MCC 26 MCD 26 Thyristor Modules Thyristor/Diode Modules ITRMS = 2x 50 A ITAVM = 2x 32 A VRRM = 800-1600 V VRSM VRRM TO-240 AA VDSM VDRM V V 900 1300 1500 1700 800 1200 1400 1600 Type 1 Version 1 B Version 8 B Version 8 B MCC 26-08io1 B MCC 26-12io1 B MCC 26-14io1 B MCC 26-16io1 B MCC 26-08io8 B MCC 26-12io8 B MCC 26-14io8 B MCC 26-16io8 B MCD 26-08io8 B MCD 26-12io8 B MCD 26-14io8 B MCD 26-16io8 B 3 Symbol Test Conditions ITRMS, IFRMS ITAVM, IFAVM TVJ = TVJM TC = 75C; 180 sine TC = 85C; 180 sine ITSM, IFSM TVJ = 45C; VR = 0 oi2dt (dv/dt)cr Maximum Ratings 50 32 27 A A A t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 520 560 A A TVJ = TVJM VR = 0 t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 460 500 A A TVJ = 45C VR = 0 t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 1350 1300 A2s A2s t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 1050 1030 2 As A2s TVJ = TVJM repetitive, IT = 45 A f =50 Hz, tP =200 ms VD = 2/3 VDRM IG = 0.45 A non repetitive, IT = ITAVM diG/dt = 0.45 A/ms 150 A/ms TVJ = TVJM VR = 0 (di/dt)cr 500 A/ms 1000 V/ms VRGM 10 V TVJ TVJM Tstg -40...+125 125 -40...+125 C C C 3000 3600 V~ V~ t = 1 min t=1s Mounting torque (M5) Terminal connection torque (M5) Weight Typical including screws 3 5 4 2 6 1 5 2 1 5 2 MCD Version 8 B tP = 30 ms tP = 300 ms Md 5 MCC Version 8 B PGAV 50/60 Hz, RMS IISOL 1 mA 3 W W W VISOL 4 MCC Version 1 B TVJ = TVJM; VDR = 2/3 VDRM RGK = ; method 1 (linear voltage rise) TVJ = TVJM IT = ITAVM 6 7 1 7 Features 10 5 0.5 PGM 6 3 2 2.5-4.0/22-35 Nm/lb.in. 2.5-4.0/22-35 Nm/lb.in. Applications DC motor control Softstart AC motor controller Light, heat and temperature control Advantages 90 International standard package, JEDEC TO-240 AA Direct copper bonded Al2O3 -ceramic base plate Planar passivated chips Isolation voltage 3600 V~ UL registered, E 72873 Gate-cathode twin pins for version 1B g Space and weight savings Simple mounting with two screws Improved temperature and power cycling Reduced protection circuits Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated. IXYS reserves the right to change limits, test conditions and dimensions (c) 2000 IXYS All rights reserved 1-4 MCC 26 MCD 26 Symbol Test Conditions Characteristic Values IRRM, IDRM TVJ = TVJM; VR = VRRM; VD = VDRM VT, VF IT, IF = 80 A; TVJ = 25C 1.64 V VT0 rT For power-loss calculations only (TVJ = 125C) 0.85 11.0 V mW VGT VD = 6 V; IGT VD = 6 V; TVJ = 25C TVJ = -40C TVJ = 25C TVJ = -40C 1.5 1.6 100 200 V V mA mA VGD IGD TVJ = TVJM; VD = 2/3 VDRM 0.2 10 V mA IL TVJ = 25C; tP = 10 ms; VD = 6 V IG = 0.45 A; diG/dt = 0.45 A/ms 450 mA 3 V 2: IGT, TVJ = 25C 3: IGT, TVJ = -40C VG 3 2 1 200 mA tgd TVJ = 25C; VD = 1/2 VDRM IG = 0.45 A; diG/dt = 0.45 A/ms 2 ms tq TVJ = TVJM; IT = 20 A, tP = 200 ms; -di/dt = 10 A/ms VR = 100 V; dv/dt = 20 V/ms; VD = 2/3 VDRM 150 ms QS IRM TVJ = TVJM; IT, IF = 25 A, -di/dt = 0.64 A/ms 50 6 mC A RthJC per per per per 5 6 1 4 4: PGAV = 0.5 W 5: PGM = IGD, TVJ = 125C TVJ = 25C; VD = 6 V; RGK = dS dA a 1: IGT, TVJ = 125C mA IH RthJK 10 0.1 100 101 5W 6: PGM = 10 W 102 103 IG mA 104 Fig. 1 Gate trigger characteristics thyristor/diode; DC current module thyristor/diode; DC current module other values see Fig. 8/9 Creepage distance on surface Strike distance through air Maximum allowable acceleration typ. 1000 0.88 0.44 1.08 0.54 K/W K/W K/W K/W 12.7 9.6 50 mm mm m/s2 TVJ = 25C s tgd typ. 100 Limit 10 Optional accessories for module-type MCC 26 version 1 B Keyed gate/cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red Type ZY 200L (L = Left for pin pair 4/5) UL 758, style 1385, Type ZY 200R (R = right for pin pair 6/7) CSA class 5851, guide 460-1-1 1 10 mA 100 1000 IG Fig. 2 Gate trigger delay time Dimensions in mm (1 mm = 0.0394") MCC Version 1 B (c) 2000 IXYS All rights reserved MCC Version 8 B MCD Version 8 B 2-4 MCC 26 MCD 26 Fig. 3 Surge overload current ITSM, IFSM: Crest value, t: duration Fig. 4 oi2dt versus time (1-10 ms) Fig. 4a Maximum forward current at case temperature Fig. 5 Power dissipation versus onstate current and ambient temperature (per thyristor or diode) Fig. 6 Three phase rectifier bridge: Power dissipation versus direct output current and ambient temperature (c) 2000 IXYS All rights reserved 3-4 MCC 26 MCD 26 Fig. 7 Three phase AC-controller: Power dissipation versus RMS output current and ambient temperature Fig. 8 Transient thermal impedance junction to case (per thyristor or diode) RthJC for various conduction angles d: d RthJC (K/W) DC 180 120 60 30 0.88 0.92 0.95 0.98 1.01 Constants for ZthJC calculation: i 1 2 3 Rthi (K/W) ti (s) 0.019 0.029 0.832 0.0031 0.0216 0.191 Fig. 9 Transient thermal impedance junction to heatsink (per thyristor or diode) RthJK for various conduction angles d: d DC 180 120 60 30 RthJK (K/W) 1.08 1.12 1.15 1.18 1.21 Constants for ZthJK calculation: i 1 2 3 4 (c) 2000 IXYS All rights reserved Rthi (K/W) ti (s) 0.019 0.029 0.832 0.2 0.0031 0.0216 0.191 0.45 4-4