D−16
D−8 DBV−5
DRB−8 DGN−8
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
IN2
EN3†
NC
OC3
OUT3
NC
NC
1
2
3
4
8
7
6
5
GND
IN
IN
EN†
OUT
OUT
OUT
OC
TPS2041B/TPS2051B
D ANDDGNPACKAGES
(TOP VIEW)
1
2
3
4
8
7
6
5
GND
GND
IN
IN
EN1
EN1
†
†
EN2
EN2
†
†
OC1
OC1
OUT1
OUT1
OUT2
OUT2
OC2
OC2
TPS2042B/TPS2052B
DRBPACKAGES
(TOP VIEW) OC1
OUT1
OUT2
OC2
GND
IN1
EN1†
EN2†
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
IN2
EN3†
EN4†
OC3
OUT3
OUT4
OC4
OC1
OUT1
OUT2
OC2
GND
IN1
EN1†
EN2†
− NoconnectNC
†Allenableinputsareactivehighforthe TPS205xBseries.
TPS2044B/TPS2054B
D PACKAGE
(TOP VIEW)
TPS2043B/TPS2053B
DPACKAGE
(TOP VIEW)
GND
OUT
TPS2041B/TPS2051B
DBVPACKAGE
(TOP VIEW)
OC
IN
EN †
4
3
2
1
5
6
7
8
TPS2042B/TPS2052B
D ANDDGNPACKAGES
(TOP VIEW)
TPS2014600mA
TPS20151 A
TPS2041B500mA
TPS2051B500mA
TPS2045A 250mA
TPS2049100mA
TPS2055A 250mA
TPS20611 A
TPS20651 A
TPS20681.5 A
TPS20691.5 A
TPS2042B500mA
TPS2052B500mA
TPS2046B250mA
TPS2056250mA
TPS20621 A
TPS20661 A
TPS20601.5 A
TPS20641.5 A
TPS2080500mA
TPS2081500mA
TPS2082500mA
TPS2090250mA
TPS2091250mA
TPS2092250mA
TPS2043B500mA
TPS2053B500mA
TPS2047B250mA
TPS2057A 250mA
TPS20631 A
TPS20671 A
TPS2044B500mA
TPS2054B500mA
TPS2048A 250mA
TPS2058250mA
TPS2085500mA
TPS2086500mA
TPS2087500mA
TPS2095250mA
TPS2096250mA
TPS2097250mA
TPS201xA 0.2 A to2 A
TPS202x0.2 A to2 A
TPS203x0.2 A to2 A
GENERAL SWITCHCATALOG
33m ,SingleW80m ,SingleW80m ,DualW80m ,DualW80m , TripleW80m ,QuadW80m ,QuadW
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
Check for Samples: TPS2041B,TPS2042B,TPS2043B,TPS2044B,TPS2051B,TPS2052B,TPS2053B,TPS2054B
1FEATURES APPLICATIONS
2•70-mΩHigh-Side MOSFET •Heavy Capacitive Loads
•500-mA Continuous Current •Short-Circuit Protections
•Thermal and Short-Circuit Protection
•Accurate Current Limit
(0.75 A min, 1.25 A max)
•Operating Range: 2.7 V to 5.5 V
•0.6-ms Typical Rise Time
•Undervoltage Lockout
•Deglitched Fault Report (OC)
•No OC Glitch During Power Up
•Maximum Standby Supply Current:
1-μA (Single, Dual) or 2-μA (Triple, Quad)
•Ambient Temperature Range: -40°C to 85°C
•UL Recognized, File Number E169910
•Additional UL Recognition for TPS2042B and
TPS2052B for Ganged Configuration
DESCRIPTION
The TPS204xB/TPS205xB power-distribution switches are intended for applications where heavy capacitive
loads and short circuits are likely to be encountered. These devices incorporates 70-mΩN-channel MOSFET
power switches for power-distribution systems that require multiple power switches in a single package. Each
switch is controlled by a logic enable input. Gate drive is provided by an internal charge pump designed to
control the power-switch rise times and fall times to minimize current surges during switching. The charge pump
requires no external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1 A
typically.
See TI Switch Portfolio at http://www.ti.com/usbpower
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains Copyright ©2010–2011, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DEVICE INFORMATION(1)
TYPICAL PACKAGED DEVICES
RECOMMENDED SHORT- NUMBER
MAXIMUM CIRCUIT
TAENABLE OF
CONTINUOUS CURRENT MSOP (DGN) SOIC (D) SOT-23 (DBV) SON (DRB)
SWITCHES
LOAD CURRENT LIMIT
AT 25°C
Active low Single TPS2041BDGN TPS2041BD TPS2041BDBV
Active high Single TPS2051BDGN TPS2051BD TPS2051BDBV
Active low Dual TPS2042BDGN TPS2042BD TPS2042BDRB
Active high Dual TPS2052BDGN TPS2052BD TPS2052BDRB
-40°C to 0.5 A 1 A
85°CActive low Triple -- TPS2043BD
Active high Triple -- TPS2053BD
Active low Quad -- TPS2044BD
Active high Quad -- TPS2054BD
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Input voltage range, VI(IN), VI(INx) (2) -0.3 V to 6 V
Output voltage range, VO(OUT), VO(OUTx) (2) -0.3 V to 6 V
Input voltage range, VI(EN), VI(ENx), VI(EN), VI(ENx) -0.3 V to 6 V
Voltage range, VI(/OC), VI(OCx) -0.3 V to 6 V
Continuous output current, IO(OUT), IO(OUTx) Internally limited
Continuous total power dissipation See Dissipation Rating Table
Operating virtual junction temperature range, TJ-40°C to 125°C
Storage temperature range, Tstg -65°C to 150°C
Human body model (HBM) 2 kV
Electrostatic discharge (ESD) protection Charge device model (CDM) 500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND.
DISSIPATING RATING TABLE
THERMAL TA≤25°C DERATING FACTOR TA= 70°C TA= 85°C
PACKAGE RESISTANCE, θJA POWER RATING ABOVE TA= 25°C POWER RATING POWER RATING
DGN-8 1712.3 mW 17.123 mW/°C 941.78 mW 684.93 mW
D-8 585.82 mW 5.8582 mW/°C 322.20 mW 234.32 mW
D-16 898.47 mW 8.9847 mW/°C 494.15 mW 359.38 mW
DBV-5 285 mW 2.85 mW/°C 155 mW 114 mW
DRB-8 (Low-K)(1) 270 °CW 370 mW 3.71 mW/°C 203 mW 148 mW
DRB-8 (High-K)(2) 60 °CW 1600 mW 16.67 mW/°C 916 mW 866 mW
(1) Soldered PowerPAD on a standard 2-layer PCB without vias for thermal pad. See TI application note SLMA002 for further details.
(2) Soldered PowerPAD on a standard 4-layer PCB with vias for thermal pad. See TI application note SLMA002 for further details.
2Copyright ©2010–2011, Texas Instruments Incorporated
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT
Input voltage, VI(IN), VI(INx) 2.7 5.5 V
Input voltage, VI(EN), VI(ENx), VI(EN), VI(ENx) 0 5.5 V
Continuous output current, IO(OUT), IO(OUTx) 0 500 mA
Operating virtual junction temperature, TJ-40 125 °C
ELECTRICAL CHARACTERISTICS
over recommended operating junction temperature range, VI(IN) = 5.5 V, IO= 0.5 A, VI(/ENx) = 0 V (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
POWER SWITCH
Static drain-source on-state D and DGN packages 70 135
VI(IN) = 5 V or 3.3 V, IO= 0.5 A,
resistance, 5-V operation mΩ
-40°C≤TJ≤125°CDBV package only 95 140
and 3.3-V operation
rDS(on) Static drain-source on-state VI(IN) = 2.7 V, IO= 0.5 A, D and DGN packages 75 150 mΩ
resistance, 2.7-V operation -40°C≤TJ≤125°C
Static drain-source on-state VI(IN) = 5 V, IO= 1.0 A, OUT1 and OUT2 DGN package, 49 mΩ
resistance, 5-V operation connected, 0°C≤TJ≤70°C TPS2042B/52B
VI(IN) = 5.5 V 0.6 1.5
trRise time, output VI(IN) = 2.7 V 0.4 1
CL= 1 μF, TJ= 25°C ms
RL= 10 Ω
VI(IN) = 5.5 V 0.05 0.5
tfFall time, output VI(IN) = 2.7 V 0.05 0.5
ENABLE INPUT EN AND ENx
VIH High-level input voltage 2.7 V ≤VI(IN) ≤5.5 V 2 V
VIL Low-level input voltage 2.7 V ≤VI(IN) ≤5.5 V 0.8
IIInput current VI(ENx) = 0 V or 5.5 V -0.5 0.5 μA
ton Turnon time CL= 100 μF, RL= 10 Ω3ms
toff Turnoff time CL= 100 μF, RL= 10 Ω10
CURRENT LIMIT
TJ= 25°C 0.75 1 1.25
VI(IN) = 5 V, OUT connected to GND,
device enabled into short-circuit -40°C≤TJ≤125°C 0.7 1 1.3
IOS Short-circuit output current A
VI(IN) = 5 V, OUT1 and OUT2 connected to 0°C≤TJ≤70°C
GND, device enabled into short-circuit, 1.5
TPS2042B/52B
measure at IN TPS2041B/51B IOS 1.5 1.9
IOC Overcurrent trip threshold VIN = 5 V, 100 A/s A
TPS2042B/52B IOS 1.55 2.0
SUPPLY CURRENT (TPS2041B, TPS2051B)
TJ= 25°C 0.5 1
No load on OUT, VI(ENx) = 5.5 V,
Supply current, low-level output μA
or VI(ENx) = 0 V -40°°C≤TJ≤125°C 0.5 5
TJ= 25°C 43 60
No load on OUT, VI(ENx) = 0 V,
Supply current, high-level output μA
or VI(ENx) = 5.5 V -40°C≤TJ≤125°C 43 70
OUT connected to ground, VI(ENx) = 5.5 V,
Leakage current -40°C≤TJ≤125°C 1 μA
or VI(ENx) = 0 V
Reverse leakage current VI(OUTx) = 5.5 V, IN = ground TJ= 25°C 0 μA
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
Copyright ©2010–2011, Texas Instruments Incorporated 3
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating junction temperature range, VI(IN) = 5.5 V, IO= 0.5 A, VI(/ENx) = 0 V (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
SUPPLY CURRENT (TPS2042B, TPS2052B)
TJ= 25°C 0.5 1
Supply current, low-level output No load on OUT, VI(ENx) = 5.5 V μA
-40°C≤TJ≤125°C 0.5 5
TJ= 25°C 50 70
Supply current, high-level output No load on OUT, VI(ENx) = 0 V μA
-40°C≤TJ≤125°C 50 90
Leakage current OUT connected to ground, VI(ENx) = 5.5 V -40°C≤TJ≤125°C 1 μA
Reverse leakage current VI(OUTx) = 5.5 V, IN = ground TJ= 25°C 0.2 μA
SUPPLY CURRENT (TPS2043B, TPS2053B)
TJ= 25°C 0.5 2
Supply current, low-level output No load on OUT, VI(ENx) = 0 V μA
-40°C≤TJ≤125°C 0.5 10
TJ= 25°C 65 90
Supply current, high-level output No load on OUT, VI(ENx) = 5.5 V μA
-40°C≤TJ≤125°C 65 110
Leakage current OUT connected to ground, VI(ENx) = 0 V -40°C≤TJ≤125°C 1 μA
Reverse leakage current VI(OUTx) = 5.5 V, INx = ground TJ= 25°C 0.2 μA
SUPPLY CURRENT (TPS2044B, TPS2054B)
TJ= 25°C 0.5 2
No load on OUT, VI(ENx) = 5.5 V,
Supply current, low-level output μA
or VI(ENx) = 0 V -40°C≤TJ≤125°C 0.5 10
TJ= 25°C 75 110
No load on OUT, VI(ENx) = 0 V,
Supply current, high-level output μA
or VI(ENx) = 5.5 V -40°C≤TJ≤125°C 75 140
OUT connected to ground, VI(ENx) = 5.5 V,
Leakage current -40°C≤TJ≤125°C 1 μA
or VI(ENx) = 0 V
Reverse leakage current VI(OUTx) = 5.5 V, INx = ground TJ= 25°C 0.2 μA
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN, INx 2 2.5 V
Hysteresis, IN, INx TJ= 25°C 75 mV
OVERCURRENT OC and OCx
Output low voltage, VOL(/OCx) IO(OCx) = 5 mA 0.4 V
Off-state current VO(OCx) = 5 V or 3.3 V 1 μA
OC deglitch OCx assertion or deassertion 4 8 15 ms
THERMAL SHUTDOWN(2)
Thermal shutdown threshold 135 °C
Recovery from thermal shutdown 125 °C
Hysteresis 10 °C
(2) The thermal shutdown only reacts under overcurrent conditions.
4Copyright ©2010–2011, Texas Instruments Incorporated
OUT
OC
IN
EN
GND
Current
Limit
Driver
UVLO
Charge
Pump
CS
Thermal
Sense Deglitch
Note A: Current sense
Note B: Active low (EN) for TPS2041B; Active high (EN) for TPS2051B
(See Note A)
(See Note B)
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
DEVICE INFORMATION
Terminal Functions (TPS2041B and TPS2051B)
TERMINAL
D AND DGN PACKAGE DBV PACKAGE I/O DESCRIPTION
NAME TPS2041B TPS2051B TPS2041B TPS2051B
EN 4 –4–I Enable input, logic low turns on power switch
EN –4–4 I Enable input, logic high turns on power switch
GND 1 1 2 2 Ground
IN 2, 3 2, 3 5 5 I Input voltage
OC 5 5 3 3 O Overcurrent open-drain output, active-low
OUT 6, 7, 8 6, 7, 8 1 1 O Power-switch output
Figure 1. Functional Block Diagram (TPS2041B and TPS2051B)
Copyright ©2010–2011, Texas Instruments Incorporated 5
Thermal
Sense
Driver Current
Limit
Charge
Pump
UVLO
CS
Driver Current
Limit
CS
Thermal
Sense
Charge
Pump
GND
EN1
IN
EN2
OC1
OUT1
OUT2
OC2
Deglitch
Deglitch
(See Note A)
(See Note B)
Note A: Current sense
Note B: Active low (ENx) for TPS2042B; Active high (ENx) for TPS2052B
(See Note B)
(See Note A)
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
Terminal Functions (TPS2042B and TPS2052B)
TERMINAL
D, DGN, and DRB PACKAGES I/O DESCRIPTION
NAME TPS2042B TPS2052B
EN1 3 - I Enable input, logic low turns on power switch IN-OUT1
EN2 4 - I Enable input, logic low turns on power switch IN-OUT2
EN1 - 3 I Enable input, logic high turns on power switch IN-OUT1
EN2 - 4 I Enable input, logic high turns on power switch IN-OUT2
GND 1 1 Ground
IN 2 2 I Input voltage
OC1 8 8 O Overcurrent, open-drain output, active low, IN-OUT1
OC2 5 5 O Overcurrent, open-drain output, active low, IN-OUT2
OUT1 7 7 O Power-switch output, IN-OUT1
OUT2 6 6 O Power-switch output, IN-OUT2
Internally connected to GND; used to heat-sink the part to the circuit board
PowerPAD™- - traces. Should be connected to GND pin.
Functional Block Diagram (TPS2042B and TPS2052B)
6Copyright ©2010–2011, Texas Instruments Incorporated
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
Terminal Functions (TPS2043B and TPS2053B)
TERMINAL I/O DESCRIPTION
NAME TPS2043B TPS2053B
EN1 3 -- I Enable input, logic low turns on power switch IN1-OUT1
EN2 4 -- I Enable input, logic low turns on power switch IN1-OUT2
EN3 7 -- I Enable input, logic low turns on power switch IN2-OUT3
EN1 -- 3 I Enable input, logic high turns on power switch IN1-OUT1
EN2 -- 4 I Enable input, logic high turns on power switch IN1-OUT2
EN3 -- 7 I Enable input, logic high turns on power switch IN2-OUT3
GND 1, 5 1, 5 Ground
IN1 2 2 I Input voltage for OUT1 and OUT2
IN2 6 6 I Input voltage for OUT3
NC 8, 9, 10 8, 9, 10 No connection
OC1 16 16 O Overcurrent, open-drain output, active low, IN1-OUT1
OC2 13 13 O Overcurrent, open-drain output, active low, IN1-OUT2
OC3 12 12 O Overcurrent, open-drain output, active low, IN2-OUT3
OUT1 15 15 O Power-switch output, IN1-OUT1
OUT2 14 14 O Power-switch output, IN1-OUT2
OUT3 11 11 O Power-switch output, IN2-OUT3
Copyright ©2010–2011, Texas Instruments Incorporated 7
Thermal
Sense
Driver Current
Limit
UVLO CS
Driver Current
Limit
CS
Thermal
Sense
GND
EN1
IN1
EN2
OC1
OUT1
OUT2
OC2
Deglitch
Deglitch
Driver Current
Limit
CS
Thermal
Sense
Charge
Pump
GND
IN2
EN3
OUT3
OC3
Deglitch
VCC
Selector
UVLO
(See Note A)
Note A: Current sense
Note B: Active low (ENx) for TPS2043B; Active high (ENx) for TPS2053B
(See Note A)
(See Note A)
(See Note B)
(See Note B)
(See Note B)
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
Figure 2. Functional Block Diagram (TPS2043B and TPS2053B)
8Copyright ©2010–2011, Texas Instruments Incorporated
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
Terminal Functions (TPS2044B and TPS2054B)
TERMINAL I/O DESCRIPTION
NAME TPS2044B TPS2054B
EN1 3 - I Enable input, logic low turns on power switch IN1-OUT1
EN2 4 - I Enable input, logic low turns on power switch IN1-OUT2
EN3 7 - I Enable input, logic low turns on power switch IN2-OUT3
EN4 8 - I Enable input, logic low turns on power switch IN2-OUT4
EN1 - 3 I Enable input, logic high turns on power switch IN1-OUT1
EN2 - 4 I Enable input, logic high turns on power switch IN1-OUT2
EN3 - 7 I Enable input, logic high turns on power switch IN2-OUT3
EN4 - 8 I Enable input, logic high turns on power switch IN2-OUT4
GND 1, 5 1, 5 Ground
IN1 2 2 I Input voltage for OUT1 and OUT2
IN2 6 6 I Input voltage for OUT3 and OUT4
OC1 16 16 O Overcurrent, open-drain output, active low, IN1-OUT1
OC2 13 13 O Overcurrent, open-drain output, active low, IN1-OUT2
OC3 12 12 O Overcurrent, open-drain output, active low, IN2-OUT3
OC4 9 9 O Overcurrent, open-drain output, active low, IN2-OUT4
OUT1 15 15 O Power-switch output, IN1-OUT1
OUT2 14 14 O Power-switch output, IN1-OUT2
OUT3 11 11 O Power-switch output, IN2-OUT3
OUT4 10 10 O Power-switch output, IN2-OUT4
Copyright ©2010–2011, Texas Instruments Incorporated 9
Thermal
Sense
Driver Current
Limit
UVLO CS
Driver Current
Limit
CS
Thermal
Sense
Power Switch
GND
EN1
IN1
EN2
OC1
OUT1
OUT2
OC2
Deglitch
Deglitch
Thermal
Sense
Driver Current
Limit
UVLO CS
Driver Current
Limit
CS
Thermal
Sense
Charge
Pump
Power Switch
GND
EN3
IN2
EN4
OC3
OUT3
OUT4
OC4
Deglitch
Deglitch
VCC
Selector
Note A: Current sense
Note B: Active low (ENx) for TPS2044B; Active high (ENx) for TPS2054B
(See Note A)
(See Note A)
(See Note A)
(See Note A)
(See Note B)
(See Note B)
(See Note B)
(See Note B)
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
Figure 3. Functional Block Diagram (TPS2044B and TPS2054B)
10 Copyright ©2010–2011, Texas Instruments Incorporated
RLCL
OUT
trtf
90% 90%
10%
10%
50% 50%
90%
10%
VO(OUT)
VI(EN)
VO(OUT)
VOLTAGE WAVEFORMS
TEST CIRCUIT
ton toff
50% 50%
90%
10%
VI(EN)
VO(OUT)
ton toff
VI(EN)
VI(EN)
5 V/div
VO(OUT)
2 V/div
RL = 10 W,
CL = 1 mF
TA = 255C
t − Time − 500 ms/div
VI(EN)
VI(EN)
5 V/div
VO(OUT)
2 V/div
RL = 10 W,
CL = 1 mF
TA = 255C
t − Time − 500 ms/div
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
PARAMETER MEASUREMENT INFORMATION
Figure 4. Test Circuit and Voltage Waveforms
Figure 5. Turnon Delay and Rise Time With 1-μF Figure 6. Turnoff Delay and Fall Time With 1-μF
Load Load
Copyright ©2010–2011, Texas Instruments Incorporated 11
VI(EN)
VI(EN)
5 V/div
VO(OUT)
2 V/div
RL = 10 W,
CL = 100 mF
TA = 255C
t − Time − 500 ms/div
VO(OUT)
2 V/div
VI(EN)
VI(EN)
5 V/div
RL = 10 W,
CL = 100 mF
TA = 255C
t − Time − 500 ms/div
220 mF470 mF
100 mF
VI = 5 V,
RL = 10 W,
TA = 255C
VI(EN)
VI(EN)
5 V/div
IO(OUT)
500 mA/div
t − Time − 500 ms/div
VI(EN)
VI(EN)
5 V/div
IO(OUT)
500 mA/div
t − Time − 500 ms/div
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 7. Turnon Delay and Rise Time With 100-μF Figure 8. Turnoff Delay and Fall Time With 100-μF
Load Load
Figure 9. Short-Circuit Current, Figure 10. Inrush Current With Different
Device Enabled Into Short Load Capacitance
12 Copyright ©2010–2011, Texas Instruments Incorporated
VO(OC)
2 V/div
IO(OUT)
500 mA/div
t − Time − 2 ms/div
VO(OC)
2 V/div
IO(OUT)
500 mA/div
t − Time − 2 ms/div
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
23456
Turnon Time − ms
VI − Input Voltage − V
CL = 100 mF,
RL = 10 W,
TA = 255C
2.8
2.9
3
3.1
3.2
3.3
23456
Turnoff Time − ms
VI − Input Voltage − V
CL = 100 mF,
RL = 10 W,
TA = 255C
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 11. 3-ΩLoad Connected to Enabled Device Figure 12. 2-ΩLoad Connected to Enabled Device
TYPICAL CHARACTERISTICS
TURNON TIME TURNOFF TIME
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 13. Figure 14.
Copyright ©2010–2011, Texas Instruments Incorporated 13
0
0.1
0.2
0.3
0.4
0.5
0.6
2 3 4 5 6
Rise Time − ms
VI − Input Voltage − V
CL = 1 mF,
RL = 10 W,
TA = 255C
0
0.05
0.1
0.15
0.2
0.25
2 3 4 5 6
CL = 1 mF,
RL = 10 W,
TA = 255C
Fall Time − ms
VI − Input Voltage − V
0
10
20
30
40
50
60
−50 0 50 100 150
VI = 5.5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Enabled −
II (IN) Aµ
VI = 5 V
0
10
20
30
40
50
60
70
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Enabled −
II (IN) Aµ
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
RISE TIME FALL TIME
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 15. Figure 16.
TPS2041B/2051B TPS2042B/TPS2052B
SUPPLY CURRENT, OUTPUT ENABLED SUPPLY CURRENT, OUTPUT ENABLED
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 17. Figure 18.
14 Copyright ©2010–2011, Texas Instruments Incorporated
0
10
20
30
40
50
60
70
80
90
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Enabled −
II (IN) Aµ
0
20
40
60
80
100
120
−50 0 50 100 150
VI = 5.5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Enabled −
II (IN) Aµ
VI = 5 V
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 5.5 V VI = 5 V
VI = 3.3 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Disabled −
II (IN) Aµ
TJ − Junction Temperature − 5C
− Supply Current, Output Disabled −II (IN) Aµ
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 2.7 V VI = 3.3 V
VI = 5.5 V
VI = 5 V
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
TYPICAL CHARACTERISTICS (continued)
TPS2043B/TPS2053B TPS2044B/2054B
SUPPLY CURRENT, OUTPUT ENABLED SUPPLY CURRENT, OUTPUT ENABLED
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 19. Figure 20.
TPS2041B/2051B TPS2042B/TPS2052B
SUPPLY CURRENT, OUTPUT DISABLED SUPPLY CURRENT, OUTPUT DISABLED
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 21. Figure 22.
Copyright ©2010–2011, Texas Instruments Incorporated 15
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 5.5 V
VI = 5 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Disabled −
II (IN) Aµ
VI = 3.3 V
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
−50 0 50 100 150
VI = 5.5 V VI = 5 V
VI = 2.7 V
TJ − Junction Temperature − 5C
− Supply Current, Output Disabled −II (IN) Aµ
VI = 3.3 V
0.9
0.92
0.94
0.96
0.98
1.0
1.02
1.04
1.06
1.08
−50 0 50 100 150
VI = 5 V
VI = 3.3 V
VI = 5.5 V
TJ − Junction Temperature − 5C
VI = 2.7 V
− Short-Circuit Output Current − A
IOS
0
20
40
60
80
100
120
−50 0 50 100 150
VI = 5 V
VI = 3.3 V
TJ − Junction Temperature − 5C
rDS(on) − Static Drain-Source On-State Resistance − mΩ
VI = 2.7 V
IO = 0.5 A
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TPS2043B/TPS2053B TPS2044B/2054B
SUPPLY CURRENT, OUTPUT DISABLED SUPPLY CURRENT, OUTPUT DISABLED
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 23. Figure 24.
STATIC DRAIN-SOURCE ON-STATE RESISTANCE SHORT-CIRCUIT OUTPUT CURRENT
vs vs
JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 25. Figure 26.
16 Copyright ©2010–2011, Texas Instruments Incorporated
1
1.2
1.4
1.6
1.8
2
2.5 3 3.5 4 4.5 5 5.5 6
TA = 255C
Load Ramp = 1A/10 ms
Threshold Trip Current − A
VI − Input Voltage − V
TPS2043B,
TPS2044B,
TPS2053B,
TPS2054B
Threshold Trip Current − A
VI − Input Voltage − V
1
1.2
1.4
1.6
1.8
2
2.5 3 3.5 4 4.5 5 5.5 6
TA = 255C
Load Ramp = 1A/10 ms
TPS2041B,
TPS2042B,
TPS2051B,
TPS2052B
0
20
40
60
80
100
0 2.5 5 7.5 10 12.5
Peak Current − A
VI = 5 V,
TA = 255C
Current-Limit Response − sµ
2.1
2.14
2.18
2.22
2.26
2.3
−50 0 50 100 150
UVLO Rising
UVLO Falling
UVLO − Undervoltage Lockout − V
TJ − Junction Temperature − 5C
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
TYPICAL CHARACTERISTICS (continued)
THRESHOLD TRIP CURRENT THRESHOLD TRIP CURRENT
vs vs
INPUT VOLTAGE INPUT VOLTAGE
Figure 27. Figure 28.
UNDERVOLTAGE LOCKOUT CURRENT-LIMIT RESPONSE
vs vs
JUNCTION TEMPERATURE PEAK CURRENT
Figure 29. Figure 30.
Copyright ©2010–2011, Texas Instruments Incorporated 17
IN
OC1
EN1
OC2
2
8
5
7
0.1 µF22 µF
0.1 µF22 µF
Load
Load
OUT1
OUT2
Power Supply
2.7 V to 5.5 V
6
EN2
3
4
GND
0.1 µF
TPS2042B
1
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
APPLICATION INFORMATION
POWER-SUPPLY CONSIDERATIONS
Figure 31. Typical Application (Example, TPS2042B)
A 0.01-μF to 0.1-μF ceramic bypass capacitor between IN and GND, close to the device, is recommended.
Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy.
This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the
output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients.
OVERCURRENT
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not
increase the series resistance of the current path. When an overcurrent condition is detected, the device
maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only
if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the
device is enabled or before VI(IN) has been applied (see Figure 17 through Figure 20). The TPS204xB/TPS205xB
senses the short and immediately switches into a constant-current output.
In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload
occurs, high currents may flow for a short period of time before the current-limit circuit can react. After the
current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into constant-current
mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The
current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is
exceeded (see Figure 21 through Figure 24). The TPS204xB/TPS205xB is capable of delivering current up to the
current-limit threshold without damaging the device. Once the threshold has been reached, the device switches
into its constant-current mode.
OC RESPONSE
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition
is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or
overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a
momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit.
The TPS204xB/TPS205xB is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch
eliminates the need for external components to remove unwanted pulses. OCx is not deglitched when the switch
is turned off due to an overtemperature shutdown.
18 Copyright ©2010–2011, Texas Instruments Incorporated
GND
IN
EN1
EN2
OC1
OC2
OUT1
OUT2
TPS2042B Rpullup
V+
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
Figure 32. Typical Circuit for the OC Pin (Example, TPS2042B)
POWER DISSIPATION AND JUNCTION TEMPERATURE
The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large
currents. The thermal resistances of these packages are high compared to those of power packages; it is good
design practice to check power dissipation and junction temperature. Begin by determining the rDS(on) of the
N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the
highest operating ambient temperature of interest and read rDS(on) from Figure 25. Using this value, the power
dissipation per switch can be calculated by:
PD= rDS(on) ×I2
Multiply this number by the number of switches being used. This step renders the total power dissipation from
the N-channel MOSFETs.
Finally, calculate the junction temperature:
TJ= PD×RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD= Total power dissipation based on number of switches being used.
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
THERMAL PROTECTION
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The TPS204xB/TPS205xB implements a thermal sensing to monitor the operating
junction temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction
temperature rises due to excessive power dissipation. Once the die temperature rises to approximately 140°C
due to overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the
power switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled
approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown
or overcurrent occurs.
UNDERVOLTAGE LOCKOUT (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input
voltage falls below approximately 2 V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the
switch is enabled. On reinsertion, the power switch is turned on, with a controlled rise time to reduce EMI and
voltage overshoots.
Copyright ©2010–2011, Texas Instruments Incorporated 19
IN
OC
EN
GND
0.1 µF
2, 3
5
4
6, 7, 8
0.1 µF120 µFGND
OUT
TPS2041B
Power Supply
D+
D−
VBUS
Downstream
USB Ports
USB
Control
3.3 V 5 V
1
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
UNIVERSAL SERIAL BUS (USB) APPLICATIONS
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for
low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB
interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for
differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power
is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V
from the 5-V input or its own internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption
requirements:
•Hosts/self-powered hubs (SPH)
•Bus-powered hubs (BPH)
•Low-power, bus-powered functions
•High-power, bus-powered functions
•Self-powered functions
Self-powered and bus-powered hubs distribute data and power to downstream functions. The
TPS204xB/TPS205xB can provide-power distribution solutions to many of these classes of devices.
HOST/SELF-POWERED AND BUS-POWERED HUBS
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the
downstream ports (see Figure 33 and Figure 34). This power supply must provide from 5.25 V to 4.75 V to the
board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs are required to
have current-limit protection and must report overcurrent conditions to the USB controller. Typical SPHs are
desktop PCs, monitors, printers, and stand-alone hubs.
Figure 33. Typical One-Port USB Host / Self-Powered Hub
20 Copyright ©2010–2011, Texas Instruments Incorporated
IN1
OC1
EN1
OC2
EN2
GND
0.1 µF
2
16
3
13
4
15
14
33 µF
33 µF
GND
1
OUT1
OUT2
TPS2044B
Power Supply D+
D−
VBUS
GND
D+
D−
VBUS
Downstream
USB Ports
USB
Controller
3.3 V 5 V
OC3
EN3
OC4
EN4
12
7
9
8
6IN2
+
+
5
GND
11
10 33 µF
33 µF
GND
OUT3
OUT4
D+
D−
VBUS
GND
D+
D−
VBUS
+
+
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
Figure 34. Typical Four-Port USB Host / Self-Powered Hub
Bus-powered hubs obtain all power from upstream ports and often contain an embedded function. The hubs are
required to power up with less than one unit load. The BPH usually has one embedded function, and power is
always available to the controller of the hub. If the embedded function and hub require more than 100 mA on
power up, the power to the embedded function may need to be kept off until enumeration is completed. This can
be accomplished by removing power or by shutting off the clock to the embedded function. Power switching the
embedded function is not necessary if the aggregate power draw for the function and controller is less than one
unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
LOW-POWER BUS-POWERED AND HIGH-POWER BUS-POWERED FUNCTIONS
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power
functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and can
draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44 Ω
and 10 μF at power up, the device must implement inrush current limiting (see Figure 35).
Copyright ©2010–2011, Texas Instruments Incorporated 21
IN
OC1
OC2
2
8
3
5
4
7
0.1 µF10 µFInternal
Function
OUT1
Power Supply
3.3 V
EN1
6
0.1 µF10 µF
OUT2 Internal
Function
0.1 µF
10 µF
USB
Control
GND
VBUS
D−
D+
EN2 GND
1
TPS2042B
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
Figure 35. High-Power Bus-Powered Function (Example, TPS2042B)
USB POWER-DISTRIBUTION REQUIREMENTS
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several
power-distribution features must be implemented.
•Hosts/self-powered hubs must:
–Current-limit downstream ports
–Report overcurrent conditions on USB VBUS
•Bus-powered hubs must:
–Enable/disable power to downstream ports
–Power up at <100 mA
–Limit inrush current (<44 Ωand 10 μF)
•Functions must:
–Limit inrush currents
–Power up at <100 mA
The feature set of the TPS204xB/TPS205xB allows them to meet each of these requirements. The integrated
current-limiting and overcurrent reporting is required by hosts and self-powered hubs. The logic-level enable and
controlled rise times meet the need of both input and output ports on bus-powered hubs, as well as the input
ports for bus-powered functions (see Figure 36 through Figure 39).
22 Copyright ©2010–2011, Texas Instruments Incorporated
†USB rev 1.1 requires 120 µF per hub.
DP1
DM1
DP2
DM2
DP3
DM3
DP4
PWRON1
OVRCUR1
PWRON2
OVRCUR2
PWRON3
OVRCUR3
PWRON4
OVRCUR4
DM4
DP0
DM0
VCC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2041B
Hub Controller
Tuning
Circuit
A
BC
D
33 µF†
SN75240
A
BC
D
GND
GND
GND
33 µF†
33 µF†
33 µF†
D +
D −
Upstream
Port
TPS2041B
SN75240
A
B
5 V
GND
C
D
1 µF
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µF
0.1 µF
4.7 µF
GND
EN
OC
IN
TPS2041B
OUT
EN
OC
IN
TPS2041B
OUT
EN
OC
IN
TPS2041B
OUT
EN
OC
IN
TPS2041B
OUT
TPS76333
0.1 µF
0.1 µF
0.1 µF
0.1 µF
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
Figure 36. Hybrid Self / Bus-Powered Hub Implementation, TPS2041B/TPS2051B
Copyright ©2010–2011, Texas Instruments Incorporated 23
DP1
DM1
DP2
DM2
DP3
DM3
DP4
PWRON1
OVRCUR1
PWRON2
OVRCUR2
DM4
DP0
DM0
VCC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2040
Hub Controller
Tuning
Circuit
A
BC
D
33 µF†
SN75240
A
BC
D
GND
GND
GND
33 µF†
33 µF†
33 µF†
D +
D −
Upstream
Port
TPS2041B
SN75240
A
B
5 V
GND
C
D
1 µF
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µF
0.1 µF
4.7 µF
EN1
IN
OC1
OUT1
TPS2042B
EN2
OC2
OUT2
0.1 µF
GND
†USB rev 1.1 requires 120 µF per hub.
TPS76333
PWRON3
PWRON4
OVRCUR3
OVRCUR4
EN1
IN
OC1
OUT1
TPS2042B
EN2
OC2
OUT2
0.1 µF
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
Figure 37. Hybrid Self / Bus-Powered Hub Implementation, TPS2042B/TPS2052B
24 Copyright ©2010–2011, Texas Instruments Incorporated
DP1
DM1
DP2
DM2
DP3
DM3
PWRON1
OVRCUR1
PWRON2
OVRCUR2
PWRON3
OVRCUR3
DP0
DM0
VCC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2040
Hub Controller
Tuning
Circuit
A
BC
D
47 µF†
1/2 SN75240
A
BC
D
GND
GND
47 µF†
47 µF†
D +
D −
Upstream
Port
TPS2041B
1/2 SN75240
A
B
5 V
GND
C
D
1 µF
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µF
0.1 µF
4.7 µF
EN1
IN1
OC1
OUT1
TPS2053B
EN2
OC2
OUT2
0.1 µF
0.1 µF
GND
†USB rev 1.1 requires 120 µF per hub.
OUT3
EN3
OC3
IN2
GND
GND
TPS76333
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
Figure 38. Hybrid Self / Bus-Powered Hub Implementation, TPS2043B/TPS2053B
Copyright ©2010–2011, Texas Instruments Incorporated 25
DP1
DM1
DP2
DM2
DP3
DM3
DP4
PWRON1
OVRCUR1
PWRON2
OVRCUR2
PWRON3
OVRCUR3
PWRON4
OVRCUR4
DM4
DP0
DM0
VCC
XTAL1
XTAL2
OCSOFF
SN75240
D +
D −
5 V
GND
D +
D −
5 V
D +
D −
5 V
D +
D −
5 V
48-MHz
Crystal
Downstream
Ports
TUSB2040
Hub Controller
Tuning
Circuit
A
BC
D
33 µF†
SN75240
A
BC
D
GND
GND
GND
33 µF†
33 µF†
33 µF†
D +
D −
Upstream
Port
TPS2041B
SN75240
A
B
5 V
GND
C
D
1 µF
IN
GND
Ferrite Beads
Ferrite Beads
Ferrite Beads
Ferrite Beads
BUSPWR
GANGED
Tie to TPS2041B EN Input
OC EN
OUT
5-V Power
Supply
IN
GND
3.3 V
4.7 µF
0.1 µF
4.7 µF
EN1
IN1
OC1
OUT1
TPS2044B
EN2
OC2
OUT2
0.1 µF
0.1 µF
GND
†USB rev 1.1 requires 120 µF per hub.
EN3
OC3
OUT3
EN4
OC4
OUT4
IN2
GND1
GND2
TPS76333
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
Figure 39. Hybrid Self / Bus-Powered Hub Implementation, TPS2044B/TPS2054B
26 Copyright ©2010–2011, Texas Instruments Incorporated
Power
Supply
0.1 µF
1000 µF
Optimum
2.7 V to 5.5 V
PC Board
Overcurrent Response
TPS2042B
OC1
GND
EN1
IN
EN2
OUT1
OUT2
OC2 Block of
Circuitry
Block of
Circuitry
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
GENERIC HOT-PLUG APPLICATIONS
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen by
the main power supply and the card being inserted. The most effective way to control these surges is to limit and
slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply
normally turns on. Due to the controlled rise times and fall times of the TPS204xB/TPS205xB, these devices can
be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of
the TPS204xB/TPS205xB also ensures that the switch is off after the card has been removed, and that the
switch is off during the next insertion. The UVLO feature insures a soft start with a controlled rise time for every
insertion of the card or module.
Figure 40. Typical Hot-Plug Implementation (Example, TPS2042B)
By placing the TPS204xB/TPS205xB between the VCC input and the rest of the circuitry, the input power reaches
these devices first after insertion. The typical rise time of the switch is approximately 1 ms, providing a slow
voltage ramp at the output of the device. This implementation controls system surge currents and provides a
hot-plugging mechanism for any device.
DETAILED DESCRIPTION
Power Switch
The power switch is an N-channel MOSFET with a low on-state resistance. Configured as a high-side switch, the
power switch prevents current flow from OUT to IN and IN to OUT when disabled. The power switch supplies a
minimum current of 500 mA.
Charge Pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
little supply current.
Driver
The driver controls the gate voltage of the power switch. To limit large current surges and reduce the associated
electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall
times of the output voltage.
Enable (ENx)
The logic enable pin disables the power switch and the bias for the charge pump, driver, and other circuitry to
reduce the supply current. The supply current is reduced to less than 1 μA or 2 μA when a logic high is present
on EN. A logic zero input on EN restores bias to the drive and control circuits and turns the switch on. The
enable input is compatible with both TTL and CMOS logic levels.
Copyright ©2010–2011, Texas Instruments Incorporated 27
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
SLVS514L –JUNE 2010–REVISED JUNE 2011
www.ti.com
Enable (ENx)
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to reduce
the supply current. The supply current is reduced to less than 1 μA or 2 μA when a logic low is present on ENx.
A logic high input on ENx restores bias to the drive and control circuits and turns the switch on. The enable input
is compatible with both TTL and CMOS logic levels.
Overcurrent (OCx)
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. A
10-ms deglitch circuit prevents the OCx signal from oscillation or false triggering. If an overtemperature shutdown
occurs, the OCx is asserted instantaneously.
Current Sense
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than
conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry
sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into its
saturation region, which switches the output into a constant-current mode and holds the current constant while
varying the voltage on the load.
Thermal Sense
The TPS204xB/TPS205xB implements a thermal sensing to monitor the operating temperature of the power
distribution switch. In an overcurrent or short-circuit condition, the junction temperature rises. When the die
temperature rises to approximately 140°C due to overcurrent conditions, the internal thermal sense circuitry turns
off the switch, thus preventing the device from damage. Hysteresis is built into the thermal sense, and after the
device has cooled approximately 10 degrees, the switch turns back on. The switch continues to cycle off and on
until the fault is removed. The open-drain false reporting output (OCx) is asserted (active low) when an
overtemperature shutdown or overcurrent occurs.
Undervoltage Lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V, a control
signal turns off the power switch.
28 Copyright ©2010–2011, Texas Instruments Incorporated
TPS2041B, TPS2042B
TPS2043B, TPS2044B, TPS2051B
TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514L –JUNE 2010–REVISED JUNE 2011
REVISION HISTORY
Changes from Revision F (June 2006) to Revision G Page
•Deleted Product Preview from the DBV package ................................................................................................................. 1
•Added TPS2060 1.5 A and TPS2064 1.5 A to the General Switch Catalog table ............................................................... 1
•Added DRB package to the Ordering Information table ....................................................................................................... 2
•Added D, DGN and DBV package options to the rDS(on) Test Condition ............................................................................... 3
•Added the DBV PACKAGE to the Terminal Functions table ................................................................................................ 5
Changes from Revision G (OCTOBER 2006) to Revision H Page
•Updated the General Switch Catalog table .......................................................................................................................... 1
Changes from Revision H (September 2007) to Revision I Page
•Added Featured Bullet: Additional UL Recognition.. ............................................................................................................ 1
•Added DRB-8 pinout package. ............................................................................................................................................. 1
•Added DRB-8 to the Dissipation Rating Table. .................................................................................................................... 2
Changes from Revision I (October 2008) to Revision J Page
•Deleted Product Preview from the DRB package ................................................................................................................. 1
•Deleted Electrical Char Table note - This configuration has not been tested for UL certification. ....................................... 4
Changes from Revision J (December 2008) to Revision K Page
•Deleted Electrical Char Table note - Estimated value. Final value pending characterization. ............................................. 4
Changes from Revision K (June 2010) to Revision L Page
•Added note to General Switch Catalog link at www.ti.com .................................................................................................. 1
•Changed Table title from AVAILABLE AND ORDERING INFORMATION, TO: DEVICE INFORMATION and deleted
(1) table note ......................................................................................................................................................................... 2
•Deleted lead temperature spec from the ABS MAX RATINGS table and changed MIL-STD-883C to (HBM) .................... 2
•Added IOC spec to the ELEC CHARA TABLE ...................................................................................................................... 3
•Deleted Not tested in production, specified by design. note 2 in ELECTRICAL CHARA TABLE ........................................ 3
Copyright ©2010–2011, Texas Instruments Incorporated 29
PACKAGE OPTION ADDENDUM
www.ti.com 14-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS2041BD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDGN ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDGN-ASY OBSOLETE MSOP-
PowerPAD DGN 8 TBD Call TI Call TI
TPS2041BDGNG4 ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2041BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDGN ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDGNG4 ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 14-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS2042BDGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDRBR ACTIVE SON DRB 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDRBT ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2042BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2043BD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2043BDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2043BDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2043BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2044BD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2044BDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2044BDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2044BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 14-Sep-2011
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS2051BDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDGN ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDGNG4 ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2051BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDGN ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDGNG4 ACTIVE MSOP-
PowerPAD DGN 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDGNR ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDGNRG4 ACTIVE MSOP-
PowerPAD DGN 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDRBR ACTIVE SON DRB 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDRBT ACTIVE SON DRB 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2052BDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 14-Sep-2011
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS2053BD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2053BDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2053BDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2053BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2054BD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2054BDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2054BDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2054BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 14-Sep-2011
Addendum-Page 5
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS2041B, TPS2042B, TPS2051B :
•Automotive: TPS2041B-Q1, TPS2042B-Q1, TPS2051B-Q1
•Enhanced Product: TPS2041B-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS2041BDBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS2041BDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS2041BDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS2041BDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS2041BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
TPS2041BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS2042BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
TPS2042BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS2042BDRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2
TPS2042BDRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2
TPS2043BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TPS2044BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TPS2051BDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS2051BDBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS2051BDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Oct-2011
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS2051BDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS2051BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
TPS2051BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS2051BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS2052BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
TPS2052BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS2052BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS2052BDRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2
TPS2052BDRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2
TPS2053BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TPS2054BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
*All dimensions are nominal
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Oct-2011
Pack Materials-Page 2
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS2041BDBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
TPS2041BDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS2041BDBVT SOT-23 DBV 5 250 203.0 203.0 35.0
TPS2041BDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS2041BDGNR MSOP-PowerPAD DGN 8 2500 346.0 346.0 35.0
TPS2041BDR SOIC D 8 2500 340.5 338.1 20.6
TPS2042BDGNR MSOP-PowerPAD DGN 8 2500 346.0 346.0 35.0
TPS2042BDR SOIC D 8 2500 340.5 338.1 20.6
TPS2042BDRBR SON DRB 8 3000 346.0 346.0 35.0
TPS2042BDRBT SON DRB 8 250 203.0 203.0 35.0
TPS2043BDR SOIC D 16 2500 333.2 345.9 28.6
TPS2044BDR SOIC D 16 2500 333.2 345.9 28.6
TPS2051BDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TPS2051BDBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
TPS2051BDBVT SOT-23 DBV 5 250 203.0 203.0 35.0
TPS2051BDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TPS2051BDGNR MSOP-PowerPAD DGN 8 2500 346.0 346.0 35.0
TPS2051BDGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
TPS2051BDR SOIC D 8 2500 340.5 338.1 20.6
TPS2052BDGNR MSOP-PowerPAD DGN 8 2500 346.0 346.0 35.0
TPS2052BDGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0
TPS2052BDR SOIC D 8 2500 340.5 338.1 20.6
TPS2052BDRBR SON DRB 8 3000 346.0 346.0 35.0
TPS2052BDRBT SON DRB 8 250 203.0 203.0 35.0
TPS2053BDR SOIC D 16 2500 333.2 345.9 28.6
TPS2054BDR SOIC D 16 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Oct-2011
Pack Materials-Page 3
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