(R) ISO113 ISO 113 Low-Cost, High-Voltage, Internally Powered OUTPUT ISOLATION AMPLIFIER FEATURES DESCRIPTION SELF-CONTAINED ISOLATED SIGNAL AND OUTPUT POWER SMALL PACKAGE SIZE: Double-Wide (0.6") Sidebraze DIP CONTINUOUS AC BARRIER RATING: 1500Vrms WIDE BANDWIDTH: 20kHz Small Signal, 20kHz Full Power BUILT-IN ISOLATED OUTPUT POWER: 10V to 18V Input, 50mA Output MULTICHANNEL SYNCHRONIZATION CAPABILITY BOARD AREA ONLY 0.72in.2 (4.6cm2) The ISO113 output isolation amplifier provides both signal and output power across an isolation barrier in a small double-wide DIP package. The ceramic nonhermetic hybrid package with side-brazed pins contains a transformer-coupled DC/ DC converter and a capacitor-coupled signal channel. APPLICATIONS 4mA TO 20mA V/I CONVERTERS MOTOR AND VALVE CONTROLLERS ISOLATED RECORDER OUTPUTS MEDICAL INSTRUMENTATION OUTPUTS GAS ANALYZERS Extra power is available on the isolated output side for driving external loads. The converter is protected from shorts to ground with an internal current limit, and the soft-start feature limits the initial currents from the power source. Multiple-channel synchronization can be accomplished by applying a TTL clock signal to paralleled Sync pins. The Enable control is used to turn off transformer drive while keeping the signal channel modulator active. This feature provides a convenient way to reduce quiescent current for low power applications. The wide barrier pin spacing and internal insulation allow for the generous 1500Vrms continuous rating. Reliability is assured by 100% barrier breakdown testing that conforms to UL1244 test methods. Low barrier capacitance minimizes AC leakage currents. These specifications and built-in features make the ISO113 easy to use, and provides for compact PC board layout. +VCC1 V IN Duty Cycle Demodulator Duty Cycle Modulator -VCC1 Sync Com 1 Sync* Enable +VC Sense V OUT Gnd 2 -VC +VCC2 Oscillators, Driver Rectifiers, Filters Ps Gnd -VCC2 Gnd 1 *Ground if not used International Airport Industrial Park * Mailing Address: PO Box 11400, Tucson, AZ 85734 * Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 * Tel: (520) 746-1111 Twx: 910-952-1111 * Internet: http://www.burr-brown.com/ * Cable: BBRCORP * Telex: 066-6491 * FAX: (520) 889-1510 * Immediate Product Info: (800) 548-6132 (c) 1989 Burr-Brown Corporation SBOS159 PDS-844E Printed in U.S.A. August, 1999 SPECIFICATIONS ELECTRICAL At TA = +25C and VCC1 = 15V, 15mA output, current unless otherwise noted. ISO113 PARAMETER ISOLATION Rated Continuous Voltage AC, 60Hz DC Test Breakdown, 100% AC, 60Hz Isolation-Mode Rejection Barrier Impedance Leakage Current GAIN Nominal Initial Error Gain vs Temperature Nonlinearity INPUT OFFSET VOLTAGE Initial Offset vs Temperature vs Power Supplies vs Output Supply Load SIGNAL INPUT Voltage Range Resistance CONDITIONS MIN TMIN to TMAX TMIN to TMAX 10s 1500Vrms, 60Hz 2121VDC 1500 2121 5657 VO = -10V to 10V VO = -5V to 5V 1 0.3 60 0.05 0.02 0.5 100 0.1 0.04 20 0.03 0.012 VCC2 = 10 to 18V IO = 0 to 50mA 20 300 0.9 0.3 Load Regulation Line Regulation Output Voltage vs Temperature Voltage Balance, VCC2 Voltage Ripple (800kHz) Output Capacitive Load Sync Frequency TEMPERATURE RANGE Specification Operating Storage UNITS Vrms VDC Vpk dB dB || pF A 50 0.05 0.02 V/V %FSR ppm/C %FSR %FSR 60 500 100 250 mV V/C mV/V mV/mA 10 15 200 V k 10 5 12.5 15 25 5 1000 4 V mA mVp-p mVp-p pF V/Hz kHz V/s s 20 1.5 75 0.1%, -10/10V IO = 15mA IO = 0mA No Filter CIN = 1F Load = 15mA 50mA Balanced Load 100mA Single-Ended Load Balanced Load MAX 2 400/4.7nF (See Figure 4) Rated Output Voltage Output TYP 240Vrms, 60Hz Capacitive Load Drive Voltage Noise Ripple Current MIN SIGNAL OUTPUT Voltage Range Current Drive Ripple Voltage, 800kHz Carrier POWER SUPPLIES Rated Voltage, VCC1 Voltage Range Input Current MAX 130 160 1012 || 9 1 Output Voltage in Range FREQUENCY RESPONSE Small Signal Bandwidth Slew Rate Settling Time TYP ISO113B 10 14.25 10 10 15 +90/-4.5 +60/-4.5 60 3 15 No External Capacitors CEXT = 1F 0.3 1.12 2.5 0.05 50 5 Sync-Pin Grounded(2) 1.6 18 15.75 1 -25 -25 -25 +85 +85 +125 V V mA mA mAp-p mAp-p V V V %/mA V/V mV/C % mVp-p mVp-p F MHz C C C Specifications same as ISO113. NOTE: (1) Conforms to UL1244 test methods. 100% tested at 1500Vrms for 1 minute. (2) If using external synchronization with a TTL-level clock, frequency should be between 1.2MHz and 2MHz with a duty-cycle greater than 25%. (R) ISO113 2 PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS Enable 1 24 NC +V CC1 2 23 Gnd 1 Sync 3 22 V IN -V CC1 4 21 Com 1 Gnd 2 9 16 -V C V OUT 10 15 -V CC2 Sense 11 14 +VCC2 Ps Gnd 12 13 +VC Supply Without Damage .................................................................... 18V VIN, Sense Voltage ............................................................................. 50V Com1 to Gnd1 ................................................................................................................ 200mV Enable, Sync ......................................................................... Gnd to +VCC1 Continuous Isolation Voltage ..................................................... 1500Vrms VISO, dv/dt ..................................................................................... 20kV/s Junction Temperature .................................................................... +150C Storage Temperature ...................................................... -25C to +125C Lead Temperature,10s .................................................................. +300C Output Short to Gnd Duration .................................................. Continuous VCC2 to Gnd 2 Duration .......................................................... Continuous ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DRAWING NUMBER(1) ISO113 24-Pin DIP 231 SPECIFIED TEMPERATURE RANGE -25C to +85C PACKAGE MARKING ORDERING NUMBER(2) TRANSPORT MEDIA NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of "ISO113/2K5" will get a single 2500piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. (R) 3 ISO113 TYPICAL PERFORMANCE CURVES At TA = +25C,VCC1 = 15VDC, 15mA output, current unless otherwise noted. IMR/LEAKAGE vs FREQUENCY RECOMMENDED RANGE OF ISOLATION VOLTAGE 2.1k 1k IMR Isolation-Mode Rejection (dB) Maximum Isolation Voltage (Vpk) Barrier Voltage Rating Non-Specified Signal Operation 2100V at 75kHz 100 Operational Region 10 1 Leakage at 1500Vrms 130 1mA 100A 120 Leakage at 240Vrms 110 10A 100 1A 100nA 100k 90 100 1k 10k 100k 1M 10 10M 100 1k 10k Isolation Voltage Frequency (Hz) Isolation Voltage Frequency (Hz) DISTORTION vs FREQUENCY GAIN/PHASE vs FREQUENCY 10 3 0 0 45 -3 VO = 2Vp-p 0.1 VO = 20Vp-p 0.01 100 10 1k 90 -6 Phase -9 135 -12 180 -15 100 10k Frequency (Hz) 1k 10k Phase Shift () 1 Gain (dB) THD + N (%) Gain 100k Small Signal Frequency (Hz) ISOLATED POWER SUPPLY LOAD REGULATION AND EFFICIENCY LARGE SIGNAL TRANSIENT RESPONSE 20 17 60 10 0 -10 16 45 Output Voltage Balanced Loads 15 30 Output Voltage Single-Ended Loads 14 15 13 -20 0 50 100 0 0 0 Time (s) 10 20 20 40 30 60 V CC1 Supply Output Current (mA) (R) ISO113 4 40 80 Efficiency (%) V CC1 Output Voltage (V) Output Voltage (V) Balanced Load Efficiency Barrier Leakage Current (rms) 10mA 140 10k TYPICAL PERFORMANCE CURVES (CONT) At TA = +25C,VCC1 = 15VDC, 15mA output current, unless otherwise noted. ISOLATION POWER SUPPLY VOLTAGE vs TEMPERATURE ISOLATED POWER SUPPLY LINE REGULATION 19 2 18 17 15mA Load 1 V CC2 (%) 15 14 1.12V/V 13 0 12 -1 11 10 9 -2 10 11 12 13 14 15 16 17 18 19 -25 0 25 +V CC1 (V) 50 75 100 Temperature (C) ISOLATED SUPPLY VOLTAGE AND VOS vs SYNC FREQUENCY 250 5 VCC2 125 2.5 VOS 0 0 V CC2 (mA) 9 V OS (mA) V CC2 (V) 16 -125 -2.5 -250 -5 1 1.5 2 2.5 Sync Frequency (MHz) (R) 5 ISO113 Isolation Barrier V IN - LO* + LO* CO 24 23 NC Gnd 1 22 21 Com 1 V IN 16 CO 15 -V C Supply Outputs 14 13 -V CC2 +V CC2 +V C ISO 113 (1) 10F Tantalum (2) Enable +V CC1 Sync -V CC1 1 2 (3) LI 3 Gnd 2 4 9 C2 1F V OUT 10 Sense 11 Ps Gnd 12 RL * Optional Filtering For LO 0 LO < 10H CO < 1F For LO LO 10H, <10 CO 10F +VCC1 C1 1F -VCC1 NOTES: (1) Enable = pin open or TTL high. (2) Ground sync if not used. (3) filter reduces ripple current; LI = 10H, <10. FIGURE 1. Signal and Power Connections. The ISO113 isolation amplifier contains a transformercoupled DC/DC converter that is powered from the input side of the isolation amplifier. All power supply pins (2, 4, 13, 14, 15, and 16) of the ISO113 have an internal 0.1F capacitor to ground. L1 is used to slow down fast changes in the input current to the DC/DC converter. C1 is used to help regulate the voltage ripple caused by the current demands of the converter. L1, C1, and C2 are optional, however, recommended for low noise applications. THEORY OF OPERATION The block diagram on the front page shows the isolation amplifier's synchronized signal and power configuration, which eliminate beat frequency interference. A proprietary 800kHz oscillator chip, power MOSFET transformer drivers, patented square core wirebonded transformer, and single chip diode bridge provide power to the output side of the isolation amplifier as well as external loads. The signal channel capacitively couples a duty-cycle encoded signal across the ceramic high-voltage barrier built into the package. A proprietary transmitter-receiver pair of integrated circuits, laser trimmed at wafer level, and coupled through a pair of matched "fringe" capacitors, results in a simple, reliable design. The DC/DC converter creates an unregulated 15V output to VCC2. If the ISO113 is the only device using the DC/DC converter for power, pins 13 and 14 and pins 15 and 16 can be connected directly without CO or LO in the circuit. If an external capacitor is used in this configuration, it should not exceed 1F. This configuration is possible because the isolation amplifier and the DC/DC converter are synchronized internally. SIGNAL AND POWER CONNECTIONS Figure 1 shows the proper power supply and signal connections. All power supply pins should be bypassed as shown with the filter for +VCC1, an option recommended if more than 15mA are drawn from the isolated supply. Separate rectifier output pins (VCC2) and amplifier supply input pins (VC) allow additional ripple filtering and/or regulation. The separate input common pin and output sense are low current inputs tied to the signal source ground, and output load, respectively, to minimize errors due to IR drop in long conductors. Otherwise, connect Com 1 to Gnd 1, and Sense to VOUT at the ISO113 socket. The enable pin may be left open if the ISO113 is continuously operated. If not, a TTL low level will disable the internal DC/ DC converter. The Sync input must be grounded for unsynchronized operation while a 1.2MHz to 2MHz TTL clock signal provides synchronization of multiple units. If additional devices are powered by the DC/DC converter of the ISO113, the application may require that the ripple voltage of the ISO113 converter be attenuated, in which case, LO and CO should be added to the circuit. The inductor is used to attenuate the ripple current and a higher value capacitor can be used to reduce the ripple voltage even further. OPTIONAL GAIN AND OFFSET ADJUSTMENTS Rated gain accuracy and offset performance can be achieved with no external adjustments, but the circuit of Figure 2a may be used to provide a gain trim of 0.5% for the values shown. Greater range may be provided by increasing the size of R1 and R2. Every 2k increase in R1 will give an additional 1% (R) ISO113 6 R1 R2 22 11 1k VIN 11 VOUT 2k 10 VIN FIGURE 2a. Gain Adjust. 11 VIN MULTICHANNEL SYNCHRONIZATION Synchronization of multiple ISO113s can be accomplished by connecting pin 3 of each device to an external TTL level oscillator, as shown in Figure 7. The PWS750-1 oscillator is convenient because its nominal synchronizing output frequency is 1.6MHz, resulting in a 800kHz carrier in the ISO113 (its nominal unsynchronized value). The open collector output typically switches 7.5mA to a 0.2V low level so that the external pull up resistor can be chosen for different pull-up voltages as shown in Figure 7. The number of channels synchronized by one PWS750-1 is determined by the total capacitance of the sync voltage conductors. They must be less than 1000pF to ensure TTL level switching at 800kHz. At higher frequencies the capacitance must be proportionally lower. VOUT 10 9 21 4.7nF FIGURE 4. Ripple Reduction. Sense 22 VOUT 400 10 9 21 9 21 Sense 22 R1 R2 Gain = 1 + (R1 /R 2 + R1 /200k) FIGURE 2b. Gain Setting. adjustment range, with R2 2R1. If safety or convenience dictate location of the adjustment potentiometer on the other side of the barrier from the position shown in Figure 2a, the position of R1 and R2 may be reversed. Customers can supply their own TTL level synchronization logic, provided the frequency is between 1.2MHz and 2MHz, and the duty cycle is greater than 25%. Gains greater than 1 may be obtained by using the circuit of Figure 2b. Note that the effect of input referred errors will be multiplied at the output in proportion to the increase in gain. Also, the small-signal bandwidth will be decreased in inverse proportion to the increase in gain. In most instances, a precision gain block at the input of the isolation amplifier will provide better overall performance. Single or multichannel synchronization with reduced power dissipation for applications requiring less than 15mA from VCC1 is accomplished by driving both the Sync input pin (3) and Enable pin (1) with the TTL oscillator as shown in Figure 5. Figure 3 shows a method for trimming VOS of the ISO113. This circuit may be applied to Signal Com1. With the values shown, 15V supplies and unity gain, the circuit will provide 150mV adjustment range and 0.25mV resolution with a typical trim potentiometer. The output will have some sensitivity to power supply variations. For a 100mV trim, power supply sensitivity is 8mV/V at the output. External Load <15mA 16 15 14 13 23 ISO 113 +V CC1 or +V CC2 1M 1 2 3 12 Signal Com 1 100k 10k IQ (Reduced) -V CC1 or -V CC2 TTL Oscillation +VCC1 FIGURE 3. VOS Adjust. FIGURE 5. Reduced Power Dissipation. OPTIONAL OUTPUT FILTER Figure 4 shows an optional output ripple filter that reduces the 800kHz ripple voltage to <5mVp-p without compromising DC performance. The small signal bandwidth is extended above 30kHz as a result of this compensation. ISOLATION BARRIER VOLTAGE The typical performance of the ISO113 under conditions of barrier voltage stress is indicated in the first two performance curves--Recommended Range of Isolation Voltage and IMR/ Leakage vs Frequency. At low barrier modulation (R) 7 ISO113 HIGH VOLTAGE TESTING The ISO113 was designed to reliably operate with 1500Vrms continuous isolation barrier voltage. To confirm barrier integrity, a two-step breakdown test is performed on 100% of the units. First, an 5657V peak, 60Hz barrier potential is applied for 10s to verify that the dielectric strength of the insulation is above this level. Following this exposure, a 1500Vrms, 60Hz potential is applied for one minute to conform to UL1244. Life-test results show reliable operation under continuous rated voltage and maximum operating temperature conditions. levels, errors can be determined by the IMRR characteristic. At higher barrier voltages, typical performance is obtained as long as the dv/dt across the barrier is below the shaded area in the first curve. Otherwise, the signal channel will be interrupted, causing the output to distort, and/or shift DC level. This condition is temporary, with normal operation resuming as soon as the transient subsides. Permanent damage to the integrated circuits occurs only if transients exceed 20kV/s. Even in this extreme case, the barrier integrity is assured. APPLICATIONS 0 VIN 5V 6.2V 20k IL = 0 1F 23 22 21 20mA RL 600 16 15 14 13 1F 113 ISO 1 2 3 9 4 10 11 12 +15V VN2222 10F 1F 250 0.1% -15V FIGURE 6. Isolated Current Loop Driver. VIN1 Sync 1.6MHz 23 12 14 22 11 21 ISO 16 15 14 13 113 PWS750-1 R 3 7 2 3 4 9 10 11 12 VOUT1 R= +VCC1 7.5 VIN2 k 23 22 21 16 15 14 13 +VCC1 -VCC1 ISO 2 3 4 113 9 10 11 12 VOUT2 Additional Channels NOTES: (1) PWS750-1 can sync > 20 ISO113s. (2) Bypass supplies as shown in Figure 1. FIGURE 7. Synchronized-Multichannel Isolation. (R) ISO113 8 PACKAGE OPTION ADDENDUM www.ti.com 12-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) ISO113 NRND CDIP SB JVB 16 TBD Call TI Call TI ISO113B NRND CDIP SB JVB 16 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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