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May 1998

Revised August 2004

NC7SZ175 TinyLogic



UHS D-Type Flip-Flop wit h Asynchronous Clear

NC7SZ175

TinyLogic UHS D-Type Flip-Flop

with Asynchronous Clear

General Description

The NC7SZ175 is a single positive edge-triggered D-type

CMOS Flip-Flop with Asynchronous Clear from Fairchild’s

Ultra High Speed Series of TinyLogic in the space saving

SC70 6-lead package. The device is fabricated with

advanced CMOS technology to achieve ultra high speed

with high output drive while maintaining low static power

dissipation over a very broad VCC operating range. The

device is spe cified to operate over the 1.65V to 5.5V VCC

range. The inputs and output are high impedance when

VCC is 0V. Inputs tolerate voltages up to 7V independent of

VCC operating voltage. This single flip-flop will store the

state of the D input that meets the setup and hold time

requirements on the LOW-to-HIGH Clock (CP) transition. A

LOW input to Clear sets the Q output to LOW level. The

Clear input is independent of clock.

Features

■Space saving SC70 6-lead package

■Ultra small MicroPak leadless packa ge

■Ultra High Speed; tPD 2.6 ns Typ into 50 pF at 5V VCC

■High Output Drive; ±24 mA at 3V VCC

■Broad VCC Operating Range; 1.65V to 5.5V

■Matches the performance of LCX when operated at

3.3V VCC

■Power down high impedance inputs/output

■Overvoltage tolerant inputs facilitate 5V to 3V translation

Ordering Code:

TinyLogic is a registered t rademark of F airc hild Semi co nductor Corporation.

MicroPak is a trademark of Fair ch ild Semiconductor Co rporation.

Order Package Product Code Package Description Supplied As

Number Number To p Mark

NC7SZ175P6X MAA06A Z75 6-Lead SC70, EIAJ SC88, 1.25mm Wide 3k Units on Tape and Reel

NC7SZ175L6X MAC06A C4 6-Lead MicroPak, 1.0mm Wide 5k Units on Tape and Reel

■Proprietary noise/EMI reduction circuitry implemented

www.fairchildsemi.com 2

NC7SZ175

Logic Symbol

IEEE/IEC

Function Table

H = HIGH Logi c Level Qn = No change in data

L = LOW Logic Level X = Immaterial

Pin Descriptions

Connection Diagrams

Pin Assignments for SC7 0

(Top View)

Pin One Orientation D iagram

AAA represents P roduct Cod e Top Mark - see ordering cod e

Note: Orientation of Top Mark determines Pin One location. Read the top

produc t co de mark left to right, Pin One is th e lower left pi n (s ee diagram ).

Pad Assignments for MicroPak

(Top Thru View)

Inputs Output

CP D C Q



LH L



HH H



XHQn

XXL L

Pin Names Description

D Data Input

CP Clock Pulse Input

CClear Input

Q Flip-Flop Output

3 www.fairchildsemi.com

NC7SZ175

Absolute Maxim um Ratings(Note 1) Recommended Operating

Conditions (Note 2)

Note 1: The “Absolute Maximum Ratings”: are t hos e v alues bey ond whic h

the saf ety of the device cannot b e guaranteed . The device should not be

operated at these limits. The parametric values defined in the Electrical

Char ac teristics tables are not guaranteed at t he absolute maxim um ratings .

The “R ecomm ended Ope rating Co ndition s” table will define the condit ions

for actu al device operation.

Note 2: Unused inputs must be held HIGH or LOW. They may not floa t.

DC Electrical Characteristics

Supply Voltage (VCC)−0.5V to +7.0V

DC In put Voltage (VIN)−0.5V to +7.0V

DC Output Voltage (VOUT)−0.5V to +7.0V

DC Input Diode Current (IIK)

VIN < 0V −50 mA

DC Output Diode Current (IOK)

VOUT < 0V −50 mA

DC Output (IOUT) Source/Sink Current ±50 mA

DC VCC/GND Current (ICC/IGND)±50 mA

Storage Temperature Range (TSTG)−65°C to +150°C

Junction Temperature under Bias (TJ)150°C

Junction Lead Temperature (TL)

(Soldering, 10 seconds) 260°C

Power D is sipation (PD) @+85°C180 mW

Power Supply

Operating (VCC) 1.65V to 5.5V

Data Retention 1.5V to 5.5V

Input Voltage (VIN) 0V to 5.5V

Output Voltage (VOUT)0V to V

Input Rise and Fall Time (tr, tf)

VCC = 1.8V, 2.5V ± 0.2V 0 to 20 ns/V

VCC = 3.3V ± 0.3V 0 to 10 ns/V

VCC = 5.5V ± 0.5V 0 to 5 ns/V

Operating Temperature (TA)−40°C to +85°C

Thermal Resistance (θJA) 350° C/W

Symbol Parameter VCC TA = +25°CT

A = −40°C to +85°CUnit Conditions

(V) Min Typ Max Min Max

VIH HIGH Level Control 1.65 to 1.95 0.75 VCC 0.75 VCC V

Input Voltage 2.3 to 5.5 0.7 VCC 0.7 VCC

VIL LOW Level Control 1.65 to 1.95 0.25 VCC 0.25 VCC V

Input Voltage 2.3 to 5.5 0.3 VCC 0.3 VCC

VOH HIGH Level Control 1.65 1.55 1.65 1.55

IOH = −100 µA

Output Voltage 1.8 1.7 1.8 1.7

2.3 2.2 2.3 2.2

3.0 2.9 3.0 2.9

4.5 4.4 4.5 4.4 VIN = VIH

1.65 1.24 1.52 1.29 or VIL IOH = −4 mA

2.3 1.9 2.15 1.9 IOH = −8 mA

3.0 2.4 2.8 2.4 IOH = −16 mA

3.0 2.3 2.68 2.3 IOH = −24 mA

4.5 3.8 4.2 3.8 IOH = −32 mA

VOL LOW Level Control 1.65 0.0 0.1 0.1

IOL = 100 µA

Output Voltage 1.8 0.0 0.1 0.1

2.3 0.0 0.1 0.1

3.0 0.0 0.1 0.1

4.5 0.0 0.1 0.1 VIN = VIL

1.65 0.08 0.24 0.24 or VIH IOL = 4 mA

2.3 0.10 0.3 0.3 IOL = 8 mA

3.0 0.15 0.4 0.4 IOL = 16 mA

3.0 0.22 0.55 0.55 IOL = 24 mA

4.5 0.22 0.55 0.55 IOL = 32 mA

IIN Input Leakage Current 0 to 5.5 ±0.1 ±1.0 µA0 ≤ VIN ≤ 5.5V

IOFF Power Off Leakage Current 0.0 1.0 10 µAV

IN or VOUT = 5.5V

ICC Quiescent Supply Current 1.65 to 5.5 1.0 10.0 µAV

IN = 5.5V, GND

www.fairchildsemi.com 4

NC7SZ175

AC Electrical Characteristics

Capacitance (Note 3)

Note 3: TA = +25C, f = 1MHz.

Note 4: CPD is defined as the v alue of th e internal equivale nt c apacitanc e which is derived f rom dynamic operat ing curren t c onsumptio n (ICCD) at no outpu t

loading and operating at 50% duty cycle. (See Fig ure 2)

CPD is related to ICCD dynam ic operating current by the ex pression: ICCD = (CPD)(VCC)(fIN) + (ICCstatic).

Symbol Parameter VCC TA = +25°CT

A = −40°C to +85°CUnits Conditions Figure

(V) Min Typ Max Min Max Number

fMAX Maximum Cl ock 1.65 100

MHz Figures

1, 4

Frequency 1.8 100

2.5 ± 0.2 125 CL = 50 pF

3.3 ± 0.3 150 RL = 500 Ω

5.0 ± 0.5 175

tPLH Propagation Delay 1.65 2.5 9.8 15.0 2.5 16.5

Figures

1, 3

tPHL CP to Q 1.8 2.5 6.5 10.0 2.5 11.0

2.5 ± 0.2 2.0 3.8 6.5 2.0 7.0 CL = 15 pF

3.3 ± 0.3 1.5 2.8 4.5 1.4 5.0 RL = 1 MΩ

5.0 ± 0.5 1.0 2.2 3.5 1.0 3.8

3.3 ± 0.3 2.0 3.4 5.5 1.6 6.2 CL = 50 pF Figures

1, 3

5.0 ± 0.5 1.5 2.6 4.0 1.4 4.7 RL = 500 Ω

tPHL Propagation Delay 1.65 2.5 9.8 13.5 2.5 15.0

Figures

1, 3

C to Q 1.8 2.5 6.5 9.0 2.5 10.0

2.5 ± 0.2 2.0 3.8 6.0 2.0 6.4 CL = 15 pF

3.3 ± 0.3 1.5 2.8 4.3 1.2 4.6 RL = 1 MΩ

5.0 ± 0.5 1.5 2.2 3.2 1.0 3.5

3.3 ± 0.3 1.5 3.4 5.3 1.5 5.8 CL = 50 pF Figures

1, 3

5.0 ± 0.5 1.0 2.7 4.0 1.2 4.5 RL = 500 Ω

tSSetup Time 2.5 ± 0.2 2.5 ns CL = 50 pF Figures

1, 4

CP to D 3.3 ± 0.3 2.0 RL = 500 Ω

5.0 ± 0.5 1.5

tHHold Time, 2.5 ± 0.2 1.5 ns CL = 50 pF Figures

1, 4

CP to D 3.3 ± 0.3 1.5 RL = 500 Ω

5.0 ± 0.5 1.5

tWPulse Width, CP 2.5 ± 0.2 3.0 CL = 50 pF Figures

1, 4

3.3 ± 0.3 2.8 ns RL = 500 Ω

5.0 ± 0.5 2.5

Pulse Width, C 2.5 ± 0.2 3.0 Clock HIGH or LOW Figures

1, 4

3.3 ± 0.3 2.8 ns CL = 50 pF

5.0 ± 0.5 2.5 RL = 500 Ω

trec Recovery Time, 2.5 ± 0.2 1.0 CL = 50 pF Figures

1, 4

C to CP 3.3 ± 0.3 1.0 ns RL = 500 Ω

5.0 ± 0.5 1.0

Symbol Parameter Typ Max Units Conditions

CIN Input Capacitance 3 pF VCC = Open, VIN = 0V or VCC

COUT Output Capacitance 4 pF VCC = 3.3V, VIN = 0V or VCC

CPD Power Dissipation Capacitance 10 pF VCC = 3.3V

(Note 4) 12 VCC = 5.0V

5 www.fairchildsemi.com

NC7SZ175

AC Loading and Waveforms

CL include s l oad and stray c apacitance

Input PRR = 1.0 MHz , t w = 500 ns

FIGURE 1. AC Test Circuit

CP Input = AC Waveform; tr = tf = 1.8 ns;

CP Input PRR = 10 MHz; Duty Cycle = 50%

D Input PRR = 5MHz; Duty Cycle = 50%

FIGURE 2. ICCD Test Circuit

FIGURE 3. AC Waveforms

FIGURE 4. AC Waveforms

www.fairchildsemi.com 6

NC7SZ175

Tape and Reel Specification

TAPE FORMAT for SC70

TAPE DIMENSIONS inches (millimeters)

Package Tape Number Cavity Cover Tape

Designator Section Cavities Status Status

Leader (St art E nd) 125 (typ ) E mp ty Sea l ed

P6X Carrier 3000 Filled Sealed

Trailer (Hub End) 75 (typ) Empty Sealed

Package Tape Size DIM A DIM B DIM F DIM KoDIM P1 DIM W

SC70-6 8 mm 0.093 0.096 0.138 ± 0.004 0.053 ± 0.004 0.157 0.315 ± 0.004

(2.35) (2.45) (3.5 ± 0.10) ( 1.35 ± 0.10) (4) (8 ± 0.1 )

7 www.fairchildsemi.com

NC7SZ175

Tape and Reel Specification (Continued)

TAPE FORMAT for MicroPak

REEL DIMENSIONS inches (millimeters)

Package Tape Number Cavity Cover Tape

Designator Section Cavities Status Status

Leader (Start End) 125 (typ) Empty Sealed

L6X Carrier 5000 Filled Sealed

Trailer (Hub End) 75 (typ ) E m pty Se al ed

Tape

Size ABCDN W1 W2 W3

8 mm 7.0 0.059 0.512 0.795 2.165 0.331 + 0.059/−0.000 0.567 W1 + 0.078/−0.039

(177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.5 0/−0.00) (14.40) (W1 + 2.00/−1.00)

www.fairchildsemi.com 8

NC7SZ175

Physical Dimensions inches (millimeters) unless otherwise noted

6-Lead SC70, EIAJ SC88, 1.25mm Wide

Package Number MAA06A

9 www.fairchildsemi.com

NC7SZ175 TinyLogic



UHS D-Type Flip-Flop wit h Asynchronous Clear

Physical Dim ensions inches (millimeters) unless otherwise noted (Continued)

6-Lead MicroPak, 1.0mm Wide

Package Number MAC06A

Fairchild does not assume an y responsibility for use of any circuitry descr ib ed, no circuit patent licenses are implied and

Fairchild reserves the right at any time without notice to change said circuitry and specifications.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD

SEMICONDUCTOR CORPORATION. As used herein:

1. Life sup por t de vices o r syst ems are dev ic es or syste ms

which, (a) are intended for surgical implant into the

body, or (b) support or sustain life, and (c) whose failure

to perform when properly used in accordance with

instruct ions fo r use pr ovi de d in the l abe ling, can be rea-

sonably expected to result in a significant injury to the

user.

2. A criti cal com ponen t in any com ponen t of a life s uppor t

device or system whose failure to perform can be rea-

sonabl y e xpec ted to cause the fa i lure of the l ife support

device or system, or to affect its safety or effectiveness.

www.fairchildsemi.com

www.onsemi.com

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

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