INTEGRATED CIRCUITS DIVISION
XS170
Multifunction Telecom Switch
www.ixysic.com
DS-XS170-R03 1
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Applications
Features
Description
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• FCC Compatible
• VDE Compatible
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount and Tape & Reel Versions Available
Parameter Rating Units
Blocking Voltage 350 VP
Load Current 100 mArms / mADC
On-Resistance (max) 50
Ordering Information
Part # Description
XS170 8-Pin DIP (50/Tube)
XS170P 8-Pin Flatpack (50/Tube)
XS170PTR 8-Pin Flatpack (50/Tube)
XS170S 8-Pin Surface Mount (50/Tube)
XS170STR 8-Pin Surface Mount (1000/Reel)
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Approvals
1
2
3
4
8
7
6
5
+ LED - Relay
– LED - Relay
Collector - Phototransistor
Emitter - Phototransistor
Load - Relay (MOSFET Output)
Load - Relay (MOSFET Output)
LED - Phototransistor –/+
LED - Phototransistor +/–
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950 Certified Component:
TUV Certificate: B 10 05 49410 006
The XS170 integrated circuit device combines a
350V, 100mA, 50, normally open (1-Form-A) relay
with an optocoupler in a single package. The relay
uses optically coupled MOSFET technology to
provide 3750Vrms of input to output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Telecom circuit designers, using the XS170, can now
take advantage of two discrete functions in a single
component that uses less space than traditional
discrete component solutions.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R03
XS170
Absolute Maximum Ratings @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Ratings Units
Relay Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Power Dissipation 1150 mW
Relay Input Control Current 50 mA
Peak (10ms) 1 A
Detector Input Control Current 100 mA
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Electrical Characteristics @25ºC: Relay Section
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current, Continuous
Continuous - IL- - 100 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance IL=120mA RON -3350
Off-State Leakage Current VL=350V ILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --5 ms
Turn-Off toff --5
Output Capacitance VL=50V, f=1MHz COUT -25 - pF
Input Characteristics
Input Control Current to Activate IL=120mA IF--2 mA
Input Control Current to Deactivate - IF0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance - CI/O -3 - pF
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Blocking Voltage IC=10ABV
CEO 20 50 - V
Phototransistor Dark Current VCE=5V, IF=0mA ICEO - 50 500 nA
Saturation Voltage IC=2mA, IF=16mA VSAT - 0.3 0.5 V
Current Transfer Ratio IF=6mA, VCE=0.5V CTR 33 100 - %
Input Characteristics
Input Control Current IC=2mA, VCE=0.5V IF-26mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Input Current (Detector must be off) IC=1A, VCE=5V IF525 -A
Isolation, Input to Output - VI/O 3750 - - Vrms
Common Characteristics
Input to Output Capacitance - CI/O -3 -pF
Electrical Characteristics @25ºC: Detector Section
INTEGRATED CIRCUITS DIVISION
XS170
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R03
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical Turn-On Time
(N=50, IL=100mADC)
0.67 0.83 0.99 1.140.75 0.91 1.06
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IL=100mADC)
0.11 0.17 0.22 0.280.250.190.14
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=100mADC)
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Dropout
(N=50, IL=100mADC)
25
20
15
10
5
0
0.50 0.62 0.750.44 0.56 0.69 0.81
LED Current (mA)
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=100mADC)
25
20
15
10
5
0
29.09 30.63 32.16 33.7029.86 31.40 32.93
On-Resistance (:)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
25
20
15
10
5
0
424.0 434.5 444.9 455.4429.3 439.7 450.1
Blocking Voltage (VP)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
Forward Voltage (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R03
XS170
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
Temperature (ºC)
IF=5mA
IF=10mA
IF=20mA
Turn-On Time (ms)
-40
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100 120
Typical Turn-Off Time
vs. Temperature
(IL=120mADC)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100 120
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
Temperature (ºC)
On-Resistance (:)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100 120
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
Typical IF for Switch Dropout
vs. Temperature
(IF=100mADC)
Temperature (ºC)
LED Current (mA)
-40
6
5
4
3
2
1
0
-20 0 20 40 60 80 100 120
Maximum Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
160
140
120
100
80
60
40
20
0
-40 -20 0 20 40 60 80 120100
IF=10mA
IF=5mA
IF=2mA
Typical Load Current
vs. Load Voltage
(IF=5mA)
Load Voltage (V)
Load Current (mA)
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120 -3-4 -2 -1 0 1 2 3 4
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
455
450
445
440
435
430
425
420
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 4&6
Temperature (ºC)
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
INTEGRATED CIRCUITS DIVISION
XS170
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R03
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
DETECTOR PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Normalized CTR
vs. Forward Current
(VCE=0.5V)
Forward Current (mA)
Normalized CTR (%)
02 4 6 8 10 12 14 16 18
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
020
Typical Normalized CTR
vs. Temperature
(VCE=0.5V)
Temperature (ºC)
Normalized CTR (%)
8
7
6
5
4
3
2
1
0-40 -20 0 20 40 60 80 120100
I
F
=1mA
I
F
=2mA
I
F
=5mA
I
F
=10mA
I
F
=15mA
I
F
=20mA
Typical Collector Current
vs. Forward Current
(VCE=0.5V)
Forward Current (mA)
Collector Current (mA)
02468 1210 14 16 18 20
12
10
8
6
4
2
0
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R03
XS170
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
XS170 / XS170P / XS170S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
XS170P 260ºC for 30 seconds
XS170 / XS170S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
XS170
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R03
XS170
XS170S
Mechanical Dimensions
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
XS170P
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
INTEGRATED CIRCUITS DIVISION
Specification: DS-XS170-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
For additional information please visit our website at: www.ixysic.com
8
XS170
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
XS170STR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
XS170PTR Tape & Reel
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
