Triple-Channel Digital Isolators, Enhanced System Level ESD Reliability ADuM3300W/ADuM3301W Data Sheet VDD1 1 16 VDD2 GND1 2 15 GND2 VIA 3 ENCODE DECODE 14 VOA VIB 4 ENCODE DECODE 13 VOB VIC 5 ENCODE DECODE 12 VOC NC 6 11 NC NC 7 10 VE2 GND1 8 9 GND2 VDD1 1 16 VDD2 GND1 2 15 GND2 11427-001 FUNCTIONAL BLOCK DIAGRAMS Qualified for automotive applications Enhanced system level ESD performance per IEC 61000-4-x Low power operation 5 V operation 1.8 mA per channel maximum at 0 Mbps to1 Mbps 3.9 mA per channel maximum at 10 Mbps 3.3 V operation 1.2 mA per channel maximum at 0 Mbps to 1 Mbps 2.4 mA per channel maximum at 10 Mbps Bidirectional communication 3.3 V/5 V level translation High temperature operation: 125C High data rate: dc to 10 Mbps (NRZ) Precise timing characteristics 3.5 ns maximum pulse width distortion 3.5 ns maximum channel-to-channel matching High common-mode transient immunity: >25 kV/s Output enable function 16-lead SOIC, wide body, RoHS compliant package Safety and regulatory approvals UL recognition: 2500 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice #5A VDE certificate of conformity DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 VIORM = 560 V peak Figure 1. ADuM3300W VIA 3 ENCODE DECODE 14 VOA VIB 4 ENCODE DECODE 13 VOB VOC 5 DECODE ENCODE 12 VIC NC 6 11 NC VE1 7 10 VE2 GND1 8 9 GND2 11427-002 FEATURES Figure 2. ADuM3301W APPLICATIONS Hybrid electric vehicles, battery monitors, and motor drives GENERAL DESCRIPTION The ADuM3300W1 and ADuM3301W1 are triple-channel digital isolators based on Analog Devices, Inc., iCoupler(R) technology. Combining high speed CMOS and monolithic air core transformer technologies, these isolation components provide outstanding performance characteristics superior to alternatives, such as optocoupler devices. iCoupler devices remove the usual optocoupler design difficulties. Typical optocoupler concerns regarding uncertain current transfer ratios, nonlinear transfer functions, and temperature and lifetime effects are eliminated by the simple iCoupler digital interfaces and stable performance characteristics. These iCoupler products also eliminate the need for external drivers and other discrete components. Furthermore, iCoupler devices consume one tenth to one sixth the power of optocouplers at comparable signal data rates. 1 The ADuM3300W/ADuM3301W isolators provide three independent isolation channels in a variety of channel configurations and data rates (see the Ordering Guide). All models operate with the supply voltage on either side ranging from 3.135 V to 5.5 V, providing compatibility with lower voltage systems, as well as enabling voltage translation functionality across the isolation barrier. In the absence of input logic transitions and during power-up/power-down conditions, the isolators have a patented refresh feature that ensures dc correctness. In comparison to the ADuM130x isolator family, the ADuM3300W/ ADuM3301W isolators contain various circuit and layout changes that offer increased capability relative to system level IEC 61000-4-x testing (ESD, burst, and surge). The design and layout of the user's system determine the precise capability in the IEC 61000-4-x tests for the ADuM130x and ADuM3300W/ADuM3301W products. Protected by U.S. Patents 5,952,849; 6,873,065; and 7,075,329. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2013-2014 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADuM3300W/ADuM3301W Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Absolute Maximum Ratings ..................................................... 10 Applications ....................................................................................... 1 ESD Caution................................................................................ 10 Functional Block Diagrams ............................................................. 1 Pin Configuration and Function Descriptions........................... 11 General Description ......................................................................... 1 Typical Performance Characteristics ........................................... 13 Revision History ............................................................................... 2 Applications Information .............................................................. 15 Specifications..................................................................................... 3 Printed Circuit Board Layout ................................................... 15 Electrical Characteristics--5 V Operation................................ 3 System Level ESD Considerations and Enhancements ......... 15 Electrical Characteristics--3.3 V Operation ............................ 4 Propagation Delay-Related Parameters................................... 15 Electrical Characteristics--Mixed 5 V/3.3 V Operation ........ 5 DC Correctness and Magnetic Field Immunity .......................... 15 Electrical Characteristics--Mixed 3.3 V/5 V Operation ........ 6 Power Consumption .................................................................. 16 Package Characteristics ............................................................... 8 Insulation Lifetime ..................................................................... 17 Regulatory Information ............................................................... 8 Packaging and Ordering Information ......................................... 18 Insulation and Safety-Related Specifications ............................ 8 Outline Dimensions ................................................................... 18 DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Characteristics .............................................................................. 9 Ordering Guide .......................................................................... 18 Automotive Products ................................................................. 18 Recommended Operating Conditions ...................................... 9 REVISION HISTORY 11/14--Rev. 0 to Rev. A Changed Minimum Supply Voltage from 3.0 V to 3.135 V (Throughout) .................................................................................... 1 Changes to Table 3 ............................................................................ 3 Changes to Table 6 ............................................................................ 4 4/13--Revision 0: Initial Version Rev. A | Page 2 of 20 Data Sheet ADuM3300W/ADuM3301W SPECIFICATIONS ELECTRICAL CHARACTERISTICS--5 V OPERATION All typical specifications are at TA = 25C, VDD1 = VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended operating range of 4.5 V VDD1 5.5 V, 4.5 V VDD2 5.5 V, and -40C TA +125C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted. Table 1. Parameter SWITCHING SPECIFICATIONS Data Rate Propagation Delay Pulse Width Distortion Change vs. Temperature Pulse Width Propagation Delay Skew Channel Matching Codirectional Opposing Direction Symbol Min tPHL, tPLH PWD 50 PW tPSK 1000 A Grade Typ Max 1 100 40 65 Min B Grade Typ Max Within PWD limit 50% input to 50% output |tPLH - tPHL| 50 15 50 50 3.5 6 ns ns 11 32 5 100 tPSKCD tPSKOD Test Conditions/Comments Mbps ns ns ps/C ns ns 18 10 36 3.5 Unit Within PWD limit Between any two units Table 2. Parameter SUPPLY CURRENT ADuM3300W ADuM3301W Symbol Min IDD1 IDD2 IDD1 IDD2 1 Mbps--A, B Grades Typ Max 2.4 1.1 2.0 1.6 3.3 2.1 3.1 2.6 Symbol Min VIH VIL 2.0 VOH VDDx - 0.1 VDDx - 0.4 10 Mbps--B Grade Min Typ Max 7.0 2.7 5.5 3.9 8.1 3.6 6.9 5.4 Unit Test Conditions/Comments No load mA mA mA mA Table 3. For All Models Parameter DC SPECIFICATIONS Input Threshold Logic High Logic Low Output Voltage Logic High Logic Low Input Leakage per Channel VEx Input Pull-Up Current Tristate Leakage Current per Channel Supply Current per Channel Quiescent Supply Current Input Output Dynamic Supply Current Input Output VOL Typ Max Unit 0.8 V V VDDx VDDx- 0.2 V V IOx = -20 A, VIx = VIxH IOx = -4 mA, VIx = VIxH IOx = 20 A, VIx = VIxL IOx = 400 A, VIx = VIxL IOx = 4 mA, VIx = VIxL 0 V VIx VDDx VEx = 0 V 0.0 0.04 0.2 +0.01 -3 +0.01 +10 V V V A A A IDDI(Q) IDDO(Q) 0.66 0.39 0.97 0.55 mA mA IDDI(D) IDDO(D) 0.20 0.05 II IPU IOZ -10 -10 -10 0.1 0.1 0.4 +10 Test Conditions/Comments All data inputs at logic low Rev. A | Page 3 of 20 mA/Mbps mA/Mbps ADuM3300W/ADuM3301W Parameter AC SPECIFICATIONS Output Rise/Fall Time Common-Mode Transient Immunity1 Propagation Delay Output Disable Output Enable Refresh Rate 1 Data Sheet Symbol Min Typ tR/tF |CM| 25 2.5 35 tPHZ, tPLZ tPZH, tPZL fr Max 6 6 1.0 8 8 Unit Test Conditions/Comments ns kV/s 10% to 90% VIx = VDDx ns ns Mbps High/low output to high impedance High impedance to high/low output |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. VCM = 1000 V, transient magnitude = 800 V. ELECTRICAL CHARACTERISTICS--3.3 V OPERATION All typical specifications are at TA = 25C, VDD1 = VDD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended operation range of 3.135 V VDD1 3.6 V, 3.135 V VDD2 3.6 V, and -40C TA +125C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted. Table 4. Parameter SWITCHING SPECIFICATIONS Data Rate Propagation Delay Pulse Width Distortion Change vs. Temperature Pulse Width Propagation Delay Skew Channel Matching Codirectional Opposing Direction Symbol Min tPHL, tPLH PWD 50 PW tPSK 1000 A Grade Typ Max 1 100 40 75 Min B Grade Typ Max Within PWD limit 50% input to 50% output |tPLH - tPHL| 50 22 50 50 3.5 6 ns ns 11 38 5 100 tPSKCD tPSKOD Test Conditions/Comments Mbps ns ns ps/C ns ns 20 10 45 3.5 Unit Within PWD limit Between any two units Table 5. Parameter SUPPLY CURRENT ADuM3300W ADuM3301W Symbol IDD1 IDD2 IDD1 IDD2 1 Mbps--A, WB Grades Min Typ Max 1.4 0.7 1.1 0.9 10 Mbps--B Grade Min Typ Max Unit 3.8 1.5 3.0 2.2 mA mA mA mA 2.1 1.4 1.9 1.7 5.3 2.1 4.1 3.0 Test Conditions/Comments No load Table 6. For All Models Parameter DC SPECIFICATIONS Input Threshold Logic High Logic Low Output Voltage Logic High Logic Low Symbol Min VIH VIL 1.6 VOH VDDx - 0.1 VDDx - 0.4 VOL Typ Max Unit 0.4 V V VDDx VDDx- 0.2 0.0 0.04 0.2 Rev. A | Page 4 of 20 0.1 0.1 0.4 Test Conditions/Comments V V IOx = -20 A, VIx = VIxH IOx = -4 mA, VIx = VIxH V V V IOx = 20 A, VIx = VIxL IOx = 400 A, VIx = VIxL IOx = 4 mA, VIx = VIxL Data Sheet ADuM3300W/ADuM3301W Parameter Input Leakage per Channel VEx Input Pull-Up Current Tristate Leakage Current per Channel Supply Current per Channel Quiescent Supply Current Input Output Dynamic Supply Current Input Output AC SPECIFICATIONS Output Rise/Fall Time Common-Mode Transient Immunity1 Propagation Delay Output Disable Output Enable Refresh Rate 1 Symbol II IPU IOZ Min -10 -10 -10 Typ +0.01 -3 +0.01 Max +10 +10 Unit A A A Test Conditions/Comments 0 V VI x VDDx VEx = 0 V IDDI(Q) IDDO(Q) 0.37 0.25 0.57 0.37 mA mA IDDI(D) IDDO(D) 0.1 0.03 mA/Mbps mA/Mbps 3 35 ns kV/s 10% to 90% VIx = VDDx ns ns Mbps High/low output to high impedance High impedance to high/low output All data inputs at logic low tR/tF |CM| 25 tPHZ, tPLZ tPZH, tPZL fr 6 6 1.0 8 8 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. VCM = 1000 V, transient magnitude = 800 V. ELECTRICAL CHARACTERISTICS--MIXED 5 V/3.3 V OPERATION All typical specifications are at TA = 25C, VDD1 = 5 V, VDD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended operating range: 4.5 V VDD1 5.5 V, 3.135 V VDD2 3.6 V, and -40C TA +125C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted. Table 7. Parameter SWITCHING SPECIFICATIONS Data Rate Propagation Delay Pulse Width Distortion Change vs. Temperature Pulse Width Propagation Delay Skew Channel Matching Codirectional Opposing Direction Symbol Min tPHL, tPLH PWD 50 PW tPSK 1000 A Grade Typ Max 1 100 40 70 Min B Grade Typ Max Within PWD limit 50% input to 50% output |tPLH - tPHL| 50 22 50 50 3.5 6 ns ns 11 30 5 100 tPSKCD tPSKOD Test Conditions/Comments Mbps ns ns ps/C ns ns 20 10 42 3.5 Unit Within PWD limit Between any two units Table 8. Parameter SUPPLY CURRENT ADuM3300W ADuM3301W Symbol IDD1 IDD2 IDD1 IDD2 Min 1 Mbps--A, B Grades Typ Max 2.4 0.7 7.0 1.5 10 Mbps--B Grade Min Typ Max 3.3 1.4 3.1 1.7 2.0 0.9 5.5 2.2 Rev. A | Page 5 of 20 8.1 2.1 6.9 3.0 Unit mA mA mA mA Test Conditions/Comments No load ADuM3300W/ADuM3301W Data Sheet Table 9. For All Models Parameter DC SPECIFICATIONS Input Threshold Logic High 5V 3.3 V Logic Low 5V 3.3 V Output Voltage Logic High Symbol Typ Max Unit Test Conditions/Comments VIH 2.0 1.6 V V VIL 0.8 0.4 V V VDDx VDDx - 0.2 0.0 0.04 0.2 +0.01 -3 +0.01 0.1 0.1 0.4 +10 +10 V V V V V A A A IDDI(Q) IDDO(Q) 0.66 0.25 0.97 0.37 mA mA IDDI(D) IDDO(D) 0.20 0.05 mA/Mbps mA/Mbps 3.0 35 ns kV/s 10% to 90% VIx = VDDx ns ns Mbps High/low output to high impedance High impedance to high/low output VOH Logic Low VDDx - 0.1 VDDx - 0.4 VOL Input Leakage per Channel VEx Input Pull-Up Current Tristate Leakage Current per Channel Supply Current per Channel Quiescent Supply Current Input Output Dynamic Supply Current Input Output AC SPECIFICATIONS Output Rise/Fall Time Common-Mode Transient Immunity1 Propagation Delay Output Disable Output Enable Refresh Rate 1 Min II IPU IOZ -10 -10 -10 IOx = -20 A, VIx = VIxH IOx = -4 mA, VIx = VIxH IOx = 20 A, VIx = VIxL IOx = 400 A, VIx = VIxL IOx = 4 mA, VIx = VIxL 0 V VIx VDDx VEx = 0 V All data inputs at logic low tR/tF |CM| 25 tPHZ, tPLZ tPZH, tPZL fr 6 6 1.0 8 8 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. VCM = 1000 V, transient magnitude = 800 V. ELECTRICAL CHARACTERISTICS--MIXED 3.3 V/5 V OPERATION All typical specifications are at TA = 25C, VDD1 = 3.3 V, VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended operation range of 3.135 V VDD1 3.6 V, 4.5 V VDD2 5.5 V, and -40C TA +125C, unless otherwise noted. Switching specifications are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted. Table 10. Parameter SWITCHING SPECIFICATIONS Data Rate Propagation Delay Pulse Width Distortion Change vs. Temperature Pulse Width Propagation Delay Skew Channel Matching Codirectional Opposing Direction Symbol Min tPHL, tPLH PWD 50 PW tPSK 1000 A Grade Typ Max 70 1 100 40 Min Test Conditions/Comments Within PWD limit 50% input to 50% output |tPLH - tPHL| 50 22 50 50 3.5 6 ns ns 30 10 42 3.5 Unit Mbps ns ns ps/C ns ns 20 11 tPSKCD tPSKOD B Grade Typ Max 5 100 Rev. A | Page 6 of 20 Within PWD limit Between any two units Data Sheet ADuM3300W/ADuM3301W Table 11. Parameter SUPPLY CURRENT ADuM3300W ADuM3301W Symbol Min 1 Mbps--A, B Grades Typ Max IDD1 IDD2 IDD1 IDD2 1.4 1.1 1.1 1.6 10 Mbps--B Grade Min Typ Max 2.1 2.1 1.9 2.6 3.8 2.7 3.0 3.9 5.3 3.6 4.1 5.4 Unit Test Conditions/Comments No load mA mA mA mA Table 12. For All Models Parameter DC SPECIFICATIONS Input Threshold Logic High 5V 3.3 V Logic Low 5V 3.3 V Output Voltage Logic High Logic Low Input Leakage per Channel VEx Input Pull-Up Current Tristate Leakage Current per Channel Supply Current per Channel Quiescent Supply Current Input Output Dynamic Supply Current Input Output AC SPECIFICATIONS Output Rise/Fall Time Common-Mode Transient Immunity1 Propagation Delay Output Disable Output Enable Refresh Rate 1 Symbol Min Typ Max Unit Test Conditions/Comments VIH 2.0 1.6 V V VIL 0.8 0.4 V V VDDx VDDx - 0.2 0.0 0.04 0.2 +0.01 -3 +0.01 0.1 0.1 0.4 +10 IOx = -20 A, VIx = VIxH IOx = -4 mA, VIx = VIxH IOx = 20 A, VIx = VIxL IOx = 400 A, VIx = VIxL IOx = 4 mA, VIx = VIxL 0 V VIx VDDx VEx = 0 V +10 V V V V V A A A IDDI(Q) IDDO(Q) 0.37 0.39 0.57 0.55 mA mA All data inputs at logic low All data inputs at logic low IDDI(D) IDDO(D) 0.10 0.03 mA/Mbps mA/Mbps 2.5 35 ns kV/s 10% to 90% VIx = VDDx ns ns Mbps High/low output to high impedance High impedance to high/low output VOH VDDx - 0.1 VDDx - 0.4 VOL II IPU IOZ tR/tF |CM| tPHZ, tPLZ tPZH, tPZL fr -10 -10 -10 25 6 6 1.0 8 8 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. VCM = 1000 V, transient magnitude = 800 V. Rev. A | Page 7 of 20 ADuM3300W/ADuM3301W Data Sheet PACKAGE CHARACTERISTICS Table 13. Parameter RESISTANCE Input to Output1 CAPACITANCE Input to Output1 Input2 THERMAL RESISTANCE IC Junction-to- Ambient 1 2 Symbol Min Typ Max Unit RI-O 1012 CI-O CI 2.0 4.0 pF pF JA 45 C/W Test Conditions/Comments f = 1 MHz The device is considered a 2-terminal device; Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together. Input capacitance is from any input data pin to ground. REGULATORY INFORMATION The ADuM3300W/ADuM3301W are approved by the organizations listed in Table 14. See Table 19 and the Insulation Lifetime section for more information regarding recommended maximum working voltages for specific cross isolation waveforms and insulation levels. Table 14. UL Recognized under UL 1577 component recognition program1 Single insulation, 2500 V rms Isolation Voltage File E214100 CSA Approved under CSA Component Acceptance Notice #5A Basic insulation per CSA 60950-1-03 and IEC 60950-1, 400 V rms (566 V peak) maximum working voltage File 205078 VDE Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-122 Reinforced insulation, 560 V peak File 2471900-4880-0001 In accordance with UL 1577, each ADuM3300W/ADuM3301W is proof tested by applying an insulation test voltage of 3000 V rms for 1 sec (current leakage detection limit = 5 A). 2 In accordance with DIN V VDE V 0884-10, each ADuM3300W/ADuM3301W is proof tested by applying an insulation test voltage of 1050 V peak for 1 sec (partial discharge detection limit = 5 pC). An asterisk (*) marking branded on the component designates DIN V VDE V 0884-10 approval. 1 INSULATION AND SAFETY-RELATED SPECIFICATIONS Table 15. Parameter Rated Dielectric Insulation Voltage Minimum External Air Gap (Clearance) Symbol L(I01) Value 2500 8.0 min Unit V rms mm Minimum External Tracking (Creepage) L(I02) 7.6 min mm Minimum Internal Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group CTI 0.017 min >400 II mm V Rev. A | Page 8 of 20 Test Conditions/Comments 1-minute duration Measured from input terminals to output terminals, shortest distance through air in the plane of the printed circuit board (PCB) Measured from input terminals to output terminals, shortest distance path along body Insulation distance through insulation DIN IEC 112/VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) Data Sheet ADuM3300W/ADuM3301W DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured by protective circuits. The asterisk (*) marking branded on the component designates DIN V VDE V 0884-10 approval for a 560 V peak working voltage. Table 16. Description Installation Classification per DIN VDE 0110 For Rated Mains Voltage 150 V rms For Rated Mains Voltage 300 V rms For Rated Mains Voltage 400 V rms Climatic Classification Pollution Degree per DIN VDE 0110, Table 1 Maximum Working Insulation Voltage Input-to-Output Test Voltage, Method B1 Test Conditions/Comments VIORM x 1.875 = Vpd(m), 100% production test, tini = tm = 1 sec, partial discharge < 5 pC VIORM x 1.5 = Vpd(m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC Input-to-Output Test Voltage, Method A After Environmental Tests Subgroup 1 After Input and/or Safety Test Subgroup 2 and Subgroup 3 Highest Allowable Overvoltage Surge Isolation Voltage Safety Limiting Values VIORM x 1.2 = Vpd(m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC V peak = 10 kV, 1.2 s rise time, 50 s, 50% fall time Maximum value allowed in the event of a failure (see Figure 3) Maximum Junction Temperature Total Power Dissipation @ 25C Insulation Resistance at TS VIO = 500 V Characteristic Unit VIORM Vpd(m) I to IV I to III I to II 40/105/21 2 560 1050 V peak V peak Vpd(m) 840 V peak Vpd(m) 672 V peak VIOTM VIOSM 4000 4000 V peak V peak TS PS RS 150 2.78 >109 C W RECOMMENDED OPERATING CONDITIONS 3.0 Table 17. 2.5 Parameter Operating Temperature Supply Voltages1 2.0 1.5 Input Signal Rise and Fall Times Symbol TA VDD1, VDD2 Min -40 3.135 Max +125 5.5 Unit C V 1.0 ms 1.0 1 0.5 0 0 50 100 AMBIENT TEMPERATURE (C) 150 200 All voltages are relative to their respective grounds. See the DC Correctness and Magnetic Field Immunity section for information on immunity to external magnetic fields. 11427-003 SAFE LIMITING POWER (mW) Symbol Figure 3. Thermal Derating Curve, Dependence of Safety Limiting Values with Ambient Temperature per DIN V VDE V 0884-10 Rev. A | Page 9 of 20 ADuM3300W/ADuM3301W Data Sheet ABSOLUTE MAXIMUM RATINGS Ambient temperature = 25C, unless otherwise noted. Table 18. Rating1 Parameter Temperature Range Storage (TST) Operating (Ambient, TA) Supply Voltages1 (VDD1, VDD2) Input Voltage1, 2 (VIA, VIB, VIC, VE1, VE2) Output Voltage1, 2 (VOA, VOB, VOC) Average Output Current per Pin3 Side 1 (IO1) Side 2 (IO2) Common-Mode Transients4 (CMH, CML) -65C to +150C -40C to +125C -0.5 V to +7.0 V -0.5 V to VDDI + 0.5 V -0.5 V to VDDO + 0.5 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION -10 mA to +10 mA -10 mA to +10 mA -100 kV/s to +100 kV/s 1 VDDI and VDDO refer to the supply voltages on the input and output sides of a given channel, respectively. All voltages are relative to their respective grounds. 3 See Figure 3 for maximum rated power values for various temperatures. 4 Refers to common-mode transients across the insulation barrier. Commonmode transients exceeding the absolute maximum rating can cause latch-up or permanent damage. 2 Table 19. Maximum Continuous Working Voltage1 Parameter AC Voltage, Bipolar Waveform AC Voltage, Unipolar Waveform Basic Insulation DC Voltage Basic Insulation 1 Max 560 Unit V peak Constraint 50-year minimum lifetime 1131 V peak 50-year minimum lifetime 1131 V peak 50-year minimum lifetime Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more information. Table 20. Truth Table Abbreviations Letter H L NC X Z Description High level Low level No connect Irrelevant (don't care) High impedance Table 21. Truth Table (Positive Logic) VIx Input1 H L X X VEx Input2 H or NC H or NC L H or NC VDDI State1 Powered Powered Powered Unpowered VDDO State1 Powered Powered Powered Powered VOx Output1 H L Z H X X L X Unpowered Powered Powered Unpowered Z Indeterminate 1 2 Notes Outputs return to the input state within 1 s of VDDI power restoration. Outputs return to the input state within 1 s of VDDO power restoration when the VEx state is H or NC. Outputs return to a high impedance state within 8 ns of VDDO power restoration when the VEx state is L. VIx and VOx refer to the input and output signals of a given channel (A, B, or C). VEX refers to the output enable signal on the same side as the VOx outputs. VDDI and VDDO refer to the supply voltages on the input and output sides of a given channel, respectively. In noisy environments, connecting VEx to an external logic high or low is recommended. Rev. A | Page 10 of 20 Data Sheet ADuM3300W/ADuM3301W PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS ADuM3300W VDD1 1 16 VDD2 GND1 2 15 GND2 VIA 3 14 VOA TOP VIEW 13 VOB VIC 5 (Not to Scale) 12 VOC VIB 4 NC 6 11 NC NC 7 10 VE2 GND1 8 9 GND2 11427-004 NC = NO CONNECT NOTES 1. PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED TO EACH OTHER, AND IT IS RECOMMENDED THAT BOTH PINS BE CONNECTED TO A COMMON GROUND. 2. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED TO EACH OTHER, AND IT IS RECOMMENDED THAT BOTH PINS BE CONNECTED TO A COMMON GROUND. Figure 4. ADuM3300W Pin Configuration Table 22. ADuM3300W Pin Function Descriptions Pin No. 1 2, 8 Mnemonic VDD1 GND1 3 4 5 6, 7, 11 9, 15 VIA VIB VIC NC GND2 10 VE2 12 13 14 16 VOC VOB VOA VDD2 Description Supply Voltage for Isolator Side 1, 3.135 V to 5.5 V. Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected to each other, and it is recommended that both pins be connected to a common ground. Logic Input A. Logic Input B. Logic Input C. No Connection. Do not connect to these pins. Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected to each other, and it is recommended that both pins be connected to a common ground. Output Enable 2. Active high logic input. The VOA, VOB, and VOC outputs are enabled when VE2 is high or disconnected. The VOA, VOB, and VOC outputs are disabled when VE2 is low. In noisy environments, connecting VE2 to an external logic high or low is recommended. Logic Output C. Logic Output B. Logic Output A. Supply Voltage for Isolator Side 2, 3.135 V to 5.5 V. Rev. A | Page 11 of 20 ADuM3300W/ADuM3301W Data Sheet ADuM3301W VDD1 1 16 VDD2 GND1 2 15 GND2 VIA 3 14 VOA TOP VIEW 13 VOB VOC 5 (Not to Scale) 12 VIC 11 NC NC 6 VIB 4 VE1 7 GND1 8 10 VE2 9 GND2 11427-005 NC = NO CONNECT NOTES 1. PIN 2 AND PIN 8 ARE INTERNALLY CONNECTED TO EACH OTHER, AND IT IS RECOMMENDED THAT BOTH PINS BE CONNECTED TO A COMMON GROUND. 2. PIN 9 AND PIN 15 ARE INTERNALLY CONNECTED TO EACH OTHER, AND IT IS RECOMMENDED THAT BOTH PINS BE CONNECTED TO A COMMON GROUND. Figure 5. ADuM3301W Pin Configuration Table 23. ADuM3301W Pin Function Descriptions Pin No. 1 2, 8 Mnemonic VDD1 GND1 3 4 5 6, 11 7 VIA VIB VOC NC VE1 9, 15 GND2 10 VE2 12 13 14 16 VIC VOB VOA VDD2 Description Supply Voltage for Isolator Side 1, 3.135 V to 5.5 V. Ground 1. Ground reference for Isolator Side 1. Pin 2 and Pin 8 are internally connected to each other, and it is recommended that both pins be connected to a common ground. Logic Input A. Logic Input B. Logic Output C. No Connection. Do not connect to these pins. Output Enable 1. Active high logic input. The VOC output is enabled when VE1 is high or disconnected. The VOC output is disabled when VE1 is low. In noisy environments, connecting VE1 to an external logic high or low is recommended. Ground 2. Ground reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected to each other, and it is recommended that both pins be connected to a common ground. Output Enable 2. Active high logic input. The VOA and VOB outputs are enabled when VE2 is high or disconnected. The VOA and VOB outputs are disabled when VE2 is low. In noisy environments, connecting VE2 to an external logic high or low is recommended. Logic Input C. Logic Output B. Logic Output A. Supply Voltage for Isolator Side 2, 3.135 V to 5.5 V. Rev. A | Page 12 of 20 Data Sheet ADuM3300W/ADuM3301W TYPICAL PERFORMANCE CHARACTERISTICS 3.0 20 15 2.0 CURRENT (mA) CURRENT/CHANNEL (mA) 2.5 5V 1.5 3V 1.0 10 5V 5 0.5 0 2 4 6 DATA RATE (Mbps) 8 10 0 11427-006 0 0 Figure 6. Typical Input Supply Current per Channel vs. Data Rate (No Load) for 5 V and 3.3 V Operation 2 4 6 DATA RATE (Mbps) 8 10 11427-009 3V Figure 9. Typical ADuM3300W VDD1 Supply Current vs. Data Rate for 5 V and 3.3 V Operation 20 3.0 15 2.0 CURRENT (mA) CURRENT/CHANNEL (mA) 2.5 1.5 1.0 5V 10 5 0.5 5V 3V 2 4 6 DATA RATE (Mbps) 8 10 3V 0 0 2 4 6 DATA RATE (Mbps) 8 10 11427-010 0 11427-007 0 Figure 10. Typical ADuM3300W VDD2 Supply Current vs. Data Rate for 5 V and 3.3 V Operation Figure 7. Typical Output Supply Current per Channel vs. Data Rate (No Load) for 5 V and 3.3 V Operation 20 3.0 15 2.0 CURRENT (mA) 1.5 1.0 10 5 5V 5V 0.5 3V 0 2 4 6 DATA RATE (Mbps) 8 10 11427-008 3V 0 0 0 2 4 6 DATA RATE (Mbps) 8 10 Figure 11. Typical ADuM3301W VDD1 Supply Current vs. Data Rate for 5 V and 3.3 V Operation Figure 8. Typical Output Supply Current per Channel vs. Data Rate (15 pF Output Load) for 5 V and 3.3 V Operation Rev. A | Page 13 of 20 11427-011 CURRENT/CHANNEL (mA) 2.5 ADuM3300W/ADuM3301W Data Sheet 20 45 PROPAGATION DELAY (ns) CURRENT (mA) 15 10 5 40 3V 35 5V 5V 2 6 4 DATA RATE (Mbps) 8 10 Figure 12. Typical ADuM3301W VDD2 Supply Current vs. Data Rate for 5 V and 3.3 V Operation 30 -50 -25 0 25 50 TEMPERATURE (C) 75 100 125 Figure 13. Propagation Delay vs. Temperature, B Grade for 5 V and 3.3 V Operation Rev. A | Page 14 of 20 11427-019 0 11427-012 3V 0 Data Sheet ADuM3300W/ADuM3301W APPLICATIONS INFORMATION The ADuM3300W/ADuM3301W digital isolators require no external interface circuitry for the logic interfaces. Power supply bypassing is strongly recommended at the input and output supply pins (see Figure 14). Bypass capacitors are most conveniently connected between Pin 1 and Pin 2 for VDD1 and between Pin 15 and Pin 16 for VDD2. Use capacitor values between 0.01 F and 0.1 F. Do not exceed 2 mm for total lead length between both ends of the capacitor and the input power supply pin. Consider bypassing between Pin 1 and Pin 8 and between Pin 9 and Pin 16, unless the ground pair on each package side is connected close to the package. VDD2 GND2 VOA VOB VOC/VIC NC VE2 GND2 PROPAGATION DELAY-RELATED PARAMETERS Propagation delay is a parameter that describes the time it takes a logic signal to propagate through a component. The propagation delay to a logic low output can differ from the propagation delay to a logic high output (see Figure 15). INPUT (VIx) 50% tPLH OUTPUT (VOx) 11427-015 VDD1 GND1 VIA VIB VIC/VOC NC VE1 GND1 Although the ADuM3300W/ADuM3301W improve system level ESD reliability, these devices are no substitute for a robust system level design. See the AN-793 Application Note, ESD/Latch-Up Considerations with iCoupler(R) Isolation Products, for detailed recommendations on board layout and system level design. tPHL 50% 11427-016 PRINTED CIRCUIT BOARD LAYOUT Figure 15. Propagation Delay Parameters Figure 14. Recommended Printed Circuit Board Layout In applications involving high common-mode transients, ensure that board coupling across the isolation barrier is minimized. Furthermore, design the board layout such that any coupling that does occur affects all pins equally on a given component side. Failure to ensure this can cause voltage differentials between pins, thereby exceeding the absolute maximum ratings for the device, leading to latch-up or permanent damage. See the AN-1109 Application Note for board layout guidelines. SYSTEM LEVEL ESD CONSIDERATIONS AND ENHANCEMENTS Pulse width distortion is the maximum difference between these two propagation delay values and is an indication of how accurately timing of the input signal is preserved. Channel-to-channel matching refers to the maximum amount that the propagation delay differs between channels within a single ADuM3300W or ADuM3301W component. Propagation delay skew refers to the maximum amount that the propagation delay differs between multiple ADuM3300W and ADuM3301W components operating under the same conditions. DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY System level ESD reliability (for example, per IEC 61000-4-x) is highly dependent on system design, which varies widely by application. The ADuM3300W/ADuM3301W incorporate many enhancements to make ESD reliability less dependent on system design. The enhancements include ESD protection cells are added to all input/output interfaces. Key metal trace resistances are reduced using wider geometry and paralleling of lines with vias. Guarding and isolation technique employed between the PMOS and NMOS devices minimizes the SCR effect inherent in CMOS devices. 45 corners on metal traces eliminate areas of high electric field concentration. Larger ESD clamps between each supply pin and its respective ground prevent supply pin overvoltage. Positive and negative logic transitions at the isolator input cause narrow (~1 ns) pulses to be sent to the decoder via the transformer. The decoder is bistable and is, therefore, either set or reset by the pulses, indicating input logic transitions. In the absence of logic transitions at the input for more than ~1 s, a periodic set of refresh pulses indicative of the correct input state is sent to ensure dc correctness at the output. If the decoder receives no internal pulses for more than approximately 5 s, the input side is assumed to be unpowered or nonfunctional, in which case the isolator output is forced to a default state by the watchdog timer circuit (see Table 21). The limitation on the magnetic field immunity of the ADuM3300W/ADuM3301W is set by the condition in which induced voltage in the receiving coil of the transformer is sufficiently large to either falsely set or reset the decoder. The following analysis defines the conditions under which this can occur. The 3.3 V operating condition of the ADuM3300W/ ADuM3301W is examined because it represents the most susceptible mode of operation. Rev. A | Page 15 of 20 ADuM3300W/ADuM3301W Data Sheet where: is the magnetic flux density (gauss). rn is the radius of the nth turn in the receiving coil (cm). N is the number of turns in the receiving coil. Given the geometry of the receiving coil in the ADuM3300W/ ADuM3301W and an imposed requirement that the induced voltage is at most 50% of the 0.5 V margin at the decoder, a maximum allowable magnetic field is calculated, as shown in Figure 16. MAXIMUM ALLOWABLE MAGNETIC FLUX DENSITY (kgauss) 10 DISTANCE = 100mm 1 DISTANCE = 5mm 0.1 0.01 1k 10k 100k 1M 10M 100M MAGNETIC FIELD FREQUENCY (Hz) Figure 17. Maximum Allowable Current for Various Current to ADuM3300W/ADuM3301W Spacings 100 Note that at combinations of strong magnetic field and high frequency, any loops formed by printed circuit board (PCB) traces can induce error voltages sufficiently large enough to trigger the thresholds of succeeding circuitry. Take care in the layout of such traces to avoid this possibility. 10 1 POWER CONSUMPTION 0.1 The supply current at a given channel of the ADuM3300W or ADuM3301W isolator is a function of the supply voltage, the data rate of the channel, and the output load of the channel. 0.01 For each input channel, the supply current is given by 100k 10M 10k 1M MAGNETIC FIELD FREQUENCY (Hz) 100M 11427-017 0.001 1k DISTANCE = 1m 100 11427-018 V = (-d/dt) rn2; n = 1, 2, ... , N 1000 MAXIMUM ALLOWABLE CURRENT (kA) The pulses at the transformer output have an amplitude greater than 1.0 V. The decoder has a sensing threshold at about 0.5 V, establishing a 0.5 V margin in which induced voltages are tolerated. The voltage induced across the receiving coil is given by Figure 16. Maximum Allowable External Magnetic Flux Density For example, at a magnetic field frequency of 1 MHz, the maximum allowable magnetic field of 0.2 kgauss induces a voltage of 0.25 V at the receiving coil. This is about 50% of the sensing threshold and does not cause a faulty output transition. Similarly, if such a magnetic field event were to occur during a transmitted pulse (and was of the worst-case polarity), it would reduce the received pulse from >1.0 V to 0.75 V--still well above the 0.5 V sensing threshold of the decoder. The preceding magnetic flux density values correspond to specific current magnitudes at given distances from the ADuM3300W or ADuM3301W transformers. Figure 17 expresses these allowable current magnitudes as a function of frequency for selected distances. The ADuM3300W/ADuM3301W are extremely immune and can be affected only by extremely large currents operating at high frequency very close to the component (see Figure 17). For the 1 MHz example noted, a 0.5 kA current would have to be placed 5 mm away from the ADuM3300W or ADuM3301W to affect the operation of the component. IDDI = IDDI(Q) f 0.5 fr IDDI = IDDI(D) x (2f - fr) + IDDI(Q) f > 0.5 fr For each output channel, the supply current is given by IDDO = IDDO(Q) f 0.5 fr IDDO = (IDDO(D) + (0.5 x 10 ) x CL x VDDO) x (2f - fr) + IDDO(Q) f > 0.5 fr -3 where: IDDI(D), IDDO(D) are the input and output dynamic supply currents per channel (mA/Mbps). CL is the output load capacitance (pF). VDDO is the output supply voltage (V). f is the input logic signal frequency (MHz); it is half of the input data rate expressed in units of Mbps. fr is the input stage refresh rate (Mbps). IDDI(Q), IDDO(Q) are the specified input and output quiescent supply currents (mA). To calculate the total IDD1 and IDD2 supply current, the supply currents for each input and output channel corresponding to VDD1 and VDD2 are calculated and totaled. Figure 6 provides per channel input supply current as a function of data rate. Figure 7 and Figure 8 provide per channel output supply current as a function of data rate for an unloaded output condition and for a 15 pF output condition, respectively. Figure 9 through Figure 12 provide total VDD1 and VDD2 supply current as a function of data rate for ADuM3300W/ADuM3301W channel configurations. Rev. A | Page 16 of 20 Data Sheet ADuM3300W/ADuM3301W Note that the voltage presented in Figure 19 is shown as sinusoidal for illustration purposes only. It is meant to represent any voltage waveform varying between 0 V and some limiting value. The limiting value can be positive or negative, but the voltage cannot cross 0 V. The values shown in Table 19 summarize the peak voltage for 50 years of service life. In many cases, the approved working voltage is higher than the 50-year service life voltage. Operation at these high working voltages can lead to shortened insulation life. The insulation lifetime of the ADuM3300W/ADuM3301W depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates, depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 18, Figure 19, and Figure 20 illustrate these different isolation voltage waveforms. Bipolar ac voltage is the most stringent environment. The goal of a 50-year operating lifetime under the bipolar ac condition determines the maximum working voltage recommended by Analog Devices. RATED PEAK VOLTAGE 11427-020 Analog Devices performs accelerated life testing using voltage levels higher than the rated continuous working voltage. Acceleration factors for several operating conditions are determined. These factors allow calculation of the time to failure at the actual working voltage. 0V Figure 18. Bipolar AC Waveform RATED PEAK VOLTAGE 11427-021 All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation. In addition to the testing performed by the regulatory agencies, Analog Devices executes an extensive set of evaluations to determine the lifetime of the insulation structure within the ADuM3300W and ADuM3301W. In the case of unipolar ac or dc voltage, the stress on the insulation is significantly lower. This allows operation at higher working voltages while still achieving a 50-year service life. The working voltages listed in Table 19 can be applied while maintaining the 50-year minimum lifetime, provided that the voltage conforms to either the unipolar ac or dc voltage cases. Treat any cross insulation voltage waveform that does not conform to Figure 19 or Figure 20 as a bipolar ac waveform, and limit its peak voltage to the 50-year lifetime voltage value listed in Table 19. 0V Figure 19. Unipolar AC Waveform RATED PEAK VOLTAGE 11427-022 INSULATION LIFETIME 0V Figure 20. DC Waveform Rev. A | Page 17 of 20 ADuM3300W/ADuM3301W Data Sheet PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS 10.50 (0.4134) 10.10 (0.3976) 9 16 7.60 (0.2992) 7.40 (0.2913) 8 1.27 (0.0500) BSC 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 0.51 (0.0201) 0.31 (0.0122) 10.65 (0.4193) 10.00 (0.3937) 0.75 (0.0295) 45 0.25 (0.0098) 2.65 (0.1043) 2.35 (0.0925) SEATING PLANE 8 0 1.27 (0.0500) 0.40 (0.0157) 0.33 (0.0130) 0.20 (0.0079) COMPLIANT TO JEDEC STANDARDS MS-013-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 03-27-2007-B 1 Figure 21. 16-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-16) Dimensions shown in millimeters and (inches) ORDERING GUIDE Model1, 2 ADuM3300WARWZ ADuM3300WBRWZ ADuM3301WARWZ ADuM3301WBRWZ 1 2 3 Temperature Range -40C to +125C -40C to +125C -40C to +125C -40C to +125C Number of Inputs, VDD1 Side 3 3 2 2 Number of Inputs, VDD2 Side 0 0 1 1 Maximum Data Rate (Mbps) 1 10 1 10 Maximum Propagation Delay, 5 V (ns) 100 36 100 36 Maximum Pulse Width Distortion (ns) 40 3.5 40 3.5 Package Option3 RW-16 RW-16 RW-16 RW-16 Z = RoHS Compliant Part. W = Qualified for Automotive Applications. Tape and reel are available. The addition of an -RL suffix designates a 13-inch (1,000 units) tape and reel option. AUTOMOTIVE PRODUCTS The ADuM3300W and ADuM3301W models are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. Rev. A | Page 18 of 20 Data Sheet ADuM3300W/ADuM3301W NOTES Rev. A | Page 19 of 20 ADuM3300W/ADuM3301W Data Sheet NOTES (c)2013-2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D11427-0-11/14(A) www.analog.com/ADuM3300W/ADuM3301W Rev. A | Page 20 of 20