SPECIFICATION
(Reference sheet)
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Supplier : Samsung electro-mechanics · Samsung P/N : CL42B102KJFNNNE
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Product : Multi-layer Ceramic Capacitor ·Description : CAP, 1nF, 2000V, ±10%, X7R, 1808
CL 42 B102 K J F N N N E
① ②③ ④ ⑤ ⑥ ⑦ ⑧⑨⑩⑪
①Series Samsung Multi-layer Ceramic Capacitor
②Size 1808 (inch code) L : 4.50 ± 0.40 ㎜ W : 2.00 ± 0.20 ㎜
③Dielectric X7R ⑧Inner electrode
④Capacitance 1Termination
⑤Capacitance ±10 % Plating (Pb Free)
tolerance ⑨Product Normal
⑥Rated Voltage 2000 V ⑩Special Reserved for future use
⑦Thickness 1.25 ± 0.20 ㎜ ⑪Packaging Embossed Type, 7" reel
B. Structure & Dimension
CL42B102KJFNNNE 4.50 ± 0.40 2.00 ± 0.20 1.25 ± 0.20 0.80 ± 0.30
A. Samsung Part Number
Ni
nF
Sn 100%
Samsung P/N
Dimension(㎜)
WLTBW
Cu
C. Samsung Reliablility Test and Judgement Condition
Capacitance Within specified tolerance
Tan δ (DF) 0.025 max.
Insulation 10,000Mohm or 500Mohm×㎌500±50 Vdc 60±5 sec.
Resistance Whichever is smaller
Appearance No abnormal exterior appearance Microscope (×10)
Withstanding No dielectric breakdown or of the rated voltage
Voltage mechanical breakdown
Temperature X7R
Characteristics (From -55℃ to 125℃, Capacitance change should be within ±15%)
Adhesive Strength No peeling shall be occur on the 500g·f, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : within ±12.5% Bending to the limit (1㎜)
with 1.0mm/sec.
Solderability More than 95% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to Capacitance change : within ±7.5% Solder pot : 270±5℃, 10±1sec.
Soldering Heat Tan δ, IR : initial spec.
Vibration Test Capacitance change : within ± 5% Amplitude : 1.5mm
Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.)
2hours × 3 direction (x, y, z)
High Temperature Capacitance change : within ±12.5% With of the rated voltage
Resistance Tan δ : 0.05 max Max. operating temperature
IR : 1,000Mohm or 50Mohm × ㎌1,000+48/-0hrs
Whichever is smaller
Temperature Capacitance change : within ±7.5% 1 cycle condition
Cycling Tan δ, IR : initial spec. Min. operating temperature →25℃
→Max. operating temperature →25℃
5 cycle test
※ The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 250℃, 6 sec max. )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
120%
100%
Judgement Test condition
1㎑ ±10% / 1.0±0.2Vrms
*A capacitor prior to measuring the capacitance is heat
treated at 150℃+0/-10℃ for 1hour and maintained in
ambient air for 24±2 hours.
The products listed in this Specification sheet are NOT designed and manufactured for any use
and applications set forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
We will NOT be liable for any damages resulting from any misuse of the products, specifically
including using the products for high reliability applications as listed below.
If you have any questions regarding this 'Limitation of Use and Application', you should first contact
our sales personnel or application engineers.
Aerospace/Aviation equipment
Automotive or Transportation equipment (vehicles, trains, ships, etc)
Medical equipment
Military equipment
Disaster prevention/crime prevention equipment
Power plant control equipment
Atomic energy-related equipment
Undersea equipment
Traffic signal equipment
Data-processing equipment
Electric heating apparatus, burning equipment
Safety equipment
Any other applications with the same as or similar complexity or reliability to the applications
