Q2–1/8
PNP Silicon Surface Mount Transistor with
Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base-emitter resistor.The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SOT-23 package which is
designed for low power surface mount applications.
∗ Simplifies Circuit Design
∗ Reduces Board Space
∗ Reduces Component Count
∗ The SOT-23 package can be soldered using wave or
reflow. The modified gull-winged leads absorb thermal
stress during soldering eliminating the possibility of
damage to the die.
∗ Available in 8 mm embossed tape and reel. Use the
Device Number to order the 7 inch/3000 unit reel.
Replace “T1” with “T3” in the Device Number to order
the 13 inch/10,000 unit reel.
MMUN2211RLT1
MMUN2212RLT1
MMUN2213RLT1
MMUN2214RLT1
MMUN2215RLT1
MMUN2230RLT1
MMUN2231RLT1
MMUN2232RLT1
MMUN2233RL34
CASE 318–08, STYLE 6
SOT– 23 (TO–236AB)
NPN SILICON
BIAS RESISTOR
TRANSISTOR
Bias Resistor T ransistor
MAXIMUM RATINGS (T A = 25°C unless otherwise noted)
Rating Symbol Value Unit
Collector-Base Voltage VCBO 50 Vdc
Collector-Emitter Voltage V CEO 50 Vdc
Collector Current I C 100 mAdc
Total Power Dissipation @ T A = 25°C (1) P D200 mW
Derate above 25°C1.6 mW/°C
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Resistance — Junction-to-Ambient (surface mounted) R θJA 625 °C/W
Operating and Storage Temperature Range TJ , Tstg –65 to +150 °C
Maximum Temperature for Soldering Purposes T L 260 °C
Time in Solder Bath 10 Sec
DEVICE MARKING AND RESISTOR VALUES
Device Marking R 1 ( K) R 2 ( K)
MMUN2211RLT1 A8A 10 10
MMUN2212RLT1 A8B 22 22
MMUN2213RLT1 A 8C 47 47
MMUN2214RLT1 A8D 10 47
MMUN2215RLT1 (2) A8E 10
MMUN2216RLT1 (2) A8F 4.7
MMUN2230RLT1 (2) A8G 1 1
MMUN2231RLT1 (2) A8H 2.2 2.2
MMUN2232RLT1 (2) A8J 4.7 4.7
MMUN2233RLT1 (2) A8K 4.7 47
MMUN2234RLT1 (2) A8L 22 47
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
R1
R2
PIN3
Collector
(output)
PIN1
base
(Input) PIN2
Emitter
(Ground)
88
1
3
2