INSULATED GATE BIPOLAR TRANSISTOR
10/14/10
www.irf.com 1
AUIRGS30B60K
AUIRGSL30B60K
VCES = 600V
IC = 50A, TC=100°C
at TJ=175°C
tsc > 10µs, TJ=150°C
VCE(on) typ. = 1.95V
Features
• Low VCE(on) Non Punch Through IGBT Technology
• 10µs Short Circuit Capability
• Square RBSOA
• Positive VCE(on) Temperature Coefficient
• Maximum Junction Temperature rated at 175°C
• Lead-Free, RoHS Compliant
• Automotive Qualified *
Benefits
• Benchmark Efficiency for Motor Control
• Rugged Transient Performance
• Low EMI
• Excellent Current Sharing in Parallel Operation
E
C
G
n-channel
* RθJC (end of life) = 0.65°C/W. This is the maximum measured value after 1000 temperature cycles from -55 to 150°C
and is accounted for by the physical wearout of the die attach medium.
AUTOMOTIVE GRADE
D2Pak
AUIRGS30B60K
TO-262
AUIRGSL30B60K
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only; and functional operation of the device at these or any other condition
beyond those indicated in the specifications is not implied.Exposure to absolute-maximum-rated conditions
for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are
measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise
specified
GC E
Gate Collector Emitter
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 78
I
C
@ T
C
= 100°C Continuous Collector Current 50 A
I
CM
Pulse Collector Current (Ref.Fig.C.T.5) 120
I
LM
Clamped Inductive Load current
c
120
V
ISO
L
RMS Isolation Voltage, Terminal to Case, t=1 min. 2500 V
V
GE
Gate-to-Emitter Voltage ±20
P
D
@ T
C
= 25°C Maximum Power Dissipation 370 W
P
D
@ T
C
= 100°C Maximum Power Dissipation 180
T
J
Operating Junction and -55 to +175
T
STG
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Thermal / Mechanical Characteristics
Parameter Min. Typ. Max. Units
R
θJC
Junction-to-Case- IGBT ––– ––– 0.41*
R
θCS
Case-to-Sink, flat, greased surface ––– 0.50 –––
R
θJA
Junction-to-Ambient (PCB Mount, Steady State)
d
––– ––– 40
Wt Weight ––– 1.44 ––– g
°C/W
PD - 96334
AUIRGS/SL30B60K
2 www.irf.com
Notes:
VCC = 80% (VCES), VGE = 20V, L = 28µH, RG = 22Ω.
This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
Energy losses include "tail" and diode reverse recovery.
Dynamic Electrical
C
haracteristics
@
TJ = 25°
C
(
unless otherwise specified
)
Parameter Min. T
y
p. Max. Unit
s
Conditions
Ref.Fig.
V
(BR)CES
Collector-to-Emitter Breakdown Voltage 600——V
V
GE
= 0V, I
C
= 500µA
∆V(BR)CES/∆TJTemperature Coeff. of Breakdown Voltage —0.40—V/°C
V
GE
= 0V, I
C
= 1mA (25°C-150°C)
V
CE(on)
Collector-to-Emitter Voltage — 1.95 2.35 I
C
= 30A, V
GE
= 15V, T
J
= 25°C 5,6,7
—2.402.75V
I
C
= 30A, V
GE
= 15V, T
J
= 150°C 8,9,10
— 2.6 2.95 I
C
= 30A, V
GE
= 15V, T
J
= 175°C
V
GE(th)
Gate Threshold Voltage 3.5 4.5 5.5 V V
CE
= V
GE
, I
C
= 250µA 8,9,10
∆V
GE(th)
/
∆T
J
Threshold Voltage temp. coefficient — -10 — mV/°
C
V
CE
= V
GE
, I
C
= 1.0mA (25°C-150°C) 11
gfe Forward Transconductance — 18 — S V
CE
= 50V, I
C
= 50A, PW = 80µs
I
CES
Zero Gate Voltage Collector Current — 5.0 250 V
GE
= 0V, V
CE
= 600V
— 1000 2000 V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
— 1830 3000 V
GE
= 0V, V
CE
= 600V, T
J
= 175°C
I
GES
Gate-to-Emitter Leakage Current — — ±100 nA V
GE
= ±20V, V
CE
= 0V
S
tatic or
S
witchin
g
C
haracteristics
@
TJ = 25°
C
(
unless otherwise specified
)
Parameter Min. Typ. Max. Unit
s
Conditions
Ref.Fig.
Q
g
Total Gate Charge (turn-on) — 102 153 I
C
= 30A 17
Q
ge
Gate-to-Emitter Charge (turn-on) — 14 21 nC V
CC
= 400V CT1
Q
gc
Gate-to-Collector Charge (turn-on) — 44 66 V
GE
= 15V
E
on
Turn-On Switching Loss — 350 620 I
C
= 30A, V
CC
= 400V CT4
E
off
Turn-Off Switching Loss — 825 955 µJ V
GE
= 15V, R
G
= 10Ω, L = 200µH
E
tot
Total Switching Loss — 1175 1575 T
J
= 25°C
e
t
d(on)
Turn-On delay time — 46 60 I
C
= 30A, V
CC
= 400V
t
r
Rise time — 28 39 ns V
GE
= 15V, R
G
= 10Ω, L = 200µH CT4
t
d(off)
Turn-Off delay time — 185 200 T
J
= 25°C
t
f
Fall time — 31 40
E
on
Turn-On Switching Loss — 635 1085 I
C
= 30A, V
CC
= 400V CT4
E
off
Turn-Off Switching Loss — 1150 1350 µJ V
GE
= 15V, R
G
= 10Ω, L = 200µH 12,14
E
tot
Total Switching Loss — 1785 2435 T
J
= 150°C
e
F1,WF2
t
d(on)
Turn-On delay time — 46 60 I
C
= 30A, V
CC
= 400V 13,15
t
r
Rise time — 28 39 ns V
GE
= 15V, R
G
= 10Ω, L = 200µH CT4
t
d(off)
Turn-Off delay time — 205 235 T
J
= 150°C WF1
t
f
Fall time — 32 42 WF2
L
E
Internal Emitter Inductance — 7.5 — nH Measured 5mm from package
C
ies
Input Capacitance — 1750 — V
GE
= 0V
C
oes
Output Capacitance — 160 — pF V
CC
= 30V 16
C
res
Reverse Transfer Capacitance — 60 — f = 1.0MHz
RBSOA Reverse Bias Safe Operating Area FULL SQUARE T
J
= 150°C, I
C
= 120A, Vp = 600V 4
VCC=500V,VGE = +15V to 0V,RG =10Ω CT2
SCSOA Short Circuit Safe Operating Area 10 — — µs T
J
= 150°C, Vp = 600V, R
G
= 10Ω CT3
V
CC
=360V,V
GE
= +15V to 0V WF3
I
SC
(Peak) Peak Short Circuit Collector Current — 200 — A WF3
µA
AUIRGS/SL30B60K
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† Qualification standards can be found at International Rectifier’s web site: http://www.irf.com
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.
††† Higher MSL ratings may be available for the specific package types listed here. Please
contact your International Rectifier sales representative for further information.
Qualification Information
†
D
2
PAK MSL1
†††
(per IPC/JEDEC J-STD-020)
TO-262 N/A
RoHS Compliant Yes
ESD
Machine Model Class M4 (400V)
AEC-Q101-002
Human Body Model Class H2 (4000V)
AEC-Q101-001
Charged Device Model Class C4 (1000V)
AEC-Q101-005
Qualification Level
Automotive
(per AEC-Q101)
††
Comments: This part number(s) passed Automotive
qualification. IR’s Industrial and Consumer qualification
level is granted by extension of the higher Automotive
level.
Moisture Sensitivity Level
AUIRGS/SL30B60K
4 www.irf.com
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
Fig. 2 - Power Dissipation vs. Case
Temperature
Fig. 3 - Forward SOA
TC = 25°C; TJ ≤ 150°C
Fig. 4 - Reverse Bias SOA
TJ = 150°C; VGE =15V
1 10 100 1000 10000
VCE (V)
0.1
1
10
100
1000
IC (A)
10 µs
100 µs
1ms
DC
10 100 1000
VCE (V)
1
10
100
1000
IC A)
0 20 40 60 80 100 120 140 160 180
TC (°C)
0
50
100
150
200
250
300
350
400
Ptot (W)
0 20406080100120140160180
TC (°C)
0
10
20
30
40
50
60
70
80
IC (A)
AUIRGS/SL30B60K
www.irf.com 5
Fig. 6 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 80µs
Fig. 5 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 80µs
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 150°C; tp = 80µs
012345
VCE (V)
0
10
20
30
40
50
60
ICE (A)
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
012345
VCE (V)
0
10
20
30
40
50
60
ICE (A)
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
012345
VCE (V)
0
10
20
30
40
50
60
ICE (A)
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
AUIRGS/SL30B60K
6 www.irf.com
Fig. 11 - Typ. Transfer Characteristics
VCE = 50V; tp = 10µs
Fig. 10 - Typical VCE vs. VGE
TJ = 150°C
Fig. 9 - Typical VCE vs. VGE
TJ = 25°C
Fig. 8 - Typical VCE vs. VGE
TJ = -40°C
5 101520
VGE (V)
0
2
4
6
8
10
12
14
16
18
20
VCE (V)
ICE = 15A
ICE = 30A
ICE = 60A
5 101520
VGE (V)
0
2
4
6
8
10
12
14
16
18
20
VCE (V)
ICE = 15A
ICE = 30A
ICE = 60A
5101520
VGE (V)
0
2
4
6
8
10
12
14
16
18
20
VCE (V)
ICE = 15A
ICE = 30A
ICE = 60A
0 5 10 15 20
VGE (V)
0
50
100
150
200
250
ICE (A)
TJ = 25°C
TJ = 150°C
TJ = 150°C
TJ = 25°C
AUIRGS/SL30B60K
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Fig. 15 - Typ. Switching Time vs. RG
TJ = 150°C; L=200µH; VCE= 400V
ICE= 30A; VGE= 15V
Fig. 14 - Typ. Energy Loss vs. RG
TJ = 150°C; L=200µH; VCE= 400V
ICE= 30A; VGE= 15V
Fig. 13 - Typ. Switching Time vs. IC
TJ = 150°C; L=200µH; VCE= 400V
RG= 10Ω; VGE= 15V
Fig. 12 - Typ. Energy Loss vs. IC
TJ = 150°C; L=200µH; VCE= 400V,
RG= 10Ω; VGE= 15V
0 20406080
IC (A)
0
500
1000
1500
2000
2500
3000
Energy (µJ)
EOFF
EON
020 40 60 80
IC (A)
10
100
1000
Swiching Time (ns)
tR
tdOFF
tF
tdON
025 50 75 100 125
RG (Ω)
0
500
1000
1500
2000
2500
3000
Energy (µJ)
EON
EOFF
025 50 75 100 125
RG (Ω)
10
100
1000
10000
Swiching Time (ns)
tR
tdOFF
tF
tdON
AUIRGS/SL30B60K
8 www.irf.com
Fig 18. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
Fig. 16- Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
Fig. 17 - Typical Gate Charge vs. VGE
ICE = 30A; L = 600µH
020 40 60 80 100
VCE (V)
10
100
1000
10000
Capacitance (pF)
Cies
Coes
Cres
0 25 50 75 100 125
Q G, Total Gate Charge (nC)
0
2
4
6
8
10
12
14
16
VGE (V)
200V
400V
1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t1 , Rectangular Pulse Duration (sec)
0.0001
0.001
0.01
0.1
1
10
Thermal Response ( Z thJC )
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
Ri (°C/W) τi (sec)
0.200 0.000428
0.209 0.013031
τJ
τJ
τ1
τ1
τ2
τ2
R1
R1R2
R2
τ
τC
Ci i/Ri
Ci= τi/Ri
AUIRGS/SL30B60K
www.irf.com 9
Fig.C.T.1 - Gate Charge Circuit (turn-off) Fig.C.T.2 - RBSOA Circuit
1K
VCC
DUT
0
L
Fig.C.T.3 - S.C.SOA Circuit Fig.C.T.4 - Switching Loss Circuit
Fig.C.T.5 - Resistive Load Circuit
L
Rg
VCC
diode clamp /
DUT
DUT /
DRIVER
- 5V
Rg
VCC
DUT
R =
V
CC
I
CM
L
Rg
80 V DUT
480V
+
-
DC
Driver
DUT
360V
AUIRGS/SL30B60K
10 www.irf.com
Fig. WF3- Typ. S.C Waveform
@ TC = 150°C using Fig. CT.3
Fig. WF1- Typ. Turn-off Loss Waveform
@ TJ = 150°C using Fig. CT.4
Fig. WF2- Typ. Turn-on Loss Waveform
@ TJ = 150°C using Fig. CT.4
-100
0
100
200
300
400
500
600
700
-0.20 0.00 0.20 0.40 0.60 0.80
Time(µs)
V
CE
(V)
-5
0
5
10
15
20
25
30
35
I
CE
(A)
90% ICE
5% VCE
5% ICE
Eoff Loss
tf
-100
0
100
200
300
400
500
600
700
15.90 16.00 16.10 16.20 16.30
Time (µs)
V
CE
(V)
-10
0
10
20
30
40
50
60
70
I
CE
(A)
TEST CURRENT
90% test current
5% VCE
10% test curren
t
tr
Eon Loss
0
100
200
300
400
500
600
-5.00 0.00 5.00 10.00 15.00
time (µS)
V
CE
(V)
0
50
100
150
200
250
300
I
CE
(A)
VCE
ICE
AUIRGS/SL30B60K
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TO-262 Part Marking Information
TO-262 Package Outline
Dimensions are shown in millimeters (inches)
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
YWWA
XX or XX
Part Number
IR Logo
Lot Code
AUGSL30B60K
Date Code
Y= Year
WW= Work Week
A= Automotive, Lead Free
AUIRGS/SL30B60K
12 www.irf.com
D2Pak (TO-263AB) Part Marking Information
D2Pak (TO-263AB) Package Outline
Dimensions are shown in millimeters (inches)
YWWA
XX or XX
Part Number
IR Logo
Lot Code
AUGS30B60K
Date Code
Y= Year
WW= Work Week
A= Automotive, Lead Free
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
AUIRGS/SL30B60K
www.irf.com 13
D2Pak (TO-263AB) Tape & Reel Information
Dimensions are shown in millimeters (inches)
3
4
4
TRR
FEED DIRECTION
1.85 (.073)
1.65 (.065)
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
TRL
FEED DIRECTION
10.90 (.429)
10.70 (.421)
16.10 (.634)
15.90 (.626)
1.75 (.069)
1.25 (.049)
11.60 (.457)
11.40 (.449) 15.42 (.609)
15.22 (.601)
4.72 (.136)
4.52 (.178)
24.30 (.957)
23.90 (.941)
0.368 (.0145)
0.342 (.0135)
1.60 (.063)
1.50 (.059)
13.50 (.532)
12.80 (.504)
330.00
(14.173)
MAX.
27.40 (1.079)
23.90 (.941)
60.00 (2.362)
MIN.
30.40 (1.197)
MAX.
26.40 (1.039)
24.40 (.961)
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
AUIRGS/SL30B60K
14 www.irf.com
Ordering Information
Base
p
art number Packa
g
e T
yp
e Standard Pack Com
p
lete Part Number
Form Quantit
y
AUIRGSL30B60K TO-262 Tube 50 AUIRGSL30B60K
AUIRGS30B60K D2Pak Tube 50 AUIRGS30B60K
Tape and Reel Left 800 AUIRGS30B60KTRL
Tape and Reel Right 800 AUIRGS30B60KTRR
AUIRGS/SL30B60K
www.irf.com 15
IMPORTANT NOTICE
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve
the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services
at any time and to discontinue any product or services without notice. Part numbers designated with the “AU” prefix follow
automotive industry and / or customer specific requirements with regards to product discontinuance and process change
notification. All products are sold subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.
IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with IR’s
standard warranty. Testing and other quality control techniques are used to the extent IR deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
IR assumes no liability for applications assistance or customer product design. Customers are responsible for their products
and applications using IR components. To minimize the risks with customer products and applications, customers should
provide adequate design and operating safeguards.
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could create a situation where personal injury or death may occur. Should Buyer purchase or use IR products for any such
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responsible for any failure to meet such requirements
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