Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but th ere is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regar ding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corpo r ation assumes no respon sibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HD74HC4051
8-Channel Analog Multiplexer Demultiplexer
ADE-205-535 (Z)
1st. Edition
Sep. 2000
Description
This device connects together the outputs of 8 switches, thus achieving an 8 Channel Multiplexer. The
binary code placed on the A, B, and C select lines determine which one of the eight switches in “on”, and
connects one of the eight inputs to the common output.
Features
High Speed Operation
Wide Operating Voltage
Low Quiescent Supply Current
Function Table
Control Inputs
Inhibit C B A ON Switch
LL L L X
0
LL L H X
1
LL H L X
2
LL H H X
3
LH L L X
4
LH L H X
5
LH H L X
6
LH H H X
7
HX X X
X : Don’t Care
HD74HC4051
2
Pin Arrangement
1
2
3
4
5
6
7
8
X4
X6
X
X7
X5
Inhibit
VEE
GND
VCC
X2
X1
X0
X3
A
B
C
X2
X1
X0
X3
A
B
X6
X
X7
X5
Inhibit
16
15
14
13
12
11
10
9
X4
C
(Top View)
Block Diagram
Inhibit
A
B
C
X0
X1
X2
X3
X4
X5
X6
X7
Switch
In/Out
Common
Out/In
X
Control
Level
Converter
Binary to 1-of-8
Decoder With inhibit
GND VEE
VCC
HD74HC4051
3
Absolute Maximum Ratings
Item Symbol Rating Unit
Supply voltage VCC –0.5 to +7.0 V
VCC – VEE –0.5 to +7.0 V
Control input voltage VIN GND – 0.5 to VCC + 0.5 V
Switch I/O voltage VI/O VEE – 0.5 to VCC + 0.5 V
Supply current (VCC)I
CC +50 mA
(GND) IGND –50 mA
Switch I/O current (per pin) II/O ±25 mA
Control input diode current IIK ±20 mA
Switch I/O diode current IIOK ±20 mA
Power dissipation PT500 mW
Storage temperature range Tstg –65 to +150 °C
Recommended Operating Range
Item Symbol Min Typ Max Unit
Supply voltage VCC – VEE 2—6V
GND – VEE –4 0 V
Control input voltage VIN 0—V
CC V
Switch I/O voltage VI/O VEE —V
CC V
Operating temperature Topr –40 +85 °C
Input rise/fall time VCC = 2.0 V tr, tf0 1000 ns
VCC = 4.5 V 0 500 ns
VCC = 6.0 V 0 400 ns
HD74HC4051
4
DC Characteristics (VEE = GND)
Ta = 25°CTa = –40 to
+85°C
Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
Control input voltage VIH 2.0 1.5 1.5 V
4.5 3.15 3.15
6.0 4.2 4.2
VIL 2.0 0.5 0.5 V
4.5 1.35 1.35
6.0 1.8 1.8
ON resistance RON 2.0 2000 5000 6250 VINH = VIL
4.5 120 180 225 VI/O = VCC to VEE
6.0 100 170 210 II/O 2 mA
2.0 200 800 1000 VINH = VIL
4.5 80 150 190 VI/O = VCC to VEE
6.0 70 140 175 VI/O 2 mA
ON resistance RON 2.0 —50———VINH = VIL
between any two 4.5 13 40 50 VI/O = VCC to VEE
channels 6.0 10 20 25 II/O 2 mA
OFF channel
leakage current
(switch off)
IS (OFF) 6.0 ±0.1 ±1.0 µAV
INH = VIL
OFF channel
leakage current
(switch on)
IS (ON) 6.0 ±0.1 ±1.0 µAV
INH = VIL
Control input current Iin 6.0 ±0.1 ±1.0 µA Vin = VCC or GND
Quiescent supply
current ICC 6.0 4.0 40 µA Vin = VCC or GND
HD74HC4051
5
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns, VEE = GND)
Ta = 25°CTa = –40 to
+85°C
Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
Propagation delay tPLH 2.0 25 60 75 ns RL = 10 k
time 4.5 6 12 15 Switch input to
6.0 5 10 13 switch output
tPHL 2.0 25 60 75 ns
4.5 6 12 15
6.0 5 10 13
Propagation delay tPLH 2.0 50 153 191 ns RL = 10 k
time 4.5 16 30 38 Control input to
6.0 14 26 33 switch output
tPHL 2.0 50 153 191 ns
4.5 16 30 38
6.0 14 26 33
Output enable tZH 2.0 50 153 191 ns RL = 1 k
time 4.5 14 30 38
6.0 12 26 33
tZL 2.0 50 153 191 ns
4.5 14 30 38
6.0 12 26 33
Output disable tHZ 2.0 40 153 191 ns RL = 1 k
time 4.5 17 30 38
6.0 14 26 33
tLZ 2.0 40 153 191 ns
4.5 17 30 38
6.0 14 26 33
Control input
capacitance Cin 5 10 10 pF
Switch input
capacitance Cin 5.0 5 pF
Output capacitance
(Common pin) Cout 5.0 22 pF
Feed through
capacitance Cin–out 5.0 0.7 pF
Power dissipation
capacitance CPD 5.0 22.0 pF
HD74HC4051
6
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns, VEE = GND) (cont)
Ta = 25°CTa = –40 to
+85°C
Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
Sine wave distortion 4.5 0.1 % fin = 1 kHz, Vin = 4 VP-P
RL = 10 k, CL = 50 pF
Frequency response
channel “ON”
(Sine wave input)
4.5 95 MHz fin = 1 MHz,
20 log10 VOS/VIS = –3 dB
RL = 50 , CL = 10 pF
Feed through
attenuation 4.5 –50 dB RL = 600 , CL = 50 pF,
fin = 1 MHz
Cross talk between 2.0 25 mV RL = 600 , CL = 15 pF,
any two switches 4.5 60 fin = 1 MHz
6.0 —75———
Maximum control 2.0 20 MHz RL = 1 k, CL = 15 pF
frequency 4.5 30 Vout = 1/2 (VCC)
6.0 —30———
AC Characteristics Test Circuit
Maximum Control Frequency
VCC
VCC Vout
GNDVEE
VCC
Vout Vcc/2
VC0 V
RL=
1kCL=
15pF
VC
Vin VCC
HD74HC4051
7
Cross talk (Control Input to Switch Output)
V
CC
V
C
V
in
R
in
=
600RL=
600CL=
50pF
V
CC
V
out
V
CC
/2 V
CC
/2
GNDV
EE
V
CC
90%
t
f
t
r
10%
(f=1MHz)
t
r
=t
r
=6ns
V
SS
Feed through Attenuation
VCC
fin Rin=
600RL=
600CL=
50pF
VCC
(OFF)
Vin
0.1µFVout
VCC/2 VCC/2
GNDVEE
Vin
(Sine Wave)
(Vin=0dBm,f=1MHz)
Sine Wave Distortion
VCC
fin RL=
10kCL=
50pF
VCC
(ON)
Vin
10µF
Vout
VCC/2
GNDVEE
Vin
(Sine Wave)
(Vin=4Vp-p,f=1kHz)
HD74HC4051
8
Cin, Cout, Cin–out (Input, Output, and Feed through Capacitance)
5V
Signal Input Pin Commom Pin
VCC
(OFF)
Cin Cout
Cin-out
VSS
VEE
5V
Signal Input Pin Commom Pin
VCC
(OFF)
Cin Cout
Cin-out
GNDVEE
Frequency Response Channel ON
VCC
fin
RL=
50CL=
10pF
VCC
(ON)
Vin
0.1µF
Vout
GNDVEE
fin
(Sine Wave)
(Vout=0dBm,f=1MHz)
RON: ON Resistance
VCC
Vin
VI-O
Vout
VCC
(ON)
I/O O/I
GNDVEE
V
HD74HC4051
9
IS (OFF): OFF Channel Leakage Current (Switch OFF)
VCC
Vin=VCC
or GND Vout=VSS
or VCC
VCC
(OFF)
I/O
GNDVEE
A
IS (ON): OFF Channel Leakage Current (Switch ON)
VCC
Vin=VCC
or GND Vout
OPEN
VCC
(ON)
I/O
GNDVEE
A
tPLH, tPHL: Propagation Delay Time (Switch Input to Switch Output)
V
CC
V
in
V
out
V
CC
V
in
V
out
V
OL
V
OH
GND
RL=
10kCL=
50pF
V
CC
(ON)
GNDV
EE
t
f
t
r
t
PLH
t
PHL
90%
10%
50%
50%
tPLH, tPHL: Propagation Delay Time (Control Input to Switch Output)
V
CC
V
CC or
GND
Switch input pin
GND
or
V
CC
V
C=
V
in
V
out
(Common Pin)
V
CC
V
C
V
out
V
OL
V
OH
GND
RL=
10kCL=
50pF
V
CC
GNDV
EE
t
PLH
t
PHL
50%
50%
HD74HC4051
10
tZH, tZL/tHZ, tLZ: Output Enable and Disable Time
V
CC
V
CC
V
INH
V
out
V
out
V
OH
V
OL
V
OL
V
OH
GND
V
CC
GND
V
INH =
V
in
V
out
RL=
1kCL=
50pF
V
CC
GNDV
EE
GND V
CC
t
f
t
ZH
t
ZL
t
LZ
t
HZ
t
r
90%
50% 10%
50%
50%
10%
90%
HD74HC4051
11
Package Dimensions
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
DP-16
Conforms
Conforms
1.07 g
Unit: mm
6.30
19.20
16 9
81 1.3
20.00 Max
7.40 Max
7.62
0.25
+ 0.13
– 0.05
2.54 ± 0.25 0.48 ± 0.10
0.51 Min
2.54 Min 5.06 Max
0° – 15°
1.11 Max
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
FP-16DA
Conforms
0.24 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
*0.22 ± 0.05
*0.42 ± 0.08
0.12
0.15
M
2.20 Max 5.5
10.06
0.80 Max
16 9
18
10.5 Max
+ 0.20
– 0.30
7.80
0.70 ± 0.20
0° – 8°
0.10 ± 0.10
1.15
1.27
0.40 ± 0.06
0.20 ± 0.04
HD74HC4051
12
Hitachi Code
JEDEC
EIAJ
Mass
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
1.27
16 9
18
0.15
0.25
M
1.75 Max 3.95
*0.22 ± 0.03
9.9
0° – 8°
10.3 Max
+ 0.10
– 0.30
6.10
+ 0.67
– 0.20
0.60
+ 0.11
– 0.04
0.14
*0.42 ± 0.08
0.635 Max
0.40 ± 0.06
0.20 ± 0.03
1.08
HD74HC4051
13
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Hitachi Asia Ltd.
Hitachi Tower
16 Collyer Quay #20-00,
Singapore 049318
Tel : <65>-538-6533/538-8577
Fax : <65>-538-6933/538-3877
URL : http://www.hitachi.com.sg
URL NorthAmerica : http://semiconductor.hitachi.com/
Europe : http://www.hitachi-eu.com/hel/ecg
Asia : http://sicapac.hitachi-asia.com
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road,
Hung-Kuo Building,
Taipei (105), Taiwan
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon,
Hong Kong
Tel : <852>-(2)-735-9218
Fax : <852>-(2)-730-0281
URL : http://www.hitachi.com.hk
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 585160
Hitachi Europe GmbH
Electronic Components Group
Dornacher Straβe 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
For further information write to:
Colophon 2.0