ISSUE 1 - MARCH 2001
ZVN4525E6
4
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated).
PARAMETER SYMBOL MIN. TYP. MAX. UNI
TCONDITIONS.
STATIC
Drain-Source Breakdown Voltage V(BR)DSS 250 285 V ID=1mA, VGS=0V
Zero Gate Voltage Drain Current IDSS 35 500 nA VDS=250V, VGS=0V
Gate-Body Leakage IGSS ±1 ±100 nA VGS=±40V, VDS=0V
Gate-Source Threshold Voltage VGS(th) 0.8 1.4 1.8 V ID=1mA, VDS=V
GS
Static Drain-Source On-State Resistance (1) RDS(on) 5.6
5.9
6.4
8.5
9.0
9.5
Ω
Ω
Ω
VGS=10V, ID=500mA
VGS=4.5V, ID=360mA
VGS=2.4V, ID=20mA
Forward Transconductance (3) gfs 0.3 0.475 S VDS=10V,ID=0.3A
DYNAMIC (3)
Input Capacitance Ciss 72 pF VDS=25V,V
GS=0V,
f=1MHz
Output Capacitance Coss 11 pF
Reverse Transfer Capacitance Crss 3.6 pF
SWITCHING(2) (3)
Turn-On Delay Time td(on) 1.25 ns VDD =30V, ID=360mA
RG=50Ω,V
qs=10V
(refer to test circuit)
Rise Time tr1.70 ns
Turn-Off Delay Time td(off) 11.40 ns
Fall Time tf3.5 ns
Total Gate Charge Qg2.6 3.65 nC VDS=25V,VGS=10V,
ID=360mA(refer to
test circuit)
Gate-Source Charge Qgs 0.2 0.28 nC
Gate Drain Charge Qgd 0.5 0.70 nC
SOURCE-DRAIN DIODE
Diode Forward Voltage (1) VSD 0.97 V Tj=25°C, IS=360mA,
VGS=0V
Reverse Recovery Time (3) trr 186 260 ns Tj=25°C, IF=360mA,
di/dt= 100A/µs
Reverse Recovery Charge (3) Qrr 34 48 nC
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.