1. Product profile
1.1 General description
250 W LDMOS power transistor intended for CW applications at a frequency of 1.3 GHz.
1.2 Features and benefits
Easy power control
Integrated ESD protection
Excellent ruggedness
High efficiency
Excellent thermal stability
Internally matched for ease of use
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
Industrial, scientific and medical applications
BLF6G13L-250P;
BLF6G13LS-250P(G)
Power LDMOS transistor
Rev. 5. — 1 September 2015 Product data sheet
Table 1. Test information
Typical RF performance at Tcase =25
C; IDq = 100 mA; in a class-AB production test circuit.
Test signal f VDS PL(1dB) GpD
(GHz) (V) (W) (dB) (%)
CW 1.3 50 250 17 56
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 2 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
2. Pinning information
[1] Connected to flange.
3. Ordering information
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
BLF6G13L-250P (SOT1121A)
1drain1
2drain2
3gate1
4gate2
5source [1]
BLF6G13LS-250P (SOT1121B)
1drain1
2drain2
3gate1
4gate2
5source [1]
BLF6G13LS-250PG (SOT1121E)
1drain1
2drain2
3gate1
4gate2
5source [1]
2
4
5
3
1
4
3
5
1
2
sym117
12
345
4
3
5
1
2
sym117
5
12
34
4
3
5
1
2
sym117
Table 3. Ordering information
Type number Package
Name Description Version
BLF6G13L-250P - flanged LDMOST ceramic package; 2 mounting holes;
4 leads
SOT1121A
BLF6G13LS-250P - earless flanged LDMOST ceramic package; 4 leads SOT1121B
BLF6G13LS-250PG - earless flanged LDMOST ceramic package; 4 leads SOT1121E
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 3 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
4. Limiting values
[1] Continuous use at maximum temperature will affect the reliability, for details refer to the on-line MTF
calculator.
5. Thermal characteristics
6. Characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Min Max Unit
VDS drain-source voltage - 100 V
VGS gate-source voltage 0.5 +13 V
Tstg storage temperature 65 +150 C
Tjjunction temperature [1] - 225 C
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case Tcase =85C; PL= 250 W 0.26 K/W
Table 6. DC characteristics
Tj = 25
C; per section unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID= 1.4 mA 100 - - V
VGS(th) gate-source threshold voltage VDS = 10 V; ID= 235 mA 1.4 1.8 2.4 V
IDSS drain leakage current VGS = 0 V; VDS =50V--1.4A
IDSX drain cut-off current VGS =V
GS(th) + 3.75 V;
VDS =10V
-21-A
IGSS gate leakage current VGS =11V; V
DS =0V--240nA
gfs forward transconductance VDS = 10 V; ID=120mA - 1 - S
RDS(on) drain-source on-state resistance VGS =V
GS(th) + 3.75 V;
ID=4.75A
-200-m
Table 7. RF characteristics
Test signal: CW; f = 1.3 GHz; RF performance at VDS =50V; I
Dq = 100 mA; Tcase =25
C; unless
otherwise specified, in a class-AB production test circuit.
Symbol Parameter Conditions Min Typ Max Unit
VDS drain-source voltage PL=250W - - 50 V
Gppower gain PL= 250 W 15 17 - dB
RLin input return loss PL=250W - 30 20 dB
Ddrain efficiency PL=250W 52 56 - %
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 4 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
7. Application information
7.1 Ruggedness in class-AB operation
The BLF6G13L-250P, BLF6G13LS-250P and BLF6G13LS-250PG are capable of
withstanding a load mismatch corresponding to VSWR = 5 : 1 through all phases under
the following conditions: VDS = 50 V; IDq =100mA; P
L= 250 W; f = 1.3 GHz.
7.2 Impedance information
7.3 Circuit information
Table 8. Typical impedance
Typical values valid per section unless otherwise specified.
f ZSZL optimized for GpZL optimized for D
(MHz) () () ()
1200 3.03 j8.15 2.03 j0.25 1.46 j0.47
1300 4.06 j9.52 1.67 j0.92 1.19 j0.95
1400 7.00 j9.61 1.50 j1.48 1.22 j1.49
Fig 1. Definition of transistor impedance
001aak544
gate 1
gate 2
drain 2
drain 1
Z
S
Z
L
Table 9. List of components
For application circuit see Figure 2.
Component Description Value Remarks
C1, C2 multilayer ceramic chip capacitor 1.9 pF [1]
C3, C4 multilayer ceramic chip capacitor 4.7 pF [1]
C5 multilayer ceramic chip capacitor 10 pF [1]
C6, C7, C8, C9, C10,
C11, C38, C39
multilayer ceramic chip capacitor 56 pF [1]
C12, C13 multilayer ceramic chip capacitor 100 pF [2]
C14, C15, C32, C34 multilayer ceramic chip capacitor 1 nF [2]
C16, C17 electrolytic capacitor 10 F, 50 V 220 X5R
C20, C21, C22, C23 multilayer ceramic chip capacitor 3.0 pF [1]
C40, C41 multilayer ceramic chip capacitor 2.4 pF [1]
C42, C43, C44, C45 multilayer ceramic chip capacitor 2.7 pF [1]
C24 multilayer ceramic chip capacitor 0.8 pF [1]
C25 multilayer ceramic chip capacitor 0.6 pF [1]
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 5 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
[1] American Technical Ceramics type 800B or capacitor of same quality.
[2] American Technical Ceramics type 100B or capacitor of same quality.
[3] American Technical Ceramics type 200B or capacitor of same quality.
C26, C27, c28, C29,
C30, C31, C33, C35
multilayer ceramic chip capacitor 100 pF [1]
C36, C37 multilayer ceramic chip capacitor 20 nF [3]
C46, C47 electrolytic capacitor 100 F, 63 V
R1, R2 SMD resistor 0603 5.1
SR1 COAX 25 UT-141C-25-TP
SR2 COAX 35 UT-141C-35-TP
Printed-Circuit Board (PCB): Duroid 4350B; r = 3.48; thickness = 0.762 mm;
thickness copper plating = 35 m.
See Table 9 for a list of components.
Fig 2. Component layout for application circuit
Table 9. List of components …continued
For application circuit see Figure 2.
Component Description Value Remarks
001aan872
6.600
mm
C40 C44
C42
C20 C22
C41
C43
C45
C38
C37
C34 C35
C33
C32
C36
C47
C46
C31
C30
C29
C28
C27
C26
SR2
C21 C23 C25
C24
C39
C17
C14
C16
C15
SR1
C12
C11
C6
C7
C8
C9 C5
C4
C3
C10
C13
C1
C2
R2
R1
4.200
mm
4.300
mm
1.500
mm
2.700
mm
2.800
mm
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 6 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
7.4 Graphical data
7.4.1 CW
7.4.2 2-Carrier CW
VDS = 50 V; IDq = 100 mA.
Fig 3. Power gain and drain efficiency as function of output power; typical values
P
L
(W)
0 100 200 300 35025015050
001aan868
13
16
19
Gp
(dB)
10
30
45
60
ηD
(%)
15
Gp
ηD
VDS = 50 V; IDq = 100 mA; carrier spacing = 100 kHz.
Fig 4. Power gain and drain efficiency as function of output power; typical values
PL (W)
0 300200100
001aan869
13
16
19
Gp
(dB)
10
30
45
60
ηD
(%)
15
Gp
ηD
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 7 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
VDS = 50 V; f = 1300 MHz; carrier spacing = 100 kHz.
(1) IDq = 100 mA
(2) IDq = 300 mA
(3) IDq = 500 mA
(4) IDq = 700 mA
(5) IDq = 900 mA
(6) IDq = 1100 mA
(7) IDq = 1300 mA
(8) IDq = 1500 mA
VDS = 50 V; f = 1300 MHz; carrier spacing = 100 kHz.
(1) IDq = 100 mA
(2) IDq = 300 mA
(3) IDq = 500 mA
(4) IDq = 700 mA
(5) IDq = 900 mA
(6) IDq = 1100 mA
(7) IDq = 1300 mA
(8) IDq = 1500 mA
Fig 5. Power gain as a function of output power;
typical values
Fig 6. Third order intermodulation distortion as a
function of output power; typical values
P
L
(W)
0 250200100 15050
001aan870
15
18
21
Gp
(dB)
12
(8)
(7)
(6)
(5)
(4)
(3)
(2)
(1)
P
L
(W)
0 250200100 15050
001aan871
-40
-30
-50
-20
-10
IMD3
(dBc)
-60
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 8 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
8. Test information
8.1 Reliability
MTTF (Years)
The reliability at pulsed conditions can be calculated as follows: MTTF x 1 / .
(1) Tj = 130 C
(2) Tj = 140 C
(3) Tj = 150 C
(4) Tj = 160 C
(5) Tj = 170 C
Fig 7. Electromigration (IDS(DC), total device)
001aao402
DS(DC)
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 9 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
9. Package outline
Fig 8. Package outline SOT1121A
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT1121A
09-10-12
10-02-02
Flanged LDMOST ceramic package; 2 mounting holes; 4 leads SOT1121A
E1
Q
E
c
D
A
F
D1
A
B
C
q
e
H1
U1
U2
H
Cw2
b
Aw1B
p
21
4
5
3
sot1121a_po
Unit(1)
mm
max
nom
min
4.75
3.45
3.94
3.68
0.18
0.10
20.02
19.61
19.96
19.66
9.53
9.27
1.14
0.89
19.94
18.92
3.38
3.12
9.91
9.65
0.25
A
Dimensions
bcDD
1EE
1
9.53
9.27
FHH
1
12.83
12.57
pQ
(2)
1.70
1.45
q
27.94
U1
34.16
33.91
U2w1
0.51
inches
max
nom
min
0.187
0.136
0.155
0.145
0.007
0.004
8.89
e
0.35
0.788
0.772
0.786
0.774
0.375
0.365
0.045
0.035
0.785
0.745
0.133
0.123
0.39
0.38
0.01
0.375
0.365
0.505
0.495
0.067
0.057
1.1
1.345
1.335
0.02
w2
0510 mm
scale
Note
1. millimeter dimensions are derived from the original inch dimensions.
2. dimension is measured 0.030 inch (0.76 mm) from the body.
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 10 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
Fig 9. Package outline SOT1121B
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT1121B
sot1121b_po
12-06-07
15-07-21
Unit(1)
mm
max
nom
min
4.75
3.45
3.94
3.68
0.18
0.08
20.02
19.61
19.96
19.66
9.53
9.27
1.14
0.89
19.94
18.92
9.91
9.65
A
Dimensions
Note
1. millimeter dimensions are derived from the original inch dimensions.
2. dimension is measured 0.030 inch (0.76 mm) from the body.
Earless flanged ceramic package; 4 leads SOT1121B
bcDD
1EE
1
9.53
9.27
FHH
1
12.83
12.57
Q
1.70
1.45
U1
20.70
20.45
U2
inches
max
nom
min
0.187
0.136
0.155
0.145
0.007
0.003
8.89
e
0.35
0.788
0.772
0.786
0.774
0.375
0.365
0.045
0.035
0.785
0.745
0.39
0.38
0.375
0.365
0.505
0.495
0.067
0.057
0.815
0.805
0.25
0.01
0.51
0.02
w2w3
0.10
0.004
y
0 5 10 mm
scale
D
H1
U1
A
F
D1D
E1
U2
H
w3
Dw2
Q
E
c
5
21
43
e
by
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 11 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
Fig 10. Package outline SOT1121E
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT1121E
sot1121e_po
14-06-12
14-06-23
inches
max
nom
min
0.187
0.136
0.155
0.145
0.788
0.772
0.786
0.774
0.375
0.365
0.375
0.365
0.563
0.555
0.055
0.039
0.815
0.805
Note
1. Millimeter dimensions are derived from the original inch dimensions.
Earless flanged LDMOST ceramic package; 4 leads SOT1121E
0.007
0.003
0.045
0.035
-0.002
-0.002
0.39
0.38
0.01 0.01
Unit(1)
mm
max
nom
min
4.75
3.45
3.94
3.68
20.02
19.61
19.96
19.66
9.53
9.27
9.53
9.27
14.3
14.1
1.38
0.98
20.70
20.45
A
12
5
34
b
Dimensions
bc
0.18
0.08
DD
1
0.35
8.89
eEE
1
αF
1.14
0.89
H
0.505
0.495
H1
12.83
12.57
LpQ
0.050
-0.050
U1U2
9.91
9.65
vw
2
0.004
y
0.25 0.25 0.10
0 5 10 mm
scale
w2B
U1B
HU2
A
vA
D1
F
c
E
E1
detail X
0.3 mm
gauge plane
Lp
Q
D
A
y
H1
e
X
α
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 12 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
10. Handling information
11. Abbreviations
12. Revision history
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 10. Abbreviations
Acronym Description
CW Continuous Wave
ESD ElectroStatic Discharge
LDMOS Laterally Diffused Metal-Oxide Semiconductor
LDMOST Laterally Diffused Metal-Oxide Semiconductor Transistor
MTF Median Time to Failure
MTTF Mean Time to Failure
SMD Surface-Mounted Device
VSWR Voltage Standing-Wave Ratio
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BLF6G13L-250P_LS-250P_LS-250PG#5 20150901 Product data sheet - BLF6G13L-250P_
6G13LS-250P v.4
Modifications: The format of this document has been redesigned to comply with the
new identity guidelines of Ampleon.
Legal texts have been adapted to the new company name where
appropriate.
BLF6G13L-250P_LS-250P_LS-250PG v.4 <tbd> Product data sheet - BLF6G13L-250P_
6G13LS-250P v.3
BLF6G13L-250P_6G13LS-250P v.3 20111014 Product data sheet - BLF6G13L-250P_
6G13LS-250P v.2
BLF6G13L-250P_6G13LS-250P v.2 20110321 Objective data sheet - BLF6G13L-250P_
6G13LS-250P v.1
BLF6G13L-250P_6G13LS-250P v.1 20101102 Objective data sheet - -
BLF6G13L-250P_LS-250P_LS-250PG#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 13 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liabilityInformation in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’ aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
Ampleon product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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Product data sheet Rev. 5 — 1 September 2015 14 of 15
BLF6G13L(S)-250P(G)
Power LDMOS transistor
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’ warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’ specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’ standard warranty and Ampleon’ product
specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own Any
reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
14. Contact information
For more information, please visit:
http://www.ampleon.com
For sales office addresses, please visit:
http://www.ampleon.com/sales
BLF6G13L(S)-250P(G)
Power LDMOS transistor
© Ampleon The Netherlands B.V. 2015. All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 1 September 2015
Document identifier: BLF6G13L-250P_LS-250P_LS-250PG#5
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Application information. . . . . . . . . . . . . . . . . . . 4
7.1 Ruggedness in class-AB operation . . . . . . . . . 4
7.2 Impedance information . . . . . . . . . . . . . . . . . . . 4
7.3 Circuit information. . . . . . . . . . . . . . . . . . . . . . . 4
7.4 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.4.1 CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.4.2 2-Carrier CW . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
8.1 Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Handling information. . . . . . . . . . . . . . . . . . . . 12
11 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
13.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
14 Contact information. . . . . . . . . . . . . . . . . . . . . 14
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15