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FEATURES
SN54HC04...JORWPACKAGE
SN74HC04...D,DB,N,NS,ORPWPACKAGE
(TOP VIEW)
1A
VCC
114
1B 4B
213
1Y 4A
312
2A 4Y
411
2B 3B
510
2Y 3A
6 9
GND 3Y
78
SN54HC04...FKPACKAGE
(TOP VIEW)
NC Nointernalconnection–
4
5
6
7
18
17
16
15
4A
NC
4Y
NC
3B
14
1Y
NC
2A
NC
2B 8
120
219
NC
VCC
1A
4B
1B
3
13
912
3A
2Y
3Y
GND
NC
10 11
DESCRIPTION/ORDERING INFORMATION
Y = A • B or Y = A +B
in positive logic.
SN54HC08, SN74HC08QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007
•Wide Operating Voltage Range of 2 V to 6 V •Typical t
pd
= 8 ns•Outputs Can Drive Up To 10 LSTTL Loads • ± 4-mA Output Drive at 5 V•Low Power Consumption, 20- µA Max I
CC
•Low Input Current of 1 µA Max
The ’HC08 devices contain four independent 2-input AND gates. They perform the Boolean function
ORDERING INFORMATION
T
A
PACKAGE
(1)
ODERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Reel of 1000 SN74HC08N SN74HC08NReel of 1000 SN74HC08DE4SOIC – D Reel of 2500 SN74HC08DR HC08Tube of 250 SN74HC08DT
SN74HC08NSRSOP – NS Reel of 2000 HC08–40 °C to 85 °C SN74HC08NSRG4
SN74HC08DBRSSOP – DB Reel of 2000 HC08SN74HC08DBRE4Tube of 90 SN74HC08PWTSSOP – PW Reel of 2000 SN74HC08PWR HC08Tube of 250 SN74HC08PWTCDIP – J Reel of 1000 SNJ54HC08J SNJ54HC08J–55 °C to 125 °C CFP – W Reel of 900 SNJ54HC08W SNJ54HC08WLCCC –FK Reel of 2200 SNJ54HC08FK SNJ54HC08JFK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1982–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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A
B
Y
Absolute Maximum Ratings
(1)
SN54HC08, SN74HC08QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007
FUNCTION TABLE(EACH INVERTER)
INPUTS OUTPUT
YA B
H H HL X LX L L
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 7 VI
IK
Input clamp current
(2)
V
I
< 0 or V
I
> V
CC
±20 mAI
OK
Output clamp current
(2)
V
O
< 0 ±20 mAI
O
Continuous output current V
O
= 0 to V
CC
±25 mAContinuous current through V
CC
or GND ±50 mAD package 86DB package 96θ
JA
Package thermal impedance
(3)
N package 80 °C/WNS package 76PW package 113T
stg
Storage temperature range –60 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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Recommended Operating Conditions
(1)
SN54HC08, SN74HC08QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007
SN54HC08 SN74HC08
UNITMIN NOM MAX MIN NOM MAX
V
CC
Supply voltage 2 5 6 2 5 6 VV
CC
= 2 V 1.5 1.5V
IH
High-level input voltage V
CC
= 4.5 V 3.15 3.15 VV
CC
= 6 V 4.2 4.2V
CC
= 2 V 0.5 0.5V
IL
Low-level input voltage V
CC
= 4.5 V 1.35 1.35 VV
CC
= 6 V 1.8 1.8V
I
Input voltage 0 V
CC
0 V
CC
VV
O
Output voltage 0 V
CC
0 V
CC
VV
CC
= 2 V 1000 1000∆t/ ∆v Input transition rise or fall rate V
CC
= 4.5 V 500 500 nsV
CC
= 6 V 400 400T
A
Operating free-air temperature –55 125 –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Electrical Characteristics
Switching Characteristics
Operating Characteristics
SN54HC08, SN74HC08QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007
over operating free-air temperature range (unless otherwise noted)
T
A
= 25 °C SN54HC08 SN74HC08PARAMETER TEST CONDITIONS V
CC
UNITMIN TYP MAX MIN MAX MIN MAX
2 V 1.9 1.998 1.9 1.9I
OH
= –20 µA 4.5 V 4.4 4.499 4.4 4.4V
OH
V
I
= V
IH
or V
IL
6 V 5.9 5.999 5.9 5.9 VI
OH
= –4 mA 4.5 V 3.98 4.3 3.7 3.84I
OH
= –5.2 mA 6 V 5.48 5.8 5.2 5.342 V 0.002 0.1 0.1 0.1I
OL
= 20 µA 4.5 V 0.001 0.1 0.1 0.1V
OL
V
I
= V
IH
or V
IL
6 V 0.001 0.1 0.1 0.1 VI
OL
= 4 mA 4.5 V 0.17 0.26 0.4 0.33I
OL
= 5.2 mA 6 V 0.15 0.26 0.4 0.33I
I
V
I
= V
CC
or 0 6 V ±0.1 ±100 ±1000 ±1000 nAI
CC
V
I
= V
CC
or 0, I
O
= 0 6 V 2 40 20 µAC
i
2 V to 6 V 3 10 10 10 pF
over operating free-air temperature range, C
L
= 50 pF (unless otherwise noted) (see Figure 1 )
T
A
= 25 °C SN54HC08 SN74HC08FROM TOPARAMETER V
CC
UNIT(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
2 V 50 100 150 125t
pd
A Y 4.5 V 10 20 30 25 ns6 V 8 17 25 242 V 38 75 110 95t
t
Y 4.5 V 8 15 22 19 ns6 V 6 13 19 16
T
A
= 25 °C
PARAMETER TEST CONDITIONS TYP UNIT
C
pd
Power dissipation capacitance per inverter No load 20 pF
4
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PARAMETER MEASURMENT INFORMATION
NOTES: A. C includesprobeandtest-fixturecapacitance.
B. Phaserelationshipsbetweenwaveformswerechosenarbitrarily. Allinputpulsesaresuppliedbygeneratorshavingthefollowing
characteristics:PRR 1MHz,Z =50 ,t =6ns,t =6ns.
C. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement.
D.t andt arethesameast .
L
O r f
PLH PHL pd
≤Ω
FromOutput
UnderTest
C =50pF
(seeNote A)
L
LOADCIRCUIT
Test
Point
VOLTAGEWAVEFORMS
INPUTRISE ANDFALL TIMES
Input 90%
90%
50% 50%
10% 10%
tf
tr
0V
VCC
VOLTAGEWAVEFORMS
PROPAGATIONDELAY ANDOUTPUTTRANSITIONTIMES
tPLH
tPLH
tPHL
tPHL
Input
In-Phase
Output
Out-of-Phase
Output
90%
90%
90%
50%
10% 10%
10%
50%
50%
50%
50%
tf
tf
tr
90%
10%
50%
tr
VCC
VOL
VOH
VOH
0V
VOL
SN54HC08, SN74HC08QUADRUPLE 2-INPUT POSITIVE-AND GATES
SCLS081F – DECEMBER 1982 – REVISED JANUARY 2007
Figure 1. Load Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-8404701VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
5962-8404701VDA ACTIVE CFP W 14 25 TBD A42 N / A for Pkg Type
84047012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
8404701CA ACTIVE CDIP J 14 1 TBD Call TI Call TI
8404701DA ACTIVE CFP W 14 1 TBD Call TI Call TI
JM38510/65203B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/65203BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/65203BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
M38510/65203B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
M38510/65203BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
M38510/65203BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN54HC08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74HC08D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC08DTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08DTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74HC08NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC08NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74HC08PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWT ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC08PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC08J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54HC08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC08, SN54HC08-SP, SN74HC08 :
•Catalog: SN74HC08, SN54HC08
•Automotive: SN74HC08-Q1, SN74HC08-Q1
•Military: SN54HC08
•Space: SN54HC08-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 4
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC08DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC08DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC08DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC08NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC08PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC08PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC08DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74HC08DR SOIC D 14 2500 367.0 367.0 38.0
SN74HC08DR SOIC D 14 2500 333.2 345.9 28.6
SN74HC08DT SOIC D 14 250 367.0 367.0 38.0
SN74HC08NSR SO NS 14 2000 367.0 367.0 38.0
SN74HC08PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC08PWT TSSOP PW 14 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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