1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
VCC−
VCC+
2OUT
2IN−
2IN+
D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
RC4558
www.ti.com
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
DUAL GENERAL-PURPOSE OPERATIONAL AMPLIFIER
Check for Samples: RC4558
1FEATURES
•Continuous Short-Circuit Protection
•Wide Common-Mode and Differential Voltage
Ranges
•No Frequency Compensation Required
•Low Power Consumption
•No Latch-Up
•Unity-Gain Bandwidth . . . 3 MHz Typ
•Gain and Phase Match Between Amplifiers
•Low Noise . . . 8 nV/√Hz Typ at 1 kHz
DESCRIPTION/ORDERING INFORMATION
The RC4558 device is a dual general-purpose operational amplifier, with each half electrically similar to the
μA741, except that offset null capability is not provided.
The high common-mode input voltage range and the absence of latch-up make this amplifier ideal for
voltage-follower applications. The device is short-circuit protected, and the internal frequency compensation
ensures stability without external components.
Table 1. ORDERING INFORMATION
TAPACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING
MSOP/VSSOP –DGK Reel of 2500 RC4558DGKR YR_(2)
PDIP –P Tube of 50 RC4558P RC4558P
Tube of 75 RC4558D
SOIC –D RC4558
0°C to 70°C Reel of 2500 RC4558DRG3
SOP –PS Reel of 2000 RC4558PSR R4558
Tube of 150 RC4558PW
TSSOP –PW R4558
Reel of 2000 RC4558PWR
MSOP/VSSOP –DGK Reel of 2500 RC4558IDGKR YS_(2)
PDIP –P Tube of 50 RC4558IP RC4558IP
Tube of 75 RC4558ID
–40°C to 85°C SOIC –D R4558I
Reel of 2500 RC4558IDR
Tube of 150 RC4558IPW
TSSOP –PW R4558I
Reel of 2000 RC4558IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) The actual top-side marking has one additional character that designates the assembly/test site.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright ©1976–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
OUT
IN+
IN−
VCC−
VCC+
RC4558
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
www.ti.com
SCHEMATIC (EACH AMPLIFIER)
2Copyright ©1976–2010, Texas Instruments Incorporated
RC4558
www.ti.com
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC+ 18
Supply voltage(2) V
VCC––18
VID Differential input voltage(3) ±30 V
VIInput voltage (any input)(2) (4) ±15 V
Duration of output short circuit to ground, one amplifier at a time(5) Unlimited
D package 97
DGK package 172
θJA Package thermal impedance(6) (7) P package 85 °C/W
PS package 95
PW package 149
TJOperating virtual junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC–.
(3) Differential voltages are at IN+ with respect to IN–.
(4) The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
(5) Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded.
(6) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) –TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(7) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions MIN MAX UNIT
VCC+ 5 15
Supply voltage V
VCC––5–15
RC4558 0 70
TAOperating free-air temperature °C
RC4558I –40 85
Copyright ©1976–2010, Texas Instruments Incorporated 3
RC4558
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
www.ti.com
Electrical Characteristics
at specified free-air temperature, VCC+ = 15 V, VCC–=–15 V TEST
PARAMETER TA(2) MIN TYP MAX UNIT
CONDITIONS(1)
25°C 0.5 6
VIO Input offset voltage VO= 0 mV
Full range 7.5
25°C 5 200
IIO Input offset current VO= 0 nA
Full range 300
25°C 150 500
IIB Input bias current VO= 0 nA
Full range 800
VICR Common-mode input voltage range 25°C±12 ±14 V
RL= 10 kΩ25°C±12 ±14
VOM Maximum output voltage swing 25°C±10 ±13 V
RL= 2 kΩFull range ±10
25°C 20 300
RL≥2 kΩ,
AVD Large-signal differential voltage amplification V/mV
VO=±10 V Full range 15
B1Unity-gain bandwith 25°C 3 MHz
riInput resistance 25°C 0.3 5 MΩ
CMRR Common-mode rejection ratio 25°C 70 90 dB
VCC =±15 V
kSVS Supply-voltage sensitivity (ΔVIO/ΔVCC) 25°C 30 150 μV/V
to ±9 V
AVD = 100,
RS= 100 Ω,
VnEquivalent input noise voltage (closed loop) 25°C 8 nV/√Hz
f = 1 kHz,
BW = 1 Hz 25°C 2.5 5.6
VO= 0,
ICC Supply current (both amplifiers) TAmin 3 6.6 mA
No load TAmax 2.3 5
25°C 75 170
VO= 0,
PDTotal power dissipation (both amplifiers) TAmin 90 200 mW
No load TAmax 70 150
Open loop 85
RS= 1 kΩ,
VO1/VO2 Crosstalk attenuation 25°C dB
f = 10 kHz
AVD = 100 105
(1) All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified.
(2) Full range is 0°C to 70°C for RC4558 and –40°C to 85°C for RC4558I.
Operating Characteristics
VCC+ = 15 V, VCC–=–15 V, TA= 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
trRise time VI= 20 mV, RL= 2 kΩ, CL= 100 pF 0.13 ns
Overshoot VI= 20 mV, RL= 2 kΩ, CL= 100 pF 5 %
SR Slew rate at unity gain VI= 10 V, RL= 2 kΩ, CL= 100 pF 1.1 1.7 V/μs
4Copyright ©1976–2010, Texas Instruments Incorporated
0
1
2
3
4
5
6
0 2 4 6 8 10 12 14 16 18 20
VCC – Supply Voltage – V
ICC – Supply Current – mA
0
1
2
3
4
5
6
-55 -35 -15 5 25 45 65 85 105 125
TA– Temperature – °C
ICC – Supply Current – mA
-20
-10
0
10
20
30
40
100 1000 10000
f – Frequency – kHz
Gain – dB
-200
-180
-160
-140
-120
-100
-80
-60
-40
-20
0
Phase – deg
Gain
Phase
-20
-10
0
10
20
30
40
100 1000 10000
f – Frequency – kHz
Gain – dB
-200
-180
-160
-140
-120
-100
-80
-60
-40
-20
0
Phase – deg
Gain
Phase
RC4558
www.ti.com
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
TYPICAL CHARACTERISTICS
SUPPLY CURRENT SUPPLY CURRENT
vs vs
SUPPLY VOLTAGE TEMPERATURE
(TA= 25°C) (VCC =±15 V)
GAIN AND PHASE GAIN AND PHASE
vs vs
FREQUENCY FREQUENCY
(VCC =±15 V, RL= 2 kΩ, CL= 22 pF) (VCC =±15 V, RL= 10 kΩ, CL= 22 pF)
Copyright ©1976–2010, Texas Instruments Incorporated 5
110 100 1k 10k 100k 1M
-15
-10
-5
0
5
10
15
6 8 10 12 14 16 18
VCC – Supply Voltage – V
VOM – Output Voltage Swing – V
12
14
16
18
20
22
24
26
28
30
32
100 1000 10000
Rload – Load Resistance –
VOM – Output Voltage Swing – V
R – Load Resistance –
LW
13
13.25
13.5
13.75
14
14.25
14.5
14.75
15
-55 -35 -15 5 25 45 65 85 105 125
TA– Temperature – °C
VOM – Output Voltage Swing – V
RC4558
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
OUTPUT VOLTAGE SWING OUTPUT VOLTAGE SWING
vs vs
SUPPLY VOLTAGE FREQUENCY
(RL= 2 kΩ, TA= 25°C) (VCC =±15 V, RL= 2 kΩ, TA= 25°C)
OUTPUT VOLTAGE SWING OUTPUT VOLTAGE SWING
vs vs
LOAD RESISTANCE TEMPERATURE
(VCC =±15 V, TA= 25°C) (VCC =±15 V, RL= 10 kΩ)
6Copyright ©1976–2010, Texas Instruments Incorporated
0
10
20
30
40
50
60
70
80
90
100
110
120
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
f – Frequency – Hz
GM– Open Loop Gain – dB
100 1k 10k 100k 1M 10M
-14
-13.75
-13.5
-13.25
-13
-12.75
-12.5
-12.25
-12
-55 -35 -15 5 25 45 65 85 105 125
TA– Temperature – °C
–VOM – Output Voltage Swing – V
100
110
120
130
140
150
160
170
180
190
200
-55 -35 -15 5 25 45 65 85 105 125
TA– Temperature – °C
IIB – Input Bias Current – nA
-0.003
-0.002
-0.001
0
0.001
0.002
0.003
-55 -35 -15 5 25 45 65 85 105 125
TA– Temperature – °C
VIO – Input Offset Voltage – V
RC4558
www.ti.com
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
TYPICAL CHARACTERISTICS (continued)
NEGATIVE OUTPUT VOLTAGE SWING OPEN LOOP GAIN
vs vs
TEMPERATURE FREQUENCY
(VCC =±15 V, RL= 10 kΩ) (VCC =±15 V, RL= 2 kΩ, CL= 22 pF, TA= 25°C)
INPUT BIAS CURRENT INPUT OFFSET VOLTAGE
vs vs
TEMPERATURE TEMPERATURE
(VCC =±15 V) (VCC =±15 V)
Copyright ©1976–2010, Texas Instruments Incorporated 7
0
2
4
6
8
10
12
14
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
f – Frequency – Hz
Vn– Input Noise Voltage – nV/rt(Hz)
10 100 1k 10k 100k
V – Input Noise Voltage – nV/
nÖHz
RC4558
SLOS073F –MARCH 1976–REVISED SEPTEMBER 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
INPUT NOISE VOLTAGE
vs
FREQUENCY
(VCC =±15 V, TA= 25°C)
8Copyright ©1976–2010, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
RC4558D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM
RC4558DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558ID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IDE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
RC4558IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
RC4558IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
RC4558IPW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558IPWRE4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
RC4558IPWRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
RC4558P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
RC4558PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
RC4558PSLE OBSOLETE SO PS 8 TBD Call TI Call TI
RC4558PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558PSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558PW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI
RC4558PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4558PWRE4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
RC4558PWRG4 ACTIVE TSSOP PW 8 TBD Call TI Call TI
RC4558Y OBSOLETE DIESALE Y 0 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
RC4558DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
RC4558DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
RC4558DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
RC4558DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
RC4558DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
RC4558IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
RC4558IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
RC4558IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
RC4558IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
RC4558PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
RC4558PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
RC4558PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
RC4558DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
RC4558DR SOIC D 8 2500 367.0 367.0 35.0
RC4558DR SOIC D 8 2500 340.5 338.1 20.6
RC4558DRG4 SOIC D 8 2500 367.0 367.0 35.0
RC4558DRG4 SOIC D 8 2500 340.5 338.1 20.6
RC4558IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
RC4558IDR SOIC D 8 2500 340.5 338.1 20.6
RC4558IPWR TSSOP PW 8 2000 367.0 367.0 35.0
RC4558IPWR TSSOP PW 8 2000 364.0 364.0 27.0
RC4558PSR SO PS 8 2000 367.0 367.0 38.0
RC4558PWR TSSOP PW 8 2000 364.0 364.0 27.0
RC4558PWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2
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