10 PAD LAYOUT
S1C33209/221/222 PRODUCT PART EPSON A-93
No. Pad name X Y No. Pad name X Y
101 #RESET 2,373 2,288 151 N.C. -1,890 2,288
102 N.C. 2,247 2,288 152 A18 -1,974 2,288
103 #NMI 2,142 2,288 153 N.C. -2,058 2,288
104 N.C. 2,058 2,288 154 A19 -2,142 2,288
105 A0/#BSL 1,974 2,288 155 N.C. -2,247 2,288
106 N.C. 1,890 2,288 156 P04/SIN1/#DMAACK2 -2,373 2,288
107 A1 1,806 2,288 157 P05/SOUT1/#DMAEND2 -2,855 1,806
108 P34/#BUSREQ/#CE6 1,722 2,288 158 N.C. -2,855 1,722
109 N.C. 1,638 2,288 159 P06/#SCLK1/DMAACK3 -2,855 1,638
110 VSS 1,554 2,288 160 N.C. -2,855 1,554
111 N.C. 1,470 2,288 161 VSS -2,855 1,470
112 A2 1,386 2,288 162 N.C. -2,855 1,386
113 N.C. 1,302 2,288 163 PLLC -2,855 1,302
114 A3 1,218 2,288 164 N.C. -2,855 1,218
115 N.C. 1,134 2,288 165 VSS -2,855 1,134
116 A4 1,050 2,288 166 N.C. -2,855 1,050
117 N.C. 966 2,288 167 PLLS1 -2,855 966
118 A5 882 2,288 168 N.C. -2,855 882
119 N.C. 798 2,288 169 PLLS0 -2,855 798
120 A6 714 2,288 170 VDD -2,855 714
121 #CE10IN 630 2,288 171 P07/#SRDY1/#DMAEND3 -2,855 630
122 VDD 546 2,288 172 N.C. -2,855 546
123 #EMEMRD 462 2,288 173 #X2SPD -2,855 462
124 A7 378 2,288 174 N.C. -2,855 378
125 #HCAS/#UWE 294 2,288 175 EA10MD0 -2,855 294
126 A8 210 2,288 176 EA10MD1 -2,855 210
127 #LCAS/#CAS 126 2,288 177 VDD -2,855 126
128 A9 42 2,288 178 N.C. -2,855 42
129 P16/EXCL5/#DMAEND1 -42 2,288 179 OSC4 -2,855 -42
130 A10 -126 2,288 180 P20/#DRD -2,855 -126
131 A20 -210 2,288 181 OSC3 -2,855 -210
132 A11 -294 2,288 182 P21/#DWE/#GAAS -2,855 -294
133 A21 -378 2,288 183 N.C. -2,855 -378
134 A12 -462 2,288 184 #CE3 -2,855 -462
135 A22 -546 2,288 185 N.C. (BSTB) -2,855 -546
136 A13 -630 2,288 186 P22/TM0 -2,855 -630
137 A23 -714 2,288 187 N.C. -2,855 -714
138 N.C. -798 2,288 188 P23/TM1 -2,855 -798
139 VSS -882 2,288 189 N.C. -2,855 -882
140 N.C. -966 2,288 190 DSIO -2,855 -966
141 A14 -1,050 2,288 191 N.C. -2,855 -1,050
142 N.C. -1,134 2,288 192 P10/EXCL0/T8UF0/DST0 -2,855 -1,134
143 A15 -1,218 2,288 193 N.C. -2,855 -1,218
144 N.C. -1,302 2,288 194 P11/EXCL1/T8UF1/DST1 -2,855 -1,302
145 VDDE -1,386 2,288 195 N.C. -2,855 -1,386
146 N.C. -1,470 2,288 196 P12/EXCL2/T8UF2/DST2 -2,855 -1,470
147 A16 -1,554 2,288 197 N.C. -2,855 -1,554
148 N.C. -1,638 2,288 198 P13/EXCL3/T8UF3/DST3 -2,855 -1,638
149 ICEMD -1,722 2,288 199 N.C. -2,855 -1,722
150 A17 -1,806 2,288 200 P14/FOSC1/DCLK -2,855 -1,806
Note: The S1C33209 is constructed with 0.35 µm process technology. Since the pad pitch is to small, it is
impossible to use all pads when mounting the chip (die form) on the board. When mounting the
chip use the pads other than "N.C." and "N.C. (xxxx)". The pads which is indicated with "N.C.
(xxxx)" in the table is available in the QFP5-128pin/QFP15-128pin package.