The documentation and process conversion measures necessary to comply with this revision shall be completed by 4 Nov 94. 1. SCOPE MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING TYPES 1N6639, 1N6640, 1N6641, IN6639US, 1N6640US, AND 1N6641US JANTX, JANTXV, AND JANS This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 7 METRIC | Ls MIL-S-19500/609A 4 August 1994 SUPERSEDING MIL~S-19500/609 eS January 1993 1.1 Scope. This specification covers the detail requirements for controlled forward voltage switching diodes suitable for high stress applications where silver bump construction may be indicated (see 6.3). Three levels of product assurance are provided for each device type as specified in MIL-S-19500. 1.2 Physical dimensions. See figure 1 (similar to DO-35) and figure 2 (D-5D). 1,3 Maximum ratings. T, = +25C. | | | | | | | | lV lv | Ig | Te sm | ; | : Rest | Rese 26x | yPes BRR | *RWM STG Tf 2/ It, = 1/120s | | L= .375| L=0 | | | | | | | | | VCpk) | VCpk) mA | A (pk) | Sc | C/W oC/ i c/w | | | | | |1N6639, IN6639US | 100 75 {300 | 2.5 | -65 to +175 | -65 to +175 160 50 25 | {1N6640, 1N6640US 75 50 {300 | 2.5 | -65 to +175 | -65 ta +175 160 50 25 | 1N6641, 1N6641US 75 50 {300 | 2.5 | -65 to #175 | -65 to +175 160 50 | | L 1/ Derate at 3.0 mA/C above T, = +75C for axial lead L = 9.53 mm (.375 inch). 2/ Derate at 4.6 mA/C above Te, = +110C for US suffix devices. | [Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be | [of use in improving this document should be addressed to: Defense Electronics Supply Center, | ATTN: DESC-ELD, 1507 Wilmington Pike, Dayton, OH 45444-5765, by using the Standardization | [Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. | | AMSC N/A Fsc 5961 DISTRIBUTION STATEMENT A. Me 0000325 0035514 715 Approved for public release; distribution is unlimited.MIL-S-19500/609A Ha T ee JEL Dimensions Symbol Millimeters Inches Notes Min Max Min Max 8 1.42 2.03 -056 -080 2,3 qo 0.46 0.56 -018 022 4 G 3.30 4.57 130 - 180 L 25.40 38.10 | 1.000 | 1.500 TYPES 1N6639, 1N6640, AND 1N6641 1. Metric equivalents are given for general information only. 2. The maximum dimension of 8 shall apply for dimension G. 3. The minimum dimension of 8 shall apply over at least 1.65 mm (.065 inch) of dimension G. 4. The specified lead diameter applies in the zone between 1.27 mm (.050 inch) from the diode body to the end of the lead. Outside - anew of this zone lead shall not exceed 6. FIGURE 1. Physical dimensions. ne @ o0001e5 0035515 b5) =MIL-S-19500/609A I Tt poe F + [7 Dimensions Symbol Millimeters Inches Min Max Min Max A 4.19 4.95 - 165 -195 8 0.48 0.71 019 -028 c 0.08 7s .003 coe D 1.78 2.16 -070 085 TYPES 1N6639US, 1N6640US, AND 1N6641US FIGURE 2. Physical dimensions of surface mount family (0-50). mm oooogies 0035514 5446 @MIL-S-19500/609A 1.4 Primary electrical characteristics. Unless otherwise specified, primary electrical characteristics at T, = +25C. Vem Vems TR Ip2 ter toe Cy Types I I at T, = 425C | at T, = +150C [1 Ip = 10 mA | Vo = 0 = 260 mal= 560 ma A A F 200 ma Tp = 10 mA R (pulsed) | (pulsed) Ve * Vous Vp = Vou Rr = 100 2 V de V de nA dc UA de ns ns pF 1N6639, 1N6639US 1.2 100 100 10 4.0 2.5 1N6640, 1N6640US; 1.0 100 100 10 4.0 2.5 1N6641, 1N6641US/ 1.1 100 100 10 5.0 3.0 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARDS MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Defense Printing Service Detachment Office, Building 40 (Customer Service), 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500 and as follows: Vem ct tt te ee wee eee Forward recovery voltage. Tee tt tt tt ee ee ee es Temperature of end caps (mounting pads for US suffix devices). - ef ns 2 2 ee ew ww End cap. & @@ 00001e5 003551? 424MIL-S-19500/609A 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500 and on figure 1 and figure 2 herein. 3.3.1 Lead finish. Lead finish shall be solderable as defined im MIL-S-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.3.2 Diode construction. a. All devices shall be of metallurgically bonded, thermally matched, noncavity-double plug construction in accordance with the requirements of category I (see MIL-S-19500). b. The US version shall be structurally identical to the non-US versions except for lead attachment. 3.4 Marking. Marking shall be in accordance with MIL-S-19500. 3.4.1 Marking for US! devices. For US version devices only, all marking may be omitted from the body cexcept for 3.5), but shail be retained on the initial container, 3.4.2 Part or Identifying Number (PIN) marking. Devices processed as 1N6640 to the requirements of this specification may alternately be marked as 1N4150-1 for a period of three years after the date of this specification. This allowance is for reacquisition only; 1N6640 remains the preferred PIN. 3.5 Polarity. Alternatively, the polarity of all types shall be indicated with a contrasting color band to denote the cathade end. For US suffix devices a minimum of three contrasting color dots spaced around the cathode end of the device may be used. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-S-19500. 4.2.1 Group E inspection. Group E inspection shall be conducted in accordance with MIL-S-19500 and table {I herein. mm 0000125 00355146 340MIL-S-19500/609A 4.3 Screening (JANS, JANTX, AND JANTXV levels only). Screening shall be in accordance with table II of MIL-S-19500, and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see Measurement table I1 of MIL-S-19500 JANS level JANTX and JANTXV Levels 3c 0 Af _-| Thermal impedance (see Thermal impedance (see 4.4.1) 4.4.1) 9 Inq. \ideson eye or Not applicable Ves (1N6639), and Vise) 11 Toa, Vez C1N6640,1N6641), or Io4, Ve, 1N6640, 1N6641) or Veg (186639), Vegey; Alp, = 2100 |vEo 18639) pecent of imie tae valu or 215 nA, whichever is greater. 12 See 4.3.1 See 4.3.1 13. 2/ |Subgroups 2 and 3 of table I Subgroup 2 of table I herein; herein; Al, S 100 percent of Al 4 = 2100 percent of initial initial vatue or 15 nA, vate or 15 nA de, whichever whichever is greater. is greater. Ave +15 percent of initial AVE, S 0.03 V de for 1N6640 reading. Reverse scope display, |and 1N6641. AVes S 20.03 V de (see 4.5.3). for 1N6639. AVe, S 20.03 V de for 1N6640 and |Scope display evaiuation AVes < 0.03 V de for 1N6639. (see 4.5.3). i/ Thermal impedance shall be performed any time after sealing provided temperature cycling is performed in accordance with MIL-S-19500, screen 3 prior to this thermal test. 2/ When thermal impedance is performed prior to screen 13, it is not required to be repeated in screen 13. 4.3.1 Power burn-in conditions. Power burn-in conditions are as follows (see 4.5.3): Method 1038, condition 8, Th, f = 50-60 Hz; I = room ambient as defined in defined in 4.5 of MIL-STD-750. 4.5 of MIL-STO-750. 4.4 Quality conformance inspection. Quality conformance inspection shail be jin accordance with MIL-S-19500. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table I herein. Thermal impedance Zeux shall be performed in accordance with MIL-STD-750, method 3101. The following conditions shall apply: Ty = 1.0 amp minimum. ty = 10 ms. 1, = 1 mM to 10 m. tup = 100 ps maximum. The maximum Limit for Zeux under these test conditions is Zeyx (max) = 25C/W. me 00001eS 0035519 2T? @ Vp = rated Vewn! = 300 m. An alternative of I, (de) = 300 mA may be used at T, = foom ambient asMIL-S-19500/609A 4.4.2 Group 8 inspection. Group 8 inspection shall be conducted in accordance with the conditions specified for subgroup testing in table [Va (JANS) and table 1Vb (JAN, JANTX, and JANTXV) of MIL-S-19500. Electrical measurements (end-points) shall be in accordance with the applicable steps and footnotes of table [, group A, subgroup 2 herein and as specified in table II! herein. 4.4.2.1 Group 8 inspection, table [Va (JANS) of MIL-S-19500. Subgroup Method Condition 4 1037 V (pk) = rated V = room ambient as defined in 4.5 of Rwy Ta MIL-STD-750; f = B60 Hz (see 4.5.1); ON time, OFF time, and Ig shall be adjusted to achieve a delta lead temperature at L = 1/16 from the body of +85C, -5C +15C. Cycle time shall be a minimum of three minutes, Ig shall be a maximum of 300 mA; 2,000 cycles. 5 1027 Ig = 200 mA de minimum; Vp = rated V, WM (see 1.3); f = 50-60 Hz (see 4.5.1); T, = +150C minimum, adjust or ly as required by the corresponding chosen value of Ty or Ig to achieve junction temperature as specified in MIL-S-19500. 4.4.2.2 Group 8 inspection, table [Vb (JAN, JANTX and JANTXV of MIL-S-19500. Subgroup Method Condition 3 1037 T, = room ambient as defined in 4.5 of MIL-STD-750; V (pk) = rated Vawm: f = 50-60 Hz (see 4.5.1); Ig = 0.8 rated (see 1.3). NOTE: Leaded samples from the same lot may be used in lieu of US! suffix sample for tife test. 5 3101 See 4.5.4. 4081 - 6 1032 Ty = +175C. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500. Electrical measurements (end-points) shall be in accordance with the applicable steps and footnotes of table [, group A, subgroup 2 herein. 4.4.3.1 Group inspection, table V of MIL-S-19500. Subgro Method Condition 2 2036 Tension: Test condition A; weight 4 pounds, t = 15 seconds. Lead fatigue: Test condition . NOTE: Not applicable for US suffix types. 6 1026 1,000 hours +72, -24 at un = room ambient as defined in 4.5 of MIL-STD-750; V (pk) = rated Vewni f = 50-60 Hz (see 4.3.1); Ip? 80 percent rated (see 1.3). NOTE: Leaded samples from the same lot may be used in lieu of US suffix samples for life tests. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. @@ 00001eS 0035520 T15 @MIL-S-19500/609A 4.5.1 Life test. These tests shall be conducted with a half-sine waveform of the specified peak voltage impressed across the diode in the reverse direction followed by a half-sine waveform of the specified average rectified current. The forward conduction angle of the rectified current shall be neither greater than 180 degrees, no less than 150 degrees. 4.5.2 Forward-recovery voltage and time. Forward recovery shall be measured as the time interval between zero time and the point where the pulse has decreased to 110 percent of the steady-state value of V_ when I, = 200 mA de. The maximum rise time of the response detector shall be 1 ns. 4.5.3 Scope display. The reverse breakdown characteristics shall be viewed on an oscilloscope with display calibration factors of 20 WA per division and 20 V per division. Reverse current over the knee shall be at least 100 pA and less than 200 pA. Any discontinuity or dynamic instability of the trace shall be cause for rejection of that device. 4.5.4 Thermal resistance. Thermal resistance measurement shall be performed in accordance with MIL-STO-750, method 3101 or 4081. Forced moving air or draft shall not be permitted across the devices during test. The maximum limit for Rout under these test condition shall be Restcmax) 7 160C/W and Reseccmax) = 50C/W. The following conditions shall apply: ty 75 mA to 300 ma. ty = 25 seconds minimum. Ty = 1 mA to 10 ma. typ = 100 ps maximum. ead spacing = 9.53 mm (.375 inch) as defined on figure 3. s L 0 for US versions. L LS COPPER LEAD CLAMP COPPER LEAD CLAMP INFINITE HEAT-OISSIPATOR FIGURE 3. Mounting arrangement. 4.5.5 Pulse measurements. Conditions for pulse measurements shall be as specified in section 4 of MIL-STO-750. 4.5.6 Thermal impedance for initial qualification or requalification. Read and record data (Zeyy? shall be supplied to the qualifying activity on 1 lot (random sample of 500 devices minimum). Twenty-two ~~ serialized devices shall be sent to the qualifying activity for test correlation. M@ 0000125 0035521 955MIL-S-19500/609A TABLE [. Group A_ inspection. MIL-STD-750 Limits Inspection 1/ Symbol Unity Method Conditions Min Max Subgroup _ 1 Visual and mechanical 2071 examination Subgroup 2 Thermal impedance 3101 See 4.4.1 Zaux 25 C/W Forward voltage 4011 I, = 1 m de pulsed 2/ Ve4 0.540 0.6201V de (1N6640, 1N6640US only) Forward voltage 4011 I, > 50 mA de pulsed 2/ Veo 0.760 0.860/V de C1N6640, 1N6640US only) Forward voltage 4011 T, = 100 mA de pulsed 2/ Ve3 0.820 0.920|V de (1N6640, 1N6640US only) Forward voltage 4011 I, = 200 mA de pulsed 2/ Veg 0.870 1.00 |V de 1N6640, 1N6640US 1.10 1N6641, 1N6641US Forward voltage 4011 Tp = 500 m de pulsed 2/ Ves 1.20 |V de (1N6639, 1N6639US only) Breakdown voltage 4021 aR) = 10 pA dc Var V de 1N6639, 1N6639US 100 1N6640, 1N6640US 75 1N6641, 1N6641US 73 Reverse current 4016 OC method Ipy nA de 1N6639, 1N6639US Ve = 75 V de 100 1N6640, 1N6640US Va = 50 V de 100 1N6641, 1N6641US VR = 50 V de 100 Subgroup 3 High temperature Ty = +150C operation: Reverse current 4016 OC method Ino BA de 1N6639, 1N6639US Ve = 75 V de 100 1N6640, 1N6640US Ve = 50 V de 100 1N6641, 1N6641US Ve = $50 V dc 100 See footnotes at end of table. 9 M 0000125 0035522 49).MIL-S-19500/609A TABLE I. Group A_inspection - Continued. MIL-STD-750 Limits {Inspection 1/ Symbol Unit Method Conditions Min Max Subgroup 3 - Continued Low-temperature Ty = -55C operation: Forward voltage 4011 Pulsed 2/ Vee V de 1N6639, 1N6639US I, = 500 ma 1.3 1N6640, 1N6640US T, = 200 ma 1.1 1N6641, 1N6641US I, = 200 ma 1.2 Subgroup 4 Capacitance 4001 re Vsig = 50 mV(p-p) Cr pF 1N6639, 1N6639US 2.5 1N6640, 1N6640US 2.5 1N6641, 1N6641US 3.0 Reverse recovery time 4031 Condition A tor ns Tp = Ipy = 10 - 100 ma de; Te cREc) = 10 percent lem 1N6639, 1N6639US 4.0 1N6640, 1N6640US 4.0 1N6641, 1N6641US 5.0 Subgroup 5 Not applicable Subgroup 6 Surge current 4066 Teo = see 1.3; 10 surges at 4 per minute (maximum) surge; duration = 8.3 ms Electrical See table [, subgroup 2 measurements Subgroup 7 Forward recovery 4026 Tp = 200 m de (see 4.5.2) Ver 5.0 |Vpk) voltage and time te, 10.0 Ins if For sampling plan, see MIL-S-19500. 2/ Ty = 300 ps. @@ 0000125 0035523 72:38 @ 10@ 0000125 00935524 bby TABLE [I. Group & inspection (all quality levels) for qualification only. MIL-S-19500/609A Inspection MIL-STOD-750 Method Conditions Subgroup 4 Thermal shock (glass strain) Hermetic seal Electrical measurement Subgroup 2 Not applicable Subgroup 3 Not applicable Subgroup 4 Thermal resistance, junction toa lead Subgroup 5 Potted environment test 1056 1071 3101 or 4081 1054 Condition A; 2,000 cycles Gross leak only See table I, group A, subgroup 2 L = 9.53 mm (.375 inch) Rai. = 160C/W maximum; Rojec = 50C/W; (see 4.5.4) 11MIL-S-19500/609A TABLE III. Groups A, 8, C, and E electrical measurements. I/ 2/ MIL-STD-750 Limits Step Inspection Symbol Unit Method Conditions Min Max 1 [Forward voltage 4011 225 max imum 1N6640, 1N6641 Tp = 200 ma de pulsed 3/ Ave, 4/ mv dc 1N6639 I, = 500 ma de pulsed 3/ | Ave. 4/ maximum change 2 [Reverse current 4016 |DC method Al 4/ 100 R1 Vp = 20 V de percent or 20 nA de, which- ever is greater. A/ The electrical measurements for table b. c. 2/ The electrical measurements for table b. lus ~ ie ~ Subgroup 2, see table [II herein, Subgroup 4, see table III herein, Subgroup 5, see table II! herein, Subgroup 3, see table III herein, Subgroup 6, see table III herein, Tp = 300 ps. me 0000125 0035525 STO step 1 and 2. step 1 and 2. step 1 and 2. steps 1 and 2. steps 1 and 2. 12 Devices which exceed the group A limits for this test shall mot be accepted. IVa (JANS) of MIL-S-19500 are as follows: IVb (JANTX and JANTXV) of MIL-S-19500 are as follows:MIL-S-19500/609A 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be im accordance with MIL-S-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents must specify the following: a. Issue of DODISS to be cited in the solicitation. b. Lead finish as specified (see 3.3.1) c. Type designation and product assurance level. 6.3 Substitution information. The 1N6640 (MIL-S-19500/609) is preferred type in lieu of the 1N4150 and 1N46150-1 (MIL-S-19500/231). 6.3.1 Cross reference substitution List. JANS level will no longer be built to MIL-S-19500/231. Devices in stock are acceptable provided the date cade does not exceed the date of implementation of MIL-$-19500/231. The devices on this specification are required for space flight applications. A PIN for PIN replacement table follows, and these devices are directly interchangeable. Non-preferred PIN] Preferred PIN 1N4150-1 1N6640 6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER OLA - ES Navy - EC Air Force - 17 (Praject 5961-1524) NASA - NA Review activities: Army - AR, MI, SM Navy - AS, MC, CG Air Force - 19, 85, 99 13 @ o0001cS 00355ceh 437?