Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
R
2
J
3
3
4
G
5
E
6
Y
7
J
8
1
9
0
10
2
11
V
12
Thick Film
Chip Resistors
Product Code Size, Power Rating
XGE : 01005
1GE : 0201
2GE : 0402
3GE : 0603
6GE : 0805
8GE : 1206
14 : 1210
12 : 1812
12Z : 2010
1T : 2512
0.031 W
0.05 W
0.063 W
0.1 W
0.125 W
0.25 W
0.25 W
0.5 W
0.5 W
1W
Power R. Marking
Code
Y
✽Nil
Marking
Value Marking on
black side
No marking
Resistance Tolerance
Code
J
0
Tolerance
±5%
Jumper
The first two digits are significant figures of resistance and
the third one denotes number of zeros following.
Decimal Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
Resistance Value
Packaging Methods
Code
Y
C
X
V
U
B
Packaging
Pressed Carrier Taping
2mmpitch, 20000 pcs.
(Only XGE type)
Pressed Carrier Taping
2mmpitch, 15000 pcs.
(Only 1GE type)
Punched Carrier Taping
2mmpitch, 10000 pcs.
(Only 2GE type)
Punched Carrier Taping
(Only 3GE, 6GE, 8GE type)
Embossed CarrierTaping
(Only 14, 12, 12Z, 1T type)
Bulk case
(Only 2GE, 3GE type)
Type : inches
Thick Film Chip Resistors
01005, 0201, 0402, 0603, 0805,
1206, 1210, 1812, 2010, 2512
Type: ERJ XG, 1G, 2G, 3G, 6G, 8G,
14, 12, 12Z, 1T
■Features
● Small size and lightweight
For PCB size reduction and lightweight products
● High reliability
Metal glaze thick fi lm resistive element and three layers of electrodes result in high reliability
● Suitable for use with placement machines
Taping and bulk case packagings for automatic placement machine
● Solderability
Suitable for both refl ow soldering and fl ow sol der ing
● Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B
■Explanation of Part Numbers
● ERJXGE, 1GE, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, ±5 % type
✽ When omitted, all the rest P/N factors shall be moved up respectively.
(Only XGE, 1GE, 2GE type and Bulk case)
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
Protective coating
Alumina substrate Electrode (Inner)
Electrode
(Between)
Thick film
resistive element Electrode (Outer)
–40 –20 0 20 40 60 80 100 120 140 160
0
180–60
155 °C
70 °C
Ambient Temperature (°C)
20
40
60
80
100
Rated Load (%)
–55 °C
3G, 6G, 8G
XG, 1G,2G,14,12,12Z,1T
125 °C
a
b
t
W
L
■Construction ■Dimensions in mm (not to scale)
Type
(inches) Dimensions (mm)
Mass (Weight)
(g/1000 pcs.)
LWab t
ERJXG
(01005) 0.40±0.02 0.20±0.02 0.10±0.03 0.10±0.03 0.13±0.02 0.04
ERJ1G
(0201) 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15
ERJ2G
(0402) 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8
ERJ3G
(0603) 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2
ERJ6G
(0805) 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4
ERJ8G
(1206) 3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10
ERJ14
(1210) 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16
ERJ12
(1812) 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27
ERJ12Z
(2010) 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27
ERJ1T
(2512) 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45
–0.05
–0.15
–0.20
Type
(inches) Power Rating
at 70 °C (W)
Limiting Element
Voltage (Maximum
RCWV)(1) (V)
Maximum Overload
Voltage(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[10–6/°C
(ppm/°C)]
Category Temperature
Range (Operating
Temperature Range)
(°C)
ERJXG
(01005) 0.031 15 30 ±5 10 to 1 M (E24) <100 :±300
100 <:±200 –55 to +125
ERJ1G
(0201) 0.05 15 30 ±5 1 to 10 M (E24)
<10 :
–100 to +600
10 to 1 M:
±200
1 M<:
–400 to +150
–55 to +125
ERJ2G
(0402) 0.063 50 100 ±5 1 to 10 M (E24) –55 to +155
ERJ3G
(0603) 0.1 50 100 ±5 1 to 10 M (E24) –55 to +155
ERJ6G
(0805) 0.125 150 200 ±5 1 to 10 M (E24) –55 to +155
ERJ8G
(1206) 0.25 200 400 ±5 1 to 10 M (E24) –55 to +125
ERJ14
(1210) 0.25 200 400 ±5 1 to 10 M (E24) –55 to +125
ERJ12
(1812) 0.5 200 400 ±5 1 to 10 M (E24) –55 to +125
ERJ12Z
(2010) 0.5 200 400 ±5 1 to 10 M (E24) –55 to +125
ERJ1T
(2512) 1200400±51 to 1 M (E24) –55 to +125
Type
(inches) Rated Current
(A)
Maximum Over load Current
(A)
ERJ1G (0201) 0.5 1
ERJ2G (0402) 12
ERJ3G (0603)
ERJ6G (0805)
24
ERJ8G (1206)
ERJ14 (1210)
ERJ12 (1812)
ERJ12Z (2010)
ERJ1T (2512)
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the following fi gure.
(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating Re sis tance Values, or Limiting Element Voltage
(max. RCWV) list ed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de ter mined from SOTV=2.5Power Rating or max. Over load Volt age list ed above
which ev er less.
■Ratings
<For Resistor>
<For Jumper>
Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
fB
W
T
fA
fC
Slider
Shutter
110
38
12
TT TA
P0
P2
P1
P1
fD0
fD1(Only Emboss)
B
F
W
E
(2 mm pitch)
● Taping Reel
● Bulk Case
■Packaging Methods (Taping)
● Standard Quantity
● Carrier Tape
■Packaging Methods (Bulk Case)
● Standard Quantity
Type Kind of Taping Pitch (P1)Quantity
ERJXG Pressed Carrier Taping 2 mm 20000 pcs./reel
ERJ1G 15000 pcs./reel
ERJ2G
Punched Carrier Taping
10000 pcs./reel
ERJ3G
4 mm 5000 pcs./reel
ERJ6G
ERJ8G
ERJ14
Embossed Carrier Taping
ERJ12
ERJ12Z
ERJ1T 4000 pcs./reel
(Unit : mm)
Type Quantity
ERJ2G 50000 pcs. / Case
ERJ3G 25000 pcs. / Case
Type fAfBfCWT
ERJXG
180.0+0 60 min. 13.0±1.0
9.0±1.0 11.4±1.0
ERJ1G
ERJ2G
ERJ3G
ERJ6G
ERJ8G
ERJ14
ERJ12 13.0±1.0 15.4±2.0
ERJ12Z
ERJ1T
(Unit : mm)
–3.0
Type A B W F E P1P2P0fD0TfD1
ERJXG 0.25±0.03 0.45±0.03
8.00±0.20 3.50±0.05
1.75±0.10
2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.31±0.05 –
ERJ1G 0.38±0.05 0.68±0.05 0.42±0.05 –
ERJ2G 0.70±0.05 1.20±0.05 0.52±0.05 –
ERJ3G 1.10±0.10 1.90±0.10
4.00±0.10
0.70±0.05 –
ERJ6G 1.65±0.15 2.50±0.20 0.84±0.05 –
ERJ8G 2.00±0.15 3.60±0.20 –
ERJ14 2.80±0.20 3.50±0.20 8.00±0.30
1.00±0.10
1.0+0.10
ERJ12 3.50±0.20 4.80±0.20
12.00±0.30
5.50±0.20 1.5 min.
ERJ12Z 2.80±0.20 5.30±0.20
ERJ1T 3.60±0.20 6.90±0.20
−0
−0
(Unit : mm)
Pressed Carrier Punched Carrier Embossed Carrier
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
Chip Resistor
c
a
b
Preheating
Peak
Heating
Temperature
Time
Type
(inches) Dimensions (mm)
abc
ERJXG(01005) 0.15 to 0.20 0.5 to 0.7 0.20 to 0.25
ERJ1G(0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
ERJ2G(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJ3G(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1
ERJ6G(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJ8G(1206) 2 to 2.4 4.4 to 5 1.2 to 1.8
ERJ14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8
ERJ12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
ERJ12Z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8
ERJ1T(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For solder For lead-free solder
Temperature Time Temperature Time
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
■Recommended Land Pattern
In the case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount
properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of refl ow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Cautions for Safety
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
· Refl ow soldering shall be a maximum of two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure a temperature of electrodes and study
solderabi lity ev ery kind of solder and board, be fore ac tu al
use.
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Ta k e m e a s u r e s a gainst m echanical stress during and after mounting of Thick Film Chip Resistors (hereafter called the
Resistors) so as not to damage their electrodes and protective coatings.
2. If a tra nsie nt load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the Resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the Resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using
a soldering iron with a high temperature tip, fi nish the soldering as quickly as po ssible (within three seconds at 35 0 °C
max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. D o not apply a shock to the Resistors or pinch them with a hard to ol (e.g. pliers and t weezers) . Other wise, the Resistors'
protectiv e coatings and bodies ma y be chipped , affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the Resistors from abnormal stress.
For solder (Example : Sn/Pb)
For lead-free solder (Example : Sn/Ag/Cu)
●Recommended soldering conditions for fl ow
– ER3 –
Cautions for Safety
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to chang e without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, co m bus tion/gas equipme nt, rotating equipme nt, and disa ster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general purpose and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the ef fects on their quality and performance, and determine whether or n ot they can be used.
1. In liquid, such as water, oil, chemicals, or o rganic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of co rrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. In an environment where strong static electricity or electromagnetic wave s exist
5. In an environment where these products cause dew condensation
6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other m aterials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect th e other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the perfor
mance or reliability of t h e prod u cts .
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water- soluble cleaning agent, be careful not to leave
water res i dues. O therw ise, the insulation performance may be deteriorated.
(2) Precautions for storag e
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative hu midity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or d ete riorated, resulting in mo unting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, o r NO2
2. In direct sunlight
This is all for the precautions common to Fixed Resistors. Also refer to the "CAUTION AND WARNIN G" section located
on the back of the fro nt cover of this catalog and precautions for individual products shown in the sub se quent pages.
<Package markings>
Package markings include the product number, quantit y, and co untry of o rigin.
In principle, the country of o rigin should be indicated in English.
