LINEAR INTEGRATED CIRCUIT CHIPS GENERAL DESCRIPTION Motorola now offers a very broad selection of linear integrated circuit chips. Among the types of circuits which compose the linear family there are: . Operational Amplifiers Voltage Regulators Comparators . Drivers and Receivers . Sense Amplifiers . D/A and A/D Converters As a general rule of thumb, all linear chips from Motorola are 100% unit probed to the D.C. parameters given in Volume 6 of the Semiconductor Data Library. Far specific information on electrical parameters which are probed contact the nearest Motorola Sales Office. mmooOmp STANDARD FEATURES FOR LINEAR INTEGRATED CIRCUIT CHIPS All linear integrated circuit chips... are 100% electrically tested to sufficient param- eter limits (min/max) to permit distinct identi- fication as either premium or industrial versions @ employ phosphorsilicate passivation which pro- tects the entire active surface area including metallization interconnects during shipping and handling : @ are 100% visually inspected to a modified cri- teria per MIL-STD-883, Method 2010, Condi- tion B @ incorporate a minimum of 4000 A gold backing to ensure positive adherence bonding GENERAL PHYSICAL CHARACTERISTICS OF LINEAR CHIPS The following characteristics represent the vast majority of all Motorola linear chips. Since an indi- vidual chip type may vary slightly, contact your local sales office for information regarding physical charac- teristics critical to a specific application. The overall size and final metallization patterns are shown in the following pages; however the geometries shown and MIC numbers listed are current at the date of print- ing. Since we are constantly striving to improve the quality, performance, and yield of our linear devices we cannot be responsible for changes at future dates. Please contact your local Motorola Sales representative for the most current information. A. Chips thickness: 8 + 1 mil B. Passivation: Phosphorsilicate C. Passivation thickness: 5kA + 1k D. Metallization: Aluminum E. Metallization thickness: 12kA + 2kA F. Back metallization: Gold, alloyed G. Bonding pad dimensions: Typical 4.0 mil x 5.0 mil H. Overall chip dimensions: See pages that follow for individual device type. Tolerance of +5 mils should be allowed. HANDLING PRECAUTIONS Although passivation on all chips provides protec- tion in shipping and handling, care should be exercised to prevent damaging the face of the chip. A vacuum pickup is most useful for this purpose; tweezers are not recommended. There are four basic requirements for handling devices in a prudent manner: 1. Store the chips in a covered or sealed container 2. Store devices in an environment of no more than 30% relative humidity 3. Process the chips in a non-inert atmosphere not exceeding 100C, or in an inert atmosphere not exceeding 400C. 4. Processing equipment should conform to the minimum standards that are normally em- ployed by semiconductor manufacturers. Motorolas engineering staff is available for consul- tation in the event of correlation or processing prob- lems encountered in the use of Motorola linear chips. For assistance, please contact your nearest Motorola sales representative. CHIP AND WAFER PACKAGING Chips Motorolas linear integrated circuit chips come Packaged to the customer in the Multi-Pak carrier. Refer to page 1-11, Figure 7. Wafers Motorolas linear integrated circuit wafers come packaged to the customer in the Wafer-Pak plastic bow. The wafer has been probed and rejects are designated by a red color dot on the die surface. Refer to page 1-8, Figure 2. HOW TO ORDER LINEAR CHIPS OR WAFERS FROM MOTOROLA 1. Remove all suffix package designators from the desired device type. (EXAMPLE: MC1741CP1 now becomes MC1741C) 2. Add a C to the prefix designator if individual chips are desired. (EXAMPLE: MC1741C now is McC1741C) Add a W to the prefix designator if a wafer is de- sired. (EXAMPLE: MC1741C now is MCW1741C) 3. When ordering chips, two options are available: a. The ~1 suffix designator will deliver to you 10 chips per Multi-Pak, up to 1000 chips. (EXAMPLE: MCC1741C-1} 5-2 MTTLMSI (continued) Type Wafer Chip Mask Size 0 to 75C 55 to +125C Function Set # | (Mils) MCC74151 MCC54151 8 Channel Data Selector/Multiplexer 13W 60x65 MCC74152 MCC54152 8 Channel Data Selector/Multiplexer 13W 60x65 MCC74153 MCC54153 Dual 4 Line to 1 Line Data Selector/Multiplexer 02T 52x60 MCC74154 MCC54154 4 Line to 16 Line Decoder/Demultiplexer 11T 77x87 MCC74155 MCC54155 Dual 2-to-4 Line Decoder/1 -to-4 Line Demultiplexer 66V 66x71 MCC74156 MCC54156 Dual 2-to-4 Line Decoder/1 -to-4 Line Demultiplexer 66V 66x71 MCC74157 MCC54157 Quad 2-Input Data Selector/Multiplexer 62V 52x57 MCC74160 MCC54160 Decade Synchronous Counter 8GK 78x99 MCC74161 MCC54161 Synchronous 4-Bit Binary Counter 8GK 78x99 MCC74162 MCC54162 Synchronous Decade Counter 8GK 78x99 MCC74163 MCC54163 Synchronous 4-Bit Binary Counter 8GK 78x99 MCC74164A MCC54164A 8 Bit Parallel-Out Serial Shift Register 20T 65x92 MCC74165 MCC54165 Parallel-Load 8-Bit Shift Register SET 73x80 MCC74167 MCC54167 Decade Rate Multiplexer (Synchronous) 7MG 44x101 MCC74174 MCC54174 Hex Type D Flip-Flop 5KS 78x88 MCC74175 MCC54175 Quadruple D Type Flip-Flop 5KS 78x88 MCC74176 MCC54176 Preset. Decade and Binary Counters/Latches 5GD 72x78 MCC74177 MCC54177 Preset. Decade and Binary Counter/Latch 5GD 72x78 MCC74180 MCC54180 8-Bit Odd/Even Parity Generator/Checker 17R 56x60 MCC74181 MCC54181 4-Bit ALU/Function Generator 4DW 87x89 MCC74182 MCC54182 Look Ahead Carry Generator 37V 62x55 MCC74190 MCC54190 BCD Synchronous Up/Down Counter 9GK 74x113 MCC74191 MCC54191 4 Bit Binary Synchronous Up/Down Counter 8RV 74x113 MCC74192 MCC54192 Preset. Decade Up/Down Counter 8RV 74x113 MCC74193 MCC54193 Preset. 4-Bit Binary Up/Down Counter 8RV 74x113 MCC74194 MCC54194 4-Bit Bidirectional Universal Shift Register 8FP 89x70 MCC74195 MCC54195 4-Bit Parallel Access Shift Register SFP 89x70 MCC74196 MCC54196 Preset. Decade or Binary Counter/Latch 5GD 72x78 MCC74197 MCC54197 Preset. Decade or Binary Counter/Latch 5GD 72x78 MCC74221 MCC54221 Dual Monostable Multivibrator w/Schmitt-Trigger Inputs | 5NG 59x80 MCC74290 MCC54290 Decade Counter 3HT 69x71 MCC74293 MCC54293 4-Bit Binary Counter 3HT 69x71 MCC74298 MCC54298 Quadruple 2-Input Multiplexer w/Storage 8FP 89x70 7-141 MTTL MSI MCC5400/7400 Series (continued) MCC74191/MCC54191 4 Bit Binary Synchronous Up/Down Counter 74x 113 (8RV) PIN CONNECTIONS CONSULT FACTORY i y | y LA BC OD 4deE 141cP MAX/MIN |}12 5{DN/UP R/C Op Ag Ac Ap Pitty 133 2 6 Vcc = Pin 16 GND = Pin8 MCC74192/MCC54192 Presettable Decade Up/Down Counter 74x 113 (8RV) PIN CONNECTIONS 11.15 1 10 9 CONSULT FACTORY PL fa fe Fe 5CcR, TCO YO12 41cr, TCpyo-13 MR OA Op Oc AH 14 392 6 #7 Voc = Pin 16 GND =Pin8 7-169