, PRIMARIONTM,PrimePACKTM,PrimeSTACKTM,PROFETTM,PRO-SILTM,RASICTM,REAL3TM,ReverSaveTM,SatRICTM,SIEGETTM,SIPMOSTM,SmartLEWISTM, SOLIDFLASHTM,SPOCTM,TEMPFETTM,thinQTM,TRENCHSTOPTM,TriCoreTM. TrademarksupdatedAugust2015 OtherTrademarks Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners. WeListentoYourComments Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to: erratum@infineon.com Publishedby InfineonTechnologiesAG 81726Munchen,Germany (c)2016InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.With respecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplication ofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout limitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. Information Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon TechnologiesOffice(www.infineon.com). Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion, pleasecontactthenearestInfineonTechnologiesOffice. TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. Final Data Sheet 10 Rev.2.0,2016-07-11