© Semiconductor Components Industries, LLC, 2007
June, 2007 - Rev. 1
1Publication Order Number:
MURS360BT3/D
MURS360BT3
Surface Mount Ultrafast
Power Rectifiers
Ideally suited for high voltage, high frequency rectification, or as
free wheeling and protection diodes in surface mount applications
where compact size and weight are critical to the system.
Features
Small Compact Surface Mountable Package with J-Bend Leads
Rectangular Package for Automated Handling
High Temperature Glass Passivated Junction
This is a Pb-Free Device
Mechanical Characteristics
Case: Epoxy, Molded
Epoxy Meets UL 94 V-O @ 0.125 in
Weight: 95 mg (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Rating: Human Body Model (HBM) 3B
Machine Model (MM) C
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
600 V
Average Rectified Forward Current IF(AV) 3.0 @ TL = 105°C A
Non- Repetitive Peak Surge Current
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
IFSM 100 A
Operating Junction Temperature TJ*65 to +175 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ULTRAFAST RECTIFIERS
3 AMPERES
600 VOLTS
Device Package Shipping
ORDERING INFORMATION
SMB
CASE 403A
http://onsemi.com
MURS360BT3G SMB
(Pb-Free)
2500/Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
B36B = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G= Pb-Free Package
(Note: Microdot may be in either location)
AYWW
B36BG
G
MARKING DIAGRAM
MURS360BT3
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2
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction-to-Lead (Note 1)
Thermal Resistance, Junction-to-Ambient (Note 1)
RqJL
RqJA
14
71
°C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Typ Max Unit
Maximum Instantaneous Forward Voltage (Note 2)
(iF = 3.0 A, TJ = 25°C)
(iF = 3.0 A, TJ = 150°C)
vF-
0.83
1.25
1.05
V
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, TJ = 25°C)
(Rated DC Voltage, TJ = 150°C)
iR-
95
3.0
150
mA
Maximum Reverse Recovery Time
(iF = 1.0 A, di/dt = 50 A/ms)
(iF = 0.5 A, iR = 1.0 A, IR to 0.25 A)
trr 75
50
ns
Maximum Forward Recovery Time
(iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V)
tfr 50 ns
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle v2.0%.
TYPICAL CHARACTERISTICS
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
VF
, INSTANTANEOUS FORWARD VOLTAGE (V) VF
, INSTANTANEOUS FORWARD VOLTAGE (V)
1.21.10.80.70.60.50.40.3
0.01
0.1
1
10
1.21.11.00.70.60.50.40.3
0.01
0.1
1
10
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
Vr, REVERSE VOLTAGE (V) Vr, REVERSE VOLTAGE (V)
6005004003002001000
0.000001
0.00001
0.0001
0.001
0.01
0.1
6005004003002001000
IF
, INSTANTANEOUS FORWARD CURRENT (A)
Ir, REVERSE CURRENT (mA)
1.00.9
150°C
125°C
25°C
IF
, INSTANTANEOUS FORWARD CURRENT (A)
0.8 0.9 1.41.3
150°C
125°C
25°C
150°C
125°C
25°C
Ir, REVERSE CURRENT (mA)
0.00001
0.0001
0.001
0.01
0.1
150°C
125°C
25°C
1
MURS360BT3
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TYPICAL CHARACTERISTICS
Square
Figure 5. Typical Capacitance Figure 6. Current Derating, Lead
Vr, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C)
100806040200
0
10
20
30
40
50
60
70
155135125115105857565
0
1
2
3
4
5
Figure 7. Current Derating, Ambient Figure 8. Typical Forward Power Dissipation
TA, AMBIENT TEMPERATURE (°C) IF(AV), AVERAGE FORWARD CURRENT (A)
1501251007550250
0
1
2
3
43210
0
1
2
3
4
Figure 9. Maximum Forward Power
Dissipation
C, CAPACITANCE (pF)
IF(AV), AVERAGE FORWARD
CURRENT (A)
IF(AV), AVERAGE FORWARD CURRENT (A)
PF(AV), AVERAGE POWER
DISSIPATION (W)
TJ = 25°C
f = 1 MHz
95 145
dc
Square Wave
dc
dc
RqJA = 71°C/W
RqJA = 120°C/W
No Heatsink
Square Wave
dc
TJ = 150°C
IF(AV), AVERAGE FORWARD CURRENT (A)
43210
0
1
2
3
4
PF(AV), AVERAGE POWER
DISSIPATION (W)
Square Wave
dc
TJ = 150°C
MURS360BT3
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4
Figure 10. Thermal Response, Junction-to-Ambient
PULSE TIME (s)
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
0.01
0.1
1
10
100
R(t) (°C/W)
Single Pulse
50% Duty Cycle
20%
10%
5%
2%
1%
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5
PACKAGE DIMENSIONS
SMB
DO-214AA
CASE 403A-03
ISSUE F
E
bD
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.90 2.13 2.45 0.075
INCHES
A1 0.05 0.10 0.20 0.002
b1.96 2.03 2.20 0.077
c0.15 0.23 0.31 0.006
D3.30 3.56 3.95 0.130
E4.06 4.32 4.60 0.160
L0.76 1.02 1.60 0.030
0.084 0.096
0.004 0.008
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205 0.214 0.220
HE
0.51 REF 0.020 REF
D
L1
HE
2.261
0.089
2.743
0.108
2.159
0.085 ǒmm
inchesǓ
SCALE 8:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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MURS360BT3/D
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