LM26CIM5-DPB/NOPB - Texas Instruments High-Performance Analog

LM26

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SNIS115R –MAY 2001–REVISED FEBRUARY 2013

LM26 SOT-23, ±3°C Accurate, Factory Preset Thermostat

Check for Samples: LM26

1FEATURES DESCRIPTION

The LM26 is a precision, single digital-output, low-

2• Internal Comparator With Pin Programmable power thermostat comprised of an internal reference,

2°C or 10°C Hysteresis DAC, temperature sensor and comparator. Utilizing

• No External Components Required factory programming, it can be manufactured with

• Open Drain or Push-Pull Digital Output; different trip points as well as different digital output

functionality. The trip point (TOS) can be preset at the

Supports CMOS Logic Levels factory to any temperature in the range of −55°C to

• Internal Temperature Sensor With VTEMP +110°C in 1°C increments. The LM26 has one digital

Output Pin output (OS/OS/US/US), one digital input (HYST) and

• VTEMP Output Allows After-Assembly System one analog output (VTEMP). The digital output stage

Testing can be preset as either open-drain or push-pull. In

addition, it can be factory programmed to be active

• Internal Voltage Reference and DAC for Trip- HIGH or LOW. The digital output can be factory

Point Setting programmed to indicate an over temperature

• Currently Available in 5-pin SOT-23 Plastic shutdown event (OS or OS) or an under temperature

Package shutdown event (US or US). When preset as an

• Excellent Power Supply Noise Rejection overtemperature shutdown (OS) it will go LOW to

indicate that the die temperature is over the internally

• UL Recognized Component preset TOS and go HIGH when the temperature goes

below (TOS–THYST). Similarly, when preprogrammed

APPLICATIONS as an undertemperature shutdown (US) it will go

• Microprocessor Thermal Management HIGH to indicate that the temperature is below TUS

and go LOW when the temperature is above

• Appliances (TUS+THYST). The typical hysteresis, THYST, can be set

• Portable Battery Powered Systems to 2°C or 10°C and is controlled by the state of the

• Fan Control HYST pin. A VTEMP analog output provides a voltage

that is proportional to temperature and has a

• Industrial Process Control −10.82mV/°C output slope.

• HVAC Systems Available parts are detailed in the ordering

• Remote Temperature Sensing information. For other part options, contact a Texas

• Electronic System Protection Instruments Distributor or Sales Representative for

information on minimum order qualification. The

KEY SPECIFICATIONS LM26 is currently available in a 5-lead SOT-23

package.

• Power Supply Voltage 2.7V to 5.5V

• Power Supply Current 40μA (max) 20μA (typ) Table 1. Temperature Trip Point Accuracy

• Hysteresis Temperature 2°C or 10°C (typ) Temperature Range LM26CIM

−55°C to +110°C ±3°C (max)

+120°C ±4°C (max)

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM26TPA V+ = 2.7V

to 5.5V

VTEMP

GND

HYST OS

HYST

REF

TEMP

SENSOR

HYST=GND for 10°C Hysteresis

HYST = V+ for 2°C Hysteresis

VTEMP = (-3.479 x 10-6 x (T-30)2) + (-1.082 x 10-2 x (T-30)) + 1.8015V

TOS

TOS - THYST

Temp. of

Leads

LM26

SNIS115R –MAY 2001–REVISED FEBRUARY 2013

www.ti.com

LM26CIM5-TPA Simplified Block Diagram and Connection Diagram

The LM26CIM5-TPA has a fixed trip point of 85°C. For other trip point and output function availability, please see

ordering information or contact Texas Instruments.

Connection Diagram

Pin Descriptions

Pin Pin Function Connection

Number Name

1 HYST Hysteresis control, digital input GND for 10°C or V+for 2°C

Ground, connected to the back side of the die

2 GND System GND

through lead frame.

3 VTEMP Analog output voltage proportional to temperature Leave floating or connect to a high impedance node.

2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR

4 V+Supply input information see Section Titled NOISE CONSIDERATIONS.

Overtemperature Shutdown open-drain active low Controller interrupt, system or power supply shutdown; pull-up

OS thermostat digital output resistor ≥10kΩ

OS Overtemperature Shutdown push-pull active high Controller interrupt, system or power supply shutdown

thermostat digital output

5(1) US Undertemperature Shutdown open-drain active System or power supply shutdown; pull-up resistor ≥10kΩ

low thermostat digital output

US Undertemperature Shutdown push-pull active System or power supply shutdown

high thermostat digital output

(1) Pin 5 functionality and trip point setting are programmed during LM26 manufacture.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM26

LM26

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SNIS115R –MAY 2001–REVISED FEBRUARY 2013

Absolute Maximum Ratings (1)

Input Voltage 6.0V

Input Current at any pin (2) 5mA

Package Input Current (2) 20mA

Package Dissipation at TA= 25°C

(3) 500mW

Soldering Information(4)

SOT-23 Package

Vapor Phase (60 seconds) 215°C

Infrared (15 seconds) 220°C

Storage Temperature −65°C to + 150°C

ESD Susceptibility (5)

Human Body Model 2500V

Machine Model 250V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see

the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics

may degrade when the device is not operated under the listed test conditions.

(2) When the input voltage (VI) at any pin exceeds the power supply (VI< GND or VI> V+), the current at that pin should be limited to 5mA.

The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input

current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each.

(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX (maximum junction temperature),

θJA (junction to ambient thermal resistance) and TA(ambient temperature). The maximum allowable power dissipation at any

temperature is PD= (TJMAX–TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJMAX

= 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow:

(4) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.

(5) The human body model is a 100pF capacitor discharge through a 1.5kΩresistor into each pin. The machine model is a 200pF capacitor

discharged directly into each pin.

Operating Ratings (1)

Specified Temperature Range TMIN ≤TA≤TMAX

LM26CIM −55°C ≤TA≤+125°C

Positive Supply Voltage (V+) +2.7V to +5.5V

Maximum VOUT +5.5V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see

the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics

may degrade when the device is not operated under the listed test conditions.

Product Folder Links: LM26

LM26

SNIS115R –MAY 2001–REVISED FEBRUARY 2013

www.ti.com

LM26 Electrical Characteristics

The following specifications apply for V+= 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified.

Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ= 25°C unless otherwise specified.

LM26CIM

Symbol Parameter Conditions Typical (1) Units (Limits)

Limits (2)

Temperature Sensor

Trip Point Accuracy (Includes VREF, DAC, -55°C ≤TA≤+110°C ±3 °C (max)

Comparator Offset, and Temperature +120°C ±4 °C (max)

Sensitivity errors) HYST = GND 11 °C

Trip Point Hysteresis HYST = V+2 °C

VTEMP Output Temperature Sensitivity −10.82 mV/°C

VTEMP Temperature Sensitivity Error to −30°C ≤TA≤120°C, 2.7V ±3 °C (max)

Equation: ≤V+≤5.5V

VO= (−3.479×10−6×(T−30)2) + −55°C ≤TA≤120°C, 4.5V ±3 °C (max)

(−1.082×10−2×(T−30)) + 1.8015V ≤V+≤5.5V

TA= 30°C ±2.5 °C (max)

Source ≤1μA 0.070 mV

VTEMP Load Regulation Sink ≤40 μA0.7 mV (max)

+2.7V ≤V+≤+5.5V,

VTEMP Line Regulation −0.2 mV/V

−30°C ≤TA≤+120°C 16 20 µA (max)

ISSupply Current 40 µA (max)

Digital Output and Input

IOUT(“1”) Logical “1” Output Leakage Current (3) V+= +5.0V 0.001 1 µA (max)

IOUT = +1.2mA and

VOUT(“0”) Logical “0” Output Voltage V+≥2.7V; IOUT = +3.2mA 0.4 V (max)

and V+≥4.5V; (4)

ISOURCE = 500µA, V+≥0.8 × V+V (min)

2.7V

VOUT(“1”) Logical “1” Push-Pull Output Voltage ISOURCE = 800µA, V+≥4.5V V+−1.5 V (min)

VIH HYST Input Logical ”1“ Threshold Voltage 0.8 × V+V (min)

VIL HYST Input Logical ”0“ Threshold Voltage 0.2 × V+V (max)

(1) Typicals are at TJ= TA= 25°C and represent most likely parametric norm.

(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

(3) The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the

current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C.

(4) Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the

LM26 would increase by 1.28mW when IOUT = 3.2mA and VOUT = 0.4V. With a thermal resistance of 250°C/W, this power dissipation

would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point

accuracy specification.

Package Type θJA

SOT-23 5 pin, DBV0005B 250°C/W

Product Folder Links: LM26

LM26

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SNIS115R –MAY 2001–REVISED FEBRUARY 2013

Part Number Template

The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of

the output as follows:

The place holders xy describe the set point temperature as shown in the following table.

x (10x) y (1x) Temperature (°C)

A - −5

B - −4

C - −3

D - −2

E - −1

F - −0

H H 0

J J 1

K K 2

L L 3

N N 4

P P 5

R R 6

S S 7

T T 8

V V 9

X - 10

Y - 11

Z - 12

The value of z describes the assignment/function of the output as shown in the following table:

Open-Drain/ Push-

Active-Low/High OS/US Value of z Digital Output Function

Pull

0 0 0 A Active-Low, Open-Drain, OS output

0 0 1 B Active-Low, Open-Drain, US output

1 1 0 C Active-High, Push-Pull, OS output

1 1 1 D Active-High, Push-Pull, US output

For example:

• the part number LM26CIM5-TPA has TOS = 85°C, and programmed as an active-low open-drain

overtemperature shutdown output.

• the part number LM26CIM5-FPD has TUS =−5°C, and programmed as an active-high, push-pull

undertemperature shutdown output.

Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more

information.

Product Folder Links: LM26

6TEMP

1.8015 V

T 1525.04 2.4182 10

3.479 10-

= - + ´ +

V ( 3.47 10 (T 30) ) ( 1.082 (T 30)) 1.8015V

= - ´ ´ - + - ´ - +

VTEMP

GND

HYST

REF

TEMP

SENSOR +

V+

LM26__C

HYST

VTEMP

GND

HYST

REF

TEMP

SENSOR +

V+

LM26__D

HYST

VTEMP

GND

HYST

REF

TEMP

SENSOR +

HYST

LM26__B V+

VTEMP

GND

HYST OS

REF

TEMP

SENSOR

HYST

LM26__A V+

LM26

SNIS115R –MAY 2001–REVISED FEBRUARY 2013

www.ti.com

FUNCTIONAL DESCRIPTION

LM26 OPTIONS

LM26-_ _A LM26-_ _B

LM26-_ _C LM26-_ _D

Figure 1. Output Pin Block Diagram

The LM26 can be factory programmed to have a trip point anywhere in the range of −55°C to +110°C.

Applications Hints

AFTER-ASSEMBLY PCB TESTING

The LM26's VTEMP output allows after-assembly PCB testing by following a simple test procedure. Simply

measuring the VTEMP output voltage will verify that the LM26 has been assembled properly and that its

temperature sensing circuitry is functional. The VTEMP output has very weak drive capability that can be

overdriven by 1.5mA. Therefore, one can simply force the VTEMP voltage to cause the digital output to change

state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test

procedure that can be used to test the LM26CIM5-TPA which has an 85°C trip point.

1. Turn on V+and measure VTEMP. Then calculate the temperature reading of the LM26 using the equation:

(1)

(2)

2. Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of

the ambient/board temperature. The ambient/board temperature (reference temperature) should be

measured using an extremely accurate calibrated temperature sensor.

3. (a) Observe that OS is high.

(b) Drive VTEMP to ground.

(d) Release the VTEMP pin.

(e) Observe that OS is now high.

4. (a) Observe that OS is high.

(b) Drive VTEMP voltage down gradually.

Product Folder Links: LM26

LM26

V+

VTEMP

GND

HYST OS/OS/US/

CLOAD

0.1Pf

Heavy Capacitive

Load, Cable/Wiring

LM26

V+

VTEMP

GND

HYST OS/OS/US/

CLOAD

R0.1Pf

Heavy Capacitive

Load, Cable/Wiring

LM26

www.ti.com

SNIS115R –MAY 2001–REVISED FEBRUARY 2013

(d) VTEMPTrig = VTEMP at OS trigger (HIGH->LOW)

(e) Calculate Trig using Equation 2.

5. (a) Gradually raise VTEMP until OS goes HIGH. Note VTEMP.

(b) Calculate THYST using Equation 2.

VTEMP LOADING

The VTEMP output has very weak drive capability (1 µA source, 40 µA sink). So care should be taken when

attaching circuitry to this pin. Capacitive loading may cause the VTEMP output to oscillate. Simply adding a resistor

in series as shown in Figure 2 will prevent oscillations from occurring. To determine the value of the resistor

follow the guidelines given in Table 2. The same value resistor will work for either placement of the resistor. If an

additional capacitive load is placed directly on the LM26 output, rather than across CLOAD, it should be at least a

factor of 10 smaller than CLOAD.

Table 2. Resistive compensation for capacitive loading of VTEMP

CLOAD R (Ω)

≤100pF 0

1nF 8200

10nF 3000

100nF 1000

≥1µF 430

a) R in series with capacitor

b) R in series with signal path

Figure 2. Resistor placement for capacitive loading compensation of VTEMP

NOISE CONSIDERATIONS

The LM26 has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM26

power supply rejection. False triggering of the output was not observed when these signals where coupled into

the V+ pin of the LM26.

• square wave 400kHz, 1Vp-p

• square wave 2kHz, 200mVp-p

• sine wave 100Hz to 1MHz, 200mVp-p

Product Folder Links: LM26

12V

System Fan

Sanyo Denki

109R0612T4H12

LM26

V+

VTEMP

GND

HYST OS

10k

0.1Pf

+5V

J A JA TEMP L _ TEMP DO DO

T T (V V )I V I )

= + Q - +

LM26

SNIS115R –MAY 2001–REVISED FEBRUARY 2013

www.ti.com

Testing was done while maintaining the temperature of the LM26 one degree centigrade way from the trip point

with the output not activated.

MOUNTING CONSIDERATIONS

The LM26 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued

or cemented to a surface. The temperature that the LM26 is sensing will be within about +0.06°C of the surface

temperature to which the LM26's leads are attached to.

This presumes that the ambient air temperature is almost the same as the surface temperature; if the air

temperature were much higher or lower than the surface temperature, the actual temperature measured would

be at an intermediate temperature between the surface temperature and the air temperature.

To ensure good thermal conductivity, the backside of the LM26 die is directly attached to the GND pin (pin 2).

The temperatures of the lands and traces to the other leads of the LM26 will also affect the temperature that is

being sensed.

Alternatively, the LM26 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or

screwed into a threaded hole in a tank. As with any IC, the LM26 and accompanying wiring and circuits must be

kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold

temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy

paints or dips are often used to ensure that moisture cannot corrode the LM26 or its connections.

The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction

temperature due to its power dissipation. For the LM26 the equation used to calculate the rise in the die junction

temperature is as follows:

(3)

where TAis the ambient temperature, V+is the power supply voltage, IQis the quiescent current, IL_TEMP is the

load current on the VTEMP output, VDO is the voltage on the digital output, and IDO is the load current on the digital

output. Since the LM26's junction temperature is the actual temperature being measured, care should be taken

to minimize the load current that the LM26 is required to drive.

Table 3 summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26

without any loading on VTEMP and a 10k pull-up resistor on an open-drain digital output with a 5.5V power supply.

Table 3. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA)

SOT-23 5 pin SOT-23 5-pin

no heat sink small heat sink

θJA TJ−TAθJA TJ−TA

(°C/W) (°C) (°C/W) (°C)

Still Air 250 0.11 TBD TBD

Moving Air TBD TBD TBD TBD

Typical Applications

Note: The fan's control pin has internal pull-up. The 10k pull-down sets a slow fan speed. When the output of the

LM26 goes low, the fan will speed up.

Figure 3. Two Speed Fan Speed Control

Product Folder Links: LM26

5V Fan

MC05J3

Comair-Rotron

IC2

LM26

V+

VTEMP

GND

HYST OS

100k

NDS356P

IC1

LM3886

47k

20k

THERMALLY COUPLED

0.1Pf

+28V

-28V

Audio

Input

10PF

3.3PF

1N4001

Vout

12V

TOYO

USTF802512HW

LM26

V+

VTEMP

GND

HYST

(1k)

0.1

1N4001

5V Fan

MC05J3

Comair-Rotron

LM26

V+

VTEMP

GND

HYST OS

(100k)

0.1

NDS356P

1N4001

LM26

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SNIS115R –MAY 2001–REVISED FEBRUARY 2013

Figure 4. Fan High Side Drive

Figure 5. Fan Low Side Drive

Figure 6. Audio Power Amplifier Thermal Protection

Product Folder Links: LM26

LM26

V+

VTEMP

(10k)

0.1

Heater

Supply

GND

HYST

LM26

SNIS115R –MAY 2001–REVISED FEBRUARY 2013

www.ti.com

Figure 7. Simple Thermostat

Product Folder Links: LM26

LM26

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SNIS115R –MAY 2001–REVISED FEBRUARY 2013

REVISION HISTORY

Changes from Revision Q (February 2013) to Revision R Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 10

Product Folder Links: LM26

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM26CIM5-BPB/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM TBPB

LM26CIM5-DPB/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TDPB

LM26CIM5-HHD/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 THHD

LM26CIM5-NPA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TNPA

LM26CIM5-PHA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TPHA

LM26CIM5-RPA NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -55 to 125 TRPA

LM26CIM5-RPA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TRPA

LM26CIM5-SHA NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -55 to 125 TSHA

LM26CIM5-SHA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TSHA

LM26CIM5-SPA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TSPA

LM26CIM5-TPA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TTPA

LM26CIM5-VHA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TVHA

LM26CIM5-VPA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TVPA

LM26CIM5-XHA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TXHA

LM26CIM5-XPA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TXPA

LM26CIM5-YHA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYHA

LM26CIM5-YPA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYPA

LM26CIM5-ZHA NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -55 to 125 TZHA

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM26CIM5-ZHA/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TZHA

LM26CIM5X-DPB/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TDPB

LM26CIM5X-HHD NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -55 to 125 THHD

LM26CIM5X-HHD/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 THHD

LM26CIM5X-NPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TNPA

LM26CIM5X-PHA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TPHA

LM26CIM5X-RPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TRPA

LM26CIM5X-SHA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TSHA

LM26CIM5X-SPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TSPA

LM26CIM5X-TPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TTPA

LM26CIM5X-VHA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TVHA

LM26CIM5X-VPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TVPA

LM26CIM5X-XHA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TXHA

LM26CIM5X-XPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TXPA

LM26CIM5X-YHA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYHA

LM26CIM5X-YPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TYPA

LM26CIM5X-ZHA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 125 TZHA

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 3

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM26CIM5-BPB/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-DPB/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-HHD/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-NPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-PHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-RPA SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-RPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-SHA SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-SHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-SPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-TPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-VHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-VPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-XHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-XPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-YHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-YPA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5-ZHA SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM26CIM5-ZHA/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-DPB/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-HHD SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-HHD/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-NPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-PHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-RPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-SHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-SPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-TPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-VHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-VPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-XHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-XPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-YHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-YPA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM26CIM5X-ZHA/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

*All dimensions are nominal

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM26CIM5-BPB/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-DPB/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-HHD/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-NPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-PHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-RPA SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-RPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-SHA SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-SHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-SPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-TPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-VHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-VPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-XHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-XPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-YHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-YPA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-ZHA SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5-ZHA/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM26CIM5X-DPB/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-HHD SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-HHD/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-NPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-PHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-RPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-SHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-SPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-TPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-VHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-VPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-XHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-XPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-YHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-YPA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM26CIM5X-ZHA/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 3

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