SEMiX202GB066HDs
© by SEMIKRON Rev. 0 16.04.2010 1
SEMiX® 2s
GB
Trench IGBT Modules
SEMiX202GB066HDs
Features
Homogeneous Si
Trench = Trenchgate technology
•V
CE(sat) with positive temperature
coefficient
UL recognised file no. E63532
Typical Applications*
Matrix Converter
Resonant Inverter
Current Source Inverter
Remarks
Case temperature limited to TC=125°C
max.
Product reliability results are valid for
Tj=150°C
For short circuit: Soft RGoff
recommended
Take care of over-voltage caused by
stray inductance
Absolute Maximum Ratings
Symbol Conditions Values Unit
IGBT
VCES 600 V
ICTj= 175 °C Tc=2C 274 A
Tc=8C 207 A
ICnom 200 A
ICRM ICRM = 2xICnom 400 A
VGES -20 ... 20 V
tpsc
VCC = 360 V
VGE 15 V
VCES 600 V
Tj= 150 °C s
Tj-40 ... 175 °C
Inverse diode
IFTj= 175 °C Tc=2C 291 A
Tc=8C 214 A
IFnom 200 A
IFRM IFRM = 2xIFnom 400 A
IFSM tp= 10 ms, sin 180°, Tj=2C 1000 A
Tj-40 ... 175 °C
Module
It(RMS) 600 A
Tstg -40 ... 125 °C
Visol AC sinus 50Hz, t = 1 min 4000 V
Characteristics
Symbol Conditions min. typ. max. Unit
IGBT
VCE(sat) IC=200A
VGE =15V
chiplevel
Tj=2C 1.45 1.85 V
Tj= 150 °C 1.7 2.1 V
VCE0 Tj=2C 0.9 1 V
Tj= 150 °C 0.85 0.9 V
rCE VGE =15V Tj=2C 2.8 4.3 m
Tj= 150 °C 4.3 6.0 m
VGE(th) VGE=VCE, IC=3.2mA 5 5.8 6.5 V
ICES VGE =0V
VCE =600V
Tj=2C 0.15 0.45 mA
Tj= 150 °C mA
Cies VCE =25V
VGE =0V
f=1MHz 12.3 nF
Coes f=1MHz 0.77 nF
Cres f=1MHz 0.37 nF
QGVGE =- 8 V...+ 15 V 1600 nC
RGint Tj=2C 1.00
td(on) VCC = 300 V
IC=200A
RG on =4.2
RG off =4.2
Tj= 150 °C 65 ns
trTj= 150 °C 80 ns
Eon Tj= 150 °C 6mJ
td(off) Tj= 150 °C 545 ns
tfTj= 150 °C 95 ns
Eoff Tj= 150 °C 8mJ
Rth(j-c) per IGBT 0.21 K/W
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SEMiX202GB066HDs
2 Rev. 0 16.04.2010 © by SEMIKRON
Characteristics
Symbol Conditions min. typ. max. Unit
Inverse diode
VF = VEC IF=200A
VGE =0V
chip
Tj=2C 1.4 1.60 V
Tj= 150 °C 1.4 1.6 V
VF0 Tj=2C 0.9 1 1.1 V
Tj= 150 °C 0.75 0.85 0.95 V
rFTj=2C 1.5 2.0 2.5 m
Tj= 150 °C 2.3 2.8 3.3 m
IRRM IF=200A
di/dtoff = 3900 A/µs
VGE =-8V
VCC = 300 V
Tj= 150 °C 205 A
Qrr Tj= 150 °C 28 µC
Err Tj= 150 °C 6.5 mJ
Rth(j-c) per diode 0.27 K/W
Module
LCE 18 nH
RCC'+EE' res., terminal-chip TC=2C 0.7 m
TC= 125 °C 1m
Rth(c-s) per module 0.045 K/W
Msto heat sink (M5) 3 5 Nm
Mtto terminals (M6) 2.5 5 Nm
Nm
w250 g
Temperatur Sensor
R100 Tc=100°C (R25=5 k) 493 ± 5%
B100/125
R(T)=R100exp[B100/125(1/T-1/T100)];
T[K];
3550
±2% K
SEMiX® 2s
GB
Trench IGBT Modules
SEMiX202GB066HDs
Features
Homogeneous Si
Trench = Trenchgate technology
•V
CE(sat) with positive temperature
coefficient
UL recognised file no. E63532
Typical Applications*
Matrix Converter
Resonant Inverter
Current Source Inverter
Remarks
Case temperature limited to TC=125°C
max.
Product reliability results are valid for
Tj=150°C
For short circuit: Soft RGoff
recommended
Take care of over-voltage caused by
stray inductance
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SEMiX202GB066HDs
© by SEMIKRON Rev. 0 16.04.2010 3
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic
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SEMiX202GB066HDs
4 Rev. 0 16.04.2010 © by SEMIKRON
Fig. 7: Typ. switching times vs. ICFig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Typ. transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11: Typ. CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode recovery charge
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SEMiX202GB066HDs
© by SEMIKRON Rev. 0 16.04.2010 5
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
SEMiX 2s
spring configuration
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