TS51231
Final Datasheet Rev 1.1
November 14, 2016
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TS51231
TRIUNE PRODUCTS
High Eciency Transmitter Driver for
Wireless Power Systems
Description
The TS51231 is a transmitter driver and output stage for
wireless charging applications. The TS51231 can support
systems up to 5W output and proprietary applications.
Switching of the TS51231 is controlled by the wireless power
transmitter controller (TS80002 or similar).
Specication
• 16 pin 3x3 QFN
Typical Application Circuit
Load
Receiver
TS51221
Transmitter
TS80002
+
TS51231
DC
Supply
Application
Processor
Features
• Supports portable wireless charging applications
• Wireless power systems up to 5W output
• Integrated gate driver and output stage
• Single pin control for switching the output stage
• Low external component count
Applications
• Low-power wireless chargers for:
Smart Watches
Wearables
Toys
Portable Lighting
Medical Devices
TS51231
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Pin-out (Top view)
SDA
SCL
nFLT
EN
SW
BOOT
NC
SW
PGND
VIN
VIN
PGND
VDD
HSON
NC
GND
Pin-out Conguration
Pin # Pin Symbol Function Description
1 EN Enable Enable
2SDA I2C Serial Data I2C Serial Data
3 SCL I2C Serial Clock I2C Serial Clock
4 nFLT Status Fault Status
5 NC Reserved Reserved
6 HSON Driver Driver high-side control
7 VDD Supply Device Supply
8 GND GND Device GND
9 NC Reserved Reserved
10 BOOT Bootstrap Pin Connected through 22nF capacitor to SW pin
11 SW Switching Node Connected to transmitter coil
12 SW Switching Node Connected to transmitter coil
13 PGND Power GND Power GND
14 PGND Power GND Power GND
15 VIN Power Supply Power Supply
16 VIN Power Supply Power Supply
17 PAD Power PAD Power GND
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Functional Block Diagram
Gate
Drive
Gate
Drive
Gate Drive
Control
SW
GND
MONITOR
&
CONTROL
Over & Under
Voltage
Protection
VIN
EN
PGND
nFLT
COUT
Lcoil
HS ON
I²C
Interface
SCL
SDA
VIN
CIN
VDD
CVDD
VDD Regulator
VIN
CBOOT
BOOT
Input
Buffer
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Final Datasheet Rev 1.1
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Absolute Maximum Ratings
Over operating free–air temperature range unless otherwise noted(1, 2)
Parameter Value Unit
VDD, EN, NFLT, SCL, SDA, HSON -0.3 to 5.5 V
VIN -0.3 to 20 V
BOOT -0.3 to 25 V
SW -1 to 20 V
Electrostatic Discharge – Human Body Model +/-2k V
Electrostatic Discharge – Charge Device Model +/-500 V
Lead Temperature (soldering, 10 seconds) 260 OC
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute–maximum–rated conditions for extended periods may aect device reliability.
(2) All voltage values are with respect to network ground terminal.
Thermal Characteristics
Symbol Parameter Value Units
ΘJA Thermal Resistance Junction to Air (Note 1) 33 - 36 °C/W
ΘJC Thermal Resistance Junction to Case (Note 1) 1.2 - 3.9 °C/W
TSTG Storage Temperature Range -65 to 150 °C
TJ MAX Maximum Junction Temperature 150 °C
TJOperating Junction Temperature Range -40 to 125 °C
Note 1: Assumes 16LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD
Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VCC Input Operating Voltage 4.2 12 16.5 V
LOUT Transmitter Coil 6.0 µH
COUT Output Filter Capacitor 100 nF
CIN Input Bypass Capacitor 100 nF
CVDD Internal Bypass Capacitor 100 nF
CBOOT Bootstrap Capacitor 22 nF
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Final Datasheet Rev 1.1
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Electrical Characteristics (T=25OC unless otherwise specied)
Electrical Characteristics, TJ = -40C to 125C (unless otherwise noted)
Parameter Symbol Conditions Min. Typ. Max. Units
Output Stage
High Side Switch On Resistance
RDSON
ISW = -1A, TJ=25C 100 mΩ
Low Side Switch On Resistance ISW = 1A, TJ=25C 100 mΩ
Max Output Current IOUT 2.0 A
Over Current Detect IOCD HS switch current 2.5 A
VDD LDO Output
LDO Output Voltage VLDO 4.75 5.0 5.25 V
LDO Output Current ILDO 50 mA
Drop Out Voltage LDODO Vin=5V, Iout=50mA 400 mV
Functional Description
Switching of the TS51231 transmitter driver is controlled by the wireless transmitter controller via the HSON pin. When the HSON
pin is high, the high-side FET is switched on and the low-side FET is switched o. When the HSON pin is low, the high-side FET is
switched o and the low-side FET is switched on.
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Final Datasheet Rev 1.1
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Application Schematic
1
1
2
2
3
3
4
4
D D
C C
B B
A A
1
200 Flynn Road
Camarillo, CA 93012
www.semtech.com
1
Wireless Power TX (Low Power)
2.0
11/11/2016 10:11:48 AM
Title
Size: Number:
Date:
Revision:
Sheet ofTime:
Letter
5V 0.5W/1W
Semtech Proprietary and Confidential Information.
Do not distribute or copy.
NRST
1
GPIO1
2
GPIO2
3
VSS
4
LDO
5VDD
6
ALERT 7
SDA8
SCL 9
PWM1_L 10
PWM2_L 11
GPIO3
12
PWM1_H 13
PWM2_H 14
DEBUG
15
V_AC 16
I_DC 17
GPIO418
VREF19
V_DC 20
U1
TS80002
1uF
6.3V
C5
GND
VCC5V
1uF
6.3V
C3
GND
10nF
10V
C4
GND
RESET
DEBUG
TP1
TP2
TP3
TP4
GND
VCC5V
RESET
DEBUG
SW 11
VIN 15
NC 5
GND
8
EN
1
nFLT
4
VDD
7
HSON
6
VIN 16
SCL
3
SDA
2
SW 12
PGND 13
PGND 14
PAD17
NC 9
BOOT 10
U2
TS51231
VCC5V
100nF
10V
C2
22uF
6.3V
C1
GND
100nF
10V
C7
GND
4.7nF
50V
C6
GND
GNDGND GND
1nF
100V
C9
330K
R7
22K
R8
D1
100nF
10V
C8
Coil Feedback
1K
R9
4.7nF
100V
C10
1K
R11
10K
R10
10K
R12
1nF
10V
C11
GND GND RX -> TX Communication
100nF
10V
C12
VCC5V
GND
DONE
22uF
6.3V
C17
GND
22nF
10V
C18
4.7nF
50V
C16
NC
C19
22uF
6.3V
C21
DONE TP5
AC1
AC2
SMB_SCL
SMB_SDA
VBUS
1
D-
2
D+
3
GND
5
x
4
SHLD 6
7
8
9
J1
5V IN
GND
VCC5V
TX Coil
AC1
AC2
1K
R20
GND
1 2
J2
LED 0805
LED1
GREEN
1
2
3
4
J3
Header 4
VCC5V
GND
SMB_SDA
SMB_SCL
Figure 1: TS80002 Application Schematic
TS51231
Final Datasheet Rev 1.1
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Package Mechanical Drawings (all dimensions in mm)
Units Millimeters
Dimensions Limits MIN NOM MAX
Number of Pins N 16
Pitch e 0.50 BSC
Overall Height A 0.80 0.90 1.00
Stando A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Length D 3.00 BSC
Exposed Pad Width E2 1.55 1.70 1.80
Overall Width E 3.00 BSC
Exposed Pad Length D2 1.55 1.70 1.80
Contact Width b 0.20 0.25 0.30
Contact Length L 0.20 0.30 0.40
Contact-to-Exposed Pad K 0.20 - -
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Final Datasheet Rev 1.1
November 14, 2016
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Recommended PCB Land Pattern
Units Millimeters
Dimensions Limits MIN NOM MAX
Contact Pitch E 0.50 BSC
Optional Center Pad Width W2 - - 1.70
Optional Center Pad Length T2 - - 1.70
Contact Pad Spacing C1 - 3.00 -
Contact Pad Spacing C2 - 3.00 -
Contact Pad Width (X16) X1 - - 0.35
Contact Pad Length (X16) Y1 - - 0.65
Distance Between Pads G 0.15 - -
RECOMMENDED
LAND PATTERN
Silk Screen
Notes:
Dimensions and tolerances per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact values shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information only
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Final Datasheet Rev 1.1
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Ordering Information
Part Number Description
TS51231-MQFNR Transmitter Driver
RoHS and Reach Compliance
Triune Systems is fully committed to environmental quality.
All Triune Systems materials and suppliers are fully compliant
with RoHS (European Union Directive 2011/65/EU), REACH
SVHC Chemical Restrictions (EC 1907/2006), IPC-1752 Level
3 materials declarations, and their subsequent amendments.
Triune Systems maintains certied laboratory reports for
all product materials, from all suppliers, which show full
compliance to restrictions on the following:
• Cadmium (Cd)
• Chlorouorocarbons (CFCs)
• Chlorinate Hydrocarbons (CHCs)
• Halons (Halogen free)
• Hexavalent Chromium (CrVI)
• Hydrobromouorocarbons (HBFCs)
• Hydrochlorouorocarbons (HCFCs)
• Lead (Pb)
• Mercury (Hg)
• Peruorocarbons (PFCs)
• Polybrominated biphenyls (PBB)
• Polybrominated Diphenyl Ethers (PBDEs)
TS51231
Final Datasheet Rev 1.1
November 14, 2016
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Contact Information
Semtech Corporation
Triune Products
1101 Resource Dr. Suite 121, Plano, Texas 75074
Phone: (972) 231-1606
For general inquiries, sales and technical supports:
www.semtech.com/contact
Important Notice
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided
as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves
the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before
placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specications
applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS,
DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY,
LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD
TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized
application, the customer shall indemnify and hold Semtech and its ocers, employees, subsidiaries, aliates, and distributors harmless against
all claims, costs damages and attorney fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be
marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described
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