RCV2010100KFKEFAT - VISHAY

RCV-AT e3

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High Voltage (Up to 3 kV) Thick Film Chip Resistors

The RCV e3 high voltage thick film chip resistors series are

the perfect choice for modern electronics with high voltage

requirements. Typical applications include automotive

inverters for H(EV) cars, voltage measurement systems as

implemented in on board chargers, and DC-DC converters.

FEATURES

• High operating voltage (up to 3 kV)

• Low voltage coefficient of resistance (VCR):

25 ppm/V

• RCV-AT series AEC-Q200 qualified

• Material categorization: for definitions of

compliance please see www.vishay.com/doc?99912

APPLICATIONS

• Inverters for (H)EV cars

• On board chargers

•DC-DC converters

Note

(1) Please refer to APPLICATION INFORMATION below

APPLICATION INFORMATION

When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal

resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted

film temperature is not exceeded.

These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift

increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a

functional lifetime.

TECHNICAL SPECIFICATIONS

DESCRIPTION RCV2010-AT e3 RCV2512-AT e3

Imperial size 2010 2512

Metric size code RR5025M RR6332M

Resistance range 100 k to 100 M

Resistance tolerance ± 5 %; ± 1 %

Temperature coefficient ± 200 ppm/K; ± 100 ppm/K

Voltage coefficient 25 ppm/V

Rated dissipation, P70 (1) 0.75 W 1.0 W

Operating voltage, Umax. ACRMS/DC 2000 V 3000 V

Permissible film temperature,



F max. (1) 155 °C

Operating temperature range -55 °C to +155 °C

Max. resistance change at P70

for resistance range, |R/R| after:

1000 h  2.0 %  2.0 %

RCV-AT e3

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TEMPERATURE COEFFICIENT AND RESISTANCE RANGE

TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES

RCV2010-AT e3

± 200 ppm/K ± 5 % 100 k to 100 ME24

± 100 ppm/K ± 1 % 100 k to 10 ME24; E96

RCV2512-AT e3

± 200 ppm/K ± 5 % 100 k to 100 ME24

± 100 ppm/K ± 1 % 100 k to 10 ME24; E96

PACKAGING

TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH PACKAGING

DIMENSIONS

RCV2010-AT e3 EF = E02 4000

Blister tape according to

IEC 60286-3, type 2a

12 mm 4 mm Ø 180 mm / 7"

RCV2512-AT e3

EG = E67 2000

12 mm

8 mm

Ø 180 mm / 7"

ET = E82 4000 4 mm

PART NUMBER AND PRODUCT DESCRIPTION

Part Number: RCV2010100KFKEFAT

TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING VERSION

RCV2010

RCV2512

K = thousand

M = million

F = ± 1 %

J = ± 5 %

K = ± 100 ppm/K

N = ± 200 ppm/K

EF, EG, EH AT = automotive

Product Description: RCV2010-AT 100 100K 1 % E02 e3

RCV2010-AT 100 100K 1 % E02 e3

TYPE / SIZE TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE

RCV2010-AT

RCV2512-AT

± 100 ppm/K

± 200 ppm/K

100K = 100 k

1M = 1 M

100M = 100 M

± 1 %

± 5 %

E02, E67, E82 e3 = pure tin

termination finish

R C V 2 0 1 0 1 0 0 K F K E F A T

RCV-AT e3

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Revision: 25-Jun-2020 3Document Number: 20082

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

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DESCRIPTION

Production is strictly controlled and follows an extensive set

of instructions established for reproducibility. A cermet film

layer and a glass-over are deposited on a high grade (Al2O3)

ceramic substrate. Specially designed inner contacts are

deposited on both sides. A special laser is used to achieve

the target value by smoothly fine trimming the resistive layer

without damaging the ceramics. The resistor elements are

covered by a protective coating designed for electrical,

mechanical, and climatic protection. The terminations

receive a final pure tin on nickel plating. The result of the

determined production is verified by an extensive testing

procedure on 100 % of the individual chip resistors. Only

accepted products are laid directly into the tape in

accordance with IEC 60286-3 type 1a and 2a (1).

ASSEMBLY

The resistors are suitable for processing on automatic SMD

assembly systems. They are suitable for automatic

soldering using wave, reflow or vapor phase as shown in

IEC 61760-1 (1). The encapsulation is resistant to all

cleaning solvents commonly used in the electronics

industry, including alcohols, esters, and aqueous solutions.

The suitability of conformal coatings, potting compounds

and their processes, if applied, shall be qualified by

appropriate means to ensure the long-term stability of the

whole system.

The resistors are RoHS-compliant, the pure tin plating

provides compatibility with lead (Pb)-free and

lead-containing soldering processes. Solderability is

specified for 2 years after production or requalification. The

permitted storage time is 20 years. The immunity of the

plating against tin whisker growth has been proven under

extensive testing.

MATERIALS

Vishay acknowledges the following systems for the

regulation of hazardous substances:

• IEC 62474, Material Declaration for Products of and for the

Electrotechnical Industry, with the list of declarable

substances given therein (2)

• The Global Automotive Declarable Substance List

(GADSL) (3)

• The REACH regulation (1907/2006/EC) and the related list

of substances with very high concern (SVHC) (4) for its

supply chain

The products do not contain any of the banned substances

as per IEC 62474, GADSL, or the SVHC list, see

www.vishay.com/how/leadfree.

Hence the products fully comply with the following

directives:

• 2000/53/EC End-of-Life Vehicle Directive (ELV) and

Annex II (ELV II)

• 2011/65/EU Restriction of the Use of Hazardous

Substances Directive (RoHS) with amendment

2015/863/EU

• 2012/19/EU Waste Electrical and Electronic Equipment

Directive (WEEE)

Vishay pursues the elimination of conflict minerals from its

supply chain, see the Conflict Minerals Policy at

www.vishay.com/doc?49037.

APPROVALS

The resistors are qualified according to AEC-Q200.

Where applicable, the resistors are tested in accordance

with EN 140401-802 which refers to EN 60115-1,

EN 60115-8 and the variety of environmental test

procedures of the IEC 60068 (1) series.

RELATED PRODUCTS

For high voltage thin film products, please refer to latest

edition of TNPV e3, High Voltage Thin Film Chip Resistors

datasheet, www.vishay.com/doc?28881.

Notes

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents

(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474

(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at

www.gadsl.org

(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table

RCV-AT e3

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Revision: 25-Jun-2020 4Document Number: 20082

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DERATING

NOMINAL OPERATING VOLTAGE

The permissible operating voltage Umax. equals the rated voltage.

For ambient temperatures above 70 °C power derating must be considered

TESTS AND REQUIREMENTS

All executed tests are carried out in accordance with the

following specifications:

EN 60115-1, generic specification

EN 60115-8 (successor of EN 140400), sectional

specification

EN 140401-802, detail specification

IEC 60068-2-xx, test methods

The parameters stated in the “Test Procedures and

Requirements” table are based on the required tests and

permitted limits of EN 140401-802. The table presents only

the most important tests, for the full test schedule refer to

the documents listed above. However, some additional

tests and a number of improvements against those

minimum requirements have been included.

The testing also covers most of the requirements specified

by EIA/IS-703 and JIS-C-5201-1.

The tests are carried out under standard atmospheric

conditions in accordance with IEC 60068-1, 4.3, whereupon

the following values are applied:

Temperature: 15 °C to 35 °C

Relative humidity: 25 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)

A climatic category LCT / UCT / 56 is applied, defined by the

lower category temperature (LCT), the upper category

temperature (UCT), and the duration of exposure in the

damp heat, steady state test (56 days).

100

1000

10000

0.2

0.4

0.6

0.8

1.0

1.2

-70 -50 -30 -10 10 30 50 70 90 110 130 150

Axis Title

1st line

2nd line

P- Power Dissipation (W)

ϑamb - Ambient Temperature (°C)

RCV2010-AT

RCV2512-AT

100

1000

10000

400

800

1200

1600

2000

2400

2800

3200

100 000 1 000 000 10 000 000 100 000 000

Axis Title

1st line

2nd line

Permissible Operating Voltage (V)

Resistance Value (Ω)

RCV2512-AT

RCV2010-AT

RCV-AT e3

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Revision: 25-Jun-2020 5Document Number: 20082

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TEST PROCEDURES AND REQUIREMENTS

60115-1

CLAUSE

IEC

60082-2 (1)

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS PERMISSIBLE

CHANGE (R)

STABILITY CLASS 1

OR BETTER

STABILITY CLASS 2

OR BETTER

Stability for product types: 100 k to 100 M

RCV-AT e3

4.5 - Resistance - ± 1 % ± 5 %

4.8 - Temperature coefficient At (20 / -55 / 20) °C and

(20 / 155 / 20) °C ± 100 ppm/K ± 200 ppm/K

4.25.1 - Endurance at 70 °C

U = P70 x R or U = Umax.

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h;

70 °C; 8000 h

± (2 % R + 0.1 )

± (4 % R + 0.1 )

4.25.3 - Endurance at upper

category temperature 155 °C; 1000 h ± (2 % R + 0.1 )

4.24 78 (Cab) Damp heat,

steady state

(40 ± 2) °C; 56 days;

(93 ± 3) % RH ± (2 % R + 0.1 )

4.37 67 (Cy)

Damp heat, steady state,

accelerated power

operation mode

(85 ± 2) °C; (85 ± 5) % RH

U = (0.1 x P85 x R)1/2  0.3 x Umax.; 1000 h ± (2 % R + 0.1 )

4.23 - Climatic sequence:

± (2 % R + 0.1 )

4.23.2 2 (Bb) Dry heat 125 °C; 16 h

4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h;  90 % RH; 1 cycle

4.23.4 1 (Ab) Cold -55 °C; 2 h

4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C

4.23.6 30 (Db) Damp heat, cyclic 55 °C; 5 days;

> 90 % RH; 5 cycles

4.23.7 - DC load U = (P70 x R)1/2  Umax.; 1 min

- 1 (Aa) Cold -55 °C; 2 h ± (0.5 % R + 0.05 )

4.19 14 (Na) Rapid change

of temperature

30 min. at -55 °C and 30 min. at 125 °C;

1000 cycles

± (1 % R + 0.05 )

no visible damage

4.13 - Short time overload

U = 2.5 x (P70 x R)1/2 2 x Umax.;

whichever is the less severe; 5 s

± (2 % R + 0.05 )

Style Duration Maximum UOL

RCV2010-AT 5 s 3000

RCV2512-AT 5 s 4000

4.27 - Single pulse high

voltage overload

Severity no. 4:

U = 10 x (P70 x R)1/2

or U = 2 x Umax.;

whichever is the less severe;

10 pulses 10 μs / 700 μs

± (2 % R + 0.1 )

no visible damage

4.39 - Periodic electric

overload

U = 15 x P70 x R or U = 2 x Umax.;

whichever is the less severe;

0.1 s on; 2.5 s off; 1000 cycles

± (2 % R + 0.05 )

4.38 - Electrostatic discharge

(human body model)

IEC 61340-3-1 (1);

3 positive + 3 negative discharges;

RCV2010: 12 kV

RCV2512: 25 kV

± (1 % R + 0.05 )

4.22 6 (Fc) Vibration

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

amplitude  1.5 mm or  200 m/s2;

7.5 h

± (0.25 % R + 0.05 )

no visible damage

± (0.5 % R + 0.05 )

no visible damage

4.17 58 (Td) Solderability

Solder bath method, SnPb40;

non-activated flux (235 ± 5) °C; (2 ± 0.2) s Good tinning ( 95 % covered);

no visible damage

Solder bath method, Sn96.5Ag3Cu0.5;

non-activated flux (245 ± 5) °C; (3 ± 0.3) s

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Note

(1) The quoted IEC standards are also released as EN standards with the same number and identical contents

DIMENSIONS

SOLDER PAD DIMENSIONS

Note

• Utilization of the full specified operating voltage may require special considerations on the creepage and clearance distance between

conductors at different potential levels

4.18 58 (Td) Resistance to

soldering heat

Soldering bath method;

(260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )

4.29 45 (XA) Component solvent

resistance Isopropyl alcohol +50 °C; method 2 No visible damage

4.32 21 (Uu3) Shear (adhesion) 17.7 N No visible damage

4.33 21 (Uu1) Substrate bending Depth 2 mm; 3 times

± (1 % R + 0.05 )

no visible damage,

no open circuit in bent position

4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown

4.35 - Flammability,

needle flame test IEC 60695-11-5 (1);

10 s No burning after 30 s

DIMENSIONS AND MASS

TYPE / SIZE L

(mm)

MASS

(mg)

RCV2010-AT e3 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.45 ± 0.20 25.5

RCV2512-AT e3 6.3 ± 0.20 3.15 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.45 ± 0.20 42

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE / SIZE

WAVE SOLDERING REFLOW SOLDERING

(mm)

RCV2010-AT e3 3.60 1.65 2.85 6.90 3.70 1.20 2.70 6.10

RCV2512-AT e3 4.90 1.60 3.50 8.10 5.00 1.25 3.35 7.50

TEST PROCEDURES AND REQUIREMENTS

60115-1

CLAUSE

IEC

60082-2 (1)

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS PERMISSIBLE

CHANGE (R)

STABILITY CLASS 1

OR BETTER

STABILITY CLASS 2

OR BETTER

Stability for product types: 100 k to 100 M

RCV-AT e3

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Revision: 01-Jan-2021 1Document Number: 91000

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE

RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,

“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,

consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular

purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of

typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding

statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a

particular product with the properties described in the product specification is suitable for use in a particular application.

Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over

time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s

technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,

including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

applications or for any other application in which the failure of the Vishay product could result in personal injury or death.

Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.

Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for

such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document

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