4
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25°C
150°C
200°C
250°C260°C (Peak Temperature)
217°C
Time (sec)
Temperature (°C)
Absolute Maximum Ratings
Storage Temperature, TS –55˚C to +150˚C
Operating Temperature, TA –55˚C to +100˚C
Lead Solder Temperature, max. 260˚C for 10 s
(1.6 mm below seating plane)
Average Forward Current, IF 80 mA
Reverse Input Voltage, VR 6 V
Input Power Dissipation, PI 150 mW
Collector Current, IC 100 mA
Collector-Emitter Voltage, VCEO 30 V
Emitter-Collector Voltage, VECO 7 V
Collector-Base Voltage, VCBO 70 V
Collector Power Dissipation 150 mW
Total Power Dissipation 250 mW
Isolation Voltage, Viso 2500 Vrms
(AC for 1 minute, R.H. = 40 ~ 60%)
Solder Reow Temperature Prole
1. One-time soldering reow is recommended within
the condition of temperature and time prole shown
at right.
2. When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package
of the device within the condition of (1) above.
Note: Non-halide ux should be used.