Stamped And Formed Contacts
Surface Mount Connectors
SM2 SERIES
5TELEPHONE: (416) 754-5656 FAX: (416) 754-8668 E-MAIL: SALES@AMPHENOLCANADA.COM
Shells Steel with tin plating
Insulator High temperature (peak at 500°F [260°C])
glass-filled thermoplastic, UL 94V- 0
Socket Contact Stamped and formed brass, selected
gold in mating area; 100µ" (2.54µm)
min. tin-lead on termination area, with entire contact
under-plated 50µ" (1.27µm) min. nickel
Rear Insert Brass, 118µ" up to 197µ" (3µm up to 5µm)
tinned over nickel 78µ" to 118µ" (2µm up to 3µm)
Boardlock Tin-lead plating 157µ" up to 236µ" (4µm up to 6µm)
over nickel 78µ" up to 118µ" (2µm up to 3µm)
Insertion force: Low Insertion Force = LIF (bronze)
Zero Insertion Force = ZeFo (brass)
Screwlock Brass, 236µ" up to 394µ" (6µm up to 10µm)
tinned over nickel 78µ" up to 118µ" (2µm up to 3µm)
Grounding Grounding strap: brass, (4µ" up to 6µ")
(0.10µm up to 0.15µm) tin-lead plating over nickel
78µ" up to 118µ" (2µm up to 3µm)
Current Rating 3A
Voltage Rating 300V AC/ rms 50Hz
Withstanding Voltage 1000V AC/ rms 50Hz for one minute
Insulation Resistance 5000MΩ
Contact Resistance10 mΩmax.
Single Contact Insertion Force 1.2N < F < 2.5N
Single Contact Withdrawal Force 0.4N min.
LIF Boardlock 8N max. per connector
Coplanarity of Contacts .008" (0.2) max.
Mating and Unmating Force
Unit: N
No. of Contacts Mate (max.) Unmate (min.)
9 (size E) 30 3.5
15 (size A) 50 4.5
25 (size B) 83 8.0
Operating Temperature 185°F (85°C), peak at 221°F (105°C)
Damp Heat 56 days 221°F (105°C) - 95% RH
MATERIALS AND PLATINGS
ELECTRICAL DATA
CLIMATIC DATA
MECHANICAL DATA
SPECIFICATIONS:
The new Amphenol SMT
D-Sub is offered in right angle,
receptacle with brackets,
as an industry standard
for I / O connections.
New boardlock features:
-LIF (Low Insertion Force)
boardlock especially designed
to be fully compatible with
pick and place equipment.
-ZeFo (Zero Insertion Force)
boardlock has been designed so
that once placed and expanded,
secures the connector in place.
Applications
• Industrial
• Telecom
• Any industry standard
I / O connections