Multilayer Ceramic Capacitors High Q / Low ESR Series Description: MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC HH series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance, typical within the 30ppm/C required for NP0 (C0G) classification and have excellent conductivity internal electrode. Thus, WTC HH series MLCC will be with the feature of low ESR and high Q characteristics. Features: Applications: * * * * * High Q and low ESR performance at high frequency Quality improvement of telephone calls for low power loss and better performance External Dimensions: Size Inch (mm) L (mm) W (mm) 0402 (1005) 10.05 0.50.05 0.50.05 N 1.60.1 0.80.1 0.80.07 S 1.6 +0.15/-0.1 0.8 +0.15/-0.1 0.8 +0.15/-0.1 X 0603 (1608) The outline of MLCC Mobile telecommunication: Mobile phone, WLAN RF module: Power amplifier, VCO Tuners T (mm)/Symbol Remark MB (mm) # 0.25 +0.05/-0.1 0.40.15 # Reflow soldering only is recommended. General Electrical Data: Dielectric NP0 Size 0402, 0603 Capacitance* 0402: 0.5pF to 470pF** & 0603: 0.5pF to 3300pF Capacitance tolerance Cap5pF: B (0.1pF), C (0.25pF) 5pF<Cap<10pF: C (0.25pF), D (0.5pF) Cap10pF: F (1%), G (2%), J (5%) Rated voltage (WVDC) 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V Q* Cap<30pF: Q400+20C; Cap30pF: Q1,000 Insulation resistance at Ur 10G or RxC100-F whichever is smaller Operating temperature -55C to +125C Capacitance change 30ppm/C Termination Ni/Sn (lead-free termination) * Measured at the conditions of 25C ambient temper ature and 30~70% related humidity. Apply 10.2Vrms, 1MHz10% for Cap1000pF and 10.2Vrms, 1kHz10% for Cap>1,000pF. ** 0402, Capacitance <0.5pF: On request. www.element14.com www.farnell.com www.newark.com Page <1> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Capacitance Range DIELECTRIC NP0 SIZE 0402 NP0 SIZE 0402 0603 16 25 50 16 25 50 100 Rated Voltage 16 25 50 16 25 50 100 0.5pF (0R5) N^ N^ N^ S^ S^ S^ S^ 39pF (390) N N N S S S S 0.6pF (0R6) N^ N^ N^ S^ S^ S^ S^ 47pF (470) N N N S S S S 0.7pF (0R7) N^ N^ N^ S^ S^ S^ S^ 56pF (560) N N N S S S S 0.8pF (0R8) N^ N^ N^ S^ S^ S^ S^ 68pF (680) N N N S S S S 0.9pF (0R9) N^ N^ N^ S^ S^ S^ S^ 82pF (820) N N N S S S S 1.0pF (1R0) N^ N^ N^ S^ S^ S^ S^ 100pF (101) N N N S S S S 1.2pF (1R2) N^ N^ N^ S^ S^ S^ S^ 120pF (121) N N N S S S S 1.5pF (1R5) N^ N^ N^ S^ S^ S^ S^ 150pF (151) N N N S S S S 1.8pF (1R8) N^ N^ N^ S^ S^ S^ S^ 180pF (181) N N N S S S S 2.2pF (2R2) N^ N^ N^ S^ S^ S^ S^ 220pF (221) N N N S S S S 2.7pF (2R7) N^ N^ N^ S^ S^ S^ S^ 3.3pF (3R3) N^ N^ N^ S^ S^ S^ S^ 3.9pF (3R9) N^ N^ N^ S^ S^ S^ S^ 4.7pF (4R7) N^ N^ N^ S^ S^ S^ S^ 5.6pF (5R6) N^ N^ N^ S^ S^ S^ S^ 560pF (561) 6.8pF (6R8) N^ N^ N^ S^ S^ S^ S^ 8.2pF (8R2) N^ N^ N^ S^ S^ S^ 10pF (100) N N N S S S 12pF (120) N N N S S 15pF (150) N N N S 18pF (180) N N N S 22pF (220) N N N 27pF (270) N N N 33pF (330) N N N 270pF (271) N N N S S S S 330pF (331) N N N S S S S 390pF (391) N N N S S S S 470pF (471) N N N S S S S S S S S 680pF (681) S S S S S^ 820pF (821) S S S S S 1,000pF (102) S S S S S S 1,200pF (122) X X X S S S 1,500pF (152) X X X S S S 1,800pF (182) X X X S S S S 2,200pF (222) X X X S S S S 2,700pF (272) X X X S S S S 3,300pF (332) X X X Capacitance Capacitance Rated Voltage DIELECTRIC 0603 1. The letter in cell is expressed the symbol of product thickness. 2. The letter in cell with "^" mark is expressed product with Ag/Ni/Sn terminations. 3. 0402, Capacitance <0.5pF: On request. 4. For more information about products with special capacitance or other data, please contact WTC local representative Packaging Dimension And Quantity: Size 0402 0603 Paper Tape Thickness (mm)/Symbol 0.50.05 N 0.80.07 S 0.8+0.15/-0.1 X 7" reel 13" reel 10,000 20,000 4,000 15,000 Unit : pieces www.element14.com www.farnell.com www.newark.com Page <2> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Reliability Test Conditions and Requirements: No Item Test Condition 1 Visual and Mechanical - 2 Capacitance 3 Q/ D.F. (Dissipation Factor) Requirements No remarkable defect Dimensions to conform to individual specification sheet Cap1,000pF, 10.2Vrms, 1MHz10% Cap>1,000pF, 10.2Vrms, 1kHz10% At 25C ambient temperature Shall not exceed the limits given in the detailed spec NP0: Cap30pF, Q1,000; Cap<30pF, Q400+20C To apply voltage: ( 100V ) 250% of rated voltage Duration: 1 to 5 sec Charge and discharge current less than 50mA 4 5 Dielectric Strength Insulation Resistance To apply voltage: 200V~300V 2 times V DC 500V~999V 1.5 times V DC Cut-off, set at 10mA TEST= 15 sec. RAMP=0 No evidence of damage or flash over during test Rated voltage:<200V To apply rated voltage for max. 120 sec. 10G Rated voltage:200~630V To apply rated voltage (500V max.) for 60 sec. 10G or RxC100-F whichever is smaller With no electrical load. Operating temperature: -55C to +125C at 25C Capacitance change: within 30ppm/C Pressurizing force: 5N (0603) and 10N (>0603) Test time: 101 sec. No remarkable damage or removal of the terminations 6 Temperature Coefficient 7 Adhesive Strength of Termination 8 Vibration Resistance Vibration frequency: 10~55 Hz/min. Total amplitude: 1.5mm Test time: 6hrs. (Two hrs each in three mutually perpendicular directions.) No remarkable damage Cap change and Q/D.F.: To meet initial spec. 9 Solderability Solder temperature: 2355C Dipping time: 20.5 sec. 95% min. coverage of all metalized area Bending Test The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure shall be maintained for 51 sec. Measurement to be made after keeping at room temp. for 242 hrs. No remarkable damage Cap change: within 5.0% or 0.5pF whichever is larger (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 10 www.element14.com www.farnell.com www.newark.com Page <3> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Reliability Test Conditions and Requirements: No 11 Item Resistance to Soldering Heat Test Condition Requirements Solder temperature: 2605C Dipping time: 101 sec Preheating: 120 to 150C for 1 minute before immerse the capacitor in a eutectic solder Measurement to be made after keeping at room temp. for 242 hrs. (Class I) or 484 hrs. (Class II) No remarkable damage Cap change: within 2.5% or 0.25pF whichever is larger Q/D.F., I.R. and dielectric strength: To meet initial requirements 25% max. leaching on each edge Conduct the five cycles according to the temperatures and time 12 Temperature Cycle Step Temp. (C) Time (Min.) 1 Min. operating temp. +0/-3 30 3 2 Room temp. 2~3 3 Max. operating temp. +3/-0 30 3 4 Room temp. 2~3 No remarkable damage Cap change: within 2.5% or 0.25pF whichever is larger Q/D.F., I.R. and dielectric strength: To meet initial requirements Measurement to be made after keeping at room temp. for 242 hrs. 13 14 15 Humidity (Damp Heat) Steady State Test temp.: 402C Humidity: 90~95% RH Test time: 500+24/-0hrs. Measurement to be made after keeping at room temp. for 242 hrs. No remarkable damage Cap change: within 5.0% or 0.5pF whichever is larger Q/D.F. value: NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C Cap<10pF; Q200+10C I.R.: 1Gor RxC50-F whichever is smaller Humidity (Damp Heat) Load Test temp.: 402C Humidity: 90~95%RH Test time: 500+24/-0 hrs. To apply voltage: rated voltage (Max. 500V) Measurement to be made after keeping at room temp. for 242 hrs. No remarkable damage. Cap change: within 7.5% or 0.75pF whichever is larger. Q/D.F. value: NP0: Cap30pF, Q200; Cap<30pF, Q100+10/3C I.R.: 500M or RxC25-F whichever is smaller. High Temperature Load (Endurance) Test temp.: NP0: 1253C To apply voltage: (1) <500V: 200% of rated voltage. (2) 500V: 150% of rated voltage. (3) 630V: 120% of rated voltage. Test time: 1000+24/-0 hrs. Measurement to be made after keeping at room temp. for 242 hrs. No remarkable damage. Cap change: within 3.0% or 0.3pF whichever is larger. Q/D.F. value: NP0: Cap30pF, Q350 10pFCap<30pF, Q275+2.5C Cap<10pF, Q200+10C I.R.: 1G or RxC50-F whichever is smaller. www.element14.com www.farnell.com www.newark.com Page <4> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Electrical Characteristics Q value criteria vs. Specific frequency HH series, 0402 Capacitance (pF) Q factor specification vs. Specific frequency for 0402 Q value criteria vs. Specific frequency HH series, 0603 Capacitance (pF) Q factor specification vs. Specific frequency for 0603 www.element14.com www.farnell.com www.newark.com Page <5> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Electrical Characteristics 0402 "HH" Series 0603 "HH" Series ESR vs. Frequency 0402 ESR vs. Frequency 0603 0402 "HH" Series 0603 "HH" Series Impedance vs. Frequency 0603 Impedance vs. Frequency 0402 SRF vs. Capacitance www.element14.com www.farnell.com www.newark.com Page <6> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Appendixes Tape & Reel Dimensions The dimension of paper tape Size 0402 The dimension of plastic tape 0603 Thickness N S, X A0 0.62 0.05 1.02 0.05 B0 1.12 0.05 1.8 0.05 T 0.6 0.05 0.95 0.05 K0 - - W 8 0.1 8 0.1 P0 4 0.1 4 0.1 10xP0 40 0.1 40 0.1 P1 2 0.05 4 0.1 P2 2 0.05 2 0.05 D0 1.55 0.05 1.55 0.05 D1 - - E 1.75 0.05 1.75 0.05 F 3.5 0.05 3.5 0.05 Size 0402 & 0603 Reel size 7" 13" C 13 +0.5/-0.2 13 +0.5/-0.2 W1 8.4 +1.5/-0 8.4 +1.5/-0 A 178 0.1 250 1 N 60 +1/-0 100 1 The dimension of reel www.element14.com www.farnell.com www.newark.com Page <7> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Constructions: No. Name 1 Ceramic material 2 Inner electrode 3 4 Inner layer Termination 5 The construction of MLCC NP0* NP0 CaZrO3 / BaTiO3 based AgPd alloy Ni Ag Cu Middle layer Ni Outer layer Sn * Partial NP0 items are with Ag/Ni/Sn(NME) terminations, please ref to product range for detail. Storage and handling conditions (1) To store products at 5 to 40C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. Recommended soldering conditions: The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Recommended wave soldering profile for SMT process with SnAgCu series solder. www.element14.com www.farnell.com www.newark.com Page <8> 12/04/13 V1.0 Multilayer Ceramic Capacitors High Q / Low ESR Series Part Number Table Description Part Number Capacitor, RF, 0.5PF, 50V, NP0, 0402 MC000269 Capacitor, RF, 0.5PF, 50V, NP0, 0402 MC000270 Capacitor, RF, 0.6PF, 50V, NP0, 0402 MC000271 Capacitor, RF, 0.8PF, 50V, NP0, 0402 MC000272 Capacitor, RF, 10PF, 50V, NP0, 0402 MC000273 Capacitor, RF, 100PF, 50V, NP0, 0402 MC000274 Capacitor, RF, 1PF, 50V, NP0, 0402 MC000275 Capacitor, RF, 1PF, 50V, NP0, 0402 MC000276 Capacitor, RF, 1.2PF, 50V, NP0, 0402 MC000277 Capacitor, RF, 1.5PF, 50V, NP0, 0402 MC000278 Capacitor, RF, 1.5PF, 50V, NP0, 0402 MC000279 Capacitor, RF, 1.8PF, 50V, NP0, 0402 MC000280 Capacitor, RF, 1.8PF, 50V, NP0, 0402 MC000281 Capacitor, RF, 2.2PF, 50V, NP0, 0402 MC000282 Capacitor, RF, 2.2PF, 50V, NP0, 0402 MC000283 Capacitor, RF, 2.7PF, 50V, NP0, 0402 MC000284 Capacitor, RF, 3PF, 50V, NP0, 0402 MC000285 Capacitor, RF, 3.9PF, 50V, NP0, 0402 MC000286 Capacitor, RF, 3.9PF, 50V, NP0, 0402 MC000287 Capacitor, RF, 4.7PF, 50V, NP0, 0402 MC000288 Capacitor, RF, 4.7PF, 50V, NP0, 0402 MC000289 Capacitor, RF, 5.1PF, 50V, NP0, 0402 MC000290 Capacitor, RF, 5.6PF, 50V, NP0, 0402 MC000291 Capacitor, RF, 6.8PF, 50V, NP0, 0402 MC000292 Capacitor, RF, 6.8PF, 50V, NP0, 0402 MC000293 Capacitor, RF, 6.8PF, 50V, NP0, 0402 MC000294 Capacitor, RF, 8.2PF, 50V, NP0, 0402 MC000295 Capacitor, RF, 0.75PF, 50V, NP0, 0402 MC000296 Capacitor, RF, 100PF, 50V, NP0, 0603 MC000297 Capacitor, RF, 1PF, 50V, NP0, 0603 MC000298 Capacitor, RF, 2.2PF, 50V, NP0, 0603 MC000299 Capacitor, RF, 2.7PF, 50V, NP0, 0603 MC000300 Capacitor, RF, 3.3PF, 50V, NP0, 0603 MC000301 www.element14.com www.farnell.com www.newark.com Page <9> 12/04/13 V1.0