© 2001 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
VCES TJ= 25°C to 150°C 600 V
VCGR TJ= 25°C to 150°C; RGE = 1 MΩ600 V
VGES Continuous ±20 V
VGEM Transient ±30 V
IC25 TC= 25°C55A
IC90 TC= 90°C30A
ICM TC= 25°C, 1 ms 110 A
SSOA VGE = 15 V, TJ = 125°C, RG = 2.7 Ω ICM = 60 A
(RBSOA) Clamped inductive load, VCC= 0.8 VCES @ 0.8 VCES
tSC VGE = 15 V, VCE = 360 V, TJ = 125°C 10µs
(SCSOA) RG = 33 Ω, non repetitive
PCTC= 25°C 200 W
TJ-55 ... +150 °C
TJM 150 °C
Tstg -55 ... +150 °C
MdMounting torque (TO-247) 1.13/10 Nm/lb.in.
Weight TO-247 6 g
TO-268 4 g
Maximum lead temperature for soldering 300 °C
1.6 mm (0.062 in.) from case for 10 s
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
BVCES IC= 250 µA, VGE = 0 V 600 V
VGE(th) IC= 2.5 mA, VCE = VGE 47V
ICES VCE = 0.8 VCES TJ = 25°C 100 µA
VGE = 0 V TJ = 125°C1mA
IGES VCE = 0 V, VGE = ±20 V ±100 nA
VCE(sat) VGE = 15 V; IC = IC90 30N60B 2.0 V
30N60C 2.5 V
Features
lInternational standard packages
lShort Circuit SOA capability
lHigh frequency IGBT
lNew generation HDMOSTM process
Applications
lAC motor speed control
lDC servo and robot drives
lDC choppers
lUninterruptible power supplies (UPS)
lSwitch-mode and resonant-mode
power supplies
Advantages
lEasy to mount with 1 screw
(isolated mounting screw hole)
lSurface mountable, high power case
style
lReduce assembly time and cost
lHigh power density
98519B (11/01)
G = Gate
S = Source TAB = Drain
TO-247 AD (IXSH)
(TAB)
TO-268 (D3) ( IXST)
(TAB)
G
S
High Speed IGBT
Short Circuit SOA Capability
VCES ICES tfi
IXSH/IXST 30N60B 600 V 2.0 V 140 ns
IXSH/IXST 30N60C 600 V 2.5 V 70 ns