Absolute Maximum Ratings (Note 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Above which the useful life may be impaired.
Storage Temperature (T
STG
) −65˚C to +150˚C
Maximum Junction Temperature (T
J
)
Ceramic +175˚C
V
EE
Pin Potential to Ground Pin −7.0V to +0.5V
Input Voltage (DC) V
EE
to +0.5V
Output Current (DC Output HIGH) −50 mA
ESD (Note 4) ≥2000V
Recommended Operating
Conditions
Case Temperature (T
C
)
Military −55˚C to +125˚C
Supply Voltage (V
EE
) −5.7V to −4.2V
Note 3: Absolute maximum ratings are those values beyond which the de-
vice may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Note 4: ESD testing conforms to MIL-STD-883, Method 3015.
Military Version
DC Electrical Characteristics
V
EE
=−4.2V to −5.7V, V
CC
=V
CCA
=GND, T
C
=−55˚C to +125˚C
Symbol Parameter Min Max Units T
C
Conditions Notes
−1025 −870 mV 0˚C to
V
OH
Output HIGH Voltage +125˚C
−1085 −870 mV −55˚C V
IN
=V
IH
(Max) Loading with (Notes 5, 6, 7)
−1830 −1620 mV 0˚C to or V
IL
(Min) 50Ωto −2.0V
V
OL
Output LOW Voltage +125˚C
−1830 −1555 mV −55˚C
−1035 mV 0˚C to
V
OHC
Output HIGH Voltage +125˚C
−1085 mV −55˚C V
IN
=V
IH
(Min) Loading with (Notes 5, 6, 7)
−1610 mV 0˚C to or V
IL
(Max) 50Ωto −2.0V
V
OLC
Output LOW Voltage +125˚C
−1555 mV −55˚C
V
IH
Input HIGH Voltage −1165 −870 mV −55˚C to Guaranteed HIGH Signal for (Notes 5, 6, 7, 8)
+125˚C All Inputs
V
IL
Input LOW Voltage −1830 −1475 mV −55˚C to Guaranteed LOW Signal for (Notes 5, 6, 7, 8)
+125˚C All Inputs
I
IL
Input LOW Current 0.50 µA −55˚C to V
EE
=−4.2V (Notes 5, 6, 7)
+125˚C V
IN
=V
IL
(Min)
I
IH
Input HIGH Current 240 µA 25˚C to
+125˚C V
EE
=−5.7V (Notes 5, 6, 7)
340 µA −55˚C V
IN
=V
IH
(Max)
I
EE
Power Supply Current −105 −36 mA −55˚C to Inputs Open (Notes 5, 6, 7)
+125˚C
Note 5: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C, then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 6: Screen tested 100%on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 7: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7, and 8.
Note 8: Guaranteed by applying specific input condition and testing VOH/VOL.
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