4
Absolute Maximum Ratings
Storage Temperature, TS –55˚C to +150˚C
Operating Temperature, TA –55˚C to +100˚C
Lead Solder Temperature, max. 260˚C for 10 s
(1.6 mm below seating plane)
Average Forward Current, IF 60 mA
Reverse Input Voltage, VR 6 V
Input Power Dissipation, PI 100 mW
Collector Current, IC 100 mA
Collector-Emitter Voltage, VCEO 30 V
Emitter-Collector Voltage, VECO 7 V
Collector-Base Voltage, VCBO 70 V
Collector Power Dissipation 300 mW
Total Power Dissipation 350 mW
Isolation Voltage, Viso 3550 Vrms
(AC for 1 minute, R.H. = 40 ~ 60%)
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25°C
150°C
200°C
250°C260°C (Peak Temperature)
217°C
Time (sec)
Temperature (°C)
Solder Reow Temperature Prole
1) One-time soldering reow is recommended within
the condition of temperature and time prole shown
at right.
2) When using another soldering method such as in-
frared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Note: Non-halide ux should be used.