TOTX1950A(F)
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FIB ER OPTIC TR ANSMIT TING M ODU L E
TOTX1950A(F)
GENERAL PURPOSE OPTICAL TRANSMITTING MODULE
For JIS F05 type optical connector
CMOS level interface
+5V single power supply
LED is driven by differential circuit.
650 nm LED
1. Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Storage Temperature Tstg −40 to 95 °C
Operating Temperature Topr −40 to 85 °C
Supply Voltage VCC −0.5 to 6 V
Input Voltage VIN −0.5 to VCC+0.5 V
Soldering Tem perat ure Tsol 260 (Note 1) °C
Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package).
Using continuously heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may c ause t his pr oduct to d ecrease in th e reliabil ity sign ifican tly ev en if the oper ating conditi ons (i.e .
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/ “Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated
failure rate, etc).
2. Operating Ranges
Characteristics Symbol Min Typ. Max Unit
Supply Voltage VCC 4.75 5.0 5.25 V
High Level Input Voltage VIH 3.5 - VCC V
Low Level Input Voltage VIL 0 - 1.5 V
Start of commercial production
2016-01
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3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V)
Characteristics Symbol Test Condition Min Typ. Max Unit
Data Rate - NRZ Code (Note 2) DC - 10 Mb/s
Transmission Distance - Using APF (Note 3) and TORX1950A(F)
0.2 - 50 m
Pulse Width Distortion (Note 4)
Δtw
Using APF (Note 3) and TORX1950A(F)
Pulse width 100 ns
Pulse cycle 200 ns, CL = 10 pF −30 - 30 ns
Using APF (Note 3) and TORX1950A(F)
Pulse width 165 ns
Pulse cycle 330 ns, CL = 10 pF −55 - 55 ns
Fiber Output Power (Note 5)
Pf R = 5.6kΩ −15 - − 9 dBm
Center Emission Wavelength λC - - 650 - nm
Current Consumpt i on ICC R = 5.6kΩ
- 12 30 mA
R = 3.3kΩ - 18 40 mA
High Level Input Voltage VIH - 3.5 - - V
Low Level Input Voltage VIL - - - 1.5 V
High Level Input Current IIH VCC = 5.25V, VI = 2.7V - - 20 μA
Low Level Input Current IIL VCC = 5.25V, VI = 0.4V - - −0.4 mA
Note 2: LED is on when input signal is high level, it is off when low level.
The duty factor must be kept 25 to 75%.
Note 3: All Plastic fiber (980μm core / 1000μm cladding, NA=0.5) with polished surface.
Note 4: Between input of TOTX1950A(F) and output of TORX1950A(F).
Note 5: Measure with a standard optical fiber with fiber optic connectors. Valued by peak.
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4. Application Circuit
Note 6: Select a resistor value as follows:
( 1) DC to 10 M b/s (with TORX1950A(F))
Fiber Optic Connector
Type Name Transmissi on Distance
(m) Resistor
(kΩ)
F05 type Optical connector
APF(980 / 1000μm) with polished surface.
0.2 to 40 5.6
10 to 50 3.3
(2) DC to 6 Mb/s (with TORX1950A(F))
Fiber Optic Connector
Type Name Transmission Distance
(m) Resistor
(kΩ)
F05 type Optical connector
APF(980 / 1000μm) with polished surface. 0.2 to 50 5.6
5. Applicable Optical Fiber with Fiber Optic Connectors
All Plastic Fiber (980μm core / 1000μm cladding), NA=0.5
F05 type optical connector with polished surface
C: 0.1μF
R(Note 6)
Within 7mm
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6. Precautions during use
(1) Absolute maximum rating
The absolute maximum ratings are the limit values which must not be exceeded during operation of device.
None of these rating value must not be exceeded. If the absolute maximum rating value is exceeded, the
characteristics of devices may never be restored properly. In extreme cases, the device may be
permanently damages.
(2) Operating Range
The oper atin g range is the ran ge of con ditions nec es sary for t he devic e t o oper ate as spe cif ied in individual
technical datasheets and databooks. Care must be exercised in the design of the equipment.
If a device is use d und er con ditions that do n ot exceed absol ute maximum ratings but ex ce ed the op erat i ng
range, the specifications related to device operation and electrical characteristics may not be met, resulting
in a decrease in reliability.
If greater reliability is required, derate the device’s operating ranges for voltage, current, power and
temperatur e befor e use.
(3) Lifetime of light emitters
If an optical module is used for a long period of time, degeneration in the characteristics will mostly be due
to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical output of the
LEDs used as the light source. The cause of degradation of the optical output of the LEDs may be defects
in wafer crystallization or mold resin stress. The detailed causes are, however, not clear.
The lifetime of light emitter s is greatly influe nced by the o perating c onditio ns and the env ironment i n w hich it
is used as well as by the lifetime characteristics unique to the device type. Thus, when a light emitting
device and its operating conditions determined, Toshiba recommend that lifetime characteris tics be
checked.
Depending on the env ir onment conditi ons, Toshiba r ecomme nd that maint enance such a s regular chec ks of
the amount of optical output in accordance with the condition of operating environment.
(4) Soldering
Optical modules are comprised of internal semiconductor devices . However, in principle, optical modules
are optical components. During soldering, ensure that flux does not contact with the emitting surface or the
detecting surface. Also ensure that proper flux removal is conduc ted aft er sol deri ng.
Some opti cal modul es com e w ith a prot ective cap. The prot ect ive cap is used t o av oid ma lfuncti on when t he
optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where there
may be flux residue and flux removal after soldering is not recommended. Toshiba recommend that
soldering be performed wi thout the optical module mounted on the board. Then, after the board has been
cleaned, the opt ica l module sh ould be soldered on to the board manually.
If the optic al module cannot be soldered manually, use non−halogen (chlorine−free) flux and make sure,
without cle aning, ther e is n o residu e such a s chlorin e. This i s one of th e way s to eliminate th e ef fects of flux .
In such cas es, be sure to check the devices’ reliability.
(5) Vibrat ion and shoc k
This module is plastic sealed and has its wire fixed by resin. This structure is relatively res istant to vibration
and shock. In ac t ua l e quip me n t, ther e are sometime s case s in which vibrati on, sho ck , or stress is applied t o
soldered parts or connected parts, resulting in lines cut. A care must be taken in the design of equipment
which will be subject to high levels of vibration.
(6) Attaching the fiber optic transmitting module
Solder the fixed pin (pins 5 and 6) of the fi ber o pti c transm itti ng mo dul e TOTX1950A(F) to the pri nted circuit
board in order to fix it to the board.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour
solvent in to t he opt ical co nnec tor port s. If solv ent is in adverte ntly poured in to t hem, clean i t off u sing cott on
tips.
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(8) Protective c ap
When the T O T X1950A(F) is not in us e, attach the protective cap.
(9) Incidence of a photo Flash
If strong light such as a photo flash is incident on an optical module, a transmission error may occur.
Be careful to avoid such situations.
(10) Supply voltage
Use the supply vol tage within the operating ranges (VCC = 5 ± 0.25 V). Make sure that supply voltage does
not exceed the absolute maximum rating value of 6 V, even for an instant.
(11) Input voltage
If a v olta ge exceeding the absolute maximum rating va lue (VCC + 0.5 V) i s app lied to t h e transmitters' inpu t,
the interna l IC may suffer damage. If th ere i s pos si bil ity that excessive voltage due to surg es may be a dded
to the input terminal, insert a protective circuit.
(12) Soldering conditi on
Solder at 260°C or less for no more than ten second s.
(13) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations in
order to protect the environment against contamination.
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7. Package Outline drawing
Pin connection
1. GND
2. Current limiting resistor of LED
3. VCC
4. Input
5. N.C
6. N.C
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