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FMP20N50ES FUJI POWER MOSFET
Super FAP-E3S series N-CHANNEL SILICON POWER MOSFET
Features
Maintains both low power loss and low noise
Lower RDS(on) characteristic
More controllable switching dv/dt by gate resistance
Smaller VGS ringing waveform during switching
Narrow band of the gate threshold voltage (4.2±0.5V)
High avalanche durability
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DC converters
Maximum Ratings and Characteristics
Absolute Maximum Ratings at Tc=25°C (unless otherwise specified)
Description Symbol Characteristics Unit Remarks
Drain-Source Voltage VDS 500 V
VDSX 500 V VGS = -30V
Continuous Drain Current ID±20 A
Pulsed Drain Current IDP ±80 A
Gate-Source Voltage VGS ±30 V
Repetitive and Non-Repetitive Maximum Avalanche Current IAR 20 A Note*1
Non-Repetitive Maximum Avalanche Energy EAS 582.5 mJ Note*2
Repetitive Maximum Avalanche Energy EAR 27 mJ Note*3
Peak Diode Recovery dV/dt dV/dt 4.6 kV/µs Note*4
Peak Diode Recovery -di/dt -di/dt 100 A/µs Note*5
Maximum Power Dissipation PD
2.02 W Ta=25°C
270 Tc=25°C
Operating and Storage Temperature range Tch 150 °C
Tstg -55 to + 150 °C
Outline Drawings [mm]
Equivalent circuit schematic
Electrical Characteristics at Tc=25°C (unless otherwise specified)
Description Symbol Conditions min. typ. max. Unit
Drain-Source Breakdown Voltage BVDSS ID=250µA, VGS=0V 500 - - V
Gate Threshold Voltage VGS (th) ID=250µA, VDS =VGS 3.7 4.2 4.7 V
Zero Gate Voltage Drain Current IDSS
VDS=500V, VGS=0V Tch=25°C - - 25 µA
VDS=400V, VGS=0V Tch=125°C - - 250
Gate-Source Leakage Current IGSS VGS =±30V, VDS=0V - 10 100 nA
Drain-Source On-State Resistance RDS (on) ID=10A, VGS=10V - 0.27 0.31 Ω
Forward Transconductance gfs ID=10A, VDS =25V 5 10 - S
Input Capacitance Ciss VDS=25V
VGS=0V
f=1MHz
- 2100 3150
pFOutput Capacitance Coss - 250 375
Reverse Transfer Capacitance Crss - 15 22.5
Turn-On Time td(on) Vcc =300V
VGS=10V
ID=10A
RGS =15Ω
- 40 60
ns
tr - 38 57
Turn-Off Time td(off) - 85 127.5
tf - 17 25.5
Total Gate Charge QGVcc =250V
ID=20A
VGS=10V
- 57 85.5
nC
Gate-Source Charge QGS - 21 31.5
Gate-Drain Charge QGD - 21 31.5
Gate-Drain Crossover Charge QSW - 10 15
Avalanche Capability IAV L=1.07mH, Tch=25°C 20 - - A
Diode Forward On-Voltage VSD IF=20A, VGS=0V, Tch=25°C - 0.90 1.35 V
Reverse Recovery Time trr IF=20A, VGS=0V
-di/dt=100A/µs, Tch=25°C
- 0.5 - µs
Reverse Recovery Charge Qrr - 7.0 - µC
Note *1 : Tch≤150°C.
Note *2 : Stating Tch=25°C, I
AS
=8A, L=16.7mH, Vcc=50V, R
G
=50Ω.
E
AS
limited by maximum channel temperature and avalanche current.
See to 'Avalanche Energy' graph.
Thermal Characteristics
Description Symbol Test Conditions min. typ. max. Unit
Thermal resistance Rth (ch-c) Channel to Case 0.460 °C/W
Rth (ch-a) Channel to Ambient 62.0 °C/W