T1235H, T1250H High temperature 12 A SnubberlessTM Triacs Features A2 Medium current Triac 150 C max. Tj turn-off commutation Low thermal resistance with clip bonding Very high 3 quadrant commutation capability Packages are RoHS (2002/95/EC) compliant UL certified (ref. file E81734) G A2 A1 A2 A2 G G A2 A1 A1 Applications Especially designed to operate in high power density or universal motor applications such as vacuum cleaner and washing machine drum motor, these 12 A Triacs provide a very high switching capability up to junction temperatures of 150 C. D2PAK T12xxH-6G TO-220AB T12xxH-6T G The heatsink can be reduced, compared to traditional Triacs, according to the high performance at given junction temperatures. A2 A1 TO-220AB Insulated T12xxH-6I Description Available in through-hole or surface mount packages, the T1235H and T1250H Triac series are suitable for general purpose mains power ac switching. By using an internal ceramic pad, the T12xxH-6I provides voltage insulation (rated at 2500 V rms). Table 1. Device summary Symbol Value Unit IT(RMS) 12 A VDRM/VRRM 600 V IGT 35 or 50 mA TM: Snubberless is a trademark of STMicroelectronics September 2011 Doc ID 13574 Rev 2 1/10 www.st.com 10 Characteristics T1235H, T1250H 1 Characteristics Table 2. Absolute maximum ratings Symbol Parameter IGM PG(AV) Tstg Tj Table 3. A TO-220AB Ins Tc = 120 C Non repetitive surge peak on-state current (full cycle, Tj initial = 25 C) F = 50 Hz t = 20 ms 120 F = 60 Hz t = 16.7 ms 126 It Value for fusing tp = 10 ms Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns F = 120 Hz Non repetitive surge peak off-state voltage Peak gate current ITSM VDSM/VRSM 12 Tc = 130 C On-state rms current (full sine wave) dI/dt Unit D2PAK, TO-220AB IT(RMS) It Value A 95 A2s Tj = 150 C 50 A/s tp = 10 ms Tj = 25 C VDRM/VRRM + 100 V tp = 20 s Tj = 150 C 4 A Tj = 150 C 1 W - 40 to + 150 - 40 to + 150 C Average gate power dissipation Storage junction temperature range Operating junction temperature range Electrical characteristics (Tj = 25 C, unless otherwise specified) Value Symbol Test conditions Quadrant Unit T1235H T1250H IGT (1) VGT VD = 12 V, RL = 33 VGD VD = VDRM, RL = 3.3 k IH (2) IT = 500 mA IL IG = 1.2 IGT I - II - III MAX. I - II - III MAX. 1.0 V I - II - III MIN. 0.15 V MAX. I - III dV/dt (2) (dI/dt)c (2) 50 35 75 50 90 80 110 MAX. II mA mA mA VD = 67% VDRM, gate open, Tj = 150 C MIN. 1000 1500 V/s Without snubber, Tj = 150 C MIN. 16 21 A/ms 1. minimum IGT is guaranted at 20% of IGT max. 2. for both polarities of A2 referenced to A1. 2/10 35 Doc ID 13574 Rev 2 T1235H, T1250H Table 4. Static characteristics Symbol VT (1) Characteristics Test conditions Value Unit ITM = 17 A, tp = 380 s Tj = 25 C MAX. 1.5 V Vt0 (1) Threshold voltage Tj = 150 C MAX. 0.80 V Rd (1) Dynamic resistance Tj = 150 C MAX. 30 m Tj = 25 C MAX. 5 A Tj = 150 C MAX. 3.9 VD/VR = 400 V (at peak mains voltage) Tj = 150 C MAX. 3.2 VD/VR = 200 V (at peak mains voltage) Tj = 150 C MAX. 2.7 VDRM = VRRM IDRM IRRM (2) mA 1. for both polarities of A2 referenced to A1 2. tp = 380 s Table 5. Thermal resistance Symbol Rth(j-c) Parameter D2PAK / TO-220AB 1.4 TO-220AB Ins 3.3 D2PAK 45 TO-220AB / TO-220AB Ins 60 Unit Junction to case (AC) S=1 Rth(j-a) Value cm2 C/W Junction to ambient Doc ID 13574 Rev 2 3/10 Characteristics Figure 1. T1235H, T1250H Maximum power dissipation versus Figure 2. on-state rms current (full cycle) On-state rms current versus case temperature (full cycle) IT(RMS) (A) P(W) 14 14 =180 TO-220AB/DPAK 12 12 10 10 8 8 6 6 4 TO-220AB Insulated 4 180 2 2 TC(C) =180 IT(RMS)(A) 0 0 0 1 2 3 Figure 3. 4 5 6 7 8 9 10 11 12 On-state rms current versus ambient temperature 0 25 Figure 4. IT(RMS) (A) 1.0E+02 4.5 75 100 125 150 Variation of thermal impedance versus pulse duration Zth(C/W) =180 DPAK SCU=1 cm Epoxy printed circuit board FR4, copper thickness = 35 m 4.0 50 Zth(j-a) 3.5 1.0E+01 3.0 2.5 Zth(j-c) 2.0 1.0E+00 1.5 1.0 0.5 0 25 Figure 5. 100 tP(s) Tamb(C) 0.0 50 75 100 125 150 On-state characteristics (maximum values) 1.0E-01 1.0E-03 Figure 6. ITM(A) 130 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Surge peak on-state current versus number of cycles ITSM (A) 120 110 10 t=20ms Non repetitive Tj initial=25 C 100 90 Tj=150 C One cycle 80 70 Tj=25 C 60 Repetitive Tc=120 C 50 40 30 Tj max. : Vt0 = 0.80 V Rd = 30 m 20 10 VTM(V) 0.0 4/10 0.5 1.0 1.5 2.0 Number of cycles 0 1 2.5 3.0 3.5 4.0 1 Doc ID 13574 Rev 2 10 100 1000 T1235H, T1250H Figure 7. 10000 Characteristics Non-repetitive surge peak on-state Figure 8. current for a sinusoidal pulse with Relative variation of IGT,IH, IL vs junction temperature (typical values) IGT, IH, IL [T j] / IGT, IH, IL [T j=25C] ITSM(A), It (As) 2.5 Tj initial=25 C dI/dt limitation: 50 A/s IGT 2.0 1000 1.5 ITSM IH & IL 1.0 It 100 0.5 2 width tp < 10 ms and corresponding value of I t 10 0.01 Figure 9. 2.0 0.10 1.00 tP(ms) Tj(C) 0.0 10.00 Relative variation of critical rate of decrease of main current (dI/dt)c versus reapplied (dV/dt)c -40 -20 0 20 40 60 80 100 120 140 160 Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature (dI/dt)c [T j] / (dI/dt)c [T j=150C] (dI/dt)c [ (dV/dt) c ] / Specified (dI/dt) c 8 typical values 1.8 7 1.6 6 1.4 5 1.2 1.0 4 0.8 3 0.6 2 0.4 1 0.2 (dV/dt)C (V/s) 0.0 0.1 1.0 10.0 100.0 Figure 11. Leakage current versus junction temperature for different values of blocking voltage (typical values) 1.E+04 T j(C) 0 25 50 75 100 125 150 Figure 12. Variation of thermal resistance junction to ambient versus copper surface under tab Rth(j-a) (C/W) IDRM/IRRM(A) 80 Epoxy printed circuit board FR4, copper thickness = 35 m 70 VDRM=VRRM=600 V 1.E+03 DPAK 60 VDRM=VRRM=400 V 50 1.E+02 VDRM=VRRM=200 V 40 1.E+01 30 20 1.E+00 10 T j(C) SCU(cm) 1.E-01 0 50 75 100 125 150 0 Doc ID 13574 Rev 2 5 10 15 20 25 30 35 40 5/10 Ordering information scheme 2 T1235H, T1250H Ordering information scheme Figure 13. Ordering information scheme T 12 xx H - 6 y Triac series Current 12 = 12 A Sensitivity 35 = 35 mA 50 = 50 mA High temperature Voltage 6 = 600 V Package G = D2PAK T = TO-220AB I = TO-220AB Ins Packing Blank = Tube (D2PAK, TO-220AB) -TR = Tape and reel (D2PAK) 6/10 Doc ID 13574 Rev 2 -TR T1235H, T1250H 3 Package information Package information Epoxy meets UL94, V0 Recommended torque 0.4 to 0.6 N*m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 6. D2PAK dimensions Dimensions Ref. Millimeters Min. A E C2 L2 D L Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 L3 1.40 0.048 0.055 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 0 0.016 8 0 8 Figure 14. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 13574 Rev 2 3.70 7/10 Package information Table 7. T1235H, T1250H TO-220AB and TO-220AB Ins dimensions Dimensions Ref. Millimeters Min. A 15.20 a1 C B OI Typ. Max. Inches Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 OI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 b2 L F A I4 l3 c2 a1 l2 a2 M b1 c1 e M 8/10 Doc ID 13574 Rev 2 2.60 0.102 T1235H, T1250H 4 Ordering information Ordering information Table 8. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode T12xxH-6G T12xxH 6G D2PAK 1.5 g 50 Tube T12xxH-6G-TR T12xxH 6G D2 1.5 g 1000 Tape and reel T12xxH-6T T12xxH 6T TO-220AB 2.3 g 50 Tube T12xxH-6I T12xxH 6I TO-220AB Ins 2.3 g 50 Tube PAK Revision history Table 9. Document revision history Date Revision Changes 17-Apr-2007 1 First issue. 20-Sep-2011 2 Updated: Features, Description and Figure 2. 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