The Hitachi B-class power amplifier HA1397 is specifically I designed for Hi-Fi stereos, encapsulated in a high performance package. The HA1397, like HA1370, yields 20W typ of output power over the wide range from 20Hz to 20kHz at 1% total har- monic distortion. HA1397 20W Audio Power Amplifier a FEATURES @ High Output Power 20W typ (4B, =4#22V, R, =8Q, f=20Hz to 20kHz, THD=1%) 18Wtyp (+B, =+22V, R, =82, f=20H2 to 20kHz, =0 59 | THD=0.5%) | (SP-12T) +B, : Supply Voltage, R, :Load Resistance, | f: Frequency, THD;Total Harmonic Distortion, +B, =25V (constant) As a protection circuit, automatically reduces the output Low THD and Low Cross Over Distortion power and the current when the chip temperature exceeds 0.02% typ (+B, =22V, R_=80, f=1kHz, Pout=2W) 150C 0.04% typ (+B, =22V, R,=82, f=20Hz to 20kHz, Pout=2W = Muting Circuit included @ Wide Frequency Range Minimizing pop noise at power-switching 5Hz to 120kHz (1dB) @ Single-in-Line Structure @ Thermal Shut-down Circuit included Simple mounting on heat-sink MI BLOCK DIAGRAM & TYPICAL APPLICATION + Be C106 Rios an 5p IM +Bi Lge T 6 OO) a 5 tL Cis | c i Mut ing Limiter ! Note) i. Pins 1, 2 and 4: N/C an M} Lio. du 2. Voltage Gain(Gv) | Gv=Rin/ Rios 380B. taro Driver Faleer Output oy 3. +B: Non Regulated Power Supplys : Rioe [Pe 82 +Bz : Connected to a regulated power supply Risple Thonal } 10 higher by 3~5V than +B at the rated Rejection Shut-down output power. | t About 2 seconds of +Bze rising time constant ----- =~ =~ 72-4 Loe minimizes pop noise at power-switching. HA1397 be 5 Rios 4. Riog(10Q) : Transient Current Limiter eT Bi 1D Rave Unit R . . LiH lo HEABSOLUTE MAXIMUM RATINGS (Unless otherwise specified, Ta=25C ) Item Symbol Rating Unit Note Positive Supply Voltage +Bi, + Be 30 V Standard Operating Voltage - __Negative Supply Voltage Bi 30 Vv | +B.=25V, +Bi=+22,+19V Output Current : Toc peaks 7.5 A Input Voltage Vin peaks +10 Vv ee Power Dissipation Pre 30 Wo] Tee = 75C ee Thermal Resistance | 85-6 2.5 C/W Junction Temperature iT; 150 C Operating Temperature Topr -20 tot 70 C ee _ Storage Temperature Tass 55 to +125 c @ HITACHI 167HA1397 M ELECTRICAL CHARACTERISTICS (Unless otherwise specified, +B:=+25V, +B2=25V, Ri=8Q, R,=6000, Ta=25C) Item Symbol Test Conditions min. typ. max Unit Quiescent Current (Pin-5) +Iai Vi.=0 20 60 120 mA Quiescent Current (Pin-6} + Tae Viz=0 _ _ 22 mA Quiescent Current (Pin-12) | Ian | Vin=0 152) mA Output Offset Voltage AVo Vin=0, DC Voltage at Pin-3 0 +0.1 V Input Resistance Rin | f=1kHz, Rice = 56k _ 55 _ ka Voltage Gain (Closed Loop) Gy | f=1kHz, Rios=6800, Rio =56k0 _ 38 _ dB Voltage Gain (Open Loop) Gyo, | f=1kHz, Rios =0 88 | @B Output Power* Por f-<20kHz THD=0.5%, Ri=80 15 18 _ W Po: THD=0.7%, Ri=40 15 18 _ W Total Harmonic Distortion THD f=20kHz, Pouw=2W : _ 0.04 0.20 % Output Noise Voltage - Va R,=5.1k0, BW =20Hz to 20kHz _ 0.35 0.50 mV supels Voltage Ripple Rejection SVR | Re=5.1kQ, frrpte100H2 (Pin-12) 52 60 | @B Note! * Purl tBi=422V, Pot +Bi=+19V MiPC-BOARD LAYOUT PATTERN (Top View) GND, : Input Side GND GND: : Output Side GND 158 @ HITACHIHA1397 MP.C. BOARD LAYOUT PATTERN FOR STEREO APPLICATION CIRCUIT eee eee ee ee ee a er 4 ' 1 ! | ! Heat Sink Space HA1397 ae ee OUT(R) GND2( OUT) OUT(L) Note) Dotted J.ines designates the jumper lines Note) Dotted Lines designates the jumper lines HITACHI 169HA1397 TOTAL HARMONIC DISTORTION VS. OUTPUT POWER (1) 2 2 hy= + 22V Harmonic Distortion Tui 0.05 Potal Oe OL Red UE lil Ouipur Power Pau W TOTAL HARMONIC DISTORTION VS. FREQUENCY B 1.0 a HOG Total Harmonie Distortion TLL O.02 ay Et) 100 2a) AOU ; 2 0k Frequency fo fhe OUTPUT POWER VS. SUPPLY VOLTAGE 25 ay = = 1h 2 c + =O lo Ho=27\ f= lkHz R= T.HD=1% a oL 20 21 22 Supply Voltage - Bi V Quiescent Current t fg mA TOTAL HARMONIC DICTORTION VS. OUTPUT POWER (2) 5 +h==1V 2 + By 25 kr=4Q Q.1 0.05 Total Harmonic Distortion TAH. % 0.02 O.1 0.2 0.5 1.0 2 5 10 20 30 Qutput Power Pow W OUTPUT POWER VS. FREQUENCY Output Power Pour W } 1 : 50k 100k Frequency f Hai QUIESCENT CURRENT VS. SUPPLY VOLTAGE 120 100 80 60 Output Transistor 40 20 22 24 Supply Voltage + Hz .V 170 @ HITACHIHA1397 POWER DISSIPATION VS. OUTPUT POWER + Bo= +B = +22Vi Ri = 801 + B= + lV: Rp =4Q: = kHz, Power Dissipation Pro Wi ag Qutput Power Pu W SUPPLY VOLTAGE RIPPLE REJECTION RATIO VS. RIPPLE FREQUENCY 7 bu 50 40 30 4 + Hi= 25 ~ Re= 25 20 = Ve appte = 779m V rms Re =5.1kQ Supply Voltage Ripple Rejection Ratio SVR dB 20 50) 108 200 500 1k 2k ok 10k 20k Ripple Frequency fripple Hz VOLTAGE GAIN VS. FREQUENCY : Loop Gain Gv woty ve ? GO RRB Voltage Gain Grats (dB* & 40 Cc Gain Gr 30 + Bo=25V Re = 20 Cro6 Compensation 10 30 l Frequency f Hz a CAUTION FOR MOUNTING The header should be insulated electrically by using washers on the screwing-holes. | Heat- Sink Insulator Washer w Binding Screw Mounting HA1397's insulator and washer are available. Concurrent order with the ICs will be taken. Insulator (Mica): SK-51B Washer: YC-40B Caution) A grounded header in the IC-operating may damage the IC. = PRECAUTIONS ON THE ELECTRICAL CHARAC- TERISTICS 1. HA1397 has three pins for the power supply. Pin-5 and pin-12 are for the main supply, plus and minus B, to which the non-regulated supply would be accepted. Pin-6 is for the driver stage and the regulated supply (less than 5mV) is required. 2. The amplifier does not operate until pin-6 comes up to about 12V. The muting time period will be set by the time of pin-6 to come up to the 12V point. Since the purpose of this muting system is to prevent the gop-sound from the pre-amplifier and others at the power-on, the inadequate use of pin-6 like controlling the pin-6 voltage during the normal operation may cause pop-noise trouble. 3. For symmetrical clipping of the output waveform, set the pin-6 voltage 2 to 3 V higher at the rated maximum output than pin-5. 4. Ryo between pin-11 and GND is to prevent the excessive transient current in case of testing the raw PC-board with the imperfect power supply grounding at the assembly line. Therefore, the use of R,9g is recommended for the actual set production. @ HITACHI 171HA1397 5. The following precautions should be taken into account for AM/FM receiver use. (1) Take asufficient distance from the power IC to the AM bar antenna. The best way is to take it out of the set casing. The distance from the antenna to the speaker terminals must also be taken into account. {2) The standard application provides 100kHz or more frequency characteristics (voltage gain). For receiver use, connect a phase compensation capacitor of 22pF to 47pF between pins 7 and 8, to achieve a proper range of the frequency. (3) Maximum level of volume under a high input level may cause over-clipping | and harmonics-return to the AM bar antenna. To prevent over-driving at the power stage, set +B, supply voltage below 25V. (4) A long distance from the ICs supply pin to the filtering capacitor may deteriorate the actual AM receiving, connect electrolytic sensitivity. For high sensitivity of AM receiving, connect electrolytic capacitors of over 47uF/35V between +B, (pins 5 and 12) and GND, or connect an additional capacitor of approximately 10pF between pins 7 and 10. = HANDLING CAUTIONS 1. MOUNTING 1-1. For mounting the SP-12T and SP-12TA packages on the heat sink, 4 to 8kgem of screwing-torque is recommended; excessive torque will cause device deformation, resulting in pellet-crack, connector-lead-wire-breaking,etc., and too less torque will increase the heat resistance. 1-2. The use of screws needs the following cautions. 1) Use the standardized binding-head screws. 2) Oval counter-sunk crews, subjecting the IC to intense stress, must not be used. 3) To the use of tapping screws the cautions for binding- torque strength must be applied. 4) Use a tapping screw diameter smaller than an [C mounting- hole. 1-3. Heat sink screw-holes should be at 20+0.2mm intervals, coincident with the IC screw-hole intervals. In IC-binding, metal-fittings striking on the plastic of the IC may cause characteristics-deterioration or package-crack. 1-4. Poor flatness of heat sink sometimes prevents effective heat-sinking or subjects the IC surface to intense stress, causing characteristics-deterioration or package-crack. 1) 0.1mm max. of heat-sink flatness error for the contact area (16mmx31mm) will be tolerated. 2) Contact-surface ruggedness should not exceed 25um. 3) For aluminum, copper, or iron plates, check them for no burr and mold them for screw-holes. 4) Cutting chips between the IC header and the heat sink will cause heat-sinking deterioration. 5) The heat-sink hole diameter should not exceed 4.0mm. 1-5. As silicone grease, the Shinetsu Chemical Industry G746 is recommended. Coarse grease or an excessive amount of grease may cause intensive stress to the [C, when binding. 172 1-6. Screw the |C on the heat sink, before soldering the lead wires on the printed circuit board (PCB). Screwing after the soldering may cause strain of PCB and of the heat sink, resulting in characteristics-deterioration of the IC. 1-7. Direct soldering of lead wires to the header will de- teriorate the IC life characteristics. For the method and conditions of lead-wire forming, users are requested to contact the vendor. 1-8. Soldering should be done within the soldering heat test standard, specifying that lead wires, up to 1 to 1.5mm off the IC body, are kept in solder at 260C for 10 seconds and at 350C for 3 seconds. Use a soldering iron grounded. 1-9. Two or more ICs on one heat sink will increase thermal resistance per IC. 2. TRANSPORTING Transporting the ICs or IC-containing products needs the following cautions. 2-1. Cases for IC-transporting must not be electrified by concussion-rubbing, etc. This can be prevented by using conductive cases or aluminum foil. 2-2. tnhandling, human bodies and clothes should be grounded via sufficiently with resistance, to prevent static electricity from damaging the ICs. To remove electrification possibility, put an approx. 1MQ-resistance at the body side between GND and the body. 2-3. In IC-mounted PCB transporting, no static-electricity should be generated. Shorting the IC pins to obtain equipoten- tiality is an effective method, The rubber of PCB-carrying belt conveyors needs antistatic treatment. 2-4. Mechanical concussion or shock should be minimized in 1C- or PCB-transporting. 3. TESTING 3-1. Static electricity and electric-appliance leak must be avoided in IC testing or handling, there being times when open pins might separately touch measuring devices, human bodies, benches, soldering irons,belt conveyors,etc. 3-2. In IC testing, IC testers should not apply surge voltage to the ICs or should contain clamping circuit, to prevent accidental leak from measuring-devices or pins for curve tracer, oscilloscope, pulse generator or DC voltage regulator. 3-3. Avoid false pin-connection, inverted pin-insertion and pins short in iC testing. Check external-capacitor for no charge before IC testing, to prevent pin-damaging possibility. 3-4. Before PCB-operation testing, check for no wiring bridges pin bridges. @ HITACHIHA1397 = CAUTIONS FOR HA1370-HA1397 EXCHANGING Please refer to the following cautions for HA1370-replacing to HA1397. 1. Two more lead holes should be added on the PC board. Pins 1 to 10 of HA1370 correspond to pins 3 to 12 of HA1397. For the HA1397 floating pins 1 and 2, two more holes should be added on the HA1370 PC board, next to the pin-1 hole. Lead Holes 4 _ _ _e pee 2. The screw-holes on the heat-sink should be relocated. Fig. shows the screw-holes location for HA1397. The screw holes should be made 3.7mm higher, shortening the hole-to-hole distance by 4mm. HA1397 | 20-7 .2mm~ ao | ' 24 + 0.4mm HAIS97 | | | | ! 12 Pin 'HA1370 10 Pin)! Lead Hole Location 3. Use washers at the screwing-holes Electrical insulation of the header should be protect by using washers on the screwing-holes. @ HITACHI 173