LP2951ACMMX-3.3 - Texas Instruments High-Performance Analog

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

LP2950-N/LP2951-N Series of Adjustable Micropower Voltage Regulators

Check for Samples: LP2950-N,LP2951-N

1FEATURES DESCRIPTION

The LP2950-N and LP2951-N are micropower

2• 5V, 3V, and 3.3V Versions Available voltage regulators with very low quiescent current (75

• High Accuracy Output Voltage μA typ.) and very low dropout voltage (typ. 40 mV at

• Ensured 100 mA Output Current light loads and 380 mV at 100 mA). They are ideally

suited for use in battery-powered systems.

• Extremely Low Quiescent Current Furthermore, the quiescent current of the LP2950-

• Low Dropout Voltage N/LP2951-N increases only slightly in dropout,

• Extremely Tight Load and Line Regulation prolonging battery life.

• Very Low Temperature Coefficient The LP2950-N-5.0 is available in the surface-mount

• Use as Regulator or Reference PFM package, and in the popular 3-pin TO-92

package for pin-compatibility with older 5V regulators.

• Needs Minimum Capacitance for Stability The 8-lead LP2951-N is available in plastic, ceramic

• Current and Thermal Limiting dual-in-line, WSON, or metal can packages and

• Stable With Low-ESR Output Capacitors (10 offers additional system functions.

mΩto 6Ω)One such feature is an error flag output which warns

of a low output voltage, often due to falling batteries

LP2951-N VERSIONS ONLY on the input. It may be used for a power-on reset. A

• Error Flag Warns of Output Dropout second feature is the logic-compatible shutdown input

which enables the regulator to be switched on and

• Logic-Controlled Electronic Shutdown off. Also, the part may be pin-strapped for a 5V, 3V,

• Output Programmable From 1.24 to 29V or 3.3V output (depending on the version), or

programmed from 1.24V to 29V with an external pair

of resistors.

Careful design of the LP2950-N/LP2951-N has

minimized all contributions to the error budget. This

includes a tight initial tolerance (.5% typ.), extremely

good load and line regulation (.05% typ.) and a very

low output voltage temperature coefficient, making

the part useful as a low-power voltage reference.

Block Diagram and Typical Applications

Figure 1. LP2950-N

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

OUTPUT

SENSE

SHUTDOWN

GND

VTAP

INPUT

FEEDBACK

ERROR

DAP

4 5

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

Figure 2. LP2951-N

Connection Diagrams

Figure 3. TO-92 Plastic Package (LP) Bottom

View

Figure 6. 10-Lead Ceramic Surface-Mount

Package (NAC) Top View

Figure 4. Dual-In-Line Packages (P, NAB)

Surface-Mount Package (D, DGK) Top View

Figure 7. PFM (NDP) Front View

Figure 5. Metal Can Package (LMC) Top View

Connect DAP to GND at device pin 4.

Figure 8. 8-Lead WSON (NGT) Top View

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS(1)(2)

Input Supply Voltage - SHUTDOWN Input Voltage Error Comparator Output Voltage(3) −0.3 to +30V

FEEDBACK Input Voltage(3)(4) −1.5 to +30V

Power Dissipation Internally Limited

Junction Temperature (TJ) +150°C

Ambient Storage Temperature −65° to +150°C

Soldering Dwell Time, Temperature Wave 4 seconds, 260°C

Infrared 10 seconds, 240°C

Vapor Phase 75 seconds, 219°C

ESD Rating Human Body Model(5) 2500V

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) May exceed input supply voltage.

(4) When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be

diode-clamped to ground.

(5) Human Body Model (HBM) is 1.5 kΩin series with 100 pF; LP2950-N passes 2.5 kV (HBM) ESD; LP2951-N passes 2.5 kV (HBM)

except: Feedback pin passes 1kV (HBM) and Shutdown pin passes 2kV (HBM).

OPERATING RATINGS(1)

Maximum Input Supply Voltage 30V

LP2950AC-XX, LP2950C-XX −40° to +125°C

Junction Temperature Range (TJ)(2) LP2951 −55° to +150°C

LP2951AC-XX, LP2951C-XX −40° to +125°C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2) The junction-to-ambient thermal resistances are as follows: 180°C/W and 160°C/W for the TO-92 package with 0.40 inch and 0.25 inch

leads to the printed circuit board (PCB) respectively, 105°C/W for the molded PDIP (P), 130°C/W for the ceramic DIP (NAB), 160°C/W

for the molded plastic SOIC (D), 200°C/W for the molded plastic VSSOP (DGK), and 160°C/W for the metal can package (LMC). The

above thermal resistances for the P, NAB, D, and DGK packages apply when the package is soldered directly to the PCB. Junction-to-

case thermal resistance for the LMC package is 20°C/W. Junction-to-case thermal resistance for the PFM package is 5.4°C/W. The

value of θJA for the WSON package is typically 51°C/W but is dependent on the PCB trace area, trace material, and the number of

layers and thermal vias. For details of thermal resistance and power dissipation for the WSON package, refer to Application Note AN-

1187 (literature number SNOA401).

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

ELECTRICAL CHARACTERISTICS(1)

LP2950AC-XX LP2950C-XX

LP2951 LP2951AC-XX LP2951C-XX

Parameter Conditions(1) Units

Typ Tested Typ Tested Design Typ Tested Design

Limit(2)(3) Limit(2) Limit(4) Limit(2) Limit(4)

3V Versions(5)

Output Voltage TJ= 25°C 3.0 3.015 3.0 3.015 3.0 3.030 V max

2.985 2.985 2.970 V min

−25°C ≤TJ≤85°C 3.0 3.0 3.030 3.0 3.045 V max

2.970 2.955 V min

Full Operating Temperature 3.0 3.036 3.0 3.036 3.0 3.060 V max

Range 2.964 2.964 2.940 V min

Output Voltage 100 μA≤IL≤100 mA 3.0 3.045 3.0 3.042 3.0 3.072 V max

TJ≤TJMAX 2.955 2.958 2.928 V min

3.3V Versions(5)

Output Voltage TJ= 25°C 3.3 3.317 3.3 3.317 3.3 3.333 V max

3.284 3.284 3.267 V min

−25°C ≤TJ≤85°C 3.3 3.3 3.333 3.3 3.350 V max

3.267 3.251 V min

Full Operating Temperature 3.3 3.340 3.3 3.340 3.3 3.366 V max

Range 3.260 3.260 3.234 V min

Output Voltage 100 μA≤IL≤100 mA 3.3 3.350 3.3 3.346 3.3 3.379 V max

TJ≤TJMAX 3.251 3.254 3.221 V min

5V Versions(5)

Output Voltage TJ= 25°C 5.0 5.025 5.0 5.025 5.0 5.05 V max

4.975 4.975 4.95 V min

−25°C ≤TJ≤85°C 5.0 5.0 5.05 5.0 5.075 V max

4.95 4.925 V min

Full Operating Temperature 5.0 5.06 5.0 5.06 5.0 5.1 V max

Range 4.94 4.94 4.9 V min

Output Voltage 100 μA≤IL≤100 mA 5.0 5.075 5.0 5.075 5.0 5.12 V max

TJ≤TJMAX 4.925 4.925 4.88 V min

All Voltage Options

Output Voltage See(6) 20 120 20 100 50 150 ppm/°C

Temperature

Coefficient

Line Regulation(7) (VONOM + 1)V ≤Vin ≤0.03 0.1 0.03 0.1 0.04 0.2 % max

30V(8) 0.5 0.2 0.4 % max

(1) Unless otherwise noted, all limits specified for VIN = (VONOM + 1)V, IL= 100 μA and CL= 1μF for 5V versions and 2.2 μF for 3V and

3.3V versions. Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in

normal type apply for TA= TJ= 25°C. Additional conditions for the 8-pin versions are FEEDBACK tied to VTAP, OUTPUT tied to SENSE,

and VSHUTDOWN ≤0.8V.

(2) Ensured and 100% production tested.

(3) A Military RETS specification is available on request. At time of printing, the LP2951-N RETS specification complied with the boldface

limits in this column. The LP2951-N LMC, NAC, or NAB may also be procured as Standard Military Drawing Spec #5962-3870501MGA,

MXA, or MPA.

(4) Ensured but not 100% production tested. These limits are not used to calculate outgoing AQL levels.

(5) All LP2950 devices have the nominal output voltage coded as the last two digits of the part number. In the LP2951 products, the 3.0V

and 3.3V versions are designated by the last two digits, but the 5V version is denoted with no code at this location of the part number

(refer to ordering information table).

(6) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.

(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specification for thermal regulation.

(8) Line regulation for the LP2951-N is tested at 150°C for IL= 1mA. For IL= 100 μA and TJ= 125°C, line regulation is specified by design

to 0.2%. See TYPICAL PERFORMANCE CHARACTERISTICS for line regulation versus temperature and load current.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

ELECTRICAL CHARACTERISTICS(1) (continued) LP2950AC-XX LP2950C-XX

LP2951 LP2951AC-XX LP2951C-XX

Parameter Conditions(1) Units

Typ Tested Typ Tested Design Typ Tested Design

Limit(2)(3) Limit(2) Limit(4) Limit(2) Limit(4)

Load Regulation(7) 100 μA≤IL≤100 mA 0.04 0.1 0.04 0.1 0.1 0.2 % max

0.3 0.2 0.3 % max

Dropout Voltage(9) IL= 100 μA 80 80 80 mV

max

50 150 50 150 50 150 mV

max

IL= 100 mA 450 450 450 mV

max

380 600 380 600 380 600 mV

max

Ground Current IL= 100 μA 75 120 75 120 75 120 μA max

140 140 140 μA max

IL= 100 mA 8 12 8 12 8 12 mA

max

14 14 14 mA

max

Dropout Ground Vin = (VONOM −0.5)V 110 170 110 170 110 170 μA max

Current IL= 100 μA200 200 200 μA max

Current Limit Vout = 0 160 200 160 200 160 200 mA

max

220 220 220 mA

max

Thermal Regulation See(10) 0.05 0.2 0.05 0.2 0.05 0.2 %/W

max

Output Noise, 10 Hz to CL= 1μF (5V Only) 430 430 430 μV rms

100 kHz CL= 200 μF 160 160 160 μV rms

CL= 3.3 μF 100 100 100 μV rms

(Bypass = 0.01 μF

Pins 7 to 1 (LP2951-N)

8-pin Versions Only LP2951 LP2951AC-XX LP2951C-XX

Reference Voltage 1.23 1.25 1.23 1.25 1.23 1.26 V max

5 5 5

1.26 1.26 1.27 V max

1.22 1.22 1.21 V min

1.2 1.2 1.2 V min

Reference Voltage See(11) 1.27 1.27 1.285 V max

1.19 1.19 1.185 V min

Feedback Pin Bias 20 40 20 40 20 40 nA max

Current 60 60 60 nA max

Reference Voltage See(12) 20 20 50 ppm/°C

Temperature

Coefficient

Feedback Pin Bias 0.1 0.1 0.1 nA/°C

Current Temperature

Coefficient

(9) Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value

measured at 1V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over

temperature) must be taken into account.

(10) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load

or line regulation effects. Specifications are for a 50 mA load pulse at VIN = 30V (1.25W pulse) for T = 10ms.

(11) VREF ≤VOUT ≤(VIN −1V), 2.3V ≤VIN ≤30V, 100 μA≤IL≤100 mA, TJ≤TJMAX.

(12) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

ELECTRICAL CHARACTERISTICS(1) (continued) LP2950AC-XX LP2950C-XX

LP2951 LP2951AC-XX LP2951C-XX

Parameter Conditions(1) Units

Typ Tested Typ Tested Design Typ Tested Design

Limit(2)(3) Limit(2) Limit(4) Limit(2) Limit(4)

Error Comparator

Output Leakage VOH = 30V 0.01 1 0.01 1 0.01 1 μA max

Current 2 2 2 μA max

Output Low Voltage Vin = (VONOM −0.5)V 150 250 150 250 150 250 mV

IOL = 400μA max

400 400 400 mV

max

Upper Threshold See(13) 60 40 60 40 60 40 mV min

Voltage 25 25 25 mV min

Lower Threshold See(13) 75 95 75 95 75 95 mV

Voltage max

140 140 140 mV

max

Hysteresis See(13) 15 15 15 mV

Shutdown Input

Input 1.3 1.3 1.3 V

Logic Low (Regulator ON) 0.6 0.7 0.7 V max

Voltage High (Regulator OFF) 2.0 2.0 2.0 V min

Shutdown Pin Input Vshutdown = 2.4V 30 50 30 50 30 50 μA max

Current 100 100 100 μA max

Vshutdown = 30V 450 600 450 600 450 600 μA max

750 750 750 μA max

Regulator Output See(14) 3 10 3 10 3 10 μA max

Current in Shutdown 20 20 20 μA max

(13) Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage

measured at Vin = (VONOM + 1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain =

VOUT/VREF = (R1 + R2)/R2.For example, at a programmed output voltage of 5V, the Error output is specified to go low when the output

drops by 95 mV × 5V/1.235V = 384 mV. Thresholds remain constant as a percent of Vout as Vout is varied, with the dropout warning

occurring at typically 5% below nominal, 7.5% ensured.

(14) VSHUTDOWN ≥2V, VIN ≤30V, VOUT = 0, Feedback pin tied to VTAP.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS

Quiescent Current Dropout Characteristics

Figure 9. Figure 10.

Input Current Input Current

Figure 11. Figure 12.

Output Voltage vs. Temperature of 3 Representative Units Quiescent Current

Figure 13. Figure 14.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Quiescent Current Quiescent Current

Figure 15. Figure 16.

Quiescent Current Short Circuit Current

Figure 17. Figure 18.

Dropout Voltage Dropout Voltage

Figure 19. Figure 20.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LP2951-N Minimum Operating Voltage LP2951-N Feedback Bias Current

Figure 21. Figure 22.

LP2951-N Feedback Pin Current LP2951-N Error Comparator Output

Figure 23. Figure 24.

LP2951-N Comparator Sink Current Line Transient Response

Figure 25. Figure 26.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Load Transient Response Load Transient Response

Figure 27. Figure 28.

LP2951-N Enable Transient Output Impedance

Figure 29. Figure 30.

Ripple Rejection Ripple Rejection

Figure 31. Figure 32.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Ripple Rejection LP2951-N Output Noise

Figure 33. Figure 34.

LP2951-N Divider Resistance Shutdown Threshold Voltage

Figure 35. Figure 36.

Line Regulation LP2951-N Maximum Rated Output Current

Figure 37. Figure 38.

Product Folder Links: LP2950-N LP2951-N

0 5 10 15 20 25 30

100

120

INPUT PIN CURRENT, IIN(A)

INPUT PIN VOLTAGE, VIN(V)

VSD= 2.0V

Output Load = Short to Ground

Ta= -50°C

Ta= -40°C

Ta= +25°C

Ta= +125°C

0 5 10 15 20 25 30

100

120

INPUT PIN CURRENT, IIN(A)

INPUT PIN VOLTAGE, VIN(V)

VSD= 2.0V

Output Load = Open

Ta= -50°C

Ta= -40°C

Ta= +25°C

Ta= +125°C

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

LP2950-N Maximum Rated Output Current Thermal Response

Figure 39. Figure 40.

Output Capacitor ESR Range LP2951-N Input Pin Current vs Input Voltage

Figure 41. Figure 42.

LP2951-N Input Pin Current vs Input Voltage

Figure 43.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

APPLICATION HINTS

Output Capacitor Requirements

A 1.0 μF (or greater) capacitor is required between the output and ground for stability at output voltages of 5V or

higher. At lower output voltages, more capacitance is required (2.2 μF or more is recommended for 3.0V and

3.3V versions). Without this capacitor the part will oscillate. Most types of tantalum or aluminum electrolytic work

fine here; even film types work but are not recommended for reasons of cost. Many aluminum electrolytics have

electrolytes that freeze at about −30°C, so solid tantalums are recommended for operation below −25°C. The

important parameters of the capacitor are an ESR of about 5Ωor less and a resonant frequency above 500 kHz.

The value of this capacitor may be increased without limit.

Figure 44. Output Capacitor ESR Range

The reason for the lower ESR limit is that the loop compensation of the feedback loop relies on the capacitance

value and the ESR value of the output capacitor to provide the zero that gives added phase lead (See

Figure 44).

fZ= (1 / (2 x πx COUT x ESR) ) (1)

Using the 2.2 µF value from the Output Capacitor ESR Range curve (Figure 44), a useful range for fZcan be

estimated:

fZ(MIN)= (1 / (2 x πx 2.2 µF x 5Ω) ) = 14.5 kHz (2)

fZ(MAX)= (1 / (2 x πx 2.2 µF x 0.05Ω) ) = 318 kHz (3)

For ceramic capacitors, the low ESR produces a zero at a frequency that is too high to be useful, so meaningful

phase lead does not occur. A ceramic output capacitor can be used if a series resistance is added

(recommended value of resistance about 0.1Ωto 2Ω) to simulate the needed ESR. Only X5R, X7R, or better,

MLCC types should be used, and should have a DC voltage rating at least twice the VOUT(NOM) value.

At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced

to 0.33 μF for currents below 10 mA or 0.1 μF for currents below 1 mA. Using the adjustable versions at voltages

below 5V runs the error amplifier at lower gains so that more output capacitance is needed. For the worst-case

situation of a 100 mA load at 1.23V output (Output shorted to Feedback) a 3.3 μF (or greater) capacitor should

be used.

Unlike many other regulators, the LP2950-N will remain stable and in regulation with no load in addition to the

internal voltage divider. This is especially important in CMOS RAM keep-alive applications. When setting the

output voltage of the LP2951-N versions with external resistors, a minimum load of 1 μA is recommended.

Applications having conditions that may drive the LP2950-N/51 into nonlinear operation require special

consideration. Nonlinear operation will occur when the output voltage is held low enough to force the output

stage into output current limiting while trying to pull the output voltage up to the regulated value. The internal loop

response time will control how long it takes for the device to regain linear operation when the output has returned

to the normal operating range. There are three significant nonlinear conditions that need to be considered, all can

force the output stage into output current limiting mode, all can cause the output voltage to over-shoot with low

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

value output capacitors when the condition is removed, and the recommended generic solution is to set the

output capacitor to a value not less than 10 μF. Although the 10 μF value for COUT may not eliminate the output

voltage over-shoot in all cases, it should lower it to acceptable levels (<10% of VOUT(NOM)) in the majority of

cases. In all three of these conditions, applications with lighter load currents are more susceptible to output

voltage over-shoot than applications with higher load currents.

1) At power-up, with the input voltage rising faster than output stage can charge the output capacitor.

VIN tRISE(MIN) > ((COUT / 100 mA) x ΔVIN)

where

•ΔVIN = VOUT(NOM) + 1.0V (4)

2) Recovery from an output short circuit to ground condition.

COUT(MIN)≈(160 mA - ILOAD(NOM))/((VOUT(NOM)/10)/25 μs)) (5)

3) Toggling the LP2951-N SHUTDOWN pin from high (i.e. OFF) to low (i.e. ON).

COUT(MIN)≈(160 mA - ILOAD(NOM))/((VOUT(NOM)/10)/25 μs)) (6)

Figure 45. LP2951-N Enable Transient

Input Capacitor Requirements

A minimum 1 μF tantalum, ceramic or aluminum electrolytic capacitor should be placed from the LP2950-

N/LP2951-N input pin to ground if there is more than 10 inches of wire between the input and the AC filter

capacitor or if a battery is used as the input.

Error Detection Comparator Output

The comparator produces a logic low output whenever the LP2951-N output falls out of regulation by more than

approximately 5%. This figure is the comparator's built-in offset of about 60mV divided by the 1.235 reference

voltage. (Refer to the block diagram in the front of the datasheet.) This trip level remains “5% below normal”

regardless of the programmed output voltage of the 2951. For example, the error flag trip level is typically 4.75V

for a 5V output or 11.4V for a 12V output. The out of regulation condition may be due either to low input voltage,

current limiting, or thermal limiting.

Figure 46 below gives a timing diagram depicting the ERROR signal and the regulated output voltage as the

LP2951-N input is ramped up and down. For 5V versions, the ERROR signal becomes valid (low) at about 1.3V

input. It goes high at about 5V input (the input voltage at which VOUT = 4.75V). Since the LP2951-N's dropout

voltage is load-dependent (see curve in typical performance characteristics), the input voltage trip point (about

5V) will vary with the load current. The output voltage trip point (approx. 4.75V) does not vary with load.

The error comparator has an open-collector output which requires an external pull up resistor. This resistor may

be returned to the output or some other supply voltage depending on system requirements. In determining a

value for this resistor, note that while the output is rated to sink 400 μA, this sink current adds to battery drain in

a low battery condition. Suggested values range from 100k to 1 MΩ. The resistor is not required if this output is

unused.

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

*When VIN ≤1.3V, the error flag pin becomes a high impedance, and the error flag voltage rises to its pull-up voltage.

Using VOUT as the pull-up voltage (see Figure 47), rather than an external 5V source, will keep the error flag voltage

under 1.2V (typ.) in this condition. The user may wish to divide down the error flag voltage using equal-value resistors

(10 kΩsuggested), to ensure a low-level logic signal during any fault condition, while still allowing a valid high logic

level during normal operation.

Figure 46. ERROR Output Timing

Programming the Output Voltage (LP2951-N)

The LP2951-N may be pin-strapped for the nominal fixed output voltage using its internal voltage divider by tying

the output and sense pins together, and also tying the feedback and VTAP pins together. Alternatively, it may be

programmed for any output voltage between its 1.235V reference and its 30V maximum rating. As seen in

Figure 47, an external pair of resistors is required.

The complete equation for the output voltage is

where

• VREF is the nominal 1.235V reference voltage and IFB is the feedback pin bias current, nominally -20nA (7)

The minimum recommended load current of 1 μA forces an upper limit of 1.2 MΩon the value of R2, if the

regulator must work with no load (a condition often found in CMOS in standby). IFB will produce a 2% typical

error in VOUT which may be eliminated at room temperature by trimming R1. For better accuracy, choosing R2 =

100 kΩreduces this error to 0.17% while increasing the resistor program current to 12 μA. Since the LP2951-N

typically draws 60 μA at no load with Pin 2 open-circuited, this is a small price to pay.

*See Application Hints

**Drive with TTL-high to shut down. Ground or leave open if shutdown feature is not to be used.

Note: Pins 2 and 6 are left open.

Figure 47. Adjustable Regulator

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

Stray capacitance to the LP2951-N Feedback terminal can cause instability. This may especially be a problem

when using high value external resistors to set the output voltage. Adding a 100 pF capacitor between the Output

pin and the Feedback pin,and increasing the output capacitor to at least 3.3 μF, will fix this problem.

Reducing Output Noise

In reference applications it may be advantageous to reduce the AC noise present at the output. One method is to

reduce the regulator bandwidth by increasing the size of the output capacitor. This is the only way noise can be

reduced on the 3 lead LP2950-N but is relatively inefficient, as increasing the capacitor from 1 μF to 220 μF only

decreases the noise from 430 μV(RMS) to 160 μV(RMS) for a 100 kHz bandwidth at 5V output.

Noise can be reduced fourfold by a bypass capacitor across R1, since it reduces the high frequency gain from 4

to unity. Pick

(8)

or about 0.01 μF. When doing this, the output capacitor must be increased to 3.3 μF to maintain stability. These

changes reduce the output noise from 430 μV to 100 μV rms for a 100 kHz bandwidth at 5V output. With the

bypass capacitor added, noise no longer scales with output voltage so that improvements are more dramatic at

higher output voltages.

WSON Mounting

The NGT (No Pullback) 8-Lead WSON package requires specific mounting techniques which are detailed in

Application Note 1187 (literature number SNOA401). Referring to the PCB Design Recommendations section

(literature number SNOA401), it should be noted that the pad style which should be used with the WSON

package is the NSMD (non-solder mask defined) type. Additionally, it is recommended the PCB terminal pads to

be 0.2 mm longer than the package pads to create a solder fillet to improve reliability and inspection.

The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the

amount of additional copper area connected to the DAP.

The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive

die attach adhesive. The DAP has no direct electrical (wire) connection to any of the eight pins. There is a

parasitic PN junction between the die substrate and the device ground. As such, it is strongly recommend that

the DAP be connected directly to the ground at device lead 4 (i.e. GND). Alternately, but not recommended, the

DAP may be left floating (i.e. no electrical connection). The DAP must not be connected to any potential other

than ground.

For the LP2951-N in the NGT 8-Lead WSON package, the junction-to-case thermal rating, θJC, is 14.2°C/W,

where the case is the bottom of the package at the center of the DAP. The junction-to-ambient thermal

performance for the LP2951-N in the NGT 8-Lead WSON package, using the JEDEC JESD51 standards is

summarized in the following table:

Board Type Thermal Vias θJC θJA

JEDEC 2-Layer JESD 51-3 None 14.2°C/W 185°C/W

1 14.2°C/W 68°C/W

2 14.2°C/W 60°C/W

JEDEC 4-Layer JESD 51-7 4 14.2°C/W 51°C/W

6 14.2°C/W 48°C/W

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

Typical Applications

Figure 48. 1A Regulator with 1.2V Dropout

Figure 49. 300mA Regulator with 0.75V Dropout

*Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically

160mA.

Figure 50. Wide Input Voltage Range Current Limiter

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

Figure 51. Low Drift Current Source

*Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically

160mA.

Figure 52. 5 Volt Current Limiter

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

• Early warning flag on low input voltage

• Main output latches off at lower input voltages

• Battery backup on auxiliary output

• Operation: Reg. #1's VOUT is programmed one diode drop above 5V. Its error flag becomes active when VIN ≤

5.7V. When VIN drops below 5.3V, the error flag of Reg. #2 becomes active and via Q1 latches the main output

off. When VIN again exceeds 5.7V Reg. #1 is back in regulation and the early warning signal rises, unlatching

Reg. #2 via D3.

Figure 53. Regulator with Early Warning and Auxiliary Output

Figure 54. Latch Off When Error Flag Occurs

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

For 5Vout, use internal resistors. Wire pin 6 to 7, & wire pin 2 to +Vout Bus.

Figure 55. 2 Ampere Low Dropout Regulator

*High input lowers Vout to 2.5V

Figure 56. 5V Regulator with 2.5V Sleep Function

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

Figure 57. Open Circuit Detector for 4 →20mA Current Loop

*Optional Latch off when drop out occurs. Adjust R3 for C2 Switching when Vin is 6.0V

**Outputs go low when VIN drops below designated thresholds.

Figure 58. Regulator with State-of-Charge Indicator

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

For values shown, Regulator shuts down when Vin < 5.5V and turns on again at 6.0V. Current drain in disconnected

mode is ≈150μA.

*Sets disconnect Voltage

**Sets disconnect Hysteresis

Figure 59. Low Battery Disconnect

LM34 for 125°F Shutdown

LM35 for 125°C Shutdown

Figure 60. System Overtemperature Protection Circuit

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

www.ti.com

SNVS764N –JANUARY 2000–REVISED MAY 2013

Schematic Diagram

Product Folder Links: LP2950-N LP2951-N

LP2950-N, LP2951-N

SNVS764N –JANUARY 2000–REVISED MAY 2013

www.ti.com

REVISION HISTORY

Changes from Revision M (April 2013) to Revision N Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 23

Product Folder Links: LP2950-N LP2951-N

PACKAGE OPTION ADDENDUM

www.ti.com 2-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2950ACZ-3.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 125 2950A

CZ3.0

LP2950ACZ-3.3/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) Call TI N / A for Pkg Type -40 to 125 2950A

CZ3.3

LP2950ACZ-5.0/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950A

CZ5.0

LP2950ACZ-5.0/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950A

CZ5.0

LP2950ACZ-5.0/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) Call TI N / A for Pkg Type 2950A

CZ5.0

LP2950ACZ-5.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) Call TI N / A for Pkg Type -40 to 125 2950A

CZ5.0

LP2950CDT-3.0 ACTIVE TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125

LP2950CDT-3.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.0

LP2950CDT-3.3 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LP2950

CDT-3.3

LP2950CDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.3

LP2950CDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-5.0

LP2950CDTX-3.0 ACTIVE TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125

LP2950CDTX-3.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.0

LP2950CDTX-3.3 ACTIVE TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125

LP2950CDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-3.3

LP2950CDTX-5.0 NRND TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LP2950

CDT-5.0

LP2950CDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LP2950

CDT-5.0

LP2950CN NRND PDIP P 8 40 TBD Call TI Call TI -40 to 125 LP

PACKAGE OPTION ADDENDUM

www.ti.com 2-Nov-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

2951CN

LP2950CZ-3.0/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950

CZ3.0

LP2950CZ-3.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 125 2950

CZ3.0

LP2950CZ-3.3/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950

CZ3.3

LP2950CZ-3.3/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950

CZ3.3

LP2950CZ-3.3/NOPB ACTIVE TO-92 LP 3 1800 TBD Call TI Call TI -40 to 125 2950

CZ3.3

LP2950CZ-5.0/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950

CZ5.0

LP2950CZ-5.0/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950

CZ5.0

LP2950CZ-5.0/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) Call TI N / A for Pkg Type 2950

CZ5.0

LP2950CZ-5.0/LFT8 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) SN | CU SN N / A for Pkg Type 2950

CZ5.0

LP2950CZ-5.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) Call TI N / A for Pkg Type -40 to 125 2950

CZ5.0

LP2951ACM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2951

ACM>D

LP2951ACM-3.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2951A

CM30>D

LP2951ACM-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2951A

CM33>D

LP2951ACM-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951A

CM33>D

LP2951ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951

ACM>D

LP2951ACMM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 L0DA

LP2951ACMM-3.0 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 L0BA

LP2951ACMM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0BA

LP2951ACMM-3.3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 L0CA

PACKAGE OPTION ADDENDUM

www.ti.com 2-Nov-2013

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2951ACMM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0CA

LP2951ACMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0DA

LP2951ACMMX-3.0 NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 L0BA

LP2951ACMMX-3.0/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0BA

LP2951ACMMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0CA

LP2951ACMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0DA

LP2951ACMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 2951

ACM>D

LP2951ACMX-3.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2951A

CM30>D

LP2951ACMX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951A

CM33>D

LP2951ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951

ACM>D

LP2951ACN NRND PDIP P 8 40 TBD Call TI Call TI -40 to 125 LP

2951ACN

LP2951ACN/NOPB ACTIVE PDIP P 8 40 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP

2951ACN

LP2951ACSD NRND WSON NGT 8 1000 TBD Call TI Call TI -40 to 125 2951AC

LP2951ACSD/NOPB ACTIVE WSON NGT 8 1000 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 2951AC

LP2951ACSDX-3.3/NOPB ACTIVE WSON NGT 8 4500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 51AC33

LP2951ACSDX/NOPB ACTIVE WSON NGT 8 4500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 2951AC

LP2951CM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2951

CM>D

LP2951CM-3.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2951C

M30>D

LP2951CM-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2951C

M33>D

PACKAGE OPTION ADDENDUM

www.ti.com 2-Nov-2013

Addendum-Page 4

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2951CM-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951C

M33>D

LP2951CM/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951

CM>D

LP2951CMM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 L0DB

LP2951CMM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0BB

LP2951CMM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0CB

LP2951CMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0DB

LP2951CMMX NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 L0DB

LP2951CMMX-3.0/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0BB

LP2951CMMX-3.3 NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 L0CB

LP2951CMMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0CB

LP2951CMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0DB

LP2951CMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 2951

CM>D

LP2951CMX-3.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 2951C

M30>D

LP2951CMX-3.3 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 2951C

M33>D

LP2951CMX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951C

M33>D

LP2951CMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 125 2951

CM>D

LP2951CN NRND PDIP P 8 40 TBD Call TI Call TI -40 to 125 LP

2951CN

LP2951CN/NOPB ACTIVE PDIP P 8 40 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LP

2951CN

LP2951CSD-3.0/NOPB ACTIVE WSON NGT 8 1000 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 51AC30B

PACKAGE OPTION ADDENDUM

www.ti.com 2-Nov-2013

Addendum-Page 5

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP2951CSD-3.3/NOPB ACTIVE WSON NGT 8 1000 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 51AC33B

LP2951CSD/NOPB ACTIVE WSON NGT 8 1000 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 2951ACB

LP2951CSDX-3.0/NOPB ACTIVE WSON NGT 8 4500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 51AC30B

LP2951CSDX-3.3/NOPB ACTIVE WSON NGT 8 4500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 51AC33B

LP2951CSDX/NOPB ACTIVE WSON NGT 8 4500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 2951ACB

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

PACKAGE OPTION ADDENDUM

www.ti.com 2-Nov-2013

Addendum-Page 6

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP2950CDTX-3.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LP2950CDTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LP2950CDTX-5.0 TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LP2950CDTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2

LP2951ACMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.0 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMMX-3.0 VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMMX-3.0/NOP

BVSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMMX-3.3/NOP

BVSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951ACMX-3.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951ACMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP2951ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951ACSD WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951ACSD/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951ACSDX-3.3/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951ACSDX/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CMM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX-3.0/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX-3.3 VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LP2951CMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CMX-3.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CMX-3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LP2951CSD-3.0/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSD-3.3/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSD/NOPB WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSDX-3.0/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSDX-3.3/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

LP2951CSDX/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP2950CDTX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LP2950CDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LP2950CDTX-5.0 TO-252 NDP 3 2500 367.0 367.0 35.0

LP2950CDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0

LP2951ACMM VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.0 VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951ACMMX-3.0 VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951ACMMX-3.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951ACMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951ACMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951ACMX SOIC D 8 2500 367.0 367.0 35.0

LP2951ACMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951ACMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951ACSD WSON NGT 8 1000 210.0 185.0 35.0

LP2951ACSD/NOPB WSON NGT 8 1000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 3

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP2951ACSDX-3.3/NOPB WSON NGT 8 4500 367.0 367.0 35.0

LP2951ACSDX/NOPB WSON NGT 8 4500 367.0 367.0 35.0

LP2951CMM VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LP2951CMMX VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMMX-3.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMMX-3.3 VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LP2951CMX SOIC D 8 2500 367.0 367.0 35.0

LP2951CMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951CMX-3.3 SOIC D 8 2500 367.0 367.0 35.0

LP2951CMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951CMX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LP2951CSD-3.0/NOPB WSON NGT 8 1000 210.0 185.0 35.0

LP2951CSD-3.3/NOPB WSON NGT 8 1000 210.0 185.0 35.0

LP2951CSD/NOPB WSON NGT 8 1000 210.0 185.0 35.0

LP2951CSDX-3.0/NOPB WSON NGT 8 4500 367.0 367.0 35.0

LP2951CSDX-3.3/NOPB WSON NGT 8 4500 367.0 367.0 35.0

LP2951CSDX/NOPB WSON NGT 8 4500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 4

MECHANICAL DATA

NDP0003B

www.ti.com

TD03B (Rev F)

MECHANICAL DATA

NGT0008A

www.ti.com

SDC08A (Rev A)

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265